WO2008132833A1 - Working apparatus, and cover for the working apparatus - Google Patents

Working apparatus, and cover for the working apparatus Download PDF

Info

Publication number
WO2008132833A1
WO2008132833A1 PCT/JP2008/001044 JP2008001044W WO2008132833A1 WO 2008132833 A1 WO2008132833 A1 WO 2008132833A1 JP 2008001044 W JP2008001044 W JP 2008001044W WO 2008132833 A1 WO2008132833 A1 WO 2008132833A1
Authority
WO
WIPO (PCT)
Prior art keywords
working apparatus
working
carriage
cover
frame
Prior art date
Application number
PCT/JP2008/001044
Other languages
French (fr)
Japanese (ja)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering, Inc. filed Critical Musashi Engineering, Inc.
Priority to KR1020097021760A priority Critical patent/KR101505891B1/en
Priority to CN2008800130135A priority patent/CN101663098B/en
Priority to JP2009511682A priority patent/JP5470036B2/en
Publication of WO2008132833A1 publication Critical patent/WO2008132833A1/en
Priority to HK10104110.5A priority patent/HK1137161A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C15/00—Enclosures for apparatus; Booths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/12—Guards, shields or dust excluders
    • B41J29/13—Cases or covers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/28—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing downwardly on flat surfaces, e.g. of books, drawings, boxes, envelopes, e.g. flat-bed ink-jet printers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Manipulator (AREA)
  • Auxiliary Devices For Machine Tools (AREA)

Abstract

Provided are a working apparatus, which can maintain a working head easily and which can perform the maintenance without deteriorating the cleanness, and a cover for the working apparatus. The working apparatus moves a table mounted on a carriage and a working head confronting the table, relative to each other, thereby to perform a desired work on a work mounted on the table. The working apparatus comprises a plurality of supports arranged on the carriage, a frame supported by the supports and extended in a first direction, and a working head arranged on the frame movably in a first direction. The working apparatus and the working apparatus cover are characterized in that the frame is constituted to have its end portions extended to the outer sides of the outer edges of the carriage, and in that the working head can move to the outer side of the outer edges of the carriage.
PCT/JP2008/001044 2007-04-23 2008-04-22 Working apparatus, and cover for the working apparatus WO2008132833A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097021760A KR101505891B1 (en) 2007-04-23 2008-04-22 Working apparatus, and cover for the working apparatus
CN2008800130135A CN101663098B (en) 2007-04-23 2008-04-22 Working apparatus, and cover for the working apparatus
JP2009511682A JP5470036B2 (en) 2007-04-23 2008-04-22 Working device and working device cover
HK10104110.5A HK1137161A1 (en) 2007-04-23 2010-04-27 Working apparatus, and cover for the working apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-113370 2007-04-23
JP2007113370 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008132833A1 true WO2008132833A1 (en) 2008-11-06

Family

ID=39925304

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001044 WO2008132833A1 (en) 2007-04-23 2008-04-22 Working apparatus, and cover for the working apparatus

Country Status (6)

Country Link
JP (1) JP5470036B2 (en)
KR (1) KR101505891B1 (en)
CN (1) CN101663098B (en)
HK (1) HK1137161A1 (en)
TW (1) TWI483785B (en)
WO (1) WO2008132833A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171034A (en) * 2009-01-20 2010-08-05 Panasonic Corp Resin applying device
JP2010253446A (en) * 2009-04-28 2010-11-11 Hitachi Plant Technologies Ltd Apparatus and method for coating paste
JP2011056424A (en) * 2009-09-10 2011-03-24 Shibaura Mechatronics Corp Paste applicator
JP2014195805A (en) * 2014-05-19 2014-10-16 芝浦メカトロニクス株式会社 Paste coating apparatus
JP2015099730A (en) * 2013-11-20 2015-05-28 セーレン株式会社 Ink jet printer
CN114364537A (en) * 2019-05-16 2022-04-15 西门子股份公司 Printing device, printing press system and method for printing objects
US12011935B2 (en) 2019-05-16 2024-06-18 Siemens Aktiengesellschaft Printing apparatus, printer system and method for printing on an object

