WO2008084206A8 - Procédé de découpage au laser d'un matériau non métallique - Google Patents

Procédé de découpage au laser d'un matériau non métallique Download PDF

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Publication number
WO2008084206A8
WO2008084206A8 PCT/GB2008/000039 GB2008000039W WO2008084206A8 WO 2008084206 A8 WO2008084206 A8 WO 2008084206A8 GB 2008000039 W GB2008000039 W GB 2008000039W WO 2008084206 A8 WO2008084206 A8 WO 2008084206A8
Authority
WO
WIPO (PCT)
Prior art keywords
laser
outlet orifice
plasma jet
metallic material
gas
Prior art date
Application number
PCT/GB2008/000039
Other languages
English (en)
Other versions
WO2008084206A1 (fr
Inventor
Anthony Paul Hoult
Jacek Tadeusz Gabzdyl
Malcolm Paul Varnham
Original Assignee
Spi Lasers Uk Ltd
Anthony Paul Hoult
Jacek Tadeusz Gabzdyl
Malcolm Paul Varnham
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0700271A external-priority patent/GB0700271D0/en
Priority claimed from GB0704216A external-priority patent/GB0704216D0/en
Priority claimed from GB0723029A external-priority patent/GB0723029D0/en
Application filed by Spi Lasers Uk Ltd, Anthony Paul Hoult, Jacek Tadeusz Gabzdyl, Malcolm Paul Varnham filed Critical Spi Lasers Uk Ltd
Priority to EP08701755A priority Critical patent/EP2104587B1/fr
Priority to AT08701755T priority patent/ATE503603T1/de
Priority to DE602008005842T priority patent/DE602008005842D1/de
Priority to CA2674541A priority patent/CA2674541C/fr
Publication of WO2008084206A1 publication Critical patent/WO2008084206A1/fr
Publication of WO2008084206A8 publication Critical patent/WO2008084206A8/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Cette invention concerne un procédé permettant de découper un matériau non métallique (1), lequel procédé comprend les étapes qui consistent à utiliser un appareil de découpage au laser équipé d'un laser (2), d'une tuyère à gaz (4) et d'un orifice de sortie (6) ménagé dans la tuyère à gaz (4); à placer l'orifice de sortie (6) à une distance de sécurité (15) d'une surface (7) du matériau (1); à faire circuler le gaz (5) à travers l'orifice de sortie (6) de manière à créer un flux gazeux (47); à mettre le laser (2) sous tension de manière à créer un faisceau laser (3); à focaliser le faisceau laser (3) à travers l'orifice de sortie (6) de manière à former une taille minimale de faisceau (41) à une position de focalisation (48) au niveau ou à proximité de la surface (7) du matériau (1). Le procédé se caractérise par l'utilisation du laser (2) pour frapper un jet de plasma (9) dans le flux gazeux (47); et par l'utilisation du laser (2) pour chauffer le jet de plasma (9) de manière à provoquer une augmentation de la température du jet de plasma (9) suffisante pour couper le matériau (1) avec une entaille (31) qui présente une zone supérieure (58) dont la rugosité moyenne est inférieure à 5μm Ra.
PCT/GB2008/000039 2007-01-08 2008-01-07 Procédé de découpage au laser d'un matériau non métallique WO2008084206A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08701755A EP2104587B1 (fr) 2007-01-08 2008-01-07 Procédé de découpage au laser d'un matériau non métallique
AT08701755T ATE503603T1 (de) 2007-01-08 2008-01-07 Verfahren zum laserschneiden eines nichtmetallischen materials
DE602008005842T DE602008005842D1 (de) 2007-01-08 2008-01-07 Verfahren zum laserschneiden eines nichtmetallischen materials
CA2674541A CA2674541C (fr) 2007-01-08 2008-01-07 Procede de decoupage au laser d'un materiau non metallique

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
GB0700271.0 2007-01-08
GB0700271A GB0700271D0 (en) 2007-01-08 2007-01-08 Apparatus for laser processing a material
GB0704216A GB0704216D0 (en) 2007-03-05 2007-03-05 Apparatus for processing a material
GB0704216.1 2007-03-05
GB0723029.5 2007-11-23
GB0723029A GB0723029D0 (en) 2007-11-23 2007-11-23 Apparatus for cutting a material

Publications (2)

Publication Number Publication Date
WO2008084206A1 WO2008084206A1 (fr) 2008-07-17
WO2008084206A8 true WO2008084206A8 (fr) 2009-08-20

Family

ID=39156705

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2008/000039 WO2008084206A1 (fr) 2007-01-08 2008-01-07 Procédé de découpage au laser d'un matériau non métallique

Country Status (5)

Country Link
EP (1) EP2104587B1 (fr)
AT (1) ATE503603T1 (fr)
CA (1) CA2674541C (fr)
DE (1) DE602008005842D1 (fr)
WO (1) WO2008084206A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009026410A1 (de) * 2009-05-20 2011-03-17 Carl Baasel Lasertechnik Gmbh & Co. Kg Verfahren zum Vereinzeln von Silizium-Solarzellen
ITUD20090105A1 (it) * 2009-05-27 2010-11-28 Applied Materials Inc Applicazione laser in fibra per un processo di rimozione della pellicola di bordo in applicazioni di celle solari
MX342414B (es) 2010-10-22 2016-09-28 Unilever Nv Mejoras que se refieren a acondicionadores de generos.
CN103502019A (zh) * 2011-03-22 2014-01-08 劳伦斯利弗摩尔国际安全有限责任公司 气体辅助的激光加工
US9339890B2 (en) 2011-12-13 2016-05-17 Hypertherm, Inc. Optimization and control of beam quality for material processing
CN107433397B (zh) * 2017-08-02 2019-03-19 武汉大学 一种射流辅助激光等离子体的晶圆切割装置及方法
CN107579407B (zh) * 2017-09-18 2019-09-13 华中科技大学 一种激光诱导等离子体加工非金属材料的装置和方法
JP6816071B2 (ja) * 2018-08-24 2021-01-20 ファナック株式会社 レーザ加工システム、噴流観測装置、レーザ加工方法、及び噴流観測方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852946B2 (en) * 2002-12-20 2005-02-08 Caterpillar Inc Laser-induced plasma micromachining
US20050136622A1 (en) * 2003-12-18 2005-06-23 Mulligan Rose A. Methods and apparatus for laser dicing
US20070045255A1 (en) * 2005-08-23 2007-03-01 Klaus Kleine Laser induced plasma machining with an optimized process gas

Also Published As

Publication number Publication date
EP2104587A1 (fr) 2009-09-30
CA2674541A1 (fr) 2008-07-17
ATE503603T1 (de) 2011-04-15
WO2008084206A1 (fr) 2008-07-17
EP2104587B1 (fr) 2011-03-30
CA2674541C (fr) 2015-03-17
DE602008005842D1 (de) 2011-05-12

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