WO2008117324A2 - Thermoelectric heat pump with a mounting and heat dissipating device for electronic components of a control electronic circuit board - Google Patents
Thermoelectric heat pump with a mounting and heat dissipating device for electronic components of a control electronic circuit board Download PDFInfo
- Publication number
- WO2008117324A2 WO2008117324A2 PCT/IT2008/000141 IT2008000141W WO2008117324A2 WO 2008117324 A2 WO2008117324 A2 WO 2008117324A2 IT 2008000141 W IT2008000141 W IT 2008000141W WO 2008117324 A2 WO2008117324 A2 WO 2008117324A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermoelectric
- circuit board
- electronic circuit
- heat pump
- control electronic
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a thermoelectric heat pump of an improved type, with a mounting and heat dissipating device for electronic components of a control electronic circuit board.
- thermoelectric heat pump is a solid state device which uses the Peltier effect for cooling and/or heating purposes, respectively, in the civil and/or industrial field.
- An illustrative embodiment of a thermoelectric heat pump is disclosed in the published International patent application WO2005/086246, claiming the priority of the Italian utility model application No. MI2004U000079, in the name of the same Applicant of the present application.
- thermoelectric heat pump includes one or more thermoelectric modules essentially comprising an array of thermocouples formed of a combination of two different kinds of conductors and/or semiconductors and passed by a low voltage direct current supplied by an external source, typically a battery or a rectifier.
- the passage of the current through the junctions of the thermocouples simultaneously produces an absorption of heat on a side and a release of heat on another side of the thermoelectric module.
- Each side of the thermoelectric module is suitably placed in thermal contact, directly or indirectly, with a surface of a heat exchanger of the thermoelectric pump, whereby heat can be transferred to or from a heat exchange fluid, which can serve either as a so-called “service” fluid or as a so-called “treated” fluid, depending on the operating conditions of the thermoelectric pump.
- treated fluid it is meant a fluid on which the heat pump operates to extract or to supply heat with a useful cooling or heating effect, respectively, whereas by “service” fluid, it is meant a fluid used either as a heat source or as a heat sink from which or to which the heat transferred by same heat pump is extracted or dissipated.
- thermoelectric module is suitably governed and controlled by means of a PWM electronic converter circuit by which the voltage and the frequency of the electric current passing in the thermoelectric module is kept within a narrow range of optimal values, while the duty cycle of the thermoelectric module changes in accordance with the required thermal power.
- thermoelectric module is electrically connected to an electronic circuit board having the PWM electronic converter circuit.
- This circuit generally comprises a pulse generator, a cycle controller and a power module.
- the task of the present invention is aimed at solving, in an effective and reliable manner, the problem of incorporating an electronic circuit board into a thermoelectric heat pump.
- thermoelectric heat pump for ensuring a dependable operation of the electronic components, together with repeatability and simplicity in mounting the electronic circuit board on the thermoelectric heat pump during the assembly operations.
- Another object of the present invention is to minimise the number of components and of assembly steps required for incorporating the electronic circuit board into the thermoelectric heat pump, with an increase, instead of a decrease, in quality and reliability, and with a corresponding reduction in assembly costs.
- thermoelectric heat pump It is again another object of the present invention to achieve a stable, robust and reliable incorporation of the electronic circuit board into the thermoelectric heat pump. Disclosure of the invention
- thermoelectric heat pump having a mounting and heat dissipating device for the electronic components of a control electronic circuit board, wherein said thermoelectric heat pump comprises a pair of heat exchangers and one or more thermoelectric modules having opposite sides which are each in thermal contact with said heat exchangers, said thermoelectric modules being electrically connected to power supply conductors and said control electronic circuit board having electrical contacts for connection to terminals of said power supply conductors of the thermoelectric modules, characterised in that the mounting and heat dissipating device is formed of a plate made of a material having a high thermal conductivity, and comprises a first mounting portion for said electronic components of the control electronic circuit board and a second connecting portion which is intended to be fixed to a surface of said heat exchangers of the thermoelectric pump, for connecting said control electronic circuit board to the thermoelectric heat pump, said plate acting as a thermal bridge between said electronic components of the control electronic circuit board and said heat exchanger of the thermoelectric heat pump, and being capable of mechanically fastening said control electronic
- reference number 11 designates a heat exchanger surface
- reference number 12 designates a thermoelectric module.
