WO2008117324A3 - Thermoelectric heat pump with a mounting and heat dissipating device for electronic components of a control electronic circuit board - Google Patents

Thermoelectric heat pump with a mounting and heat dissipating device for electronic components of a control electronic circuit board Download PDF

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Publication number
WO2008117324A3
WO2008117324A3 PCT/IT2008/000141 IT2008000141W WO2008117324A3 WO 2008117324 A3 WO2008117324 A3 WO 2008117324A3 IT 2008000141 W IT2008000141 W IT 2008000141W WO 2008117324 A3 WO2008117324 A3 WO 2008117324A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
electronic circuit
control electronic
mounting
thermoelectric
Prior art date
Application number
PCT/IT2008/000141
Other languages
French (fr)
Other versions
WO2008117324A2 (en
Inventor
Giorgio Pastorino
Matteo Codecasa
Original Assignee
Peltech Srl
Giorgio Pastorino
Matteo Codecasa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peltech Srl, Giorgio Pastorino, Matteo Codecasa filed Critical Peltech Srl
Publication of WO2008117324A2 publication Critical patent/WO2008117324A2/en
Publication of WO2008117324A3 publication Critical patent/WO2008117324A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The thermoelectric heat pump has a mounting and heat dissipating device for the electronic components of a control electronic circuit board, and comprises a pair of heat exchangers and one or more thermoelectric modules having opposite sides which are each in thermal contact with said heat exchangers. The thermoelectric modules are electrically connected to power supply conductors and the control electronic circuit board has electrical contacts for connection to terminals of the power supply conductors of the thermoelectric modules. The mounting and heat dissipating device is formed of a plate made of a material having a high thermal conductivity, and comprises a first mounting portion for the electronic components of the control electronic circuit board and a second connecting portion which is intended to be fixed to a surface of a heat exchanger. The plate acts as a thermal bridge between the electronic components of the control electronic circuit board and the heat exchanger, and is capable of mechanically fastening the control electronic circuit board to the thermoelectric heat pump in an operative position in which the contacts of the control electronic circuit board can be electrically connected to the terminals of the power supply conductors of the thermoelectric modules.
PCT/IT2008/000141 2007-03-27 2008-03-04 Thermoelectric heat pump with a mounting and heat dissipating device for electronic components of a control electronic circuit board WO2008117324A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000105U ITMI20070105U1 (en) 2007-03-27 2007-03-27 THERMOELECTRIC HEAT PUMP WITH HEAT ASSEMBLY AND DISSIPATION DEVICE FOR THE ELECTRONIC COMPONENTS OF AN ELECTRONIC CONTROL BOARD
ITMI2007U00105 2007-03-27

Publications (2)

Publication Number Publication Date
WO2008117324A2 WO2008117324A2 (en) 2008-10-02
WO2008117324A3 true WO2008117324A3 (en) 2009-08-06

Family

ID=39651408

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IT2008/000141 WO2008117324A2 (en) 2007-03-27 2008-03-04 Thermoelectric heat pump with a mounting and heat dissipating device for electronic components of a control electronic circuit board

Country Status (2)

Country Link
IT (1) ITMI20070105U1 (en)
WO (1) WO2008117324A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8649179B2 (en) 2011-02-05 2014-02-11 Laird Technologies, Inc. Circuit assemblies including thermoelectric modules

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4727554A (en) * 1985-02-18 1988-02-23 Fuji Photo Film Co., Ltd. Temperature controller for semiconductor devices
US4935864A (en) * 1989-06-20 1990-06-19 Digital Equipment Corporation Localized cooling apparatus for cooling integrated circuit devices
US6345507B1 (en) * 2000-09-29 2002-02-12 Electrografics International Corporation Compact thermoelectric cooling system
DE202006008870U1 (en) * 2006-06-06 2006-10-12 Macs Technology Inc., Lu-Chu Cooling arrangement for display card, has thermal unit with heat absorbing and dissipating surfaces, where operating heat of card chip is absorbed by base plate and is transported from heat exchange pipes to cooling fins on another plate
US20070008700A1 (en) * 2005-07-05 2007-01-11 Cheng-Ping Lee Power supply with heat sink

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4727554A (en) * 1985-02-18 1988-02-23 Fuji Photo Film Co., Ltd. Temperature controller for semiconductor devices
US4935864A (en) * 1989-06-20 1990-06-19 Digital Equipment Corporation Localized cooling apparatus for cooling integrated circuit devices
US6345507B1 (en) * 2000-09-29 2002-02-12 Electrografics International Corporation Compact thermoelectric cooling system
US20070008700A1 (en) * 2005-07-05 2007-01-11 Cheng-Ping Lee Power supply with heat sink
DE202006008870U1 (en) * 2006-06-06 2006-10-12 Macs Technology Inc., Lu-Chu Cooling arrangement for display card, has thermal unit with heat absorbing and dissipating surfaces, where operating heat of card chip is absorbed by base plate and is transported from heat exchange pipes to cooling fins on another plate

Also Published As

Publication number Publication date
WO2008117324A2 (en) 2008-10-02
ITMI20070105U1 (en) 2008-09-28

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