WO2008071061A1 - Pellicule de blindage électromagnétique et son procédé de production - Google Patents
Pellicule de blindage électromagnétique et son procédé de production Download PDFInfo
- Publication number
- WO2008071061A1 WO2008071061A1 PCT/CN2007/003276 CN2007003276W WO2008071061A1 WO 2008071061 A1 WO2008071061 A1 WO 2008071061A1 CN 2007003276 W CN2007003276 W CN 2007003276W WO 2008071061 A1 WO2008071061 A1 WO 2008071061A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silver
- shielding film
- electromagnetic wave
- coating
- wave shielding
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- Electromagnetic wave shielding film and manufacturing method thereof are Electromagnetic wave shielding film and manufacturing method thereof.
- the present invention relates to a shielding film, and more particularly to an electromagnetic wave shielding film and a method of manufacturing the same. Background technique
- EMI Electromagnetic interference
- Electromagnetic interference not only affects the operational accuracy of surrounding electronic devices, but also causes malfunctions, and it also has adverse effects on human health. Therefore, the requirements for electromagnetic wave shielding materials are increasing.
- various transparent conductive films electromagnetic wave shielding films
- Japanese Patent Laid-Open No. JP9-53030 Japanese Patent Publication No. JP11-126024, JP-A-JP-2000-294980, JP-A-JP-2000- 357 414, JP-A-2000-329934, JP-A-2001-38843, JP-A-2001-47549, JP-A-2001-
- Various shielding films are disclosed in Japanese Laid-Open Patent Publication No. JP-A-2001-60416. However, these shielding films generally have the disadvantage of low shielding efficiency.
- the sputtering method means that a high refractive index layer such as metallic silver or indium tin oxide (IT0) is directly sputtered on a glass substrate, or sputtered on a PET film and then laminated on a glass substrate.
- I0 indium tin oxide
- the electromagnetic wave shielding film prepared by the sputtering method limits its popularization and application range due to its low light transmittance and high surface resistance.
- the etching method is a method of forming a copper foil on a transparent PET film by photolithography to form a copper grid of a fine-line grid, which has a complicated preparation process and high cost.
- the silver complex salt diffusion transfer method is carried out on a transparent PET film, first coated with a catalytic core such as palladium or ruthenium, and then coated with a silver halide emulsion for physical development, and then plated with a copper or nickel metal film due to the residual catalytic core. Suck Receiving light, there is a problem of low light transmittance. Summary of the invention
- the technical problem to be solved by the present invention is to provide an electromagnetic wave shielding film having low surface resistance and high shielding efficiency.
- Another technical problem to be solved by the present invention is to provide a method of preparing such an electromagnetic wave shielding film.
- the technical solution to solve the above problems is:
- An electromagnetic wave shielding film is a conductive film composed of a support and a fine wire grid formed thereon, and the thin wire mesh is composed of metallic silver and copper plated thereon, and is characterized by containing copper
- the mass accounts for 55 % ⁇ 90 % of the total mass of silver copper, the grid line width is 5 ⁇ 25 ⁇ , the opening ratio is 85% ⁇ 95%, and the surface resistance is greater than 0 less than 5 ⁇ / port.
- the thin wire mesh has a thickness of 2. 5 to 8 ⁇ m.
- a method for manufacturing an electromagnetic wave shielding film comprising: coating a silver salt layer and a protective layer on the support, and applying a grid exposure and development process, the exposed portion forms a metallic silver portion, and the unexposed portion forms a light transmission
- the metallic silver portion is thickened and activated, and the metal is plated to form a conductive metal portion.
- the metal silver portion is thickened by silver thickening or copper thickening.
- the activation treatment is carried out by a method of activating a heavy metal ion aqueous solution.
- the activation treatment is carried out by a method of activating palladium ions, gold ions or an aqueous solution of silver ions.
- the plated metal is electrolessly plated.