- the thermoelectric modules 12 are shown having one side thereof in thermal contact with the surface 11 of said heat exchanger.
- thermoelectric modules 12 are electrically connected, via conventional power supply conductors (not shown) and suitable contacts C, to a control electronic circuit board 13 which has an electronic PWM converter circuit generally designated by 14.
- the contacts C are of the type designated as "Standard power timer contact for p.c.b.”, series nos. 368028-1, 1-368028-1, 2- 368028-1, which are manufactured and available on the market by TYCO ELECTRONICS AMP KOREA, or they may be of any other kind having similar characteristics.
- these contacts permit the thermoelectric modules to be electrically connected to the control electronic circuit board 13 in a convenient manner, because they comprise a female portion having resiliently deformable contacts for receiving a detachable mating male portion provided at the terminals of the power supply conductors of the thermoelectric modules, thus permitting misalignments between the terminals and the same contacts to be suitably compensated for.
- the electronic PWM converter circuit comprises one or more electronic components 15 which generate heat during operation. These electronic components are mounted on a plate 16 made of a material having high thermal conductivity as, for example, aluminium.
- the plate 16 has a first portion 16A provided with mountings seats for the electronic components 15 and a second portion 16B provided with holes for receiving fastening bolts (not shown) or other fastening means as, for example, rivets, whereby the plate 16 can be fastened to the heat exchanger surface 11.
- the plate 16 is connected to the heat exchanger surface 11 in such a way that the alignment of the contacts C with the terminals of the power supply conductors connecting to the thermoelectric modules 12 is made as accurate as possible.
- the contacts C of the kind used in the present invention are capable, however, to compensate for small misalignments, both in position and angle with respect to said power supply conductors, which may occur in assembling the plate 16 on the heat exchanger surface 11 , thus ensuring that a suitable electrical connection is always achieved.
- the electrical connection made via the contacts C can adjust to the rigid fastening of the plate 16, so that high characteristics in terms fastness, tolerance, reliability and repeatability of the connection can be ensured.
- the electronic components 15 of the electronic PWM converter circuit 14 do not require specific heat sinks because the plate 16 is designed to act as a heat bridge and to transfer the heat generated by said electronic components 15 during operation to the surface 11 , from which it is dissipated via the heat exchanger of the thermoelectric heat pump.
- the heat generated by the electronic components 15 and dissipated through the heat exchanger is such that it does not modify in a significant way the temperature value of the heat exchange fluid which receives or releases heat to the heat exchanger and, however, the temperature value of the heat exchange fluid remains within tolerance limits, thus permitting the heat generated by the electronic components to be dissipated in optimal operating and reliability conditions.
- thermoelectric heat pump operating in the cooling/heating mode and having a primary circuit (heat sink), through which sea water as service fluid is passed, and a secondary circuit, through which a cold or hot fluid as treated fluid is passed to cool or heat a cabin of a watercraft, via a suitable fan coil unit.
- heat sink heat sink
- secondary circuit through which a cold or hot fluid as treated fluid is passed to cool or heat a cabin of a watercraft, via a suitable fan coil unit.
- the electric power absorbed by the thermoelectric heat pump is equal to approximately 430 W
- the frigorific power and the heat power are equal to approximately 400 W and 900 W, respectively, with a rated coefficient of performance (COP) equal to approximately 1 and 2, respectively.
- COP rated coefficient of performance
- the typical channel resistance of the power module of the electronic PWM converter is equal to approximately 13 m ⁇ ; thus, the maximum amount of heat power which needs to be dissipated for the thermal equilibrium of the power module is equal to approximately 17 W, i.e. less than 5% and 2%, respectively, of the thermal power transferred by the heat exchangers of the thermoelectric heat pump.
- This amount of heat power which increases or decreases the useful effect, is always small with respect to the thermal balance of the heat exchangers, and because it does not cause significant changes in the operation and the performance of the heat pump, it can be considered negligible.
