WO2008120547A1 - コンタクタ及びコンタクタの製造方法 - Google Patents

コンタクタ及びコンタクタの製造方法 Download PDF

Info

Publication number
WO2008120547A1
WO2008120547A1 PCT/JP2008/054526 JP2008054526W WO2008120547A1 WO 2008120547 A1 WO2008120547 A1 WO 2008120547A1 JP 2008054526 W JP2008054526 W JP 2008054526W WO 2008120547 A1 WO2008120547 A1 WO 2008120547A1
Authority
WO
WIPO (PCT)
Prior art keywords
contactor
layer
manufacturing
base part
sio2
Prior art date
Application number
PCT/JP2008/054526
Other languages
English (en)
French (fr)
Inventor
Hidenori Kitazume
Koji Asano
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to US12/532,928 priority Critical patent/US8441271B2/en
Priority to JP2009507444A priority patent/JPWO2008120547A1/ja
Publication of WO2008120547A1 publication Critical patent/WO2008120547A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

コンタクタ５０は、後端側がベース部５１に設けられ、先端側がベース部５１から突出している梁部５３の一部を構成しているシリコン層５６ｂと、シリコン層５６ｂの上に形成された、絶縁層としてのＳｉＯ２層５６ａと、ＳｉＯ２層５６ａの上に形成された導電層５４と、を備えている。
PCT/JP2008/054526 2007-04-03 2008-03-12 コンタクタ及びコンタクタの製造方法 WO2008120547A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/532,928 US8441271B2 (en) 2007-04-03 2008-03-12 Contactor and method of production of contactor
JP2009507444A JPWO2008120547A1 (ja) 2007-04-03 2008-03-12 コンタクタ及びコンタクタの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007097396 2007-04-03
JP2007-097396 2007-04-03

Publications (1)

Publication Number Publication Date
WO2008120547A1 true WO2008120547A1 (ja) 2008-10-09

Family

ID=39808131

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054526 WO2008120547A1 (ja) 2007-04-03 2008-03-12 コンタクタ及びコンタクタの製造方法

Country Status (6)

Country Link
US (1) US8441271B2 (ja)
JP (1) JPWO2008120547A1 (ja)
KR (1) KR101092389B1 (ja)
CN (1) CN101652665A (ja)
TW (1) TW200902987A (ja)
WO (1) WO2008120547A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11385258B2 (en) 2017-05-26 2022-07-12 Tektronix, Inc. Encapsulated component attachment technique using a UV-cure conductive adhesive

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4812512B2 (ja) * 2006-05-19 2011-11-09 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法
DE102008052244A1 (de) * 2008-10-18 2010-04-22 Carl Freudenberg Kg Flexible Leiterplatte
KR101022873B1 (ko) * 2009-09-14 2011-03-16 삼성전기주식회사 인쇄회로기판의 제조방법
US8525168B2 (en) * 2011-07-11 2013-09-03 International Business Machines Corporation Integrated circuit (IC) test probe
JP2014011373A (ja) * 2012-07-02 2014-01-20 Tokyo Electron Ltd 半導体検査システム及びインターフェース部の結露防止方法
CN102879618A (zh) * 2012-09-29 2013-01-16 郑礼朋 测试机构及其制作方法
US9041198B2 (en) * 2013-10-22 2015-05-26 Applied Materials, Inc. Maskless hybrid laser scribing and plasma etching wafer dicing process
JP6308910B2 (ja) * 2013-11-13 2018-04-11 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
CN106526941A (zh) * 2016-12-30 2017-03-22 惠科股份有限公司 显示面板加工工艺的改善方法、显示面板加工设备
US10739381B2 (en) * 2017-05-26 2020-08-11 Tektronix, Inc. Component attachment technique using a UV-cure conductive adhesive
CN110662972B (zh) * 2017-07-21 2021-12-14 吉佳蓝科技股份有限公司 探针卡用薄膜电阻器
CN110824207B (zh) * 2018-08-08 2022-03-22 台湾中华精测科技股份有限公司 射频探针卡装置及其间距转换板
CN113109603A (zh) * 2020-01-13 2021-07-13 科磊股份有限公司 具有多个金属涂层的悬臂式探针
US11882659B2 (en) * 2020-10-22 2024-01-23 Raytheon Company Chip substrate for reducing thermal load on a chip assembly mounted thereon

