WO2008133101A1 - Cooling system - Google Patents

Cooling system Download PDF

Info

Publication number
WO2008133101A1
WO2008133101A1 PCT/JP2008/057319 JP2008057319W WO2008133101A1 WO 2008133101 A1 WO2008133101 A1 WO 2008133101A1 JP 2008057319 W JP2008057319 W JP 2008057319W WO 2008133101 A1 WO2008133101 A1 WO 2008133101A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
radiators
radiator
heat
cooling system
Prior art date
Application number
PCT/JP2008/057319
Other languages
French (fr)
Japanese (ja)
Inventor
Hitoshi Onishi
Original Assignee
Alps Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co., Ltd. filed Critical Alps Electric Co., Ltd.
Publication of WO2008133101A1 publication Critical patent/WO2008133101A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0246—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A liquid-cooling system is provided with a heat receiving plate, which is brought into thermal contact with a heat generating source for taking heat from the heat generating source; a radiator; a pump for circulating a cooling medium between the heat receiving plate and the radiator; and a cooling fan for applying cooling wind to the radiator. A plurality of the radiators having independent channels are arranged, and cooling fans of a number smaller than the number of the radiators are arranged for applying cooling wind to the radiators.
PCT/JP2008/057319 2007-04-20 2008-04-15 Cooling system WO2008133101A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-112196 2007-04-20
JP2007112196A JP2010156467A (en) 2007-04-20 2007-04-20 Liquid cooling system

Publications (1)

Publication Number Publication Date
WO2008133101A1 true WO2008133101A1 (en) 2008-11-06

Family

ID=39925559

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057319 WO2008133101A1 (en) 2007-04-20 2008-04-15 Cooling system

Country Status (3)

Country Link
JP (1) JP2010156467A (en)
TW (1) TW200850137A (en)
WO (1) WO2008133101A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010133642A (en) * 2008-12-04 2010-06-17 Fujitsu Ltd Radiator, cooling unit, cooling system and electronic device
WO2011137774A1 (en) * 2010-11-17 2011-11-10 华为技术有限公司 Container-type data center
WO2012056261A1 (en) * 2010-10-28 2012-05-03 Asetek A/S Liquid cooling system for an electronic system
US8358505B2 (en) 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
JP2020170779A (en) * 2019-04-03 2020-10-15 株式会社日立パワーソリューションズ Cooling system
CN111863748A (en) * 2020-08-17 2020-10-30 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) Integrated micro cooler and cooling system
CN114087592A (en) * 2021-11-18 2022-02-25 九江畔月照明电器有限责任公司 Lighting lamp with indoor wide-angle light emitting

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160126095A (en) 2011-11-14 2016-11-01 가메다 세이카 컴패니 리미티드 Rice-protein composition and method for manufacturing same
KR101282780B1 (en) 2012-01-05 2013-07-05 국방과학연구소 The cooling equipment for separated multi-phase inverter
JP6331771B2 (en) 2014-06-28 2018-05-30 日本電産株式会社 Heat module
CN105611790B (en) * 2015-11-02 2017-10-13 上海理工大学 Closed spray cooling device
JP7131312B2 (en) 2018-11-07 2022-09-06 日本電産株式会社 Cooling system
CN113741126A (en) * 2020-05-29 2021-12-03 中强光电股份有限公司 Heat dissipation system and projection device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261223A (en) * 2001-03-02 2002-09-13 Sanyo Electric Co Ltd Structure and method for connection of cold plate
JP2004003816A (en) * 2002-04-02 2004-01-08 Mitsubishi Electric Corp Heat transport element, semiconductor device using heat transport element, and extra-atmospheric mobile using heat transport element
JP2004266247A (en) * 2003-02-12 2004-09-24 Denso Corp Cooling structure for heat generating component
JP2006173481A (en) * 2004-12-17 2006-06-29 Fujitsu Ltd Electronic equipment
JP2007027340A (en) * 2005-07-15 2007-02-01 Hitachi Ltd Cooling device for electronic equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261223A (en) * 2001-03-02 2002-09-13 Sanyo Electric Co Ltd Structure and method for connection of cold plate
JP2004003816A (en) * 2002-04-02 2004-01-08 Mitsubishi Electric Corp Heat transport element, semiconductor device using heat transport element, and extra-atmospheric mobile using heat transport element
JP2004266247A (en) * 2003-02-12 2004-09-24 Denso Corp Cooling structure for heat generating component
JP2006173481A (en) * 2004-12-17 2006-06-29 Fujitsu Ltd Electronic equipment
JP2007027340A (en) * 2005-07-15 2007-02-01 Hitachi Ltd Cooling device for electronic equipment

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010133642A (en) * 2008-12-04 2010-06-17 Fujitsu Ltd Radiator, cooling unit, cooling system and electronic device
WO2012056261A1 (en) * 2010-10-28 2012-05-03 Asetek A/S Liquid cooling system for an electronic system
US8358505B2 (en) 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
WO2011137774A1 (en) * 2010-11-17 2011-11-10 华为技术有限公司 Container-type data center
US8755184B2 (en) 2010-11-17 2014-06-17 Huawei Technologies Co., Ltd. Container data center
JP2020170779A (en) * 2019-04-03 2020-10-15 株式会社日立パワーソリューションズ Cooling system
CN111863748A (en) * 2020-08-17 2020-10-30 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) Integrated micro cooler and cooling system
CN111863748B (en) * 2020-08-17 2022-02-15 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) Integrated micro cooler and cooling system
CN114087592A (en) * 2021-11-18 2022-02-25 九江畔月照明电器有限责任公司 Lighting lamp with indoor wide-angle light emitting
CN114087592B (en) * 2021-11-18 2022-09-16 九江畔月照明电器有限责任公司 Lighting lamp with indoor wide-angle light emitting

Also Published As

Publication number Publication date
JP2010156467A (en) 2010-07-15
TW200850137A (en) 2008-12-16

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