WO2008126444A1 - Heat radiation structure and portable equipment - Google Patents

Heat radiation structure and portable equipment Download PDF

Info

Publication number
WO2008126444A1
WO2008126444A1 PCT/JP2008/051154 JP2008051154W WO2008126444A1 WO 2008126444 A1 WO2008126444 A1 WO 2008126444A1 JP 2008051154 W JP2008051154 W JP 2008051154W WO 2008126444 A1 WO2008126444 A1 WO 2008126444A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat radiation
radiation structure
portable equipment
heat storage
Prior art date
Application number
PCT/JP2008/051154
Other languages
French (fr)
Japanese (ja)
Inventor
Nobuhiro Mikami
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to CN2008800107139A priority Critical patent/CN101647330B/en
Priority to JP2009508935A priority patent/JPWO2008126444A1/en
Priority to US12/593,434 priority patent/US8443874B2/en
Publication of WO2008126444A1 publication Critical patent/WO2008126444A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/203—Heat conductive hinge
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H04M1/0216—Foldable in one direction, i.e. using a one degree of freedom hinge

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)

Abstract

A heat radiation structure that without the user's feeling of discomfort, is capable of radiating heat from heat generating parts; and relevant portable equipment. The heat radiation structure is one comprising a heat conductive member for conduction of heat from heat generating parts and a heat storage part thermally connected to the heat conductive member, wherein the heat storage part includes a stretch pack and, charged therein, a heat storage material capable of volume change in accordance with temperature change, and wherein the pack is provided so as to create an interstice between the same and a first heat radiation part at normal temperature and to be brought into contact with the first heat radiation part when the heat storage material is expanded by a temperature change.
PCT/JP2008/051154 2007-03-30 2008-01-28 Heat radiation structure and portable equipment WO2008126444A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800107139A CN101647330B (en) 2007-03-30 2008-01-28 Heat radiation structure and portable equipment
JP2009508935A JPWO2008126444A1 (en) 2007-03-30 2008-01-28 Heat dissipation structure and portable device
US12/593,434 US8443874B2 (en) 2007-03-30 2008-01-28 Heat dissipating structure and portable phone

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007090815 2007-03-30
JP2007-090815 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008126444A1 true WO2008126444A1 (en) 2008-10-23

Family

ID=39863603

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051154 WO2008126444A1 (en) 2007-03-30 2008-01-28 Heat radiation structure and portable equipment

Country Status (4)

Country Link
US (1) US8443874B2 (en)
JP (1) JPWO2008126444A1 (en)
CN (1) CN101647330B (en)
WO (1) WO2008126444A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014179483A (en) * 2013-03-15 2014-09-25 Furukawa Electric Co Ltd:The Heat exchange module, motor structure using the same, method for manufacturing heat exchange module and heating system
JP2015029036A (en) * 2013-06-27 2015-02-12 ソニー株式会社 Electronic apparatus and control method of electronic apparatus
JP2015032743A (en) * 2013-08-05 2015-02-16 富士通株式会社 Electronic apparatus
JP2019045071A (en) * 2017-09-01 2019-03-22 Ｊｏｙｓｏｎ Ｓａｆｅｔｙ Ｓｙｓｔｅｍｓ Ｊａｐａｎ株式会社 Temperature adjustment device and steering
JP2020504904A (en) * 2016-12-29 2020-02-13 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． Heat radiating device and terminal device having the same
JP2020030694A (en) * 2018-08-23 2020-02-27 レノボ・シンガポール・プライベート・リミテッド Electronic apparatus