- the device according to the invention also allows for a reduction in the number of elements necessary to connect the control electronic circuit board 13 to the thermoelectric heat pump 10, because the connection is made by the same plate 16 on which the electronic components 15 of the electronic circuit 14 are mounted.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The thermoelectric heat pump has a mounting and heat dissipating device for the electronic components of a control electronic circuit board, and comprises a pair of heat exchangers and one or more thermoelectric modules having opposite sides which are each in thermal contact with said heat exchangers. The thermoelectric modules are electrically connected to power supply conductors and the control electronic circuit board has electrical contacts for connection to terminals of the power supply conductors of the thermoelectric modules. The mounting and heat dissipating device is formed of a plate made of a material having a high thermal conductivity, and comprises a first mounting portion for the electronic components of the control electronic circuit board and a second connecting portion which is intended to be fixed to a surface of a heat exchanger. The plate acts as a thermal bridge between the electronic components of the control electronic circuit board and the heat exchanger, and is capable of mechanically fastening the control electronic circuit board to the thermoelectric heat pump in an operative position in which the contacts of the control electronic circuit board can be electrically connected to the terminals of the power supply conductors of the thermoelectric modules.
Description
"THERMOELECTRIC HEAT PUMP WITH A MOUNTING AND HEAT DISSIPATING DEVICE FOR ELECTRONIC COMPONENTS OF A CONTROL ELECTRONIC CIRCUIT BOARD"
DESCRIPTION
Technical field
The present invention relates to a thermoelectric heat pump of an improved type, with a mounting and heat dissipating device for electronic components of a control electronic circuit board. Background Art
A thermoelectric heat pump is a solid state device which uses the Peltier effect for cooling and/or heating purposes, respectively, in the civil and/or industrial field. An illustrative embodiment of a thermoelectric heat pump is disclosed in the published International patent application WO2005/086246, claiming the priority of the Italian utility model application No. MI2004U000079, in the name of the same Applicant of the present application.
A thermoelectric heat pump includes one or more thermoelectric modules essentially comprising an array of thermocouples formed of a combination of two different kinds of conductors and/or semiconductors and passed by a low voltage direct current supplied by an external source, typically a battery or a rectifier. The passage of the current through the junctions of the thermocouples simultaneously produces an absorption of heat on a side and a release of heat on another side of the thermoelectric module.
Each side of the thermoelectric module is suitably placed in thermal contact, directly or indirectly, with a surface of a heat exchanger of the thermoelectric pump, whereby heat can be transferred to or from a heat exchange fluid, which can serve either as a so-called "service" fluid or as a so-called "treated" fluid, depending on the operating conditions of the thermoelectric pump. By "treated" fluid, it is meant a fluid on which the heat pump operates to extract or to supply heat with a useful cooling or heating effect, respectively, whereas by "service" fluid, it is meant a fluid used either as a heat source or as a heat sink from which or to which the heat transferred by same heat pump is extracted or dissipated.
The operation of the thermoelectric module is suitably governed and controlled by means of a PWM electronic converter circuit by which the voltage and the frequency of the electric current passing in the thermoelectric module is kept within a narrow range of optimal values, while the duty cycle of the thermoelectric module changes in accordance with the required thermal power.
The thermoelectric module is electrically connected to an electronic circuit board having the PWM electronic converter circuit. This circuit generally comprises a pulse generator, a cycle controller and a power module.
During the operation of the power module an amount of heat is generated which must be dissipated in an effective manner, in order to not compromise the functionality and reliability of the same power module. Conventionally, for the dissipation of the heat generated by
the power module suitable heat sinks are used which are mounted on the same electronic circuit board. Although this solution permits the heat generated by the power module to be dissipated effectively, it has the drawback of making it difficult to incorporate the electronic circuit board into a thermoelectric heat pump, mainly because of the size of the heat sinks, which have relatively large heat exchange surfaces for dissipating the heat effectively. Furthermore, a solution of this kind accordingly requires to ensure that the air in the area near the heat sinks of the electronic circuit board is suitably exchanged.
