JP2019140358A - Component mounting method and component mounting apparatus - Google Patents

Abstract

To provide a component mounting method and a component mounting apparatus that can smoothly mount a component on a circuit board without complicating a manufacturing process even when an assembled component is an additional component retrofitted to a circuit element.SOLUTION: An assembled component having a component main body including a circuit element and an additional member attached to the component main body is mounted on the circuit board by using a mounter device. The component mounting method includes a step of placing the component main body on a temporary placement plate, a step of applying an adhesive to the component main body placed on the temporary placement plate, a step of sucking and holding the additional member by a movable head and attaching the sucked and held additional member to the component main body arranged on the temporary placement plate, and a step of attaching the assembled component formed by attaching the additional member by the temporary placement plate to the circuit board by sucking and holding the assembled component from the temporary placement plate with the movable head.SELECTED DRAWING: Figure 5

Description

本発明は、部品実装方法及び部品実装装置に関する。   The present invention relates to a component mounting method and a component mounting apparatus.

近年のマウンタ装置でチップ部品を回路基板に実装する自動実装技術は、急速に発展をし続けており、回路基板の製造においては、更なる高密度実装、低コスト化、製造タクトタイムの短縮の実現が求められている。
このようなチップ部品の実装は、抵抗やコンデンサ等のチップ部品の他に、レンズ等の光学部材を有する光学部品にも及んでいる。このような光学部品としては、例えば、特許文献１に開示された、レンズと、ベアチップＬＥＤとを備える発光装置や、特許文献２に開示された、発光モジュールと受光モジュールと備えるフォトリフレクタ等がある。 In recent years, automatic mounting technology for mounting chip components on circuit boards in mounters continues to develop rapidly. In the manufacture of circuit boards, higher-density mounting, lower costs, and shorter manufacturing tact time have been achieved. Realization is required.
Such mounting of chip components extends to optical components having optical members such as lenses in addition to chip components such as resistors and capacitors. Examples of such an optical component include a light emitting device including a lens and a bare chip LED disclosed in Patent Document 1, a photo reflector including a light emitting module and a light receiving module disclosed in Patent Document 2, and the like. .

特開２０１５−９９９４８号公報Japanese Patent Laying-Open No. 2015-99948 特開２００９−１６６９８号公報JP 2009-16698 A

特許文献１は、発光する半導体のベアチップが内蔵された基板の天面に、レンズを貼付した発光装置が開示されているが、レンズと基板との接合や切断の順序が示されているに過ぎず、発光装置を製造する製造装置の具体的な構成までは記載されていない。また、引用文献２のフォトリフレクタは、フォトリフレクタ自体の製造段階で、樹脂モールドを施す必要がある。   Patent Document 1 discloses a light-emitting device in which a lens is attached to the top surface of a substrate in which a semiconductor bare chip that emits light is built, but only shows the order of joining and cutting between the lens and the substrate. It does not describe the specific configuration of the manufacturing apparatus for manufacturing the light emitting device. In addition, the photoreflector of the cited document 2 needs to be resin-molded at the manufacturing stage of the photoreflector itself.

一般に、発光装置やフォトリフレクタ等の光学部品を回路基板に実装するときには、光学部品は既に完成品となっており、完成品の光学部材が回路基板に実装される。つまり、光学部品は、回路基板への実装工程とは別の工程で製造され、通常、光学部材は光学部品の製造段階で取り付けされる。   In general, when an optical component such as a light emitting device or a photo reflector is mounted on a circuit board, the optical component has already been completed, and the completed optical member is mounted on the circuit board. That is, the optical component is manufactured in a process different from the process of mounting on the circuit board, and the optical member is usually attached at the manufacturing stage of the optical component.

ところが、光学部品が、市販品の発光素子や受光素子等の回路素子に、ガラスや光学フィルタ等の付加部材である光学部材を後付けする組立部品である場合、光学部品を回路基板へ実装する実装工程と、光学部品自体の製造工程とは、別々の工程（製造ライン）で行うことになる。そのため、複数の製造ラインが必要となり、回路基板への部品実装工程が煩雑となって、設備コストやタクトタイムが増加する。   However, when the optical component is an assembly component in which an optical member that is an additional member such as glass or an optical filter is retrofitted to a commercially available circuit element such as a light emitting element or a light receiving element, the optical component is mounted on a circuit board. The process and the manufacturing process of the optical component itself are performed in separate processes (production lines). Therefore, a plurality of production lines are required, the component mounting process on the circuit board becomes complicated, and the equipment cost and tact time increase.

そこで本発明は、回路素子に付加部品を後付けする組立部品であっても、回路基板への部品実装をスムーズに、かつ、製造工程を煩雑にすることなく行える部品実装方法及び部品実装装置を提供することを目的とする。   Therefore, the present invention provides a component mounting method and a component mounting apparatus that can smoothly mount a component on a circuit board without complicating the manufacturing process even if it is an assembly component that is retrofitted to a circuit element. The purpose is to do.

本発明は下記構成からなる。
（１） 実装用部品を供給する部品供給部と、前記実装用部品を吸着保持する可動ヘッドとを有し、前記可動ヘッドにより前記部品供給部から前記実装用部品を吸着保持して回路基板の所望の位置に装着するマウンタ装置を用いる部品実装方法であって、
前記実装用部品は、回路素子を含む部品本体と、前記部品本体に取り付けられる付加部材と、を有する組立部品を含み、
仮置きプレートに前記部品本体を配置する工程と、
前記仮置きプレートに配置された前記部品本体に接着材を塗布する工程と、
前記付加部材を前記可動ヘッドで吸着保持し、吸着保持された前記付加部材を前記仮置きプレートに配置された前記部品本体に取り付ける工程と、
前記仮置きプレートで前記付加部材が取り付けられて形成された前記組立部品を、前記可動ヘッドにより前記仮置きプレートから吸着保持して前記回路基板に装着する工程と、
を有する部品実装方法。
（２） 実装用部品を供給する部品供給部と、前記実装用部品を吸着保持する可動ヘッドとを有し、前記可動ヘッドにより前記部品供給部から前記実装用部品を吸着保持して回路基板の所望の位置に装着するマウンタ装置を備える部品実装装置であって
前記実装用部品は、回路素子を含む部品本体と、前記部品本体に取り付けられる付加部材と、を有する組立部品を含み、
仮置きプレートに配置された前記部品本体に接着材を塗布する接着材塗布部を更に備え、
前記マウンタ装置は、前記付加部材を前記可動ヘッドで吸着保持し、吸着保持された前記付加部材を前記仮置きプレートに配置された前記部品本体に取り付け、前記仮置きプレートで前記付加部材が取り付けられて形成された前記組立部品を、前記可動ヘッドにより前記仮置きプレートから吸着保持して前記回路基板に装着する部品実装装置。 The present invention has the following configuration.
(1) A component supply unit that supplies a mounting component and a movable head that sucks and holds the mounting component, and the mounting component is sucked and held from the component supply unit by the movable head. A component mounting method using a mounter device to be mounted at a desired position,
The mounting component includes an assembly component having a component main body including a circuit element and an additional member attached to the component main body,
Placing the component body on a temporary placement plate;
Applying an adhesive to the component body disposed on the temporary placement plate;
Attaching the additional member by suction with the movable head and attaching the additional member held by suction to the component main body disposed on the temporary placement plate;
Attaching the assembly part formed by attaching the additional member on the temporary placement plate to the circuit board by sucking and holding from the temporary placement plate by the movable head;
A component mounting method comprising:
(2) A component supply unit that supplies a mounting component and a movable head that sucks and holds the mounting component, and the mounting component is sucked and held from the component supply unit by the movable head. A component mounting apparatus including a mounter device to be mounted at a desired position, wherein the mounting component includes an assembly component having a component main body including a circuit element and an additional member attached to the component main body.
Further comprising an adhesive application part for applying an adhesive to the component body arranged on the temporary placement plate;
The mounter device holds the additional member by suction with the movable head, attaches the additional member held by suction to the component main body disposed on the temporary placement plate, and attaches the additional member with the temporary placement plate. The component mounting apparatus that mounts the assembly component formed in this manner on the circuit board by sucking and holding the assembly component from the temporary placement plate by the movable head.

