WO2008111220A1 - 熱電変換装置の製造方法 - Google Patents

熱電変換装置の製造方法 Download PDF

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Publication number
WO2008111220A1
WO2008111220A1 PCT/JP2007/055260 JP2007055260W WO2008111220A1 WO 2008111220 A1 WO2008111220 A1 WO 2008111220A1 JP 2007055260 W JP2007055260 W JP 2007055260W WO 2008111220 A1 WO2008111220 A1 WO 2008111220A1
Authority
WO
WIPO (PCT)
Prior art keywords
type
honeycomb
holes
raw material
thermoelectric converter
Prior art date
Application number
PCT/JP2007/055260
Other languages
English (en)
French (fr)
Inventor
Kazushige Ohno
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to PCT/JP2007/055260 priority Critical patent/WO2008111220A1/ja
Priority to EP07021184A priority patent/EP1970972B1/en
Priority to AT07021184T priority patent/ATE523901T1/de
Priority to US11/943,035 priority patent/US20080223504A1/en
Publication of WO2008111220A1 publication Critical patent/WO2008111220A1/ja

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Ceramic Products (AREA)

Abstract

　非金属無機材料からなるからなるハニカムのそれぞれの貫通孔に、ｐ型半導体原料及びｎ型半導体原料を交互に充填する原料充填工程と、前記ハニカムに充填されたｐ型半導体原料及びｎ型半導体原料を焼結して、ハニカムのそれぞれの貫通孔にｐ型半導体とｎ型半導体とを形成する半導体形成工程と、前記ハニカムの貫通孔に形成されたｐ型半導体とｎ型半導体とを電極により接合する電極接合工程とを有する熱電変換素子の製造方法である。
PCT/JP2007/055260 2007-03-15 2007-03-15 熱電変換装置の製造方法 WO2008111220A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2007/055260 WO2008111220A1 (ja) 2007-03-15 2007-03-15 熱電変換装置の製造方法
EP07021184A EP1970972B1 (en) 2007-03-15 2007-10-30 Manufacturing method of thermoelectric converter
AT07021184T ATE523901T1 (de) 2007-03-15 2007-10-30 Herstellungsverfahren für einen thermoelektrischen wandler
US11/943,035 US20080223504A1 (en) 2007-03-15 2007-11-20 Method of manufacturing thermoelectric converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055260 WO2008111220A1 (ja) 2007-03-15 2007-03-15 熱電変換装置の製造方法

Publications (1)

Publication Number Publication Date
WO2008111220A1 true WO2008111220A1 (ja) 2008-09-18

Family

ID=38962084

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/055260 WO2008111220A1 (ja) 2007-03-15 2007-03-15 熱電変換装置の製造方法

Country Status (4)

Country Link
US (1) US20080223504A1 (ja)
EP (1) EP1970972B1 (ja)
AT (1) ATE523901T1 (ja)
WO (1) WO2008111220A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008111219A1 (ja) * 2007-03-15 2008-09-18 Ibiden Co., Ltd. 熱電変換装置
WO2008111218A1 (ja) * 2007-03-15 2008-09-18 Ibiden Co., Ltd. 熱電変換装置
KR101498047B1 (ko) * 2013-04-19 2015-03-11 주식회사 리빙케어 순간 냉수용 냉각장치
CN105702848A (zh) * 2014-11-27 2016-06-22 中国电子科技集团公司第十八研究所 一种p-n型温差电元件性能匹配方法
WO2017139751A1 (en) * 2016-02-12 2017-08-17 Rhode Island Board Of Education Temperature and thermal gradient sensor for ceramic matrix composites and methods of preparation thereof
WO2018006075A1 (en) * 2016-07-01 2018-01-04 Rhode Island Council On Postsecondary Education High resolution strain gages for ceramic matrix composites and methods of manufacture thereof
US10428713B2 (en) 2017-09-07 2019-10-01 Denso International America, Inc. Systems and methods for exhaust heat recovery and heat storage
US10782190B1 (en) 2017-12-14 2020-09-22 University Of Rhode Island Board Of Trustees Resistance temperature detector (RTD) for ceramic matrix composites
JP2019207979A (ja) * 2018-05-30 2019-12-05 イビデン株式会社 プリント配線板
US11703471B1 (en) 2018-12-20 2023-07-18 University Of Rhode Island Board Of Trustees Trace detection of chemical compounds via catalytic decomposition and redox reactions
JP7518623B2 (ja) * 2020-01-27 2024-07-18 株式会社日立製作所 熱電変換モジュール
CN115188877A (zh) * 2022-07-27 2022-10-14 武汉理工大学 一种制备强织构和高热电性能柔性热电薄膜的方法