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FR2977121B1 (en) * 2011-06-22 2014-04-25 Commissariat Energie Atomique THERMAL MANAGEMENT SYSTEM WITH VARIABLE VOLUME MATERIAL
US8913391B2 (en) * 2012-01-30 2014-12-16 Alcatel Lucent Board-level heat transfer apparatus for communication platforms
KR101861278B1 (en) * 2012-03-22 2018-05-25 엘지전자 주식회사 Mobile terminal
US9136202B2 (en) * 2012-04-17 2015-09-15 Qualcomm Incorporated Enhanced package thermal management using external and internal capacitive thermal material
JP6199411B2 (en) * 2013-11-26 2017-09-20 株式会社村田製作所 Electronics
CN106304772B (en) * 2015-06-09 2019-02-05 联想(北京)有限公司 Radiator, electronic equipment and thermal control method
CN105744813A (en) * 2016-04-29 2016-07-06 广东欧珀移动通信有限公司 Mobile terminal
US9918407B2 (en) 2016-08-02 2018-03-13 Qualcomm Incorporated Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device
CN110199539B (en) 2017-01-13 2024-03-01 华为技术有限公司 Method, device and system for adjusting radio resource configuration
CN108578726A (en) * 2018-05-31 2018-09-28 包旭红 A kind of dedicated steam sterilizing disinfecting equipment of medical treatment
US11181323B2 (en) * 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements
US11871542B2 (en) * 2019-06-19 2024-01-09 Resonac Corporation User device and case
KR20220041493A (en) * 2020-09-25 2022-04-01 삼성전자주식회사 Electronic device including heat spread member

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JPH07221479A (en) * 1994-02-08 1995-08-18 Mitsubishi Electric Corp Electronic equipment
JPH11312883A (en) * 1998-04-28 1999-11-09 Hitachi Ltd Electronic equipment
JP2004152895A (en) * 2002-10-29 2004-05-27 Sony Corp Cooling device and electronic apparatus including the same

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JPS61119097A (en) * 1984-11-15 1986-06-06 株式会社東芝 Heat dissipation controller
JPS6273595A (en) 1985-09-25 1987-04-04 松下電工株式会社 Inverter
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US6202739B1 (en) * 1998-11-25 2001-03-20 Motorola, Inc. Apparatus including a heat-dissipating apparatus, and method for forming same
US6260613B1 (en) * 1999-01-05 2001-07-17 Intel Corporation Transient cooling augmentation for electronic components
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JP5061406B2 (en) 2000-10-12 2012-10-31 株式会社Ｇｓユアサ Battery pack
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CN1294794C (en) * 2004-05-21 2007-01-10 台达电子工业股份有限公司 Electronic device with radiating structure
JP2006100564A (en) 2004-09-29 2006-04-13 Sony Corp Electronic apparatus
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KR100677744B1 (en) * 2005-03-07 2007-02-02 삼성전자주식회사 Portable apparatus
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JPH07221479A (en) * 1994-02-08 1995-08-18 Mitsubishi Electric Corp Electronic equipment
JPH11312883A (en) * 1998-04-28 1999-11-09 Hitachi Ltd Electronic equipment
JP2004152895A (en) * 2002-10-29 2004-05-27 Sony Corp Cooling device and electronic apparatus including the same

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014179483A (en) * 2013-03-15 2014-09-25 Furukawa Electric Co Ltd:The Heat exchange module, motor structure using the same, method for manufacturing heat exchange module and heating system
JP2015029036A (en) * 2013-06-27 2015-02-12 ソニー株式会社 Electronic apparatus and control method of electronic apparatus
US10097025B2 (en) 2013-06-27 2018-10-09 Sony Corporation Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system
US10447059B2 (en) 2013-06-27 2019-10-15 Sony Corporation Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system
US10734829B2 (en) 2013-06-27 2020-08-04 Sony Corporation Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system
JP2015032743A (en) * 2013-08-05 2015-02-16 富士通株式会社 Electronic apparatus
JP2020504904A (en) * 2016-12-29 2020-02-13 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． Heat radiating device and terminal device having the same
US11016546B2 (en) 2016-12-29 2021-05-25 Huawei Technologies Co., Ltd. Heat dissipation apparatus and terminal device having same
JP7015837B2 (en) 2016-12-29 2022-02-03 華為技術有限公司 Heat dissipation device and terminal device with it
JP2019045071A (en) * 2017-09-01 2019-03-22 Ｊｏｙｓｏｎ Ｓａｆｅｔｙ Ｓｙｓｔｅｍｓ Ｊａｐａｎ株式会社 Temperature adjustment device and steering
JP2020030694A (en) * 2018-08-23 2020-02-27 レノボ・シンガポール・プライベート・リミテッド Electronic apparatus

Also Published As

Publication number Publication date
JPWO2008126444A1 (en) 2010-07-22
CN101647330B (en) 2012-05-23
US20100126708A1 (en) 2010-05-27
CN101647330A (en) 2010-02-10
US8443874B2 (en) 2013-05-21

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