WO2008061406A1 - Métal d'apport de brasage à l'argent sans cadmium - Google Patents

Métal d'apport de brasage à l'argent sans cadmium Download PDF

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Publication number
WO2008061406A1
WO2008061406A1 PCT/CN2007/000237 CN2007000237W WO2008061406A1 WO 2008061406 A1 WO2008061406 A1 WO 2008061406A1 CN 2007000237 W CN2007000237 W CN 2007000237W WO 2008061406 A1 WO2008061406 A1 WO 2008061406A1
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Prior art keywords
nickel
brazing
indium
copper
brass
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PCT/CN2007/000237
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English (en)
French (fr)
Inventor
Wenhua Gu
Liyong Gu
Songbai Xue
Jianchang Gu
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Changshu Huayin Filler Metals Co., Ltd.
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Application filed by Changshu Huayin Filler Metals Co., Ltd. filed Critical Changshu Huayin Filler Metals Co., Ltd.
Priority to US12/516,194 priority Critical patent/US7985374B2/en
Publication of WO2008061406A1 publication Critical patent/WO2008061406A1/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006Ag as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • C22C5/08Alloys based on silver with copper as the next major constituent

Definitions

  • the present invention relates to a cadmium-free silver solder containing gallium, indium, nickel, and antimony, particularly a cadmium-free silver suitable for brazing of metallic materials such as copper, brass, carbon steel, stainless steel, and nickel-based alloys.
  • Brazing filler metal which is a brazing material for metal materials and metallurgy.
  • Silver solders BAg25CuZn and BAg45CuZn which are currently used have a chemical composition of about 25% and 45%, respectively.
  • BA g 25CuZn and BAg45CuZn silver brazing fillers have excellent properties, their wettability and spreadability are much inferior to those of cadmium-containing BA g 35CuZnCd and BAg45CuZnCd silver brazing filler metals, and the solid-liquidus temperature is much higher. .
  • the latter (BAg25CuZnCd, BAg45CuZnCd) is used instead, the latter (BAg35CuZnCd, BAg45CuZnCd) is selected, which is bound to be limited because: Cadmium has an impact on the operator's health and pollution to the environment, especially with the EU "R0HS""In the implementation of the directive on July 1, 2006, cadmium-containing materials are being phased out.
  • the object of the present invention is to provide a cadmium which is completely free of toxic elemental cadmium during brazing and after brazing, has excellent brazing performance, and has a conventional BA g 35CuZnCd,
  • BAg45CuZnCd solder is a comprehensive performance of cadmium-free silver solder containing gallium, indium, nickel and antimony.
  • the task of the present invention is accomplished in this way.
  • the invention has the following advantages: 1) because the component no longer contains toxic cadmium element, it can protect the operator's body safety and avoid environmental impact; 2) due to the comprehensive performance and the traditional silver content is 35%, 45 % of cadmium-containing silver solder is equivalent or similar, so it can replace BAg35CuZnCd, BA g 45CuZnCd silver solder; 3) By optimizing the content of gallium, indium, nickel and antimony and three main elements of silver, copper and zinc, the invention
  • the brazing filler metal has good wettability, spreadability and brazing mechanical properties (o b , ⁇ ); 4) due to the addition of appropriate amounts of gallium (Ga) and indium (In), the cost of raw materials is increased In a few cases, the melting point of the solder of the present invention can be lowered; 5) adding an appropriate amount of nickel (M) to improve the wettability and brazing of the brazing filler metal on copper, brass, carbon steel, stainless steel, and nickel-based alloy.
