WO2008087903A1 - 基板の処理装置及び処理方法 - Google Patents

基板の処理装置及び処理方法 Download PDF

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Publication number
WO2008087903A1
WO2008087903A1 PCT/JP2008/050264 JP2008050264W WO2008087903A1 WO 2008087903 A1 WO2008087903 A1 WO 2008087903A1 JP 2008050264 W JP2008050264 W JP 2008050264W WO 2008087903 A1 WO2008087903 A1 WO 2008087903A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
processing solution
processing
board surface
nano bubbles
Prior art date
Application number
PCT/JP2008/050264
Other languages
English (en)
French (fr)
Inventor
Akinori Iso
Yukinobu Nishibe
Yasutomo Fujimori
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007226126A external-priority patent/JP5252861B2/ja
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to CN2008800019551A priority Critical patent/CN101578688B/zh
Publication of WO2008087903A1 publication Critical patent/WO2008087903A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B01F23/232—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids using flow-mixing means for introducing the gases, e.g. baffles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B01F23/237—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media
    • B01F23/2373—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids characterised by the physical or chemical properties of gases or vapours introduced in the liquid media for obtaining fine bubbles, i.e. bubbles with a size below 100 µm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/10—Mixing by creating a vortex flow, e.g. by tangential introduction of flow components
    • B01F25/104—Mixing by creating a vortex flow, e.g. by tangential introduction of flow components characterised by the arrangement of the discharge opening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

　基板を処理液によって処理する処理装置であって、ナノバブルを発生させ、そのナノバブルを上記処理液に混合させるナノバブル発生手段と、このナノバブル発生手段によって発生させられたナノバブルを含む上記処理液を上記基板の板面に供給する処理液供給手段と、この処理液供給手段によって上記基板の板面に供給される処理液に含まれるナノバブルを加圧して上記基板の板面で圧壊させる加圧手段とを具備したことを特徴とする基板の処理装置。
PCT/JP2008/050264 2007-01-15 2008-01-11 基板の処理装置及び処理方法 WO2008087903A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800019551A CN101578688B (zh) 2007-01-15 2008-01-11 基板的处理装置以及处理方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-006061 2007-01-15
JP2007006061 2007-01-15
JP2007226126A JP5252861B2 (ja) 2007-01-15 2007-08-31 基板の処理装置
JP2007-226126 2007-08-31

Publications (1)

Publication Number Publication Date
WO2008087903A1 true WO2008087903A1 (ja) 2008-07-24

Family

ID=39635907

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050264 WO2008087903A1 (ja) 2007-01-15 2008-01-11 基板の処理装置及び処理方法

Country Status (1)

Country Link
WO (1) WO2008087903A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2202782A3 (en) * 2008-12-25 2010-10-06 Siltronic AG Micro-Bubble generating device
US10219670B2 (en) 2014-09-05 2019-03-05 Tennant Company Systems and methods for supplying treatment liquids having nanobubbles
WO2020075844A1 (ja) * 2018-10-12 2020-04-16 パナソニックＩｐマネジメント株式会社 微細気泡洗浄装置及び微細気泡洗浄方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000000447A (ja) * 1997-12-30 2000-01-07 Hirobumi Onari 旋回式微細気泡発生装置
WO2003071594A1 (fr) * 2002-02-25 2003-08-28 Sumitomo Precision Products Co., Ltd Dispositif de traitement de substrats de type support
JP2004121962A (ja) * 2002-10-01 2004-04-22 National Institute Of Advanced Industrial & Technology ナノバブルの利用方法及び装置
JP2006147617A (ja) * 2004-11-16 2006-06-08 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
JP2006179765A (ja) * 2004-12-24 2006-07-06 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
JP2006187752A (ja) * 2005-01-06 2006-07-20 Hitachi Industrial Equipment Systems Co Ltd ２流体特殊洗浄ノズル

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000000447A (ja) * 1997-12-30 2000-01-07 Hirobumi Onari 旋回式微細気泡発生装置
WO2003071594A1 (fr) * 2002-02-25 2003-08-28 Sumitomo Precision Products Co., Ltd Dispositif de traitement de substrats de type support
JP2004121962A (ja) * 2002-10-01 2004-04-22 National Institute Of Advanced Industrial & Technology ナノバブルの利用方法及び装置
JP2006147617A (ja) * 2004-11-16 2006-06-08 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
JP2006179765A (ja) * 2004-12-24 2006-07-06 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
JP2006187752A (ja) * 2005-01-06 2006-07-20 Hitachi Industrial Equipment Systems Co Ltd ２流体特殊洗浄ノズル

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2202782A3 (en) * 2008-12-25 2010-10-06 Siltronic AG Micro-Bubble generating device
US8408221B2 (en) 2008-12-25 2013-04-02 Siltronic Ag Micro bubble generating device and silicon wafer cleaning apparatus
US10219670B2 (en) 2014-09-05 2019-03-05 Tennant Company Systems and methods for supplying treatment liquids having nanobubbles
WO2020075844A1 (ja) * 2018-10-12 2020-04-16 パナソニックＩｐマネジメント株式会社 微細気泡洗浄装置及び微細気泡洗浄方法

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