WO2008132842A1 - 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品 - Google Patents
感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品 Download PDFInfo
- Publication number
- WO2008132842A1 WO2008132842A1 PCT/JP2008/001063 JP2008001063W WO2008132842A1 WO 2008132842 A1 WO2008132842 A1 WO 2008132842A1 JP 2008001063 W JP2008001063 W JP 2008001063W WO 2008132842 A1 WO2008132842 A1 WO 2008132842A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integer
- dry film
- resin composition
- photosensitive resin
- hydrogen atom
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/596,952 US8409784B2 (en) | 2007-04-24 | 2008-04-23 | Photosensitive resin composition, dry film, and processed product made using the same |
KR1020097022011A KR101161929B1 (ko) | 2007-04-24 | 2008-04-23 | 감광성 수지 조성물, 드라이 필름 및 그것을 이용한 가공품 |
JP2009511686A JP5167252B2 (ja) | 2007-04-24 | 2008-04-23 | 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品 |
CN2008800133769A CN101675387B (zh) | 2007-04-24 | 2008-04-23 | 感光性树脂组合物、干膜以及使用该干膜的加工品 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-113665 | 2007-04-24 | ||
JP2007113665 | 2007-04-24 | ||
JP2007-242638 | 2007-09-19 | ||
JP2007242638 | 2007-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008132842A1 true WO2008132842A1 (ja) | 2008-11-06 |
Family
ID=39925313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/001063 WO2008132842A1 (ja) | 2007-04-24 | 2008-04-23 | 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8409784B2 (ja) |
JP (1) | JP5167252B2 (ja) |
KR (1) | KR101161929B1 (ja) |
CN (1) | CN101675387B (ja) |
TW (1) | TWI477894B (ja) |
WO (1) | WO2008132842A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009186861A (ja) * | 2008-02-08 | 2009-08-20 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物 |
JP2010113245A (ja) * | 2008-11-07 | 2010-05-20 | Taiyo Ink Mfg Ltd | 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP2013054361A (ja) * | 2012-10-01 | 2013-03-21 | Taiyo Holdings Co Ltd | 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
WO2017169763A1 (ja) * | 2016-03-30 | 2017-10-05 | 東レ株式会社 | ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する表示装置、並びにその製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103694701B (zh) * | 2012-09-27 | 2017-07-21 | 新日铁住金化学株式会社 | 聚酰胺酸组合物、聚酰亚胺组合物、电路基板及其使用方法与层压体以及其制造方法 |
KR20150045329A (ko) * | 2013-10-18 | 2015-04-28 | 삼성디스플레이 주식회사 | 유기 발광 장치 |
CN109438735B (zh) * | 2018-11-08 | 2021-07-20 | 株洲时代华鑫新材料技术有限公司 | 一种高导热聚酰亚胺基复合薄膜及其制备方法 |
Citations (3)
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JP2000338667A (ja) * | 1999-03-24 | 2000-12-08 | Fujitsu Ltd | 感光性高誘電体組成物、その組成物からなる感光性高誘電体膜のパターン形成方法、及びその組成物を用いて製造したコンデンサ内蔵型多層回路基板 |
JP2001163936A (ja) * | 1999-12-03 | 2001-06-19 | Nippon Kayaku Co Ltd | 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物 |
JP2007293001A (ja) * | 2006-04-25 | 2007-11-08 | Mitsui Chemicals Inc | 保護膜形成用ドライフィルムおよびそれを用いた加工品 |
Family Cites Families (20)
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JPS5921646A (ja) * | 1982-06-25 | 1984-02-03 | Nippon Kayaku Co Ltd | エチレン性不飽和化合物およびその製造法 |
US4963645A (en) * | 1987-08-25 | 1990-10-16 | Ube Industries, Ltd. | Terminal-modified imide oligomer and solution composition of the same |
JP3084585B2 (ja) * | 1991-12-09 | 2000-09-04 | チッソ株式会社 | ポリイミド系感光性カバーコート剤 |
US5756260A (en) * | 1993-02-16 | 1998-05-26 | Sumitomo Bakelite Company Limited | Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same |
WO2000043439A1 (fr) * | 1999-01-21 | 2000-07-27 | Asahi Kasei Kabushiki Kaisha | Ester d'acide polyamique |
SG97168A1 (en) * | 1999-12-15 | 2003-07-18 | Ciba Sc Holding Ag | Photosensitive resin composition |