  • solder wire material 1), using commercially available silver, electrolytic copper, zinc ingot, nickel plate, metal gallium, metal indium, metal antimony, according to the need ratio, using conventional intermediate frequency smelting furnace smelting, casting, and then by extrusion, drawing, That is, the required solder wire material is obtained; 2) metal gallium, metal indium, and metal bismuth can be pre-smelted into an alloy according to production requirements, and then smelted, cast, and extruded by adding a silver-copper-zinc alloy. , pull, that is, the required solder wire is obtained.
  • the solid wire temperature of the obtained solder wire is in the range of 630 ° C to 645 ° C, and the liquidus temperature is in the range of 715 ° C to 735 ° C (the solidus temperature of the BAg 25 CuZn silver brazing filler metal is 700 ° C, The liquidus temperature is 800 ° C).
  • the smelting and casting are carried out by a conventional intermediate frequency smelting furnace, and then the required solder wire is obtained by extrusion and drawing;
  • the cadmium-free silver brazing filler metal containing gallium, indium, nickel and bismuth of the invention has silver content respectively 35%, 45% BA g 35CuZnCd, BAg45CuZnCd solder as a reference material, with FB102 (QJ102) flux, brazing copper-brass, brass-carbon steel, stainless steel-nickel-based alloy and other materials,
  • the cadmium-free silver brazing filler metal containing gallium, indium, nickel and antimony of the invention has no harmful elemental cadmium at all, which effectively protects the operator's body safety and eliminates environmental pollution.
  • the brazing joint mechanical properties of the brazing filler metal are comparable to those of BAg35CuZnCd and BAg45CuZnCd brazing filler metals. Therefore, the cadmium-free silver solder of the present invention can be applied to metal materials and metallurgy fields as a substitute for BAg35CuZnCd and BAg45CuZnCd solder.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1 :
  • the composition is: 32. 0% copper (Cu), 35.0% zinc (Zn), 2. 5% gallium (Ga), 2. 5% indium (In), 2 ⁇ 5% Nickel (Ni), 0.002% ⁇ (Ce), and the rest is silver (Ag).
  • Embodiment 2
  • the composition is: 32. 0% copper (Cu), 35. 0% zinc (Zn), 0.1% gallium (Ga), 0.1% indium (In), 0.1% Nickel (Ni), 0.1% ⁇ (Ce), and the rest is silver (Ag).
  • the solid-phase temperature of the "cadmium-free silver solder containing gallium, indium, nickel and antimony" obtained by the above-mentioned distribution ratio is about 645 ° C, the liquidus temperature is about 735 ( (considering experimental error), and FB102 (QJ102) ) flux
  • brazing base metal is the following combination of the strength of the brazing joint, see the data in brackets: copper - brass (.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • the composition is: 28.0% copper (Cu), 38.0% zinc (Zn), 0.1% gallium (Ga), 2.5% indium (In), 0.5% nickel (Ni), 0.03% bismuth (Ce ), the rest is silver (Ag).
  • Example 4 'As a percentage by mass, the composition is: 35.0% copper (Cu), 28.0% zinc (Zn), 1.5% gallium (Ga), 1.5% indium (In), 0.5 0 / 0 nickel (Ni ), 0.05% ⁇ (Ce), and the rest is silver (Ag).
  • Embodiment 5 is a diagrammatic representation of Embodiment 5:
  • the composition is: 32.0% copper (Cu), 32.0% zinc (Zn), 1.5% gallium (Ga), 0.1% indium (In), 1.5% nickel (Ni), 0.005% ⁇ (Ce ), the rest is silver (Ag).
  • the solid phase temperature of the "cadmium-free silver solder containing gallium, indium, nickel and antimony" obtained by the above-mentioned distribution ratio The degree is about 640 °C, the liquidus temperature is about 730 °C (considering the experimental error), and the FB102 (QJ102) flux is used.
  • the brazing base material is the following combination.
  • the composition is: 32.0% copper (Cu), 38.0% zinc (Zn), 0.3% gallium (Ga), 0.5% indium ( ⁇ ), 0.2% nickel (Ni), 0.05% ⁇ (Ce ), the rest is silver (Ag).
  • the above-mentioned distribution ratio of the "cadmium-free silver solder containing gallium, indium, nickel and antimony" has a solidus temperature of about 640 V and a liquidus temperature of 730.
  • the composition is: 30.0% copper (Cu), 38.0% zinc (Zn), 2.0% gallium (Ga), 1.5% indium (In), 1.2% nickel (Ni), 0.05% ⁇ (Ce ), the rest is silver (Ag).