本発明によれば、回路素子に付加部品を後付けする組立部品であっても、回路基板への部品実装をスムーズに、かつ、製造工程を煩雑にすることなく行える。   According to the present invention, even an assembly component in which an additional component is retrofitted to a circuit element can be smoothly mounted on the circuit board without complicating the manufacturing process.

組立部品の概略断面図である。It is a schematic sectional drawing of an assembly component. 図１に示す部品本体の光学部材取り付け前の状態を示す平面図である。It is a top view which shows the state before attachment of the optical member of the component main body shown in FIG. 図２に示すIII−III線断面図である。It is the III-III sectional view taken on the line shown in FIG. 表面実装型の部品実装装置の構成を概略的に示すブロック図である。It is a block diagram which shows roughly the structure of a surface mounting type component mounting apparatus. 部品実装方法の手順を示すフローチャートである。It is a flowchart which shows the procedure of the component mounting method. （Ａ）〜（Ｄ）は組立部品の製造工程を段階的に示す工程説明図である。(A)-(D) is process explanatory drawing which shows the manufacturing process of an assembly component in steps. パレットの外観斜視図である。It is an external appearance perspective view of a pallet. （Ａ），（Ｂ）は完成した組立部品をマウンタ装置により移載する様子を示す工程説明図である。(A), (B) is process explanatory drawing which shows a mode that the completed assembly components are transferred by the mounter apparatus. パレットに収容された組立部品の頂面の高さと、回路基板に実装された組立部品の頂面の高さとの関係を示す説明図である。It is explanatory drawing which shows the relationship between the height of the top surface of the assembly component accommodated in the pallet, and the height of the top surface of the assembly component mounted in the circuit board. 第１変形例のパレットに組立部品が収容された状態を示す概略断面図である。It is a schematic sectional drawing which shows the state by which the assembly components were accommodated in the pallet of the 1st modification. 第２変形例のパレットに組立部品が収容された状態を示す概略断面図である。It is a schematic sectional drawing which shows the state in which the assembly components were accommodated in the pallet of the 2nd modification.

以下、本発明の実施形態について、図面を参照して詳細に説明する。
本発明の部品実装方法においては、可動ヘッドにより実装用部品を吸着保持して回路基板の所望の位置に装着するマウンタ装置を用い、複数の部品を接合して製造される組立部品を、回路基板に実装する。ここで、組立部品としてフォトリフレクタを一例に説明するが、本発明はこれに限らない。組立部品としては、他の光学部品、電子部品、電気部品等、その他各種の部品であってもよい。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In the component mounting method of the present invention, an assembly component manufactured by joining a plurality of components using a mounter device that sucks and holds a mounting component by a movable head and mounts the mounting component at a desired position on the circuit board is obtained. To implement. Here, a photo reflector will be described as an example of an assembly part, but the present invention is not limited to this. The assembly part may be other various parts such as other optical parts, electronic parts, and electrical parts.

図１は組立部品の概略断面図である。
図示例の組立部品１００は、部品本体１１と、部品本体１１に取り付けられる付加部材である光学部材１３と、を有するフォトインタラプタである。 FIG. 1 is a schematic sectional view of an assembly part.
The assembly component 100 in the illustrated example is a photo interrupter having a component main body 11 and an optical member 13 that is an additional member attached to the component main body 11.

部品本体１１は、全体が合成樹脂製であり、一対の凹部１１ａ，１１ｂを有する。一方の凹部１１ａには発光部１５が設けられ、他方の凹部１１ｂには受光部１７が設けられる。
発光部１５は、電圧が印加されたときに発光する回路素子であり、例えば、赤外線発光ダイオード等が用いられる。
受光部１７は、発光部１５からの光を受光することにより、電気信号を出力する回路素子であり、例えば、フォトダイオード等が用いられる。 The component body 11 is entirely made of synthetic resin and has a pair of recesses 11a and 11b. The light-emitting part 15 is provided in one recessed part 11a, and the light-receiving part 17 is provided in the other recessed part 11b.
The light emitting unit 15 is a circuit element that emits light when a voltage is applied. For example, an infrared light emitting diode is used.
The light receiving unit 17 is a circuit element that outputs an electric signal by receiving light from the light emitting unit 15, and for example, a photodiode or the like is used.

発光部１５と受光部１７は、不図示のリードが接続され、部品本体１１の外側面に形成された不図示の端子部にリードを介して導通される。ここでは、回路素子である発光部１５及び受光部１７、並びに部品本体１１は、市販品として提供される部品であり、部品本体１１に適宜な光学部材１３を後付け（詳細は後述する）することで組立部品１００が完成される。   The light emitting unit 15 and the light receiving unit 17 are connected to a lead (not shown) and are electrically connected to a terminal part (not shown) formed on the outer surface of the component body 11 via the lead. Here, the light emitting unit 15 and the light receiving unit 17, which are circuit elements, and the component main body 11 are components provided as commercially available products, and an appropriate optical member 13 is retrofitted to the component main body 11 (details will be described later). Thus, the assembly part 100 is completed.

光学部材１３は、部品本体１１の発光部１５の光出射側、及び受光部１７の光入射側に対面して配置され、接着材層１９を介して部品本体１１に接合される。光学部材１３は、ガラス、又は特定の光を選択的に透過させる光学フィルタ等を例示できるが、これに限らない。例えば、受光部１７が赤外線受光素子である場合、光学部材１３は赤外光を選択的に透過させる黒色樹脂からなる。   The optical member 13 is disposed so as to face the light emitting side of the light emitting unit 15 and the light incident side of the light receiving unit 17 of the component main body 11, and is bonded to the component main body 11 via the adhesive layer 19. Although the optical member 13 can illustrate glass, the optical filter etc. which selectively permeate | transmit specific light, etc., it is not restricted to this. For example, when the light receiving unit 17 is an infrared light receiving element, the optical member 13 is made of a black resin that selectively transmits infrared light.

図２は図１に示す部品本体１１の光学部材１３取り付け前の状態を示す平面図、図３は図２に示すIII−III線断面図である。なお、図１は図２に示すI−I線断面図に相当する。   2 is a plan view showing a state before the optical member 13 is attached to the component main body 11 shown in FIG. 1, and FIG. 3 is a cross-sectional view taken along line III-III shown in FIG. 1 corresponds to a cross-sectional view taken along the line I-I shown in FIG.

図２に示すように、部品本体１１は、一対の凹部１１ａ，１１ｂが有底の円形状に形成された略直方体形状であり、その上面の一部に後述するディスペンサによって接着材２１が塗布される。接着材２１は光学部材１３が部品本体１１に押し当てられることで濡れ広がり、図１に示す接着材層１９を形成する。なお、接着材２１の塗布位置は任意である。   As shown in FIG. 2, the component main body 11 has a substantially rectangular parallelepiped shape in which a pair of concave portions 11a and 11b are formed in a bottomed circular shape, and an adhesive 21 is applied to a part of the upper surface by a dispenser described later. The The adhesive 21 wets and spreads when the optical member 13 is pressed against the component body 11, and forms the adhesive layer 19 shown in FIG. The application position of the adhesive material 21 is arbitrary.

本構成の組立部品１００のように、発光部１５と受光部１７とを共に備える場合、発光部１５と受光部１７との間に接着材２１を連続的に塗布することが好ましい。その場合、発光部１５から発せられた光がガラスや光学フィルタ等の光学部材１３で反射し、受光部１７に迷光として到達することを、接着材２１による光拡散や光吸収により防止させることが可能になる。   When both the light emitting unit 15 and the light receiving unit 17 are provided as in the assembly component 100 having this configuration, it is preferable to apply the adhesive 21 between the light emitting unit 15 and the light receiving unit 17 continuously. In that case, it is possible to prevent light emitted from the light emitting unit 15 from being reflected by the optical member 13 such as glass or an optical filter and reaching the light receiving unit 17 as stray light by light diffusion or light absorption by the adhesive 21. It becomes possible.

