WO2008100146A3 - Method and device for encapsulating electronic components using underpressure - Google Patents

Method and device for encapsulating electronic components using underpressure Download PDF

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Publication number
WO2008100146A3
WO2008100146A3 PCT/NL2008/050088 NL2008050088W WO2008100146A3 WO 2008100146 A3 WO2008100146 A3 WO 2008100146A3 NL 2008050088 W NL2008050088 W NL 2008050088W WO 2008100146 A3 WO2008100146 A3 WO 2008100146A3
Authority
WO
WIPO (PCT)
Prior art keywords
underpressure
electronic components
mould cavity
encapsulating electronic
encapsulating material
Prior art date
Application number
PCT/NL2008/050088
Other languages
French (fr)
Other versions
WO2008100146A2 (en
Inventor
Johannes Lambertus Gerardus Maria Venrooij
Wilhelmus Gerardus Jozef Gal
Haren Lambertus Franciscus Wilhelmus Van
Original Assignee
Fico Bv
Johannes Lambertus Gerardus Maria Venrooij
Wilhelmus Gerardus Jozef Gal
Haren Lambertus Franciscus Wilhelmus Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Johannes Lambertus Gerardus Maria Venrooij, Wilhelmus Gerardus Jozef Gal, Haren Lambertus Franciscus Wilhelmus Van filed Critical Fico Bv
Priority to CN2008800050817A priority Critical patent/CN101611483B/en
Publication of WO2008100146A2 publication Critical patent/WO2008100146A2/en
Publication of WO2008100146A3 publication Critical patent/WO2008100146A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76083—Position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7618—Injection unit
    • B29C2945/762—Injection unit injection piston
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76344—Phase or stage of measurement
    • B29C2945/76381—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76498—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76732—Mould
    • B29C2945/76735—Mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76822—Phase or stage of control
    • B29C2945/76859—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The invention relates to a method for encapsulating electronic components mounted on a carrier using underpressure, comprising the processing steps of: A) placing an electronic component in a mould cavity, B) heating encapsulating material, C) displacing the encapsulating material to the mould cavity, D) filling the mould cavity, and E) curing the encapsulating material in the mould cavity. The invention also relates to a device with which such a method can be performed.
PCT/NL2008/050088 2007-02-15 2008-02-15 Method and device for encapsulating electronic components using underpressure WO2008100146A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800050817A CN101611483B (en) 2007-02-15 2008-02-15 Method and device for encapsulating electronic components using underpressure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2000488A NL2000488C2 (en) 2007-02-15 2007-02-15 Method and device for enveloping electronic components with the aid of underpressure.
NL2000488 2007-02-15

Publications (2)

Publication Number Publication Date
WO2008100146A2 WO2008100146A2 (en) 2008-08-21
WO2008100146A3 true WO2008100146A3 (en) 2008-11-27

Family

ID=38514193

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2008/050088 WO2008100146A2 (en) 2007-02-15 2008-02-15 Method and device for encapsulating electronic components using underpressure

Country Status (6)

Country Link
KR (1) KR101609276B1 (en)
CN (1) CN101611483B (en)
MY (1) MY158346A (en)
NL (1) NL2000488C2 (en)
TW (1) TWI441266B (en)
WO (1) WO2008100146A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008022596A1 (en) * 2008-05-07 2009-11-12 Kraussmaffei Technologies Gmbh Method and device for producing a coated component
NL2003792C2 (en) * 2009-07-17 2011-01-18 Fico Bv METHOD AND DEVICE FOR COATING ELECTRONIC COMPONENTS WITH CONTROLLED GAS PRESSURE
CN102209448B (en) * 2010-03-29 2015-03-25 奥托立夫开发公司 Protection box for circuit board and installation method of protection box
WO2011150879A2 (en) * 2011-06-22 2011-12-08 华为终端有限公司 Method for encapsulating semiconductor and structure thereof
CN103213245B (en) * 2013-03-27 2015-11-18 国家电网公司 Transformer manufacture vacuum (-tight) housing and use the transformer manufacturing installation of this vacuum (-tight) housing
KR102376487B1 (en) * 2015-02-12 2022-03-21 삼성전자주식회사 Manufacturing device of semiconductor package and method for manufacturing the same
DE102015011735B3 (en) * 2015-09-04 2016-11-10 Audi Ag Apparatus for producing a plastic molding and method for producing a plastic molding

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155727A (en) * 1982-03-10 1983-09-16 Mitsubishi Electric Corp Mold for resin sealing of semiconductor device
JPS6395636A (en) * 1986-10-09 1988-04-26 Mitsubishi Electric Corp Resin sealing apparatus of semiconductor device
JPH07164473A (en) * 1993-12-15 1995-06-27 Sumitomo Bakelite Co Ltd Resin sealing method for semiconductor component, semiconductor sealing device and resin-sealed semiconductor component
JPH0864623A (en) * 1994-08-22 1996-03-08 Nec Corp Resin sealing method for semiconductor device and resin sealing device used for said resin sealing method
US6267577B1 (en) * 1998-07-30 2001-07-31 Oki Electric Industry Co., Ltd. Transfer molding apparatus for manufacturing semiconductor devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4752576B2 (en) 2006-03-31 2011-08-17 豊田合成株式会社 Injection molding method and injection molding apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155727A (en) * 1982-03-10 1983-09-16 Mitsubishi Electric Corp Mold for resin sealing of semiconductor device
JPS6395636A (en) * 1986-10-09 1988-04-26 Mitsubishi Electric Corp Resin sealing apparatus of semiconductor device
JPH07164473A (en) * 1993-12-15 1995-06-27 Sumitomo Bakelite Co Ltd Resin sealing method for semiconductor component, semiconductor sealing device and resin-sealed semiconductor component
JPH0864623A (en) * 1994-08-22 1996-03-08 Nec Corp Resin sealing method for semiconductor device and resin sealing device used for said resin sealing method
US6267577B1 (en) * 1998-07-30 2001-07-31 Oki Electric Industry Co., Ltd. Transfer molding apparatus for manufacturing semiconductor devices

Also Published As

Publication number Publication date
NL2000488C2 (en) 2008-08-18
MY158346A (en) 2016-09-30
TWI441266B (en) 2014-06-11
CN101611483A (en) 2009-12-23
TW200847303A (en) 2008-12-01
WO2008100146A2 (en) 2008-08-21
KR101609276B1 (en) 2016-04-05
KR20090118939A (en) 2009-11-18
CN101611483B (en) 2011-11-30

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