- the support used in the present invention may be polyethylene terephthalate resin, diacetate resin, triacetate resin, polyethylene, polypropylene, polystyrene, polyvinyl chloride resin, A single or multilayer film composed of a polyketide, polysulfone, polyethersulfone, polycarbonate, polyamide, acrylic resin or cellulose triacetate.
- the substrate is a polyethylene terephthalate (PET) film.
- the invention is used!
- the silver emulsion can be produced by a method of producing a silver halide emulsion used in the field of photographic light-sensitive materials.
- the silver halide emulsion is usually produced by mixing and emulsifying an aqueous solution of silver nitrate and an aqueous solution of sodium chloride or potassium bromide in the presence of gelatin.
- silver chloride is preferred, that is, the composition contains
- the particle size is from 0.1 to 1 OOOnm, more preferably from 1 to 200 nm.
- the crystal shape of the silver halide is not limited and may be a cube, an octahedron, a sphere, a flat particle or a flaky twin.
- metal ions are doped in the
- the cerium ion and the cerium ion have different ligand compounds, and the ligand includes a cyanide ion, a halogen ion, a thiocyanate ion, a nitrosyl ion, water, and a hydroxide ion.
- a silver salt layer when coating a silver salt layer, a protective layer, or the like, dip coating, extrusion coating, slide coating, curtain coating, bar coating, air knife coating, roll coating, and photography may be employed. Coating is performed by a coating method such as gravure coating or spray coating. In the present invention, it is preferred that the above coating method be provided as a usual continuous, uniform coating.
- the exposure light source used in the present invention may be an ultraviolet lamp or a high pressure mercury lamp or the like.
- the template with the grid pattern is printed onto the silver halide film by means of the exposure light source, or the grid pattern is scanned on the silver halide film with a laser.
- the silver halide emulsion layer is subjected to development after exposure, and development techniques in a conventional photographic material can be used.
- the developer is not limited, but it is preferable to use a high contrast developer such as commercially available D-19, D-72, D. -1 D- 8 and G-48, etc.
- a metal silver portion and a light transmitting portion are formed after exposure and development.
- the metallic silver portion is thickened and activated, and the metal is plated to form a conductive metal portion.
- the metal particles of the conductive metal portion may be metal particles such as copper, aluminum, nickel, iron, gold, cobalt, palladium or the like. However, from the viewpoint of conductivity and cost, the conductive metal portion is preferably copper.
- the thickening used in the present invention can be thickened by silver or thickened by copper, and the silver thickening process is used with one kind of The original agent reduces the metallic silver ions in the soluble silver salt solution to metallic silver, and the fine silver is slowly deposited in a suitable position.
- This metallic silver deposits in the metal portion much faster than in the non-silver transparent region, and is deposited substantially in proportion to the silver content. Therefore, silver thickening can be used to plate or deposit silver on the silver thin line pattern portion, and substantially not deposited on the transparent portion of the support.
- the copper thickening purpose is the same as the silver thickening, and the silver thin line pattern portion is roughened.
- the composition of the thickening liquid includes the following components: divalent copper ions, an acid cerium ion, for example: sulphate ion, nitrate Ion, acetate ion plasma; a halogen ion, such as chloride ion, bromide ion, iodide ion plasma.
- the silver thickening and copper thickening temperature is generally room temperature, and the thickening time is controlled within 10 seconds to 30 minutes, preferably 1 minute to 20 minutes.
- the purpose of the activation in the present invention is to form a sufficient active point on the surface of the silver fine line pattern of the transparent support to facilitate the chemical copper plating to accelerate the speed of electroless copper plating.
- the activation can be carried out by a known method, such as a sensitization-activation two-step treatment, that is, first sensitization treatment with an aqueous solution of stannous chloride, followed by activation treatment with palladium chloride, gold trichloride or silver nitrate aqueous solution; Colloidal palladium activation method, etc. Since the invention has been subjected to silver thickening or copper thickening in the early stage, it can be directly activated by heavy metal ions, that is, activated by chlorination, aluminum trichloride or silver nitrate aqueous solution.