上記構成の組立部品１００は、まず、外部から供給される電力によって発光部１５が発光する。発光部１５から出射された光は、光学部材１３を透過して不図示の被検出物に照射される。被検出物からの反射光のうち、光学部材１３を透過した光が受光部１７で検出される。受光部１７で検出された検出信号は、部品本体１１の外側面に形成された端子部（不図示）を通じて外部に電気信号として出力される。これにより、組立部品１００は、被検出物の有無を検出するセンサとして機能する。   In the assembly component 100 having the above configuration, first, the light emitting unit 15 emits light by electric power supplied from the outside. The light emitted from the light emitting unit 15 passes through the optical member 13 and is irradiated to an object not shown. Of the reflected light from the object to be detected, the light transmitted through the optical member 13 is detected by the light receiving unit 17. The detection signal detected by the light receiving unit 17 is output to the outside as an electrical signal through a terminal unit (not shown) formed on the outer surface of the component main body 11. Thereby, the assembly component 100 functions as a sensor that detects the presence or absence of an object to be detected.

次に、上記構成の組立部品１００を回路基板に実装する手順を説明する。
図４は表面実装型の部品実装装置２００の構成を概略的に示すブロック図である。この部品実装装置２００は、導電性金属からなる所定の配線パターン（パッド）を有する回路基板上に、チップ部品（電子部品、電気部品、光学部品等を含む）をマウントし、マウントされたチップ部品をリフローはんだ付けする表面実装ラインを構成する。 Next, a procedure for mounting the assembly component 100 having the above configuration on a circuit board will be described.
FIG. 4 is a block diagram schematically showing the configuration of the surface mounting type component mounting apparatus 200. The component mounting apparatus 200 mounts chip components (including electronic components, electrical components, optical components, etc.) on a circuit board having a predetermined wiring pattern (pad) made of a conductive metal, and the mounted chip components. A surface mounting line for reflow soldering is constructed.

部品実装装置２００は、ローダー３１、はんだ印刷装置３３、ディスペンサ３５、マウンタ装置３７、リフロー炉３９、及びアンローダー４１が、この順で表面実装ラインに配置される。   In the component mounting apparatus 200, a loader 31, a solder printing apparatus 33, a dispenser 35, a mounter apparatus 37, a reflow furnace 39, and an unloader 41 are arranged in this order on the surface mounting line.

ローダー３１は、回路基板を表面実装ラインの搬送路に供給するもので、回路基板を収容するカセットや前段のラインから回路基板を搬出して、ラインに載せる移送ロボットを備える。ここでいう回路基板とは、リジッド又はフレキシブルな絶縁基材であって、絶縁基材の片面又は両面に所定の配線パターンが形成された基板である。   The loader 31 supplies the circuit board to the conveyance path of the surface mounting line, and includes a cassette that accommodates the circuit board and a transfer robot that unloads the circuit board from the preceding line and places it on the line. The circuit board referred to here is a rigid or flexible insulating base material, and a predetermined wiring pattern is formed on one or both surfaces of the insulating base material.

はんだ印刷装置３３は、回路基板の配線パターン上にクリームはんだをスクリーン印刷する装置である。つまり、配線パターンが形成された回路基板上に、はんだ層形成パターンに応じた開口が形成されたマスクを被せ、スキージによりクリームはんだをマスクの開口から配線パターン上に塗布する。   The solder printing device 33 is a device that screen-prints cream solder on the wiring pattern of the circuit board. That is, a circuit board on which a wiring pattern is formed is covered with a mask in which an opening corresponding to the solder layer forming pattern is formed, and cream solder is applied onto the wiring pattern from the opening of the mask with a squeegee.

ディスペンサ３５は、塗布されたクリームはんだ上に実装されるチップ部品が、リフロー処理前にはんだ面から外れないように、接着材を回路基板上のチップ部品の実装位置に塗布するために使用する装置である。本構成のディスペンサ３５は、前述した部品本体１１に光学部材１３（図１参照）を接着するための接着材を塗布することにも使用される。なお、ディスペンサ３５で使用される接着材は、エラストマー系接着材、熱硬化型接着材等の各種の接着材が使用できる。   The dispenser 35 is an apparatus used to apply an adhesive to the mounting position of the chip component on the circuit board so that the chip component mounted on the applied cream solder does not come off the solder surface before the reflow process. It is. The dispenser 35 having this configuration is also used for applying an adhesive for bonding the optical member 13 (see FIG. 1) to the component main body 11 described above. As the adhesive used in the dispenser 35, various adhesives such as an elastomer-based adhesive and a thermosetting adhesive can be used.

マウンタ装置３７は、はんだ付けされるチップ部品を回路基板上にマウントする装置であって、チップ部品を吸着保持する吸着ノズルが搭載された可動ヘッドと、チップ部品を連続供給する部品供給装置とを備える。本構成のマウンタ装置３７は、上記以外にも、前述した光学部材１３や組立部品１００（図１参照）を移載することにも使用される。部品供給装置としては、例えばテープ供給方式、バルク供給方式、スティック供給方式、又は、後述するパレットを用いるパレット供給方式等を採用できる。   The mounter device 37 is a device for mounting a chip component to be soldered on a circuit board, and includes a movable head mounted with a suction nozzle for sucking and holding the chip component, and a component supply device for continuously supplying the chip component. Prepare. In addition to the above, the mounter device 37 having this configuration is also used for transferring the optical member 13 and the assembly component 100 (see FIG. 1) described above. As the component supply device, for example, a tape supply method, a bulk supply method, a stick supply method, a pallet supply method using a pallet described later, or the like can be adopted.

リフロー炉３９は、赤外線や熱風を熱源とするコンベア式の連続加熱炉である。リフロー炉３９は、はんだ印刷装置３３により印刷されたクリームはんだを溶融させて、チップ部品を回路基板の配線パターンにはんだ接合させる。本構成のリフロー炉３９は、上記以外にも、前述した光学部材１３と部品本体１１（図１参照）との間の接着材層を硬化させることにも使用される。   The reflow furnace 39 is a conveyor type continuous heating furnace using infrared rays or hot air as a heat source. The reflow furnace 39 melts the cream solder printed by the solder printer 33 and solders the chip component to the wiring pattern of the circuit board. In addition to the above, the reflow furnace 39 of this configuration is also used for curing the adhesive layer between the optical member 13 and the component main body 11 (see FIG. 1).

アンローダー４１は、部品実装装置内の搬送路に支持された回路基板を、搬送路から取り出す装置であって、回路基板を格納するカセットや後段のラインに回路基板を搬出する移送ロボットを備える。   The unloader 41 is a device that takes out the circuit board supported by the conveyance path in the component mounting apparatus from the conveyance path, and includes a cassette that stores the circuit board and a transfer robot that carries the circuit board to a subsequent line.

部品実装装置２００は、基本的に次の順で回路基板に実装用部品を実装する。まず、回路基板をローダー３１により表面実装ラインに載せ、はんだ印刷装置３３によりクリームはんだを印刷塗布し、ディスペンサ３５により回路基板上のチップ部品実装位置に接着材を塗布する。そして、マウンタ装置３７により回路基板上にチップ部品を装着した後、リフロー炉３９でリフロー処理する。これにより、クリームはんだが溶融してチップ部品が回路基板上の配線パターンにはんだ接合される。チップ部品が実装された回路基板は、アンローダー４１によって表示実装ラインから取り出される。   The component mounting apparatus 200 mounts mounting components on a circuit board basically in the following order. First, the circuit board is placed on the surface mounting line by the loader 31, cream solder is printed and applied by the solder printer 33, and the adhesive is applied to the chip component mounting position on the circuit board by the dispenser 35. Then, after mounting the chip component on the circuit board by the mounter device 37, the reflow process is performed in the reflow furnace 39. Thereby, the cream solder is melted and the chip component is soldered to the wiring pattern on the circuit board. The circuit board on which the chip component is mounted is taken out from the display mounting line by the unloader 41.

部品実装装置２００は、上記の回路基板の製造工程におけるディスペンサ３５からリフロー炉３９までの間のラインを、前述した組立部品１００の製造ラインとして兼用する。   In the component mounting apparatus 200, the line from the dispenser 35 to the reflow furnace 39 in the circuit board manufacturing process is also used as the assembly line for the assembly component 100 described above.

次に、部品実装装置２００を用いた組立部品１００の製造工程を説明する。
図５は部品実装方法の概略手順を示すフローチャート、図６（Ａ）〜（Ｄ）は組立部品１００の製造工程を段階的に示す工程説明図である。 Next, a manufacturing process of the assembly component 100 using the component mounting apparatus 200 will be described.
FIG. 5 is a flowchart showing a schematic procedure of the component mounting method, and FIGS. 6A to 6D are process explanatory views showing the manufacturing process of the assembly component 100 step by step.