Another drawback, which is closely related to the problem mentioned above, is that the solution adopted up until now to position the electronic circuit board directly on the thermoelectric heat pump, in a fixed and stable manner, and to connect the same to the thermoelectric module, makes use of various additional components which require a great number of sequential assembly operations to be followed.
The task of the present invention is aimed at solving, in an effective and reliable manner, the problem of incorporating an electronic circuit board into a thermoelectric heat pump.
In particular, it is an object of the present invention to achieve superior and synergistic mechanical, electrical and thermal integration characteristics among the electronic circuit board, the relevant electronic components and the thermoelectric heat pump, for ensuring a dependable operation of the electronic components,
together with repeatability and simplicity in mounting the electronic circuit board on the thermoelectric heat pump during the assembly operations.
Another object of the present invention is to minimise the number of components and of assembly steps required for incorporating the electronic circuit board into the thermoelectric heat pump, with an increase, instead of a decrease, in quality and reliability, and with a corresponding reduction in assembly costs.
It is again another object of the present invention to achieve a stable, robust and reliable incorporation of the electronic circuit board into the thermoelectric heat pump. Disclosure of the invention
These objects are achieved, according to the invention, by a thermoelectric heat pump having a mounting and heat dissipating device for the electronic components of a control electronic circuit board, wherein said thermoelectric heat pump comprises a pair of heat exchangers and one or more thermoelectric modules having opposite sides which are each in thermal contact with said heat exchangers, said thermoelectric modules being electrically connected to power supply conductors and said control electronic circuit board having electrical contacts for connection to terminals of said power supply conductors of the thermoelectric modules, characterised in that the mounting and heat dissipating device is formed of a plate made of a material having a high thermal conductivity, and comprises a first mounting portion for said
electronic components of the control electronic circuit board and a second connecting portion which is intended to be fixed to a surface of said heat exchangers of the thermoelectric pump, for connecting said control electronic circuit board to the thermoelectric heat pump, said plate acting as a thermal bridge between said electronic components of the control electronic circuit board and said heat exchanger of the thermoelectric heat pump, and being capable of mechanically fastening said control electronic circuit board to the thermoelectric heat pump in an operative position in which said contacts of the control electronic circuit board can be electrically connected to said terminals of the power supply conductors of the thermoelectric modules of the thermoelectric heat pump. Brief description of drawing
The present invention will be described in the following with reference to the annexed drawing, the sole figure of which is a diagrammatic and partial illustration of a heat exchanger of a thermoelectric heat pump, generally designated by 10. Preferred embodiment of the invention
In the figure of the drawing, reference number 11 designates a heat exchanger surface, and reference number 12 designates a thermoelectric module. The thermoelectric modules 12 are shown having one side thereof in thermal contact with the surface 11 of said heat exchanger.
The thermoelectric modules 12 are electrically connected, via conventional power supply conductors (not shown) and suitable
contacts C, to a control electronic circuit board 13 which has an electronic PWM converter circuit generally designated by 14.
The contacts C are of the type designated as "Standard power timer contact for p.c.b.", series nos. 368028-1, 1-368028-1, 2- 368028-1, which are manufactured and available on the market by TYCO ELECTRONICS AMP KOREA, or they may be of any other kind having similar characteristics. In use of the present invention, as will be apparent from the following description, these contacts permit the thermoelectric modules to be electrically connected to the control electronic circuit board 13 in a convenient manner, because they comprise a female portion having resiliently deformable contacts for receiving a detachable mating male portion provided at the terminals of the power supply conductors of the thermoelectric modules, thus permitting misalignments between the terminals and the same contacts to be suitably compensated for.
The electronic PWM converter circuit comprises one or more electronic components 15 which generate heat during operation. These electronic components are mounted on a plate 16 made of a material having high thermal conductivity as, for example, aluminium. The plate 16 has a first portion 16A provided with mountings seats for the electronic components 15 and a second portion 16B provided with holes for receiving fastening bolts (not shown) or other fastening means as, for example, rivets, whereby the plate 16 can be fastened to the heat exchanger surface 11.