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112623700A (en) * 2020-12-04 2021-04-09 深圳市韩安特科技有限公司 Display screen maintenance equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002283163A (en) * 2001-03-22 2002-10-03 Toyoda Mach Works Ltd Tool breakage detecting device
JP2003275646A (en) * 2002-03-19 2003-09-30 Seiko Epson Corp Cleaning unit of discharge head for functional liquid droplet in discharge device and discharge device with the same, manufacturing method for liquid crystal display device, organic el device, electron emission device, pdp device, electrophoretic display device, color filter and organic el, and forming method for spacer, metallic wiring, lens, resist and light diffusing body
JP2005146768A (en) * 2003-11-19 2005-06-09 Seiko Epson Corp Manufacturing method for chamber device, chamber equipment, liquid drop discharging equipment and electro-optical device
JP2005181476A (en) * 2003-12-17 2005-07-07 Dainippon Printing Co Ltd Pattern formation device
JP2006078896A (en) * 2004-09-10 2006-03-23 Seiko Epson Corp Drawing method using droplet ejection apparatus, droplet ejection apparatus, manufacturing method of electrooptical apparatus, electrooptical apparatus and electronic equipment
JP2006346593A (en) * 2005-06-16 2006-12-28 Shibaura Mechatronics Corp Paste applying apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1261230C (en) * 2003-05-19 2006-06-28 乐金电子（沈阳）有限公司 Ink jetting coating unit for making display board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002283163A (en) * 2001-03-22 2002-10-03 Toyoda Mach Works Ltd Tool breakage detecting device
JP2003275646A (en) * 2002-03-19 2003-09-30 Seiko Epson Corp Cleaning unit of discharge head for functional liquid droplet in discharge device and discharge device with the same, manufacturing method for liquid crystal display device, organic el device, electron emission device, pdp device, electrophoretic display device, color filter and organic el, and forming method for spacer, metallic wiring, lens, resist and light diffusing body
JP2005146768A (en) * 2003-11-19 2005-06-09 Seiko Epson Corp Manufacturing method for chamber device, chamber equipment, liquid drop discharging equipment and electro-optical device
JP2005181476A (en) * 2003-12-17 2005-07-07 Dainippon Printing Co Ltd Pattern formation device
JP2006078896A (en) * 2004-09-10 2006-03-23 Seiko Epson Corp Drawing method using droplet ejection apparatus, droplet ejection apparatus, manufacturing method of electrooptical apparatus, electrooptical apparatus and electronic equipment
JP2006346593A (en) * 2005-06-16 2006-12-28 Shibaura Mechatronics Corp Paste applying apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171034A (en) * 2009-01-20 2010-08-05 Panasonic Corp Resin applying device
JP2010253446A (en) * 2009-04-28 2010-11-11 Hitachi Plant Technologies Ltd Apparatus and method for coating paste
JP2011056424A (en) * 2009-09-10 2011-03-24 Shibaura Mechatronics Corp Paste applicator
JP2015099730A (en) * 2013-11-20 2015-05-28 セーレン株式会社 Ink jet printer
JP2014195805A (en) * 2014-05-19 2014-10-16 芝浦メカトロニクス株式会社 Paste coating apparatus
CN114364537A (en) * 2019-05-16 2022-04-15 西门子股份公司 Printing device, printing press system and method for printing objects
CN114364537B (en) * 2019-05-16 2024-01-12 西门子股份公司 Printing apparatus, printing press system and method for printing an object
US12011935B2 (en) 2019-05-16 2024-06-18 Siemens Aktiengesellschaft Printing apparatus, printer system and method for printing on an object

Also Published As

Publication number Publication date
HK1137161A1 (en) 2010-07-23
KR101505891B1 (en) 2015-03-30
JPWO2008132833A1 (en) 2010-07-22
TWI483785B (en) 2015-05-11
JP5470036B2 (en) 2014-04-16
TW200848167A (en) 2008-12-16
KR20100015684A (en) 2010-02-12
CN101663098B (en) 2013-02-27
CN101663098A (en) 2010-03-03

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