まず、組立部品１００の構成要素である部品本体１１を仮置きプレートとしてのパレット４３に配置する（Ｓ１）。図６（Ａ）に示すように、パレット４３には部品本体１１が収容される凹溝からなる収容部４３ａが形成されている。この収容部４３ａに部品本体１１が収容される。   First, the component main body 11 which is a component of the assembly component 100 is arranged on the pallet 43 as a temporary placement plate (S1). As shown in FIG. 6 (A), the pallet 43 is formed with an accommodating portion 43a formed of a concave groove in which the component main body 11 is accommodated. The component main body 11 is accommodated in the accommodating portion 43a.

図７はパレット４３の外観斜視図である。
パレット４３は、複数の収容部４３ａが格子状に配置された板状部材であり、各収容部４３ａは、収容する部品の形状に応じた形状にされている。図示例では、上面視で長方形の矩形溝からなる収容部４３ａが形成されているが、形状はこれに限らない。また、パレット４３は、製造する回路基板と同じ幅を有することが好ましい。これにより、パレット４３を表面実装ラインで搬送する際に、搬送路の幅調整を行わずに済み、作業効率が向上する。 FIG. 7 is an external perspective view of the pallet 43.
The pallet 43 is a plate-like member in which a plurality of accommodating portions 43a are arranged in a lattice shape, and each accommodating portion 43a is shaped according to the shape of the component to be accommodated. In the illustrated example, the accommodating portion 43a formed of a rectangular groove that is rectangular in a top view is formed, but the shape is not limited thereto. The pallet 43 preferably has the same width as the circuit board to be manufactured. As a result, when the pallet 43 is transported by the surface mounting line, it is not necessary to adjust the width of the transport path, and the work efficiency is improved.

パレット４３への部品本体１１の配置は、手作業でも行えるが、マウンタ装置３７を用いて配置してもよい。その場合、部品本体１１は、マウンタ装置３７の部品供給部で吸着保持可能な形態（テープ供給、スティック供給、又はバルク供給が可能な形態）でマウンタ装置３７に提供する。また、空のパレット４３を表面実装ラインの搬送路に配置する。そして、パレット４３を表面実装ラインのマウンタ装置３７の位置に搬送し、この位置で移動ヘッドを駆動して、部品本体１１を部品供給部からパレット４３の収容部４３ａに移送する。   The component main body 11 can be arranged on the pallet 43 manually, but may be arranged using the mounter device 37. In this case, the component main body 11 is provided to the mounter device 37 in a form that can be sucked and held by the component supply unit of the mounter device 37 (a form in which tape supply, stick supply, or bulk supply is possible). In addition, an empty pallet 43 is arranged on the conveyance path of the surface mounting line. Then, the pallet 43 is transported to the position of the mounter device 37 on the surface mounting line, and the moving head is driven at this position to transfer the component main body 11 from the component supply unit to the accommodating unit 43a of the pallet 43.

光学部材１３は、部品本体１１と同様に、上記したパレット４３と同様の他のパレットに収容する。そして、光学部材１３を収容した他のパレットをマウンタ装置３７の部品供給部に配置しておく。なお、パレットの代わりにテープやスティック等の他の部品保持手段を用いてもよい。   The optical member 13 is housed in another pallet similar to the pallet 43 described above, similarly to the component main body 11. Then, another pallet containing the optical member 13 is arranged in the component supply unit of the mounter device 37. Note that other component holding means such as a tape or a stick may be used instead of the pallet.

次に、パレット４３をディスペンサ３５の位置に搬送し、図６（Ｂ）に示すように、ディスペンサ３５の接着材吐出ノズル４５により、接着材２１を部品本体１１の所定位置に塗布する（Ｓ２）。例えば、図２に示す部品本体１１の中央部（本構成例では、長方形の長辺の中央位置に短辺と平行な矩形領域）と、部品本体１１の角部（４隅）に接着材２１を盛り付ける。   Next, the pallet 43 is conveyed to the position of the dispenser 35, and as shown in FIG. 6B, the adhesive 21 is applied to a predetermined position of the component body 11 by the adhesive discharge nozzle 45 of the dispenser 35 (S2). . For example, the adhesive 21 is attached to the center of the component main body 11 shown in FIG. 2 (in this configuration example, a rectangular region parallel to the short side at the center of the long side of the rectangle) and the corner (four corners) of the component main body 11. To serve.

接着材２１の塗布後、パレット４３をマウンタ装置３７の位置に搬送する。そして、図６（Ｃ）に示すように、マウンタ装置３７の吸着ノズル４７に、部品供給部に配置したパレットから、前述した光学部材１３を吸着保持し、この光学部材１３を、搬送路に配置されたパレット４３における部品本体１１の上面に押し付けて載置する（Ｓ３）。これにより、図６（Ｄ）に示すように、部品本体１１に塗布された接着材２１が部品本体１１の上面で濡れ広がり、接着材層１９が形成される。   After application of the adhesive 21, the pallet 43 is transported to the position of the mounter device 37. Then, as shown in FIG. 6C, the above-mentioned optical member 13 is sucked and held from the pallet placed in the component supply section to the suction nozzle 47 of the mounter device 37, and this optical member 13 is placed in the transport path. The pressed pallet 43 is pressed against and placed on the upper surface of the component main body 11 (S3). As a result, as shown in FIG. 6D, the adhesive 21 applied to the component main body 11 spreads out on the upper surface of the component main body 11, and the adhesive layer 19 is formed.

マウンタ装置３７は、パレット４３の複数の収容部４３ａに収容された部品本体１１それぞれに、光学部材１３を順次取り付ける。これにより、パレット４３には、光学部材１３付きの複数の部品本体１１が収容された状態になる。   The mounter device 37 sequentially attaches the optical member 13 to each of the component main bodies 11 accommodated in the plurality of accommodating portions 43 a of the pallet 43. As a result, the pallet 43 is in a state in which the plurality of component bodies 11 with the optical members 13 are accommodated.

次に、パレット４３をリフロー炉３９の位置に搬送し、リフロー炉３９による加熱により接着材層１９を硬化させる（Ｓ４）。この加熱処理は、熱硬化型接着材を用いる場合に適用するが、他の種類の接着材では省略することもできる。   Next, the pallet 43 is conveyed to the position of the reflow furnace 39, and the adhesive layer 19 is cured by heating with the reflow furnace 39 (S4). This heat treatment is applied when a thermosetting adhesive is used, but may be omitted for other types of adhesives.

以上の工程により、パレット４３の各収容部４３ａには、それぞれ完成品としての組立部品１００が配置される。   Through the above steps, the assembly parts 100 as finished products are arranged in the respective accommodating portions 43 a of the pallet 43.

次に、多数の組立部品１００が収容部４３ａに配置されたパレット４３をマウンタ装置３７の部品供給部に配置して、各組立部品１００をマウンタ装置３７によりマウント可能な状態にする。   Next, the pallet 43 in which a large number of assembly parts 100 are arranged in the accommodating portion 43 a is arranged in the component supply unit of the mounter device 37 so that each assembly component 100 can be mounted by the mounter device 37.

図８（Ａ），（Ｂ）は完成した組立部品１００をマウンタ装置３７により移載する様子を示す工程説明図である。
図８（Ａ）に示すように、マウンタ装置３７は吸着ノズル４７によりパレット４３に収容された組立部品１００を吸着保持し、パレット４３から取り出す。 8A and 8B are process explanatory views showing a state where the completed assembly part 100 is transferred by the mounter device 37. FIG.
As shown in FIG. 8A, the mounter device 37 sucks and holds the assembly component 100 accommodated in the pallet 43 by the suction nozzle 47 and takes it out from the pallet 43.

そして、図８（Ｂ）に示すように、マウンタ装置３７は、吸着保持された組立部品１００を回路基板５１の所望の位置に装着する（Ｓ５）。装着された組立部品１００は、前述したように、予めディスペンサ３５により塗布された接着材によって回路基板に仮固定され、後段のリフロー炉３９でリフロー処理される。これにより、クリームはんだが溶融して組立部品１００が回路基板の配線パターンにはんだ接続される。以上の工程により、組立部品１００が実装された回路基板５１が製造される。   Then, as shown in FIG. 8B, the mounter device 37 mounts the assembly component 100 held by suction at a desired position on the circuit board 51 (S5). As described above, the mounted assembly part 100 is temporarily fixed to the circuit board by the adhesive previously applied by the dispenser 35 and is reflowed in the subsequent reflow furnace 39. As a result, the cream solder is melted and the assembly component 100 is soldered to the wiring pattern of the circuit board. Through the above steps, the circuit board 51 on which the assembly component 100 is mounted is manufactured.