The plate 16 is connected to the heat exchanger surface 11 in such a way that the alignment of the contacts C with the terminals of the power supply conductors connecting to the thermoelectric modules 12 is made as accurate as possible. The contacts C of the kind used in the present invention are capable, however, to compensate for small misalignments, both in position and angle with respect to said power supply conductors, which may occur in assembling the plate 16 on the heat exchanger surface 11 , thus ensuring that a suitable electrical connection is always achieved. In this way, the electrical connection made via the contacts C can adjust to the rigid fastening of the plate 16, so that high characteristics in terms fastness, tolerance, reliability and repeatability of the connection can be ensured.
With the device of the invention, the electronic components 15 of the electronic PWM converter circuit 14 do not require specific heat sinks because the plate 16 is designed to act as a heat bridge and to transfer the heat generated by said electronic components 15 during operation to the surface 11 , from which it is dissipated via the heat exchanger of the thermoelectric heat pump. It is to be noted that the heat generated by the electronic components 15 and dissipated through the heat exchanger is such that it does not modify in a significant way the temperature value of the heat exchange fluid which receives or releases heat to the heat exchanger and, however, the temperature value of the heat exchange fluid remains within tolerance limits, thus permitting the
heat generated by the electronic components to be dissipated in optimal operating and reliability conditions. As numerical example there is given the case of a liquid-liquid thermoelectric heat pump operating in the cooling/heating mode and having a primary circuit (heat sink), through which sea water as service fluid is passed, and a secondary circuit, through which a cold or hot fluid as treated fluid is passed to cool or heat a cabin of a watercraft, via a suitable fan coil unit. Being supplied with a rated voltage of 12 V and with a maximum current rating of 36 A, the electric power absorbed by the thermoelectric heat pump is equal to approximately 430 W, while the frigorific power and the heat power are equal to approximately 400 W and 900 W, respectively, with a rated coefficient of performance (COP) equal to approximately 1 and 2, respectively. The typical channel resistance of the power module of the electronic PWM converter is equal to approximately 13 mΩ; thus, the maximum amount of heat power which needs to be dissipated for the thermal equilibrium of the power module is equal to approximately 17 W, i.e. less than 5% and 2%, respectively, of the thermal power transferred by the heat exchangers of the thermoelectric heat pump. This amount of heat power, which increases or decreases the useful effect, is always small with respect to the thermal balance of the heat exchangers, and because it does not cause significant changes in the operation and the performance of the heat pump, it can be considered negligible.
The device according to the invention also allows for a reduction in the number of elements necessary to connect the control electronic circuit board 13 to the thermoelectric heat pump 10, because the connection is made by the same plate 16 on which the electronic components 15 of the electronic circuit 14 are mounted.
Claims
1. A thermoelectric heat pump having a mounting and heat dissipating device for the electronic components of a control electronic circuit board, wherein said thermoelectric heat pump comprises a pair of heat exchangers and one or more thermoelectric modules having opposite sides which are each in thermal contact with said heat exchangers, said thermoelectric modules being electrically connected to power supply conductors and said control electronic circuit board having electrical contacts for connection to terminals of said power supply conductors of the thermoelectric modules, characterised in that the mounting and heat dissipating device is formed of a plate made of a material having a high thermal conductivity, and comprises a first mounting portion for said electronic components of the control electronic circuit board and a second connecting portion which is intended to be fixed to a surface of said heat exchangers of the thermoelectric pump, for connecting said control electronic circuit board to the thermoelectric heat pump, said plate acting as a thermal bridge between said electronic components of the control electronic circuit board and said heat exchanger of the thermoelectric heat pump, and being capable of mechanically fastening said control electronic circuit board to the thermoelectric heat pump in an operative position in which said contacts of the control electronic circuit board can be electrically connected to said terminals of the power supply conductors of the thermoelectric modules of the thermoelectric heat pump.
2. The thermoelectric heat pump according to claim 1 , characterised in that the plate is made of a metal material or a non metal material having a high thermal conductivity.
3. The thermoelectric heat pump according to claim 1 , characterised in that the plate is provided with mountings seats for the electronic components of the control electronic circuit board.
