WO2008123437A1 - 導電膜及びその製造方法 - Google Patents
導電膜及びその製造方法 Download PDFInfo
- Publication number
- WO2008123437A1 WO2008123437A1 PCT/JP2008/056150 JP2008056150W WO2008123437A1 WO 2008123437 A1 WO2008123437 A1 WO 2008123437A1 JP 2008056150 W JP2008056150 W JP 2008056150W WO 2008123437 A1 WO2008123437 A1 WO 2008123437A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive film
- producing
- smoothing
- same
- silver metal
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 3
- 238000009499 grossing Methods 0.000 abstract 3
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
- Silver Salt Photography Or Processing Solution Therefor (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/594,120 US8071271B2 (en) | 2007-03-30 | 2008-03-28 | Conductive film and method for producing the same |
KR1020097020408A KR101340119B1 (ko) | 2007-03-30 | 2008-03-28 | 도전성 필름 및 그 제조 방법 |
CN2008800107321A CN101647074B (zh) | 2007-03-30 | 2008-03-28 | 导电膜及其生产方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-093209 | 2007-03-30 | ||
JP2007093209A JP5192713B2 (ja) | 2007-03-30 | 2007-03-30 | 導電膜及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008123437A1 true WO2008123437A1 (ja) | 2008-10-16 |
Family
ID=39830922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056150 WO2008123437A1 (ja) | 2007-03-30 | 2008-03-28 | 導電膜及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8071271B2 (ja) |
JP (1) | JP5192713B2 (ja) |
KR (1) | KR101340119B1 (ja) |
CN (1) | CN101647074B (ja) |
WO (1) | WO2008123437A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011131500A (ja) * | 2009-12-24 | 2011-07-07 | Fujifilm Corp | 導電膜形成用感光材料、及び導電膜の製造方法 |
JP2012018763A (ja) * | 2010-07-06 | 2012-01-26 | Fujifilm Corp | 導電膜の製造方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2003946A4 (en) * | 2006-03-28 | 2010-11-03 | Fujifilm Corp | CONDUCTIVE FILM, MANUFACTURING METHOD THEREOF, AND TRANSPARENT ELECTROMAGNETIC SHIELDING FILM |
JP5207728B2 (ja) * | 2006-12-21 | 2013-06-12 | 富士フイルム株式会社 | 導電膜およびその製造方法 |
EP2265086B1 (en) | 2008-04-11 | 2016-07-27 | FUJIFILM Corporation | Heat generating body |
JP2009272303A (ja) | 2008-04-11 | 2009-11-19 | Fujifilm Corp | 車両灯具用前面カバー及び車両灯具用前面カバーの製造方法、並びに、電熱構造 |
JP2010199052A (ja) * | 2009-02-02 | 2010-09-09 | Fujifilm Corp | 導電膜の製造方法 |
JP2011018028A (ja) * | 2009-06-10 | 2011-01-27 | Fujifilm Corp | 導電膜形成用感光材料、導電膜および導電膜の製造方法 |
JP5629077B2 (ja) * | 2009-09-29 | 2014-11-19 | 富士フイルム株式会社 | 導電膜の製造方法 |
US20140367620A1 (en) * | 2013-06-17 | 2014-12-18 | Ronald Anthony Gogle | Method for improving patterned silver conductivity |
US11999883B2 (en) * | 2018-07-06 | 2024-06-04 | Swift Textile Metalizing LLC | Lightweight RF shielding conductive elastomeric tape |
CN110952081B (zh) * | 2018-09-27 | 2022-04-29 | Imec 非营利协会 | 用于形成互连部的方法和溶液 |
CN114002174B (zh) * | 2021-09-26 | 2023-09-15 | 陕西新时代生物转化检测有限公司 | 一种精确测定银离子含量的紫外吸收光谱法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1116491A (ja) * | 1997-06-26 | 1999-01-22 | Dainippon Printing Co Ltd | プラズマディスプレイパネル用厚膜パターンの形成方法 |
WO2006088059A1 (ja) * | 2005-02-15 | 2006-08-24 | Fujifilm Corporation | 透光性導電性膜、透光性電磁波シールド膜および光学フィルターならびにディスプレイ用フィルターの製造方法 |
JP2006290948A (ja) * | 2005-04-07 | 2006-10-26 | Fuji Photo Film Co Ltd | 防眩フィルム及び該防眩フィルムを有する合わせガラス |
JP2006336057A (ja) * | 2005-05-31 | 2006-12-14 | Fujifilm Holdings Corp | 導電性膜の製造方法及びその製造装置並びに透光性電磁波シールド膜及びプラズマディスプレーパネル |
JP2007129205A (ja) * | 2005-09-30 | 2007-05-24 | Fujifilm Corp | 導電性膜の製造方法及び導電性膜製造用感光材料 |