- the plated metal is electrolessly plated to form a conductive metal portion.
- Traditional electroless plating techniques can be used.
- Electroless plating is preferred for electroless copper plating.
- Electroless copper plating is a transparent support in which a silver fine line pattern having a sufficient active point after being treated by the above various treatment methods is placed in a copper plating solution to perform electroless copper plating.
- Electroless copper plating solutions generally consist of a copper salt, a complexing agent, a reducing agent, and other additives.
- the copper salt provides deposited copper ions, and a soluble copper salt such as copper sulphate, copper acetate or copper chloride can be used.
- the reducing agent reduces the soluble copper ions in the plating solution to metal copper and deposits on the silver fine line pattern of the transparent support to form a metal copper plating layer.
- the reducing agent may be a substance such as furfural, sodium borohydride or sodium hypophosphite.
- the complexing agent prevents the precipitation of copper hydroxide in the alkaline state, turns the copper ion into a complex ion state, is beneficial to refine the crystal grains, is also beneficial to increase the deposition rate and stability of the solution, and improve the performance of the electroless plating layer.
- Commonly used complexing agents are tartrate, EDTA, citrate, triethanolamine, cyclohexanediaminetetraacetic acid or ethylenediamine.
- Electroless copper plating almost uses furfural as a reducing agent, but furfural is toxic and volatile, polluting the environment and endangering human health.
- the present invention simultaneously studies the use of furfural and sodium hypophosphite as a reducing agent.
- the oxidation reaction of sodium hypophosphite must occur on the catalytic surface, and the reaction is not catalyzed by the deposited copper. Therefore, a small amount of nickel ions is required as a self-catalyst in the plating solution. The autocatalytic reaction is allowed to continue.
- the developed metal portion and the metal-plated conductive metal portion are subjected to oxidation treatment.
- the oxidation treatment removes a small amount of metal deposited in the transparent region, so that the transmittance of the transparent region is close to 100 ° /. .
- the copper surface needs to be blackened.
- the blackening process can use the method used in the field of printed wiring boards.
- the solution components include: sodium chloride (31 g / L), sodium hydroxide (15 g / L), trisodium phosphate (12 g / L).
- the transmittance is improved, but the conductivity is lowered, and if the width of the thin line is increased, The light transmittance is lowered and the conductivity is increased. Therefore, it is preferable that the line width is 5 to 25 ⁇ m, and the thin lines are arranged in a lattice shape in the longitudinal and lateral directions.
- the composition of the conductive metal portion after plating the metal is mainly composed of metallic copper and metallic silver, and additionally contains a small amount of metallic palladium and/or metallic nickel.
- the quality of metallic copper is 50-90°/ of the total weight of the metal. .
- the thickness of the fine line pattern after plating the metal may be arbitrarily changed according to desired characteristics, but is preferably 2. 5 - 8. 0 ⁇ m. If it is thinner than this range, the desired surface resistance value may not be obtained. If it is thicker than this range, there is no problem, but even if the efficiency of the plating operation is lowered, it is difficult to expect an effect of lowering the surface resistance value. Further, the electromagnetic wave shielding film of the present invention can obtain a shielding effect of 30 dB or more in a wide frequency range of 30 MHz to 1 000 MHz or a good shielding effect in a frequency band range higher than the above range.
- the electromagnetic wave shielding film provided by the invention has low surface resistance and good shielding effect; and the preparation method thereof is simple in process and suitable for industrial production. detailed description
- the composition of the silver milk emulsion is a silver bromoiodide emulsion in which silver bromide is 98% by mole and silver iodide is 2% by mole.
- the average particle size of the emulsion is 0. 09 microns, doped K 2 I rC in the emulsion K 3 RhBr 6 .