上記したように、組立部品１００をマウンタ装置３７により製造するとともに、完成した組立部品１００を同じマウンタ装置３７で回路基板５１に実装することにより、回路基板５１への部品実装をスムーズに、かつ、製造工程を煩雑にすることなく行える。つまり、組立部品１００が、市販品の発光素子や受光素子等の回路素子側の部品に、ガラスや光学フィルタ等の光学部材を後付けする構成であっても、組立部品１００を新たな装置を用いることなく、既存の回路基板の製造ラインで組立部品１００の製造が可能となる。よって、組立部品１００の回路基板５１への実装工程と、組立部品自体の製造工程とを別々の工程（製造ライン）で実施することや、製造ラインの新設や改変を実施する必要がなくなる。したがって、複数の製造ラインを用いる場合と比較して、回路基板の製造工程が簡単になり、設備コストの増加やタクトタイムの増加を抑制できる。   As described above, the assembly component 100 is manufactured by the mounter device 37, and the completed assembly component 100 is mounted on the circuit board 51 by the same mounter device 37, so that the component mounting on the circuit board 51 can be performed smoothly and This can be done without complicating the manufacturing process. That is, even if the assembly part 100 is configured to retrofit an optical member such as glass or an optical filter to a part on the circuit element side such as a commercially available light emitting element or light receiving element, a new apparatus is used for the assembly part 100. Without this, the assembly part 100 can be manufactured on the existing circuit board manufacturing line. Therefore, it is not necessary to perform the mounting process of the assembly part 100 on the circuit board 51 and the manufacturing process of the assembly part itself in separate processes (manufacturing lines), or to newly install or modify the manufacturing line. Therefore, compared with the case where a plurality of production lines are used, the circuit board manufacturing process is simplified, and an increase in equipment cost and an increase in tact time can be suppressed.

また、組立部品１００が、市販品の回路素子に光学部材を後付けする構成であることで、仕様の異なる多種の組立部品１００を、部品実装装置２００を用いて簡単に製造できる。例えば、部品本体１１側の回路素子を共通にして、付加部材である光学部材１３を適宜変更したり、光学部材１３を共通にして、部品本体１１側の回路素子を適宜変更したりする等、組立部品１００の製造自由度を高められる。よって、多種多様な仕様の組立部品１００を効率よく製造でき、しかも、回路基板５１の仕様に応じた組立部品１００を製造現場で簡単に製造できる。そのため、部品の欠品、入荷待ち等の製造ラインを停止させる要因を極力排除でき、高効率な製造ラインを構築できる。   Further, since the assembly component 100 has a configuration in which an optical member is retrofitted to a commercially available circuit element, various assembly components 100 having different specifications can be easily manufactured using the component mounting apparatus 200. For example, the circuit element on the component main body 11 side is shared, the optical member 13 as an additional member is appropriately changed, the optical member 13 is shared, and the circuit element on the component main body 11 side is appropriately changed, etc. The degree of freedom in manufacturing the assembly part 100 can be increased. Therefore, it is possible to efficiently manufacture the assembly component 100 having various specifications, and it is possible to easily manufacture the assembly component 100 according to the specification of the circuit board 51 at the manufacturing site. Therefore, it is possible to eliminate as much as possible the factors that stop the production line, such as missing parts or waiting for arrival, and a highly efficient production line can be constructed.

なお、部品本体１１を収容するパレット４３の収容部４３ａにおける底面の深さは、収容部品（部品本体１１、光学部材１３を有する組立部品１００）の高さに応じて、収容部品が収容部４３ａから落下しない深さに設定される。また、パレット４３を部品実装装置２００の表面実装ラインの搬送路に載置した場合を考えると、図９に示すように、パレット４３の上面４３ｂの高さと、パレット４３に収容された部品本体１１の頂面１１ｃの高さとを一致させることが好ましい。これによれば、パレット４３を搬送路６３に載置した場合と、回路基板５１を搬送路６３に載置した場合とで、ディスペンサ３５により接着材１２を塗布する際の接着材吐出ノズル４５の高さを一定にできる。   It should be noted that the depth of the bottom surface of the accommodating portion 43a of the pallet 43 that accommodates the component main body 11 depends on the height of the accommodating component (the component main body 11, the assembly component 100 having the optical member 13). The depth is set so that it will not fall off. Considering the case where the pallet 43 is placed on the conveyance path of the surface mounting line of the component mounting apparatus 200, as shown in FIG. 9, the height of the upper surface 43 b of the pallet 43 and the component main body 11 accommodated in the pallet 43. It is preferable to match the height of the top surface 11c. According to this, when the pallet 43 is placed on the conveyance path 63 and when the circuit board 51 is placed on the conveyance path 63, the adhesive discharge nozzle 45 when applying the adhesive 12 by the dispenser 35 is used. The height can be made constant.

つまり、パレット４３に収容された部品本体１１の頂面１１ｃと回路基板５１の表面とが同一の高さとなる。これによれば、ディスペンサ３５を使用して回路基板５１に接着材を塗布する場合と、部品本体１１に接着材２１を塗布する場合とを、同じ設定で制御でき、接着材の塗布制御が簡単になる。   That is, the top surface 11 c of the component main body 11 accommodated in the pallet 43 and the surface of the circuit board 51 are at the same height. According to this, the case where the adhesive is applied to the circuit board 51 using the dispenser 35 and the case where the adhesive 21 is applied to the component main body 11 can be controlled with the same setting, and the adhesive application control is simple. become.

また、パレット４３は、収容部４３ａが凹部として形成される以外にも、平坦なプレートの表面から上方に突出する凸片（板材、ブロック材、ピン等）を設け、凸片により囲まれる領域で部品本体１１等の部品を支持する構成等、種々の形態であってもよい。   Further, the pallet 43 is provided in a region surrounded by the convex pieces by providing convex pieces (plate material, block material, pins, etc.) protruding upward from the surface of the flat plate, in addition to the housing portion 43a being formed as a concave portion. Various forms such as a configuration for supporting a component such as the component main body 11 may be used.

また、部品本体１１への接着材２１の塗布は、ディスペンサ３５により行う以外にも、例えば、ローラや刷毛、又はスプレー等を用いて、パレット４３上の複数の部品本体１１に一度に接着材２１を設けることであってもよい。
更に、接着材２１は、液状のものに限らず、テープやシート状の接着材であってもよい。その場合、接着材層１９の厚さをより均一にできる。 In addition to the application of the adhesive 21 to the component main body 11 by the dispenser 35, the adhesive 21 is applied to the plurality of component main bodies 11 on the pallet 43 at once using, for example, a roller, a brush, a spray, or the like. May be provided.
Furthermore, the adhesive 21 is not limited to a liquid material, and may be a tape or a sheet-like adhesive. In that case, the thickness of the adhesive layer 19 can be made more uniform.

＜第１変形例＞
次に、部品本体１１を収容するパレット４３（光学部材１３を収容するパレットも同様）の第１変形例を説明する。
図１０は第１変形例のパレット４３Ａに組立部品１００が収容された状態を示す概略断面図である。本構成のパレット４３Ａにおける収容部４３ａの底面には、粘着性部材５３が配置される。 <First Modification>
Next, a first modification of the pallet 43 that accommodates the component main body 11 (the same applies to the pallet that accommodates the optical member 13) will be described.
FIG. 10 is a schematic cross-sectional view showing a state in which the assembly component 100 is accommodated in the pallet 43A of the first modification. An adhesive member 53 is disposed on the bottom surface of the accommodating portion 43a in the pallet 43A having this configuration.

