WO2008117645A1 - シート状プローブおよびその製造方法 - Google Patents

シート状プローブおよびその製造方法 Download PDF

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Publication number
WO2008117645A1
WO2008117645A1 PCT/JP2008/054050 JP2008054050W WO2008117645A1 WO 2008117645 A1 WO2008117645 A1 WO 2008117645A1 JP 2008054050 W JP2008054050 W JP 2008054050W WO 2008117645 A1 WO2008117645 A1 WO 2008117645A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
conductive layer
surface electrode
electrode section
probe
Prior art date
Application number
PCT/JP2008/054050
Other languages
English (en)
French (fr)
Inventor
Akira Matsuura
Hitoshi Fujiyama
Kazuo Inoue
Original Assignee
Jsr Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corporation filed Critical Jsr Corporation
Publication of WO2008117645A1 publication Critical patent/WO2008117645A1/ja

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

　被検査電極のピッチが微細であっても被検査対象の回路装置に対して安定な電気的接続状態が確実に得られるシート状プローブおよびその製造方法を提供する。 　絶縁性シートに金属シートが積層され、絶縁性シートを貫通する剛性導体からなる表面電極部およびその端部の第１導電層が形成された第１のシートと、絶縁性シートに金属シートが積層され、絶縁性シートを貫通する剛性導体からなる短絡部およびその端部の第２導電層が形成された第２のシートとを、第１導電層と第２導電層とが重なるように重ね合わせ、第１導電層と第２導電層とを接合し、表面電極部を残して第１のシートを第２のシートから剥離する。その後、第２のシートの絶縁性シート面より突出した表面電極部に対して無電解メッキ処理を施すことにより、該表面電極部の周囲に第２の表面電極部を形成する。
PCT/JP2008/054050 2007-03-13 2008-03-06 シート状プローブおよびその製造方法 WO2008117645A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007063653 2007-03-13
JP2007-063653 2007-03-13

Publications (1)

Publication Number Publication Date
WO2008117645A1 true WO2008117645A1 (ja) 2008-10-02

Family

ID=39788381

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054050 WO2008117645A1 (ja) 2007-03-13 2008-03-06 シート状プローブおよびその製造方法

Country Status (2)

Country Link
TW (1) TW200848746A (ja)
WO (1) WO2008117645A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013083620A (ja) * 2011-10-12 2013-05-09 Samsung Electro-Mechanics Co Ltd プローブカード及びその製造方法
WO2018066708A1 (ja) * 2016-10-07 2018-04-12 イシイ株式会社 面状発熱体、面状発熱装置、面状発熱体用電極、及び面状発熱体の製造方法
CN116520123A (zh) * 2023-06-28 2023-08-01 深圳宏芯宇电子股份有限公司 一种晶圆测试设备及晶圆的测试方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5847663B2 (ja) * 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
JP7308660B2 (ja) * 2019-05-27 2023-07-14 東京エレクトロン株式会社 中間接続部材及び検査装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727789A (ja) * 1993-07-09 1995-01-31 Nitto Denko Corp 回路配線板およびその製造方法
JPH11248744A (ja) * 1998-02-27 1999-09-17 Jsr Corp 回路装置検査用アダプター装置
JP2000155132A (ja) * 1998-09-14 2000-06-06 Toppan Printing Co Ltd 検査治具及びその製造方法
JP2003017159A (ja) * 2001-07-02 2003-01-17 Shinozaki Seisakusho:Kk バンプ付き薄膜シートの製造方法及びバンプ付き薄膜シート
JP2004132699A (ja) * 2002-10-08 2004-04-30 Renesas Technology Corp 接続装置、半導体チップ検査装置及び接続装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727789A (ja) * 1993-07-09 1995-01-31 Nitto Denko Corp 回路配線板およびその製造方法
JPH11248744A (ja) * 1998-02-27 1999-09-17 Jsr Corp 回路装置検査用アダプター装置
JP2000155132A (ja) * 1998-09-14 2000-06-06 Toppan Printing Co Ltd 検査治具及びその製造方法
JP2003017159A (ja) * 2001-07-02 2003-01-17 Shinozaki Seisakusho:Kk バンプ付き薄膜シートの製造方法及びバンプ付き薄膜シート
JP2004132699A (ja) * 2002-10-08 2004-04-30 Renesas Technology Corp 接続装置、半導体チップ検査装置及び接続装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013083620A (ja) * 2011-10-12 2013-05-09 Samsung Electro-Mechanics Co Ltd プローブカード及びその製造方法
WO2018066708A1 (ja) * 2016-10-07 2018-04-12 イシイ株式会社 面状発熱体、面状発熱装置、面状発熱体用電極、及び面状発熱体の製造方法
CN116520123A (zh) * 2023-06-28 2023-08-01 深圳宏芯宇电子股份有限公司 一种晶圆测试设备及晶圆的测试方法
CN116520123B (zh) * 2023-06-28 2023-09-19 深圳宏芯宇电子股份有限公司 一种晶圆测试设备及晶圆的测试方法

Also Published As

Publication number Publication date
TW200848746A (en) 2008-12-16

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