- the emulsion was further sulphur-stimulated with potassium tetrachloroaurate and sodium thiosulfate. Then, it was coated on a PET film, and the amount of silver applied was 4.0 g/m 2 and dried. .
- Phenidone 1 5 g
- Ammonium thiocyanate 160 0 g
- the sample was activated in 0.5% aqueous palladium chloride solution for 0.5 minutes. Then wash with water and perform electroless copper plating.
- the sample treated as described above was subjected to electroless copper plating in the following plating solution, and the pH of the plating solution was adjusted to 12.5 with sodium hydroxide.
- the copper was plated at 25 ° C for 5 minutes, washed with water to obtain a sample of the present invention.
- the results are shown in Table 1.
- Electroless copper plating Name Content ( mM / L )
- the emulsion is prepared in accordance with a method for producing an yttrium silver emulsion used in the field of photographic light-sensitive materials.
- the composition of the silver halide emulsion is a silver chlorobromide emulsion in which silver chloride is 70% by mole and silver bromide is 30°/» mole. /. .
- the average particle size of the emulsion is 0.23 microns, and the emulsion is doped with K 2 I rCl 6 and! [ 3 RhBr 6 .
- the emulsion was further sulphur-stimulated with potassium tetrachloroaurate and sodium thiosulfate. Then, it was coated on a PET film, and the amount of silver applied was 3.0 g/m 2 , and dried.
- composition of the developer is a mixture of the developer:
- Solution B Sodium hydroxide 22 g
- the solution B was added to the solution A, and the sample treated in the above copper solution was placed in the solution for 3 minutes and washed with water.
- the above plaque was activated in a 2% aqueous solution of nitric acid for 2 minutes. It is then washed with water and electroless copper plating.
- Example 3 The electroless copper plating process is the same as in Example 1. The results are shown in Table 1. Example 3
- the sample treated as described above was subjected to electroless copper plating in the following plating solution, and the pH of the plating solution was adjusted to 9.0 with sodium hydroxide, and copper was plated at 35 ° C for 30 minutes.
- the sample of the present invention was obtained by washing with water and dried. The results are shown in Table 1.
- the sample treated as described above was subjected to electroless copper plating in the following plating solution, and the pH of the plating solution was adjusted to 9.5 with sodium hydroxide, and copper was plated at 40 ° C for 30 minutes.
- the sample of the present invention was obtained by washing with water and dried. The results are shown in Table 1.
- the conductive metal line width of the sample of the present invention was measured by an optical microscope or a scanning electron microscope to determine the opening ratio.
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009540577A JP2010512653A (ja) | 2006-12-12 | 2007-11-20 | 電磁波シールド膜およびその製造方法 |
KR1020097013944A KR101160731B1 (ko) | 2006-12-12 | 2007-11-20 | 전자기파 차폐 필름 및 그 제조방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006101022520A CN101005755B (zh) | 2006-12-12 | 2006-12-12 | 一种电磁波屏蔽膜及其制造方法 |
CN200610102252.0 | 2006-12-12 |
Publications (1)
Publication Number | Publication Date |
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WO2008071061A1 true WO2008071061A1 (fr) | 2008-06-19 |