粘着性部材５３としては、例えば、表面に接着層を有する弾性部材等が使用できる。収容部４３ａの底面に粘着性部材５３を配置することにより、部品本体１１を収容部４３ａに、より確実に保持できる。これにより、マウンタ装置３７で部品本体１１を収容部４３ａに配置した後、部品本体１１が収容部４３ａ内でずれて姿勢が変わることや、外力等により収容部４３ａから飛び出てしまうことを防止できる。よって、収容された部品本体１１の吸着保持が安定して行え、部品本体１１と光学部材１３とのより正確な位置合わせが可能となり、また、欠品等による組立不良の発生を防止できる。そして、組立部品１００の完成後も同様に、収容部４３ａからの組立部品１００の予期しない姿勢変化や脱落が防止され、より確実な部品実装が行える。   As the adhesive member 53, for example, an elastic member having an adhesive layer on the surface can be used. By disposing the adhesive member 53 on the bottom surface of the housing portion 43a, the component main body 11 can be more securely held in the housing portion 43a. Thereby, after the component main body 11 is arranged in the accommodating portion 43a by the mounter device 37, it is possible to prevent the component main body 11 from being displaced in the accommodating portion 43a and changing its posture, or from jumping out of the accommodating portion 43a due to an external force or the like. . Therefore, the component main body 11 accommodated can be stably sucked and held, and the component main body 11 and the optical member 13 can be more accurately aligned, and an assembly failure due to a shortage can be prevented. Similarly, after the assembly part 100 is completed, an unexpected posture change or dropout of the assembly part 100 from the accommodating portion 43a is prevented, and more reliable component mounting can be performed.

＜第２変形例＞
次に、部品本体１１を収容するパレット４３（光学部材１３を収容するパレットも同様）の第２変形例を説明する。
図１１は第２変形例のパレット４３Ｂに組立部品１００が収容された状態を示す概略断面図である。本構成のパレット４３Ｂにおける収容部４３ａの底面には、エア吸引機構５５が設けられる。 <Second Modification>
Next, a second modification of the pallet 43 that accommodates the component main body 11 (the same applies to the pallet that accommodates the optical member 13) will be described.
FIG. 11 is a schematic cross-sectional view showing a state in which the assembly component 100 is accommodated in the pallet 43B of the second modified example. An air suction mechanism 55 is provided on the bottom surface of the accommodating portion 43a in the pallet 43B having this configuration.

エア吸引機構５５は、パレット４３Ｂの収容部４３ａの底面に形成された凹部５７と、凹部５７の一部に形成された吸引孔５９と、吸引孔５９に連通するエア吸引流路６１と、エア吸引流路６１に接続された吸引ポンプＰとを有する。   The air suction mechanism 55 includes a recess 57 formed in the bottom surface of the housing portion 43a of the pallet 43B, a suction hole 59 formed in a part of the recess 57, an air suction channel 61 communicating with the suction hole 59, an air A suction pump P connected to the suction channel 61.

吸引孔５９は、部品本体１１（又は光学部材１３）よりも小さいサイズの孔であればよく、収容部４３ａの複数箇所に形成してもよい。   The suction hole 59 may be a hole having a size smaller than that of the component main body 11 (or the optical member 13), and may be formed at a plurality of locations in the accommodating portion 43a.

本構成によれば、吸引ポンプＰから発生させる負圧によって部品本体１１（光学部材１３）をパレット４３Ｂの収容部４３ａに吸着保持するため、より確実な収容部品の支持が行える。また、収容部品の取り出しを行う際に、吸着を解除したり弱めたりすることで、より円滑な収容部品の受け渡しが可能となる。   According to this configuration, since the component main body 11 (optical member 13) is sucked and held in the accommodating portion 43a of the pallet 43B by the negative pressure generated from the suction pump P, the accommodated component can be supported more reliably. Further, when removing the accommodation component, it is possible to transfer the accommodation component more smoothly by releasing or weakening the suction.

本発明は上記の実施形態に限定されるものではなく、実施形態の各構成を相互に組み合わせることや、明細書の記載、並びに周知の技術に基づいて、当業者が変更、応用することも本発明の予定するところであり、保護を求める範囲に含まれる。   The present invention is not limited to the above-described embodiments, and the configurations of the embodiments may be combined with each other, or may be modified or applied by those skilled in the art based on the description of the specification and well-known techniques. The invention is intended and is within the scope of seeking protection.

以上の通り、本明細書には次の事項が開示されている。
（１） 実装用部品を供給する部品供給部と、前記実装用部品を吸着保持する可動ヘッドとを有し、前記可動ヘッドにより前記部品供給部から前記実装用部品を吸着保持して回路基板の所望の位置に装着するマウンタ装置を用いる部品実装方法であって、
前記実装用部品は、回路素子を含む部品本体と、前記部品本体に取り付けられる付加部材と、を有する組立部品を含み、
仮置きプレートに前記部品本体を配置する工程と、
前記仮置きプレートに配置された前記部品本体に接着材を塗布する工程と、
前記付加部材を前記可動ヘッドで吸着保持し、吸着保持された前記付加部材を前記仮置きプレートに配置された前記部品本体に取り付ける工程と、
前記仮置きプレートで前記付加部材が取り付けられて形成された前記組立部品を、前記可動ヘッドにより前記仮置きプレートから吸着保持して前記回路基板に装着する工程と、
を有する部品実装方法。
この部品実装方法によれば、仮置きプレートに配置された部品本体に接着材を塗布した後、可動ヘッドで付加部材を部品本体に取り付け、これにより完成した組立部品を、可動ヘッドにより仮置きプレートから回路基板に移送して装着する。これにより、組立部品の製造と、回路基板への実装とを、同じ可動ヘッドにより実施するため、市販品の回路素子に付加部品を後付けする組立部品であっても、回路基板への部品実装をスムーズに、かつ、製造工程を煩雑にすることなく行える。 As described above, the following items are disclosed in this specification.
(1) A component supply unit that supplies a mounting component and a movable head that sucks and holds the mounting component, and the mounting component is sucked and held from the component supply unit by the movable head. A component mounting method using a mounter device to be mounted at a desired position,
The mounting component includes an assembly component having a component main body including a circuit element and an additional member attached to the component main body,
Placing the component body on a temporary placement plate;
Applying an adhesive to the component body disposed on the temporary placement plate;
Attaching the additional member by suction with the movable head and attaching the additional member held by suction to the component main body disposed on the temporary placement plate;
Attaching the assembly part formed by attaching the additional member on the temporary placement plate to the circuit board by sucking and holding from the temporary placement plate by the movable head;
A component mounting method comprising:
According to this component mounting method, after an adhesive is applied to the component main body arranged on the temporary placement plate, the additional member is attached to the component main body with the movable head, and the completed assembly part is attached to the temporary placement plate by the movable head Is transferred to the circuit board and mounted. As a result, the assembly parts are manufactured and mounted on the circuit board using the same movable head, so even if the assembly parts are retrofitted to a commercially available circuit element, the parts can be mounted on the circuit board. This can be done smoothly and without complicating the manufacturing process.

（２） 前記接着材を塗布する工程は、前記回路基板に前記実装用部品を仮固定する接着材を塗布するディスペンサを用いて行う（１）に記載の部品実装方法。
この部品実装方法によれば、実装用部品を回路基板に仮付けする際に用いるディスペンサを利用して部品本体に接着材を塗布するため、接着材塗布のための機器を新設する必要がなく、低コストで円滑に組立部品を製造できる。 (2) The component mounting method according to (1), wherein the step of applying the adhesive is performed using a dispenser that applies an adhesive that temporarily fixes the mounting component to the circuit board.
According to this component mounting method, since the adhesive is applied to the component main body using a dispenser used when temporarily mounting the mounting component to the circuit board, there is no need to newly install an apparatus for applying the adhesive. Assembly parts can be manufactured smoothly at low cost.

（３） 前記仮置きプレートに前記部品本体を配置する工程は、前記マウンタ装置により行う（１）又は（２）に記載の部品実装方法。
この部品実装方法によれば、部品本体をマウンタ装置により仮置きプレートに配置することで、高速で正確な配置処理が可能となり、例えば手作業の場合よりも大きく作業効率が高められる。 (3) The component mounting method according to (1) or (2), wherein the step of arranging the component main body on the temporary placement plate is performed by the mounter device.
According to this component mounting method, the component main body is arranged on the temporary placement plate by the mounter device, so that an accurate arrangement process can be performed at a high speed, and the working efficiency can be greatly increased compared with, for example, manual work.

