WO2008105744A3 - Method and apparatus for assembling surface mount devices - Google Patents
Method and apparatus for assembling surface mount devices Download PDFInfo
- Publication number
- WO2008105744A3 WO2008105744A3 PCT/SG2008/000064 SG2008000064W WO2008105744A3 WO 2008105744 A3 WO2008105744 A3 WO 2008105744A3 SG 2008000064 W SG2008000064 W SG 2008000064W WO 2008105744 A3 WO2008105744 A3 WO 2008105744A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit boards
- thin rigid
- pieces
- surface mount
- smds
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Surface mount devices (SMDs) are mounted on singulated flexible printed circuit boards (FPCs) and/or singulated thin rigid printed circuit boards (Thin rigid PCBs) with great efficiency and high yield in an assembly process wherein a sheet of FPC or Thin rigid PCB that contents one or more pieces of circuit boards is separated into single non-interconnected pieces, a single piece or multiple pieces is/are precisely placed and arranged on a based plate hold by adhesive material and/or vacuum, and solder paste is dispensed or printed on the connecting pads of each circuit boards, and SMDs are mounted on the connecting pads, and the area that contents solder paste are selectively soldered using precise guided streams of spot hot air (or guided rays of UV lights or LASER beams).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200701348 | 2007-03-01 | ||
SG200701348-5 | 2007-03-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008105744A2 WO2008105744A2 (en) | 2008-09-04 |
WO2008105744A3 true WO2008105744A3 (en) | 2009-04-02 |
Family
ID=39721691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG2008/000064 WO2008105744A2 (en) | 2007-03-01 | 2008-02-28 | Method and apparatus for assembling surface mount devices |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2008105744A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012030299A1 (en) | 2010-09-03 | 2012-03-08 | Jsb Tech Private Limited | A rigid-flex circuit board and manufacturing method |
US9713851B2 (en) | 2013-09-04 | 2017-07-25 | Apple Inc. | Method and system for attaching flexible circuits to a mounting surface |
CN112077922B (en) * | 2019-06-12 | 2022-03-18 | 天津玖源自动化设备有限公司 | PCB board divides board feeding system |
CN111465215B (en) * | 2020-05-08 | 2023-05-30 | 瑞声科技(新加坡)有限公司 | Flexible circuit board tooling structure |
CN114289814A (en) * | 2021-12-31 | 2022-04-08 | 东莞华贝电子科技有限公司 | Circuit board welding method and jig |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07314390A (en) * | 1994-05-27 | 1995-12-05 | Nagano Japan Radio Co | Cutting device for printed circuit board |
WO1997031515A1 (en) * | 1996-02-26 | 1997-08-28 | Cencorp | High speed depaneling apparatus and method |
WO2002057047A1 (en) * | 2001-01-16 | 2002-07-25 | Tyco Electronics Corporation | Circuit board router apparatus and method thereof |
-
2008
- 2008-02-28 WO PCT/SG2008/000064 patent/WO2008105744A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07314390A (en) * | 1994-05-27 | 1995-12-05 | Nagano Japan Radio Co | Cutting device for printed circuit board |
WO1997031515A1 (en) * | 1996-02-26 | 1997-08-28 | Cencorp | High speed depaneling apparatus and method |
WO2002057047A1 (en) * | 2001-01-16 | 2002-07-25 | Tyco Electronics Corporation | Circuit board router apparatus and method thereof |
Also Published As
Publication number | Publication date |
---|---|
WO2008105744A2 (en) | 2008-09-04 |
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