WO2008136432A1 - 表面検査装置 - Google Patents

表面検査装置 Download PDF

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Publication number
WO2008136432A1
WO2008136432A1 PCT/JP2008/058124 JP2008058124W WO2008136432A1 WO 2008136432 A1 WO2008136432 A1 WO 2008136432A1 JP 2008058124 W JP2008058124 W JP 2008058124W WO 2008136432 A1 WO2008136432 A1 WO 2008136432A1
Authority
WO
WIPO (PCT)
Prior art keywords
outer circumference
semiconductor wafer
imaging
lens
inspecting apparatus
Prior art date
Application number
PCT/JP2008/058124
Other languages
English (en)
French (fr)
Inventor
Yoshinori Hayashi
Masao Kawamura
Hideki Mori
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to DE112008001114.1T priority Critical patent/DE112008001114B4/de
Priority to US12/595,699 priority patent/US8023111B2/en
Priority to KR1020097020908A priority patent/KR101120226B1/ko
Priority to JP2009512994A priority patent/JP5191484B2/ja
Publication of WO2008136432A1 publication Critical patent/WO2008136432A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

【課題】半導体ウェーハ等の板状部材の外周エッジ部を適切に検査することを可能とした表面検査装置を提供する。 【解決手段】半導体ウェーハ検査装置１０は、半導体ウェーハ１００の外周エッジ部分１０１に対向して配置される撮像レンズ２２と、撮像レンズ２２を介して半導体ウェーハ１００の外周端面に対向して配置される撮像面２４と、半導体ウェーハ１００の第１外周ベベル面１０１ｂの像を撮像レンズ２２を介して撮像面２４に結像させるミラー１２と、半導体ウェーハ１００の第２外周ベベル面１０１ｃの像を撮像レンズ２２を介して撮像面２４に結像させるミラー１４と、半導体ウェーハ１００の外周端面１０１ａの像を撮像レンズ２２の中央部を介して撮像面２４に結像させる補正レンズ２６と、外周端面１０１ａより第１外周ベベル面１０１ｂ及び第２外周ベベル面１０１ｃの方が明るくなるように、これらを照明する照明ライトガイド灯光部１８とを有する。
PCT/JP2008/058124 2007-04-27 2008-04-25 表面検査装置 WO2008136432A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE112008001114.1T DE112008001114B4 (de) 2007-04-27 2008-04-25 Vorrichtung für die Oberflächenprüfung
US12/595,699 US8023111B2 (en) 2007-04-27 2008-04-25 Surface inspection apparatus
KR1020097020908A KR101120226B1 (ko) 2007-04-27 2008-04-25 표면 검사 장치
JP2009512994A JP5191484B2 (ja) 2007-04-27 2008-04-25 表面検査装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-120174 2007-04-27
JP2007120174 2007-04-27

Publications (1)

Publication Number Publication Date
WO2008136432A1 true WO2008136432A1 (ja) 2008-11-13

Family

ID=39943539

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058124 WO2008136432A1 (ja) 2007-04-27 2008-04-25 表面検査装置

Country Status (5)

Country Link
US (1) US8023111B2 (ja)
JP (2) JP5191484B2 (ja)
KR (1) KR101120226B1 (ja)
DE (1) DE112008001114B4 (ja)
WO (1) WO2008136432A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256090A (ja) * 2009-04-22 2010-11-11 Raytex Corp 表面検査用照明装置
CN115931903A (zh) * 2023-02-02 2023-04-07 苏州高视半导体技术有限公司 边缘检测镜头及***

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
US11026361B2 (en) * 2013-03-15 2021-06-01 John S. Youngquist Linear/angular correction of pick-and-place held component and related optical subsystem
KR20160040044A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 패널 검사장치 및 검사방법
KR20220047684A (ko) 2014-12-05 2022-04-18 케이엘에이 코포레이션 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
JP6875285B2 (ja) 2015-03-13 2021-05-19 コーニング インコーポレイテッド エッジ強度試験方法および装置
CN107026095A (zh) * 2016-02-01 2017-08-08 易发精机股份有限公司 晶圆边缘量测模组
CN114322773A (zh) * 2021-12-31 2022-04-12 杭州电子科技大学 一种用于长条薄片零件视觉检测的装置及其检测方法
KR102571868B1 (ko) * 2022-09-20 2023-08-30 주식회사 아이엠반도체 웨이퍼 엣지 검사용 광원 모듈 및 웨이퍼 엣지 검사 장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09269298A (ja) * 1996-03-29 1997-10-14 Sumitomo Sitix Corp 端部欠陥検査方法とその装置
JP2002310924A (ja) * 2001-04-17 2002-10-23 Toray Ind Inc シートの欠陥検査装置及びシートの製造方法
JP2003065960A (ja) * 2001-08-24 2003-03-05 Kyoto Denkiki Kk Ｌｅｄ照明装置
JP2004191214A (ja) * 2002-12-12 2004-07-08 Kokusai Gijutsu Kaihatsu Co Ltd ライン照明装置及びライン照明装置を用いた検査装置
JP2006017685A (ja) * 2004-06-30 2006-01-19 Nippon Electro Sensari Device Kk 表面欠陥検査装置
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01233571A (ja) * 1988-03-15 1989-09-19 Fujitsu Ltd ピングリッドアレイ型部品のピン曲り検出装置
JPH04215045A (ja) * 1990-12-12 1992-08-05 Mitsubishi Rayon Co Ltd レーザ検査装置
JP4244305B2 (ja) * 2003-08-27 2009-03-25 株式会社トプコン 照明光学系及びこれを用いたパターン欠陥検査装置
JP4454356B2 (ja) * 2004-03-25 2010-04-21 シーシーエス株式会社 光照射装置及び光照射装置用ヘッド
US7280197B1 (en) * 2004-07-27 2007-10-09 Kla-Tehcor Technologies Corporation Wafer edge inspection apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09269298A (ja) * 1996-03-29 1997-10-14 Sumitomo Sitix Corp 端部欠陥検査方法とその装置
JP2002310924A (ja) * 2001-04-17 2002-10-23 Toray Ind Inc シートの欠陥検査装置及びシートの製造方法
JP2003065960A (ja) * 2001-08-24 2003-03-05 Kyoto Denkiki Kk Ｌｅｄ照明装置
JP2004191214A (ja) * 2002-12-12 2004-07-08 Kokusai Gijutsu Kaihatsu Co Ltd ライン照明装置及びライン照明装置を用いた検査装置
JP2006017685A (ja) * 2004-06-30 2006-01-19 Nippon Electro Sensari Device Kk 表面欠陥検査装置
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256090A (ja) * 2009-04-22 2010-11-11 Raytex Corp 表面検査用照明装置
CN115931903A (zh) * 2023-02-02 2023-04-07 苏州高视半导体技术有限公司 边缘检测镜头及***

Also Published As

Publication number Publication date
KR101120226B1 (ko) 2012-03-20
JP5489186B2 (ja) 2014-05-14
KR20090118105A (ko) 2009-11-17
DE112008001114B4 (de) 2014-02-27
JP5191484B2 (ja) 2013-05-08
US8023111B2 (en) 2011-09-20
JPWO2008136432A1 (ja) 2010-07-29
DE112008001114T5 (de) 2010-06-10
JP2013033068A (ja) 2013-02-14
US20100066998A1 (en) 2010-03-18

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