WO2008105744A3 - Method and apparatus for assembling surface mount devices - Google Patents

Method and apparatus for assembling surface mount devices Download PDF

Info

Publication number
WO2008105744A3
WO2008105744A3 PCT/SG2008/000064 SG2008000064W WO2008105744A3 WO 2008105744 A3 WO2008105744 A3 WO 2008105744A3 SG 2008000064 W SG2008000064 W SG 2008000064W WO 2008105744 A3 WO2008105744 A3 WO 2008105744A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit boards
thin rigid
pieces
surface mount
smds
Prior art date
Application number
PCT/SG2008/000064
Other languages
French (fr)
Other versions
WO2008105744A2 (en
Inventor
Hui Hong Jim Kery Li
Kim Meng Tan
Original Assignee
Jsb Tech Private Ltd
Hui Hong Jim Kery Li
Kim Meng Tan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsb Tech Private Ltd, Hui Hong Jim Kery Li, Kim Meng Tan filed Critical Jsb Tech Private Ltd
Publication of WO2008105744A2 publication Critical patent/WO2008105744A2/en
Publication of WO2008105744A3 publication Critical patent/WO2008105744A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Surface mount devices (SMDs) are mounted on singulated flexible printed circuit boards (FPCs) and/or singulated thin rigid printed circuit boards (Thin rigid PCBs) with great efficiency and high yield in an assembly process wherein a sheet of FPC or Thin rigid PCB that contents one or more pieces of circuit boards is separated into single non-interconnected pieces, a single piece or multiple pieces is/are precisely placed and arranged on a based plate hold by adhesive material and/or vacuum, and solder paste is dispensed or printed on the connecting pads of each circuit boards, and SMDs are mounted on the connecting pads, and the area that contents solder paste are selectively soldered using precise guided streams of spot hot air (or guided rays of UV lights or LASER beams).
PCT/SG2008/000064 2007-03-01 2008-02-28 Method and apparatus for assembling surface mount devices WO2008105744A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200701348 2007-03-01
SG200701348-5 2007-03-01

Publications (2)

Publication Number Publication Date
WO2008105744A2 WO2008105744A2 (en) 2008-09-04
WO2008105744A3 true WO2008105744A3 (en) 2009-04-02

Family

ID=39721691

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2008/000064 WO2008105744A2 (en) 2007-03-01 2008-02-28 Method and apparatus for assembling surface mount devices

Country Status (1)

Country Link
WO (1) WO2008105744A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012030299A1 (en) 2010-09-03 2012-03-08 Jsb Tech Private Limited A rigid-flex circuit board and manufacturing method
US9713851B2 (en) 2013-09-04 2017-07-25 Apple Inc. Method and system for attaching flexible circuits to a mounting surface
CN112077922B (en) * 2019-06-12 2022-03-18 天津玖源自动化设备有限公司 PCB board divides board feeding system
CN111465215B (en) * 2020-05-08 2023-05-30 瑞声科技(新加坡)有限公司 Flexible circuit board tooling structure
CN114289814A (en) * 2021-12-31 2022-04-08 东莞华贝电子科技有限公司 Circuit board welding method and jig

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07314390A (en) * 1994-05-27 1995-12-05 Nagano Japan Radio Co Cutting device for printed circuit board
WO1997031515A1 (en) * 1996-02-26 1997-08-28 Cencorp High speed depaneling apparatus and method
WO2002057047A1 (en) * 2001-01-16 2002-07-25 Tyco Electronics Corporation Circuit board router apparatus and method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07314390A (en) * 1994-05-27 1995-12-05 Nagano Japan Radio Co Cutting device for printed circuit board
WO1997031515A1 (en) * 1996-02-26 1997-08-28 Cencorp High speed depaneling apparatus and method
WO2002057047A1 (en) * 2001-01-16 2002-07-25 Tyco Electronics Corporation Circuit board router apparatus and method thereof

Also Published As

Publication number Publication date
WO2008105744A2 (en) 2008-09-04

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