WO2008087701A1 - 三次元半導体集積回路装置及びその製造方法 - Google Patents
三次元半導体集積回路装置及びその製造方法 Download PDFInfo
- Publication number
- WO2008087701A1 WO2008087701A1 PCT/JP2007/050447 JP2007050447W WO2008087701A1 WO 2008087701 A1 WO2008087701 A1 WO 2008087701A1 JP 2007050447 W JP2007050447 W JP 2007050447W WO 2008087701 A1 WO2008087701 A1 WO 2008087701A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- base
- integrated circuit
- circuit device
- semiconductor integrated
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 5
- 239000007787 solid Substances 0.000 abstract 2
Classifications
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L23/3135—Double encapsulation or coating and encapsulation
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/050447 WO2008087701A1 (ja) | 2007-01-15 | 2007-01-15 | 三次元半導体集積回路装置及びその製造方法 |
JP2008553903A JP5027823B2 (ja) | 2007-01-15 | 2007-01-15 | 三次元半導体集積回路装置及びその製造方法 |
US12/523,118 US8907459B2 (en) | 2007-01-15 | 2007-01-15 | Three-dimensional semiconductor integrated circuit device and method of fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/050447 WO2008087701A1 (ja) | 2007-01-15 | 2007-01-15 | 三次元半導体集積回路装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008087701A1 true WO2008087701A1 (ja) | 2008-07-24 |
Family
ID=39635710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/050447 WO2008087701A1 (ja) | 2007-01-15 | 2007-01-15 | 三次元半導体集積回路装置及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8907459B2 (ja) |
JP (1) | JP5027823B2 (ja) |
WO (1) | WO2008087701A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010232648A (ja) * | 2009-03-04 | 2010-10-14 | Nec Corp | 半導体装置及びその製造方法 |
US10125289B2 (en) | 2013-03-28 | 2018-11-13 | Mitsubishi Chemical Corporation | Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device |
JP2018534783A (ja) * | 2015-11-14 | 2018-11-22 | 東京エレクトロン株式会社 | 希tmahを使用してマイクロエレクトロニック基板を処理する方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8222078B2 (en) | 2009-07-22 | 2012-07-17 | Alpha And Omega Semiconductor Incorporated | Chip scale surface mounted semiconductor device package and process of manufacture |
KR20160083977A (ko) * | 2015-01-02 | 2016-07-13 | 삼성전자주식회사 | 반도체 패키지 |
CN109119426B (zh) * | 2018-09-28 | 2024-04-16 | 长江存储科技有限责任公司 | 3d存储器件 |
KR20210035546A (ko) * | 2019-09-24 | 2021-04-01 | 삼성전자주식회사 | 반도체 패키지 |
CN111952202B (zh) * | 2020-08-25 | 2022-09-09 | 山东乾元半导体科技有限公司 | 一种指纹识别传感器的封装结构及其形成方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000183283A (ja) * | 1998-12-18 | 2000-06-30 | Denso Corp | 積層型回路モジュール及びその製造方法 |
JP2006216691A (ja) * | 2005-02-02 | 2006-08-17 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2007073826A (ja) * | 2005-09-08 | 2007-03-22 | Zycube:Kk | 3次元半導体集積回路装置、その製造方法、それを用いたパッケージ化3次元半導体集積回路装置及びその実装方法。 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001250913A (ja) | 1999-12-28 | 2001-09-14 | Mitsumasa Koyanagi | 3次元半導体集積回路装置及びその製造方法 |
JP2005264746A (ja) * | 2004-03-16 | 2005-09-29 | Sanden Corp | カーエアコン用圧縮機 |
JP4795677B2 (ja) * | 2004-12-02 | 2011-10-19 | ルネサスエレクトロニクス株式会社 | 半導体装置およびそれを用いた半導体モジュール、ならびに半導体装置の製造方法 |
US7486525B2 (en) * | 2006-08-04 | 2009-02-03 | International Business Machines Corporation | Temporary chip attach carrier |
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2007
- 2007-01-15 JP JP2008553903A patent/JP5027823B2/ja not_active Expired - Fee Related
- 2007-01-15 WO PCT/JP2007/050447 patent/WO2008087701A1/ja active Application Filing
- 2007-01-15 US US12/523,118 patent/US8907459B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000183283A (ja) * | 1998-12-18 | 2000-06-30 | Denso Corp | 積層型回路モジュール及びその製造方法 |
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Also Published As
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JPWO2008087701A1 (ja) | 2010-05-06 |
JP5027823B2 (ja) | 2012-09-19 |
US20110127652A1 (en) | 2011-06-02 |
US8907459B2 (en) | 2014-12-09 |
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