4. The thermoelectric heat pump according to claim 1 , characterised in that the plate is provided with holes for receiving fastening bolts, rivets or other fastening means for the fastening thereof to one of heat exchangers of the thermoelectric heat pump.
5. The thermoelectric heat pump according to claim 1 , characterised in that the terminals of the power supply conductors of the thermoelectric modules are configured with a male portion and the contacts of control electronic circuit board are configured with a female portion having resiliency deformable contacts for detachably receiving said terminals and for permitting misalignments between the terminals and the same contacts to be suitably compensated for.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT000105U ITMI20070105U1 (en) | 2007-03-27 | 2007-03-27 | THERMOELECTRIC HEAT PUMP WITH HEAT ASSEMBLY AND DISSIPATION DEVICE FOR THE ELECTRONIC COMPONENTS OF AN ELECTRONIC CONTROL BOARD |
| ITMI2007U00105 | 2007-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008117324A2 true WO2008117324A2 (en) | 2008-10-02 |
| WO2008117324A3 WO2008117324A3 (en) | 2009-08-06 |
Family
ID=39651408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IT2008/000141 WO2008117324A2 (en) | 2007-03-27 | 2008-03-04 | Thermoelectric heat pump with a mounting and heat dissipating device for electronic components of a control electronic circuit board |
Country Status (2)
| Country | Link |
|---|---|
| IT (1) | ITMI20070105U1 (en) |
| WO (1) | WO2008117324A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8649179B2 (en) | 2011-02-05 | 2014-02-11 | Laird Technologies, Inc. | Circuit assemblies including thermoelectric modules |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4727554A (en) * | 1985-02-18 | 1988-02-23 | Fuji Photo Film Co., Ltd. | Temperature controller for semiconductor devices |
| US4935864A (en) * | 1989-06-20 | 1990-06-19 | Digital Equipment Corporation | Localized cooling apparatus for cooling integrated circuit devices |
| US6345507B1 (en) * | 2000-09-29 | 2002-02-12 | Electrografics International Corporation | Compact thermoelectric cooling system |
| DE202006008870U1 (en) * | 2006-06-06 | 2006-10-12 | Macs Technology Inc., Lu-Chu | Cooling arrangement for display card, has thermal unit with heat absorbing and dissipating surfaces, where operating heat of card chip is absorbed by base plate and is transported from heat exchange pipes to cooling fins on another plate |
| US20070008700A1 (en) * | 2005-07-05 | 2007-01-11 | Cheng-Ping Lee | Power supply with heat sink |
-
2007
- 2007-03-27 IT IT000105U patent/ITMI20070105U1/en unknown
-
2008
- 2008-03-04 WO PCT/IT2008/000141 patent/WO2008117324A2/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4727554A (en) * | 1985-02-18 | 1988-02-23 | Fuji Photo Film Co., Ltd. | Temperature controller for semiconductor devices |
| US4935864A (en) * | 1989-06-20 | 1990-06-19 | Digital Equipment Corporation | Localized cooling apparatus for cooling integrated circuit devices |
| US6345507B1 (en) * | 2000-09-29 | 2002-02-12 | Electrografics International Corporation | Compact thermoelectric cooling system |
| US20070008700A1 (en) * | 2005-07-05 | 2007-01-11 | Cheng-Ping Lee | Power supply with heat sink |
| DE202006008870U1 (en) * | 2006-06-06 | 2006-10-12 | Macs Technology Inc., Lu-Chu | Cooling arrangement for display card, has thermal unit with heat absorbing and dissipating surfaces, where operating heat of card chip is absorbed by base plate and is transported from heat exchange pipes to cooling fins on another plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8649179B2 (en) | 2011-02-05 | 2014-02-11 | Laird Technologies, Inc. | Circuit assemblies including thermoelectric modules |
| US9322580B2 (en) | 2011-02-05 | 2016-04-26 | Laird Technologies, Inc. | Circuit assemblies including thermoelectric modules |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008117324A3 (en) | 2009-08-06 |
| ITMI20070105U1 (en) | 2008-09-28 |
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