（４） 前記仮置きプレートは、前記部品本体を収容する収容部が複数箇所に形成され、
複数の前記収容部に収容された前記部品本体のそれぞれに前記付加部材を取り付けた後、前記付加部材が取り付けられた前記組立部品を前記回路基板に順次に実装する（１）〜（３）のいずれか一つに記載の部品実装方法。
この部品実装方法によれば、仮置きプレートに複数の部品本体が配置できるため、一度に複数の組立部品を製造及び供給可能となる。よって、組立部品を逐一製造する場合よりも高効率な部品実装が行える。 (4) The temporary placement plate includes a plurality of accommodating portions that accommodate the component main body,
After the additional member is attached to each of the component main bodies accommodated in the plurality of accommodating portions, the assembly component to which the additional member is attached is sequentially mounted on the circuit board. The component mounting method according to any one of the above.
According to this component mounting method, since a plurality of component bodies can be arranged on the temporary placement plate, a plurality of assembly components can be manufactured and supplied at a time. Therefore, the component mounting can be performed more efficiently than the case where assembly parts are manufactured one by one.

（５） 前記仮置きプレートに配置され前記付加部材が取り付けられた前記組立部品を加熱して、前記接着材を硬化させる工程を有する（１）〜（４）のいずれか一つに記載の部品実装方法。
この部品実装方法によれば、例えば接着材が熱硬化性である場合に、接着材の確実な硬化が得られ、また、乾燥が必要な接着材の場合には、自然乾燥の場合と比較して乾燥時間を大幅に短縮できる。 (5) The component according to any one of (1) to (4), which includes a step of heating the assembly component disposed on the temporary placement plate and attached with the additional member to cure the adhesive. Implementation method.
According to this component mounting method, for example, when the adhesive is thermosetting, reliable curing of the adhesive is obtained, and in the case of an adhesive that needs to be dried, compared to the case of natural drying. Drying time can be greatly reduced.

（６） 実装用部品を供給する部品供給部と、前記実装用部品を吸着保持する可動ヘッドとを有し、前記可動ヘッドにより前記部品供給部から前記実装用部品を吸着保持して回路基板の所望の位置に装着するマウンタ装置を備える部品実装装置であって
前記実装用部品は、回路素子を含む部品本体と、前記部品本体に取り付けられる付加部材と、を有する組立部品を含み、
仮置きプレートに配置された前記部品本体に接着材を塗布する接着材塗布部を更に備え、
前記マウンタ装置は、前記付加部材を前記可動ヘッドで吸着保持し、吸着保持された前記付加部材を前記仮置きプレートに配置された前記部品本体に取り付け、前記仮置きプレートで前記付加部材が取り付けられて形成された前記組立部品を、前記可動ヘッドにより前記仮置きプレートから吸着保持して前記回路基板に装着する部品実装装置。
この部品実装装置によれば、仮置きプレートに配置された部品本体に接着材を塗布した後、可動ヘッドで付加部材を部品本体に取り付け、これにより完成した組立部品を、可動ヘッドにより仮置きプレートから回路基板に移送して装着する。これにより、組立部品の製造と、回路基板への実装とを、同じ可動ヘッドにより実施するため、市販品の回路素子に付加部品を後付けする組立部品であっても、回路基板への部品実装をスムーズに、かつ、製造工程を煩雑にすることなく行える。 (6) A component supply unit that supplies a mounting component and a movable head that sucks and holds the mounting component, and the mounting component is sucked and held from the component supply unit by the movable head. A component mounting apparatus including a mounter device to be mounted at a desired position, wherein the mounting component includes an assembly component having a component main body including a circuit element and an additional member attached to the component main body.
Further comprising an adhesive application part for applying an adhesive to the component body arranged on the temporary placement plate;
The mounter device holds the additional member by suction with the movable head, attaches the additional member held by suction to the component main body disposed on the temporary placement plate, and attaches the additional member with the temporary placement plate. The component mounting apparatus that mounts the assembly component formed in this manner on the circuit board by sucking and holding the assembly component from the temporary placement plate by the movable head.
According to this component mounting apparatus, after an adhesive is applied to the component main body arranged on the temporary placement plate, the additional member is attached to the component main body with the movable head, and the completed assembly part is then attached to the temporary placement plate with the movable head. Is transferred to the circuit board and mounted. As a result, the assembly parts are manufactured and mounted on the circuit board using the same movable head, so even if the assembly parts are retrofitted to a commercially available circuit element, the parts can be mounted on the circuit board. This can be done smoothly and without complicating the manufacturing process.

（７） 前記接着材塗布部は、前記回路基板に前記実装用部品を仮固定する接着材を塗布するディスペンサを有する（６）に記載の部品実装装置。
この部品実装装置によれば、実装用部品を回路基板に仮付けする際に用いるディスペンサを利用して部品本体に接着材を塗布するため、接着材塗布のための機器を新設する必要がなく、低コストで円滑に組立部品を製造できる。 (7) The component mounting apparatus according to (6), wherein the adhesive application unit includes a dispenser that applies an adhesive that temporarily fixes the mounting component to the circuit board.
According to this component mounting apparatus, since the adhesive is applied to the component main body using a dispenser used when temporarily mounting the mounting component to the circuit board, there is no need to newly install an apparatus for applying the adhesive. Assembly parts can be manufactured smoothly at low cost.

（８） 前記仮置きプレートは、前記部品本体を収容する収容部が複数箇所に形成されている（６）又は（７）に記載の部品実装装置。
この部品実装装置によれば、仮置きプレートに複数の部品本体が配置できるため、一度に複数の組立部品を製造及び供給可能となる。よって、組立部品を逐一製造する場合よりも高効率な部品実装が行える。 (8) The temporary mounting plate is the component mounting apparatus according to (6) or (7), in which a housing portion that houses the component main body is formed at a plurality of locations.
According to this component mounting apparatus, since a plurality of component bodies can be arranged on the temporary placement plate, a plurality of assembly components can be manufactured and supplied at a time. Therefore, the component mounting can be performed more efficiently than the case where assembly parts are manufactured one by one.

（９） 前記仮置きプレートは、前記収容部の底部に粘着性部材が配置されている（８）に記載の部品実装装置。
この部品実装装置によれば、収容部に収容される部品が収容部外に外れることなく、収容部内に安定して支持される。 (9) The component mounting apparatus according to (8), wherein the temporary placement plate has an adhesive member disposed on a bottom portion of the housing portion.
According to this component mounting apparatus, the components housed in the housing portion are stably supported in the housing portion without coming out of the housing portion.

（１０） エアを吸引するエア吸引流路を備え、
前記仮置きプレートは、前記収容部の底部に前記エア吸引流路と連通する吸引孔が形成されている（８）に記載の部品実装装置。
この部品実装装置によれば、収容部に収容される部品が安定して支持されるとともに、可動ヘッドとの円滑な部品の受け渡しが可能となる。 (10) An air suction flow path for sucking air is provided,
The temporary mounting plate is a component mounting apparatus according to (8), wherein a suction hole communicating with the air suction flow path is formed in a bottom portion of the housing portion.
According to this component mounting apparatus, the components accommodated in the accommodating portion are stably supported, and the components can be smoothly transferred to and from the movable head.

（１１） 前記仮置きプレートに配置された前記組立部品を加熱する加熱部を備える（６）〜（１０）のいずれか一つに記載の部品実装装置。
この部品実装装置によれば、例えば接着材が熱硬化性である場合に、接着材の確実な硬化が得られ、また、乾燥が必要な接着材の場合には、自然乾燥の場合と比較して乾燥時間を大幅に短縮できる。 (11) The component mounting apparatus according to any one of (6) to (10), further including a heating unit configured to heat the assembly component arranged on the temporary placement plate.
According to this component mounting apparatus, for example, when the adhesive is thermosetting, reliable curing of the adhesive is obtained, and in the case of an adhesive that needs to be dried, compared to the case of natural drying. Drying time can be greatly reduced.