Citations (6)

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JPH098364A (ja) * 1995-06-26 1997-01-10 Saamobonitsuku:Kk 熱電変換素子の製造方法
JPH11243169A (ja) * 1998-02-24 1999-09-07 Nissan Motor Co Ltd 電子冷却モジュールおよびその製造方法
JP2002158379A (ja) * 2000-11-21 2002-05-31 National Institute Of Advanced Industrial & Technology 熱電変換素子集合体、熱電モジュール及び熱電変換素子集合体の製造方法
JP2003332644A (ja) * 2002-05-16 2003-11-21 Komatsu Ltd 熱電モジュール製造方法および熱電モジュール製造用治具
JP2004228288A (ja) * 2003-01-22 2004-08-12 Toyota Motor Corp 熱電材料とその製造方法
JP3879769B1 (ja) * 2006-02-22 2007-02-14 株式会社村田製作所 熱電変換モジュールおよびその製造方法

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US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
JPH09139526A (ja) * 1995-11-13 1997-05-27 Ngk Insulators Ltd 熱電気変換モジュールおよびその製造方法
JPH09199765A (ja) * 1995-11-13 1997-07-31 Ngk Insulators Ltd 熱電気変換モジュールおよびその製造方法
EP0874406A3 (en) * 1997-04-23 2000-12-13 Matsushita Electric Industrial Co., Ltd. A co-sb based thermoelectric material and a method of producing the same
JPH10321921A (ja) * 1997-05-22 1998-12-04 Ngk Insulators Ltd 熱電気変換モジュールおよびその製造方法
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US6297441B1 (en) * 2000-03-24 2001-10-02 Chris Macris Thermoelectric device and method of manufacture
JP2001320097A (ja) * 2000-05-09 2001-11-16 Komatsu Ltd 熱電素子とその製造方法及びこれを用いた熱電モジュール
JP2002076541A (ja) * 2000-08-25 2002-03-15 Sony Corp Ｂｇａ実装プリント配線板
JP4103812B2 (ja) * 2003-03-05 2008-06-18 株式会社Ｉｈｉ 鋳型の製造方法
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CN1820380B (zh) * 2004-01-19 2010-05-05 松下电器产业株式会社 热电转换元件及其制造方法和使用该元件的热电转换装置
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JP4584035B2 (ja) * 2005-05-31 2010-11-17 トヨタ自動車株式会社 熱電モジュール
WO2008111218A1 (ja) * 2007-03-15 2008-09-18 Ibiden Co., Ltd. 熱電変換装置
WO2008111219A1 (ja) * 2007-03-15 2008-09-18 Ibiden Co., Ltd. 熱電変換装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH098364A (ja) * 1995-06-26 1997-01-10 Saamobonitsuku:Kk 熱電変換素子の製造方法
JPH11243169A (ja) * 1998-02-24 1999-09-07 Nissan Motor Co Ltd 電子冷却モジュールおよびその製造方法
JP2002158379A (ja) * 2000-11-21 2002-05-31 National Institute Of Advanced Industrial & Technology 熱電変換素子集合体、熱電モジュール及び熱電変換素子集合体の製造方法
JP2003332644A (ja) * 2002-05-16 2003-11-21 Komatsu Ltd 熱電モジュール製造方法および熱電モジュール製造用治具
JP2004228288A (ja) * 2003-01-22 2004-08-12 Toyota Motor Corp 熱電材料とその製造方法
JP3879769B1 (ja) * 2006-02-22 2007-02-14 株式会社村田製作所 熱電変換モジュールおよびその製造方法

Also Published As

Publication number Publication date
EP1970972B1 (en) 2011-09-07
EP1970972A1 (en) 2008-09-17
ATE523901T1 (de) 2011-09-15
US20080223504A1 (en) 2008-09-18

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