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321169A (ja) * 1994-03-31 1995-12-08 Nitto Denko Corp プローブ構造
JP2000180471A (ja) * 1998-12-11 2000-06-30 Hitachi Cable Ltd ベアチップ検査用プローブ基板
JP2001091539A (ja) * 1999-08-03 2001-04-06 Advantest Corp マイクロファブリケーションで形成するコンタクトストラクチャ
JP2003222638A (ja) * 2002-01-30 2003-08-08 Mitsubishi Materials Corp コンタクトプローブおよびその製造方法
JP2004205511A (ja) * 2002-12-20 2004-07-22 Rosemount Aerospace Inc プローブフィンガ構造体及びその製造方法
WO2007000799A1 (ja) * 2005-06-27 2007-01-04 Advantest Corporation コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、試験装置、コンタクトストラクチャ製造方法、及び、コンタクトストラクチャ製造装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970707444A (ko) 1994-10-28 1997-12-01 야마모토 히데키 프로브 구조(probe structure)
EP1351060B1 (en) * 1997-07-24 2005-10-26 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a test probe for semiconductor devices
JP3420706B2 (ja) * 1998-09-22 2003-06-30 株式会社東芝 半導体装置、半導体装置の製造方法、回路基板、回路基板の製造方法
US6420884B1 (en) * 1999-01-29 2002-07-16 Advantest Corp. Contact structure formed by photolithography process
US6436802B1 (en) 1998-11-30 2002-08-20 Adoamtest Corp. Method of producing contact structure
US6535003B2 (en) 1999-01-29 2003-03-18 Advantest, Corp. Contact structure having silicon finger contactor
US6232669B1 (en) 1999-10-12 2001-05-15 Advantest Corp. Contact structure having silicon finger contactors and total stack-up structure using same
TW508440B (en) * 1999-12-27 2002-11-01 Hoya Co Ltd Probe structure and manufacturing method thereof
JP4881316B2 (ja) 2005-11-09 2012-02-22 株式会社アドバンテスト 電子部品試験装置、及び、電子部品試験装置のコンタクトアームの最適押付条件設定方法
DE112006000019T5 (de) 2006-02-13 2008-07-24 Advantest Corp. Kontaktstößel, Kontaktarm und Prüfgerät für elektronische Bauelemente
US20100126289A1 (en) 2007-04-03 2010-05-27 Advantest Corporation Method of mounting contactor
WO2009013809A1 (ja) 2007-07-24 2009-01-29 Advantest Corporation コンタクタ、プローブカード及びコンタクタの実装方法。

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321169A (ja) * 1994-03-31 1995-12-08 Nitto Denko Corp プローブ構造
JP2000180471A (ja) * 1998-12-11 2000-06-30 Hitachi Cable Ltd ベアチップ検査用プローブ基板
JP2001091539A (ja) * 1999-08-03 2001-04-06 Advantest Corp マイクロファブリケーションで形成するコンタクトストラクチャ
JP2003222638A (ja) * 2002-01-30 2003-08-08 Mitsubishi Materials Corp コンタクトプローブおよびその製造方法
JP2004205511A (ja) * 2002-12-20 2004-07-22 Rosemount Aerospace Inc プローブフィンガ構造体及びその製造方法
WO2007000799A1 (ja) * 2005-06-27 2007-01-04 Advantest Corporation コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、試験装置、コンタクトストラクチャ製造方法、及び、コンタクトストラクチャ製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11385258B2 (en) 2017-05-26 2022-07-12 Tektronix, Inc. Encapsulated component attachment technique using a UV-cure conductive adhesive

Also Published As

Publication number Publication date
JPWO2008120547A1 (ja) 2010-07-15
US8441271B2 (en) 2013-05-14
TW200902987A (en) 2009-01-16
US20100102838A1 (en) 2010-04-29
KR101092389B1 (ko) 2011-12-09
KR20090130237A (ko) 2009-12-21
CN101652665A (zh) 2010-02-17

Similar Documents

Publication Publication Date Title
WO2008120547A1 (ja) コンタクタ及びコンタクタの製造方法
TW200713415A (en) MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same
EP1740156B8 (de) Verfahren zur herstellung einer gegen missbrauch gesicherten, festen darreinchungsform
MY149110A (en) Method for manufacturing conductive contact holder, and conductive contact holder
WO2004097518A3 (en) A method of forming stepped structures employing imprint lithography
WO2010139342A8 (en) Lens and method for manufacturing same
WO2006031554A3 (en) Methods for preventing, removing, reducing, or disrupting biofilm
AU2003247705A1 (en) Pin-array, separable, compliant electrical contact member
WO2009115686A3 (fr) Composant de connexion muni d'inserts creux et son procede de realisation
WO2009029570A3 (en) Laser patterning of a carbon nanotube layer
WO2007116157A3 (fr) Interrupteur thermique
WO2007112279A3 (en) Resonators
WO2006039907A3 (de) Elektrischer schaltkreis mit einer nanostruktur und verfahren zum herstellen einer kontaktierung einer nanostruktur
WO2007027494A3 (en) Morphous solid dispersions of 7-chloro-n,n, 5-trimethyl-4-oxo-3-phenyl-3, 5,-dihydro-4h-pyridazino [4, 5-b] indole-1-acetamide
WO2005011061A3 (en) High-speed electrical connector
WO2007067433A3 (en) Poly(trimethylene terephthalate)/poly(alpha-hydroxy acid) films
WO2007067435A3 (en) Poly(trimethylene terephthalate)/poly(alpha-hydroxy acid) bi-constituent filaments
EP1538681A3 (en) Process for producing optical semiconductor device
WO2008101485A3 (de) Steckerstift
TW200742140A (en) Method of manufacturing an electrical element
WO2007078679A3 (en) Practical, cost-effective synthesis of ubiquinones
WO2004004639A3 (en) A novel stable formulation
WO2009077268A3 (de) Kühlkörper wenigstens eines elektrischen bauteils
WO2005019321A3 (en) Silicon-containing treatments for solid substrates
WO2007067434A3 (en) Poly(trimethylene terephthalate)/poly(alpha-hydroxy acid) molded, shaped articles

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880010281.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08721942

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009507444

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12532928

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20097022300

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 08721942

Country of ref document: EP

Kind code of ref document: A1