WO2007088896A1 (ja) * | 2006-01-31 | 2007-08-09 | Fujifilm Corporation | 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル |
JP2007235115A (ja) * | 2006-01-31 | 2007-09-13 | Fujifilm Corp | 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3388682B2 (ja) | 1996-05-23 | 2003-03-24 | 日立化成工業株式会社 | 電磁波シールド性と透明性を有するディスプレイ用フィルムの製造法 |
US6054647A (en) * | 1997-11-26 | 2000-04-25 | National-Standard Company | Grid material for electromagnetic shielding |
JP2000013088A (ja) | 1998-06-26 | 2000-01-14 | Hitachi Chem Co Ltd | 電磁波シールドフィルムの製造方法および該電磁波シールドフィルムを用いた電磁波遮蔽体、ディスプレイ |
EP1553212B1 (en) * | 2002-07-12 | 2017-08-23 | Fujimori Kogyo Co., Ltd. | Electromagnetic wave shield material and process for producing the same |
JP4641719B2 (ja) | 2002-12-27 | 2011-03-02 | 富士フイルム株式会社 | 透光性電磁波シールド膜の製造方法及び透光性電磁波シールド膜 |
JP4807934B2 (ja) | 2002-12-27 | 2011-11-02 | 富士フイルム株式会社 | 透光性電磁波シールド膜およびその製造方法 |
JP2006024485A (ja) | 2004-07-09 | 2006-01-26 | Mitsubishi Paper Mills Ltd | 導電性膜または導電性画像作製方法 |
JP2006228469A (ja) | 2005-02-15 | 2006-08-31 | Fuji Photo Film Co Ltd | 導電性膜形成用感光材料、導電性膜、透光性電磁波シールド膜、及びそれらの製造方法 |
JP2006332459A (ja) * | 2005-05-27 | 2006-12-07 | Fujifilm Holdings Corp | 導電性金属膜形成用感光材料、導電性金属膜の製造方法、導電性金属膜、及びプラズマディスプレイパネル用透光性電磁波シールド膜 |
US20070015094A1 (en) * | 2005-07-13 | 2007-01-18 | Konica Minolta Medical & Graphic, Inc. | Electromagnetic wave shielding material, method for manufacturing the same and electromagnetic wave shielding material for plasma display panel |
KR101039543B1 (ko) | 2006-09-28 | 2011-06-09 | 후지필름 가부시키가이샤 | 자발광 표시 장치, 자발광 표시 장치의 제조 방법, 투명 도전성 필름, 전계 발광 소자, 태양 전지용 투명 전극 및 전자 페이퍼용 투명 전극 |
JP5207728B2 (ja) | 2006-12-21 | 2013-06-12 | 富士フイルム株式会社 | 導電膜およびその製造方法 |
-
2007
- 2007-03-30 JP JP2007093209A patent/JP5192713B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-28 WO PCT/JP2008/056150 patent/WO2008123437A1/ja active Application Filing
- 2008-03-28 CN CN2008800107321A patent/CN101647074B/zh not_active Expired - Fee Related
- 2008-03-28 KR KR1020097020408A patent/KR101340119B1/ko not_active IP Right Cessation
- 2008-03-28 US US12/594,120 patent/US8071271B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1116491A (ja) * | 1997-06-26 | 1999-01-22 | Dainippon Printing Co Ltd | プラズマディスプレイパネル用厚膜パターンの形成方法 |
WO2006088059A1 (ja) * | 2005-02-15 | 2006-08-24 | Fujifilm Corporation | 透光性導電性膜、透光性電磁波シールド膜および光学フィルターならびにディスプレイ用フィルターの製造方法 |
JP2006290948A (ja) * | 2005-04-07 | 2006-10-26 | Fuji Photo Film Co Ltd | 防眩フィルム及び該防眩フィルムを有する合わせガラス |
JP2006336057A (ja) * | 2005-05-31 | 2006-12-14 | Fujifilm Holdings Corp | 導電性膜の製造方法及びその製造装置並びに透光性電磁波シールド膜及びプラズマディスプレーパネル |
JP2007129205A (ja) * | 2005-09-30 | 2007-05-24 | Fujifilm Corp | 導電性膜の製造方法及び導電性膜製造用感光材料 |
WO2007088896A1 (ja) * | 2006-01-31 | 2007-08-09 | Fujifilm Corporation | 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル |
JP2007235115A (ja) * | 2006-01-31 | 2007-09-13 | Fujifilm Corp | 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011131500A (ja) * | 2009-12-24 | 2011-07-07 | Fujifilm Corp | 導電膜形成用感光材料、及び導電膜の製造方法 |
JP2012018763A (ja) * | 2010-07-06 | 2012-01-26 | Fujifilm Corp | 導電膜の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100190111A1 (en) | 2010-07-29 |
KR101340119B1 (ko) | 2013-12-10 |
US8071271B2 (en) | 2011-12-06 |
KR20100014684A (ko) | 2010-02-10 |
CN101647074B (zh) | 2012-08-22 |
JP5192713B2 (ja) | 2013-05-08 |
JP2008251417A (ja) | 2008-10-16 |
CN101647074A (zh) | 2010-02-10 |
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