EP1327642A4 (en) | 2000-09-20 | 2006-07-19 | Taiyo Ink Mfg Co Ltd | CARBOXYLATED PHOTOSENSITIVE RESIN, THIS CONTAINING, ALKALI DEVELOPABLE, LIGHT-CURABLE / HEAT-CURABLE COMPOSITION, AND THEREOF HARDENED ARTICLE |
CN1327293C (zh) * | 2001-07-26 | 2007-07-18 | 西巴特殊化学品控股有限公司 | 光敏性树脂组合物 |
KR100529577B1 (ko) | 2001-11-22 | 2005-11-17 | 미쓰이 가가쿠 가부시키가이샤 | 감광성 수지조성물, 드라이필름 및 그것을 이용한 가공부품 |
JP3715963B2 (ja) | 2001-11-22 | 2005-11-16 | 三井化学株式会社 | 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工部品 |
CN100578359C (zh) * | 2003-03-06 | 2010-01-06 | 日本化药株式会社 | 感光树脂组合物和其固化物 |
US7851124B2 (en) * | 2003-06-03 | 2010-12-14 | Mitsui Chemicals, Inc. | Composition for forming wiring protective film and uses thereof |
CN1285970C (zh) * | 2003-06-03 | 2006-11-22 | 三井化学株式会社 | 布线保护膜形成用组合物及其用途 |
KR101041958B1 (ko) | 2003-12-22 | 2011-06-16 | 니폰 가야꾸 가부시끼가이샤 | 불포화기 함유 폴리아미드산 수지 및 그것을 이용한 감광성수지 조성물 및 그 경화물 |
JP4627146B2 (ja) | 2004-03-29 | 2011-02-09 | 京セラケミカル株式会社 | 感光性熱硬化型樹脂組成物及びフレキシブルプリント配線板 |
JP2005300785A (ja) | 2004-04-09 | 2005-10-27 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及びその硬化塗膜 |
JP4461037B2 (ja) | 2005-02-09 | 2010-05-12 | ニチゴー・モートン株式会社 | 感光性樹脂組成物およびそれを用いてなる感光性樹脂積層体 |
JP2006251715A (ja) | 2005-03-14 | 2006-09-21 | Kaneka Corp | 難燃性を有する感光性樹脂組成物及び感光性ドライフィルムレジスト |
US8361605B2 (en) * | 2007-04-24 | 2013-01-29 | Mitsui Chemicals, Inc. | Photosensitive resin composition, dry film, and processed product made using the same |
US8362103B2 (en) * | 2007-05-11 | 2013-01-29 | Mitsui Chemicals, Inc. | Resin composition, dry film, and processed product made using the same |
-
2008
- 2008-04-23 TW TW097114871A patent/TWI477894B/zh not_active IP Right Cessation
- 2008-04-23 US US12/596,952 patent/US8409784B2/en not_active Expired - Fee Related
- 2008-04-23 JP JP2009511686A patent/JP5167252B2/ja not_active Expired - Fee Related
- 2008-04-23 KR KR1020097022011A patent/KR101161929B1/ko active IP Right Grant
- 2008-04-23 CN CN2008800133769A patent/CN101675387B/zh not_active Expired - Fee Related
- 2008-04-23 WO PCT/JP2008/001063 patent/WO2008132842A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000338667A (ja) * | 1999-03-24 | 2000-12-08 | Fujitsu Ltd | 感光性高誘電体組成物、その組成物からなる感光性高誘電体膜のパターン形成方法、及びその組成物を用いて製造したコンデンサ内蔵型多層回路基板 |
JP2001163936A (ja) * | 1999-12-03 | 2001-06-19 | Nippon Kayaku Co Ltd | 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物 |
JP2007293001A (ja) * | 2006-04-25 | 2007-11-08 | Mitsui Chemicals Inc | 保護膜形成用ドライフィルムおよびそれを用いた加工品 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009186861A (ja) * | 2008-02-08 | 2009-08-20 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物 |
JP2010113245A (ja) * | 2008-11-07 | 2010-05-20 | Taiyo Ink Mfg Ltd | 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP2013054361A (ja) * | 2012-10-01 | 2013-03-21 | Taiyo Holdings Co Ltd | 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
WO2017169763A1 (ja) * | 2016-03-30 | 2017-10-05 | 東レ株式会社 | ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する表示装置、並びにその製造方法 |
JPWO2017169763A1 (ja) * | 2016-03-30 | 2019-02-07 | 東レ株式会社 | ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する表示装置、並びにその製造方法 |
US11086219B2 (en) | 2016-03-30 | 2021-08-10 | Toray Industries, Inc. | Negative-type photosensitive resin composition, cured film, display device that includes the cured film, and production method therefor |
Also Published As
Publication number | Publication date |
---|---|
TW200907568A (en) | 2009-02-16 |
KR101161929B1 (ko) | 2012-07-03 |
US8409784B2 (en) | 2013-04-02 |
CN101675387A (zh) | 2010-03-17 |
TWI477894B (zh) | 2015-03-21 |
CN101675387B (zh) | 2012-10-10 |
US20100084172A1 (en) | 2010-04-08 |
KR20100009551A (ko) | 2010-01-27 |
JPWO2008132842A1 (ja) | 2010-07-22 |
JP5167252B2 (ja) | 2013-03-21 |
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