WO2008081755A1 - 粘着テープおよびそれを用いた固定方法 - Google Patents

粘着テープおよびそれを用いた固定方法 Download PDF

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Publication number
WO2008081755A1
WO2008081755A1 PCT/JP2007/074715 JP2007074715W WO2008081755A1 WO 2008081755 A1 WO2008081755 A1 WO 2008081755A1 JP 2007074715 W JP2007074715 W JP 2007074715W WO 2008081755 A1 WO2008081755 A1 WO 2008081755A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive tape
base
adhesive
adhesive layer
article
Prior art date
Application number
PCT/JP2007/074715
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Iwami
Original Assignee
Nitto Denko Cs System Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Cs System Corporation filed Critical Nitto Denko Cs System Corporation
Priority to JP2008552102A priority Critical patent/JPWO2008081755A1/ja
Publication of WO2008081755A1 publication Critical patent/WO2008081755A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

基材の片面に粘着剤層を有する、物品の仮止め固定用粘着テープにおいて、前記基材が、ポリエステル系フィルムであり、前記粘着剤層が、アルキル基の炭素数が４～１２のアルキル（メタ）アクリレートを主成分とし、かつカルボキシル基含有単量体を含有する単量体混合物から得られたアクリル系共重合体エマルションおよびオキサゾリン基含有水系架橋剤を含有するアクリル系エマルション型粘着剤により形成されたものであり、前記基材と前記粘着剤層との間には、ベースポリマーとしての芳香族ポリエステル樹脂およびイソシアネート系架橋剤を含む下塗り層を有することを特徴とする物品の仮止め固定用粘着テープ。
PCT/JP2007/074715 2006-12-25 2007-12-21 粘着テープおよびそれを用いた固定方法 WO2008081755A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008552102A JPWO2008081755A1 (ja) 2006-12-25 2007-12-21 粘着テープおよびそれを用いた固定方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006347970 2006-12-25
JP2006-347970 2006-12-25

Publications (1)

Publication Number Publication Date
WO2008081755A1 true WO2008081755A1 (ja) 2008-07-10

Family

ID=39588439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074715 WO2008081755A1 (ja) 2006-12-25 2007-12-21 粘着テープおよびそれを用いた固定方法

Country Status (2)

Country Link
JP (1) JPWO2008081755A1 (ja)
WO (1) WO2008081755A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254741A (ja) * 2009-04-21 2010-11-11 Nitto Denko Cs System Kk 物品の仮止め固定用粘着テープおよび仮止め固定物品
JP2010275494A (ja) * 2009-06-01 2010-12-09 Nitto Denko Corp 粘着シートおよびその製造方法
WO2017113095A1 (en) * 2015-12-29 2017-07-06 Rohm And Haas Company Formaldehyde-free curable formulation
CN110982440A (zh) * 2019-12-20 2020-04-10 江门新时代胶粘科技有限公司 一种医用手套速缚胶带及其制备方法
JP2021054996A (ja) * 2019-09-30 2021-04-08 ニチバン株式会社 粘着テープ片積層体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61228030A (ja) * 1985-04-01 1986-10-11 Dainippon Ink & Chem Inc プライマ−コ−ト剤
JPH06346038A (ja) * 1993-04-12 1994-12-20 Soken Kagaku Kk 水系再剥離型感圧接着剤
JP2005179412A (ja) * 2003-12-17 2005-07-07 Nitto Denko Corp テープ状絶縁材、絶縁物品および感圧性接着テープ
JP2006282733A (ja) * 2005-03-31 2006-10-19 Nitto Denko Cs System Kk 物品の仮止め固定用粘着テープおよび仮止め固定物品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3127965B2 (ja) * 1991-04-05 2001-01-29 東洋化学株式会社 感圧粘着テープおよび創傷面保護材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61228030A (ja) * 1985-04-01 1986-10-11 Dainippon Ink & Chem Inc プライマ−コ−ト剤
JPH06346038A (ja) * 1993-04-12 1994-12-20 Soken Kagaku Kk 水系再剥離型感圧接着剤
JP2005179412A (ja) * 2003-12-17 2005-07-07 Nitto Denko Corp テープ状絶縁材、絶縁物品および感圧性接着テープ
JP2006282733A (ja) * 2005-03-31 2006-10-19 Nitto Denko Cs System Kk 物品の仮止め固定用粘着テープおよび仮止め固定物品

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010254741A (ja) * 2009-04-21 2010-11-11 Nitto Denko Cs System Kk 物品の仮止め固定用粘着テープおよび仮止め固定物品
JP2010275494A (ja) * 2009-06-01 2010-12-09 Nitto Denko Corp 粘着シートおよびその製造方法
WO2017113095A1 (en) * 2015-12-29 2017-07-06 Rohm And Haas Company Formaldehyde-free curable formulation
CN108368406A (zh) * 2015-12-29 2018-08-03 罗门哈斯公司 不含甲醛的可固化调配物
JP2019510835A (ja) * 2015-12-29 2019-04-18 ローム アンド ハース カンパニーＲｏｈｍ Ａｎｄ Ｈａａｓ Ｃｏｍｐａｎｙ ホルムアルデヒド不含硬化性配合物
US10968343B2 (en) 2015-12-29 2021-04-06 Rohm And Haas Company Formaldehyde-free curable formulation
CN108368406B (zh) * 2015-12-29 2023-06-27 罗门哈斯公司 不含甲醛的可固化调配物
JP2021054996A (ja) * 2019-09-30 2021-04-08 ニチバン株式会社 粘着テープ片積層体
CN110982440A (zh) * 2019-12-20 2020-04-10 江门新时代胶粘科技有限公司 一种医用手套速缚胶带及其制备方法
CN110982440B (zh) * 2019-12-20 2022-02-01 江门新时代胶粘科技有限公司 一种医用手套速缚胶带及其制备方法

Also Published As

Publication number Publication date
JPWO2008081755A1 (ja) 2010-04-30

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