（１２） 前記部品本体は、発光部、受光部の少なくともいずれかを含む回路素子を備え、
前記付加部材は、ガラス、又は特定の光を選択的に透過させる光学フィルタである（６）〜（１１）のいずれか一つに記載の部品実装装置。
この部品実装装置によれば、高効率で多種の仕様の光学部品を製造でき、回路基板に応じた光学部品を効率よく実装できる。 (12) The component body includes a circuit element including at least one of a light emitting unit and a light receiving unit,
The component mounting apparatus according to any one of (6) to (11), wherein the additional member is glass or an optical filter that selectively transmits specific light.
According to this component mounting apparatus, optical components of various specifications can be manufactured with high efficiency, and optical components corresponding to the circuit board can be mounted efficiently.

１１ 部品本体
１３ 光学部材
１５ 発光部
１７ 受光部
１９ 接着材層
２１ 接着材
３５ ディスペンサ
３７ マウンタ装置
３９ リフロー炉
４３ パレット（仮置きプレート）
４３ａ 収容部
４５ 接着材吐出ノズル
４７ 吸着ノズル
５１ 回路基板
５３ 粘着性部材
５５ エア吸引機構
５７ 凹部
５９ 吸引孔
６１ エア吸引流路
１００ 組立部品
２００ 部品実装装置 DESCRIPTION OF SYMBOLS 11 Component main body 13 Optical member 15 Light-emitting part 17 Light-receiving part 19 Adhesive material layer 21 Adhesive material 35 Dispenser 37 Mounter apparatus 39 Reflow furnace 43 Pallet (temporary placing plate)
43a Housing 45 Adhesive Discharge Nozzle 47 Adsorption Nozzle 51 Circuit Board 53 Adhesive Member 55 Air Suction Mechanism 57 Recess 59 Suction Hole 61 Air Suction Channel 100 Assembly Component 200 Component Mounting Device

Claims (12)

実装用部品を供給する部品供給部と、前記実装用部品を吸着保持する可動ヘッドとを有し、前記可動ヘッドにより前記部品供給部から前記実装用部品を吸着保持して回路基板の所望の位置に装着するマウンタ装置を用いる部品実装方法であって、
前記実装用部品は、回路素子を含む部品本体と、前記部品本体に取り付けられる付加部材と、を有する組立部品を含み、
仮置きプレートに前記部品本体を配置する工程と、
前記仮置きプレートに配置された前記部品本体に接着材を塗布する工程と、
前記付加部材を前記可動ヘッドで吸着保持し、吸着保持された前記付加部材を前記仮置きプレートに配置された前記部品本体に取り付ける工程と、
前記仮置きプレートで前記付加部材が取り付けられて形成された前記組立部品を、前記可動ヘッドにより前記仮置きプレートから吸着保持して前記回路基板に装着する工程と、
を有する部品実装方法。 A component supply unit that supplies a mounting component; and a movable head that sucks and holds the mounting component; and a desired position of the circuit board by sucking and holding the mounting component from the component supply unit by the movable head A component mounting method using a mounter device to be mounted on
The mounting component includes an assembly component having a component main body including a circuit element and an additional member attached to the component main body,
Placing the component body on a temporary placement plate;
Applying an adhesive to the component body disposed on the temporary placement plate;
Attaching the additional member by suction with the movable head and attaching the additional member held by suction to the component main body disposed on the temporary placement plate;
Attaching the assembly part formed by attaching the additional member on the temporary placement plate to the circuit board by sucking and holding from the temporary placement plate by the movable head;
A component mounting method comprising: 前記接着材を塗布する工程は、前記回路基板に前記実装用部品を仮固定する接着材を塗布するディスペンサを用いて行う請求項１に記載の部品実装方法。   The component mounting method according to claim 1, wherein the step of applying the adhesive is performed using a dispenser that applies an adhesive that temporarily fixes the mounting component to the circuit board. 前記仮置きプレートに前記部品本体を配置する工程は、前記マウンタ装置により行う請求項１又は請求項２に記載の部品実装方法。   The component mounting method according to claim 1, wherein the step of arranging the component main body on the temporary placement plate is performed by the mounter device. 前記仮置きプレートは、前記部品本体を収容する収容部が複数箇所に形成され、
複数の前記収容部に収容された前記部品本体のそれぞれに前記付加部材を取り付けた後、前記付加部材が取り付けられた前記組立部品を前記回路基板に順次に実装する請求項１〜請求項３のいずれか一項に記載の部品実装方法。 The temporary placement plate is formed with a plurality of accommodating portions for accommodating the component main body,
4. The assembly component according to claim 1, wherein the assembly component to which the additional member is attached is sequentially mounted on the circuit board after the additional member is attached to each of the component main bodies accommodated in the plurality of accommodating portions. The component mounting method according to any one of the above. 前記仮置きプレートに配置され前記付加部材が取り付けられた前記組立部品を加熱して、前記接着材を硬化させる工程を有する請求項１〜請求項４のいずれか一項に記載の部品実装方法。   The component mounting method according to any one of claims 1 to 4, further comprising a step of heating the assembly component disposed on the temporary placement plate and having the additional member attached thereto to cure the adhesive. 実装用部品を供給する部品供給部と、前記実装用部品を吸着保持する可動ヘッドとを有し、前記可動ヘッドにより前記部品供給部から前記実装用部品を吸着保持して回路基板の所望の位置に装着するマウンタ装置を備える部品実装装置であって
前記実装用部品は、回路素子を含む部品本体と、前記部品本体に取り付けられる付加部材と、を有する組立部品を含み、
仮置きプレートに配置された前記部品本体に接着材を塗布する接着材塗布部を更に備え、
前記マウンタ装置は、前記付加部材を前記可動ヘッドで吸着保持し、吸着保持された前記付加部材を前記仮置きプレートに配置された前記部品本体に取り付け、前記仮置きプレートで前記付加部材が取り付けられて形成された前記組立部品を、前記可動ヘッドにより前記仮置きプレートから吸着保持して前記回路基板に装着する部品実装装置。 A component supply unit that supplies a mounting component; and a movable head that sucks and holds the mounting component; and a desired position of the circuit board by sucking and holding the mounting component from the component supply unit by the movable head A mounting device including a mounter device, wherein the mounting component includes an assembly component having a component body including a circuit element and an additional member attached to the component body,
Further comprising an adhesive application part for applying an adhesive to the component body arranged on the temporary placement plate;
The mounter device holds the additional member by suction with the movable head, attaches the additional member held by suction to the component main body disposed on the temporary placement plate, and attaches the additional member with the temporary placement plate. The component mounting apparatus that mounts the assembly component formed in this manner on the circuit board by sucking and holding the assembly component from the temporary placement plate by the movable head. 前記接着材塗布部は、前記回路基板に前記実装用部品を仮固定する接着材を塗布するディスペンサを有する請求項６に記載の部品実装装置。   The component mounting apparatus according to claim 6, wherein the adhesive application unit includes a dispenser that applies an adhesive that temporarily fixes the mounting component to the circuit board. 前記仮置きプレートは、前記部品本体を収容する収容部が複数箇所に形成されている請求項６又は請求項７に記載の部品実装装置。   The component mounting apparatus according to claim 6, wherein the temporary placement plate includes a plurality of accommodating portions that accommodate the component main body. 前記仮置きプレートは、前記収容部の底部に粘着性部材が配置されている請求項８に記載の部品実装装置。   The component mounting apparatus according to claim 8, wherein the temporary placement plate has an adhesive member disposed on a bottom portion of the housing portion. エアを吸引するエア吸引流路を備え、
前記仮置きプレートは、前記収容部の底部に前記エア吸引流路と連通する吸引孔が形成されている請求項８に記載の部品実装装置。 It has an air suction channel that sucks air,
The component mounting apparatus according to claim 8, wherein the temporary placement plate is formed with a suction hole communicating with the air suction flow path at a bottom portion of the housing portion. 前記仮置きプレートに配置された前記組立部品を加熱する加熱部を備える請求項６〜請求項１０のいずれか一項に記載の部品実装装置。   The component mounting apparatus according to any one of claims 6 to 10, further comprising a heating unit configured to heat the assembly component disposed on the temporary placement plate. 前記部品本体は、発光部、受光部の少なくともいずれかを含む回路素子を備え、
前記付加部材は、ガラス、又は特定の光を選択的に透過させる光学フィルタである請求項６〜請求項１１のいずれか一項に記載の部品実装装置。 The component body includes a circuit element including at least one of a light emitting unit and a light receiving unit,
The component mounting apparatus according to claim 6, wherein the additional member is glass or an optical filter that selectively transmits specific light.

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