Family
ID=38704537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CN2007/003276 WO2008071061A1 (fr) | 2006-12-12 | 2007-11-20 | Pellicule de blindage électromagnétique et son procédé de production |
Country Status (4)
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JP (1) | JP2010512653A (zh) |
KR (1) | KR101160731B1 (zh) |
CN (1) | CN101005755B (zh) |
WO (1) | WO2008071061A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8673049B2 (en) | 2010-08-27 | 2014-03-18 | Dowa Electronics Materials Co., Ltd. | Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101005755B (zh) * | 2006-12-12 | 2011-04-20 | 中国乐凯胶片集团公司 | 一种电磁波屏蔽膜及其制造方法 |
JP5367969B2 (ja) * | 2007-09-28 | 2013-12-11 | 富士フイルム株式会社 | 導電性材料の製造方法 |
CN101271996B (zh) * | 2008-04-02 | 2013-02-06 | 中国乐凯胶片集团公司 | 一种射频识别电子标签天线及其制备方法 |
JP6467701B2 (ja) * | 2014-10-28 | 2019-02-13 | 信越ポリマー株式会社 | 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法 |
CN106872819A (zh) * | 2016-12-30 | 2017-06-20 | 深圳天珑无线科技有限公司 | 一种屏蔽膜测试组件及测试模组 |
CN112746268B (zh) * | 2020-12-29 | 2023-04-25 | 武汉理工大学 | 一种具有偏光效应薄膜镀制的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950423A (en) * | 1986-01-22 | 1990-08-21 | The B. F. Goodrich Company | Coating of EMI shielding and method therefor |
JP2004172554A (ja) * | 2002-11-22 | 2004-06-17 | Bridgestone Corp | 電磁波シールド性光透過窓材及びその製造方法並びにこの窓材を有するディスプレイ用フィルタ |
WO2006001461A1 (ja) * | 2004-06-23 | 2006-01-05 | Fuji Photo Film Co., Ltd. | 透光性電磁波シールド膜およびその製造方法 |
CN101005755A (zh) * | 2006-12-12 | 2007-07-25 | 中国乐凯胶片集团公司 | 一种电磁波屏蔽膜及其制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2165668B (en) * | 1984-10-10 | 1988-03-02 | Stc Plc | Coating optical fibres |
JPH1131896A (ja) * | 1997-07-11 | 1999-02-02 | Meiwa Packs:Kk | 携帯型電話機用電磁波シールド袋 |
JP3998975B2 (ja) * | 2001-12-28 | 2007-10-31 | 大日本印刷株式会社 | 電磁波遮蔽用シート |
EP1553212B1 (en) * | 2002-07-12 | 2017-08-23 | Fujimori Kogyo Co., Ltd. | Electromagnetic wave shield material and process for producing the same |
JP4641719B2 (ja) * | 2002-12-27 | 2011-03-02 | 富士フイルム株式会社 | 透光性電磁波シールド膜の製造方法及び透光性電磁波シールド膜 |
CN1870881A (zh) * | 2006-05-25 | 2006-11-29 | 七二国际股份有限公司 | 电磁波屏蔽薄膜及其制造方法 |
-
2006
- 2006-12-12 CN CN2006101022520A patent/CN101005755B/zh active Active
-
2007
- 2007-11-20 KR KR1020097013944A patent/KR101160731B1/ko active IP Right Grant
- 2007-11-20 JP JP2009540577A patent/JP2010512653A/ja active Pending
- 2007-11-20 WO PCT/CN2007/003276 patent/WO2008071061A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950423A (en) * | 1986-01-22 | 1990-08-21 | The B. F. Goodrich Company | Coating of EMI shielding and method therefor |
JP2004172554A (ja) * | 2002-11-22 | 2004-06-17 | Bridgestone Corp | 電磁波シールド性光透過窓材及びその製造方法並びにこの窓材を有するディスプレイ用フィルタ |
WO2006001461A1 (ja) * | 2004-06-23 | 2006-01-05 | Fuji Photo Film Co., Ltd. | 透光性電磁波シールド膜およびその製造方法 |
CN101005755A (zh) * | 2006-12-12 | 2007-07-25 | 中国乐凯胶片集团公司 | 一种电磁波屏蔽膜及其制造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8673049B2 (en) | 2010-08-27 | 2014-03-18 | Dowa Electronics Materials Co., Ltd. | Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same |
Also Published As
Publication number | Publication date |
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CN101005755B (zh) | 2011-04-20 |
KR101160731B1 (ko) | 2012-06-28 |
KR20090086630A (ko) | 2009-08-13 |
JP2010512653A (ja) | 2010-04-22 |
CN101005755A (zh) | 2007-07-25 |
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