  • the composition is: 29.0% copper (Cu), 36.0% zinc (Zn), 1.0% Gallium (Ga), 1.0% indium (In), 1.0% nickel (Ni), 0.05% cerium (Ce), and the balance is silver (Ag).
  • the above-mentioned distribution ratio of the "cadmium-free silver brazing filler metal containing gallium, indium, nickel and antimony" has a solidus temperature of about 640 ⁇ , a liquidus temperature of about 730 ( (considering experimental error), and FB102 (QJ102) brazing.
  • Example 9 In terms of mass percentage, the composition is: 33.0% copper (Cu), 34.0% zinc (Zn), 0.8% gallium (Ga), 1.6% indium (In), 0.8% nickel (Ni), 0 ⁇ 015% ⁇ (Ce), the rest is silver (Ag).
  • Example 10 In terms of mass percentage, the composition is: 30.5% copper (Cu), 35.2% zinc (Zn), 0.4% gallium (Ga), 0.9% indium (In), 0.3% nickel (Ni), 0.005 % ⁇ (Ce), the rest is silver(Ag) 0.
  • the above-mentioned distribution ratio of "cadmium-free silver solder containing gallium, indium, nickel and antimony" has a solidus temperature of about 640 °C and a liquidus temperature of 730 °C or so (considering experimental error), with FB102 (QJ102) flux, brazing base metal for the following combinations of brazing joint strength see the data in brackets: copper-brass (.
  • the composition is: 30.5% copper (Cu), 35.0% zinc (Zn), 1.2% gallium (Ga), 0.9% indium (In), 0.5% nickel (Ni), 0.002% ⁇ (Ce ), the rest is silver (Ag).
  • the composition is: 32.5% copper (Cu), 36.0% zinc (Zn), 2.2% gallium (Ga), 0.2% indium (In), 1.5% nickel (Ni), 0.008% ⁇ (Ce ), the rest is silver (Ag).
  • the solid-phase temperature of the "cadmium-free silver solder containing gallium, indium, nickel and antimony" obtained by the above-mentioned distribution ratio is about 645 ⁇
  • the liquidus temperature is about 730 ( (considering experimental error)
  • FB102 (QJ102) is used for brazing.
  • the composition is: 32.5% copper (01), 36.0% zinc (Zn), 1.3% gallium (Ga), 1.2% indium (In), 1.5% nickel (Ni), 0.008% ⁇ (Ce ), the rest is silver (Ag).
  • Embodiment 14 is a diagrammatic representation of Embodiment 14:
  • the composition is: 31.5% copper (01), 36.0% zinc (Zn), 1.1% gallium (Ga), 1.2% indium (In), 0.9% nickel (Ni), 0.003% ⁇ (Ce ), the rest is silver (Ag).
  • the composition is: 29.5% copper (Cu), 36.5% zinc (Zn), 2.3% gallium (Ga), 1.2% indium (In), 1.8% nickel (Ni), 0.002% ⁇ (Ce ), the rest is silver (Ag).
  • the above-mentioned distribution ratio of the "cadmium-free silver brazing filler metal containing gallium, indium, nickel and antimony" has a solidus temperature of about 640 ° C and a liquidus temperature of about 73 CTC (considering experimental error), and is matched with FB102 (QJ102). ) flux, brazing base material for the following combinations of brazing joint strength see the data in brackets: copper-brass (.
  • the composition is: 29.5% copper (Cu), 36.5% zinc (Zn), 0.3% gallium (Ga), 1.2% indium (In), 1.2% nickel (Ni), 0.002% ⁇ (Ce ), the rest is silver (Ag).
  • the composition is: 30. 5% copper (Cu), 34. 5% zinc (Zn), 2. 3% gallium (Ga), 2. 0% indium (In), 1. 0% Nickel (Ni), 0.002% ⁇ (Ce), and the rest is silver (Ag).
  • the cadmium-free silver brazing filler metal containing gallium, indium, nickel and bismuth of the invention has good wetting properties to the brazing base material copper, brass, carbon steel, stainless steel and nickel-based alloy, respectively, and the above-mentioned first embodiment to the embodiment Any of the seventeenth cadmium-free silver solders containing gallium, indium, nickel and niobium, in brazing copper-copper, copper-bronze, brass-carbon steel, brass-stainless steel, carbon steel-stainless steel, When the carbon steel-nickel-based alloy, stainless steel-nickel-based alloy, copper-nickel-based alloy, brass-nickel-based alloy and other composite materials (base metal) are used, the brazing composite material (base metal) is good. Wettability and brazed joints have good overall mechanical properties.

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Description

一种含镓、 铟、 镍和铈的无镉银钎料
技术领域 本发明涉及一种含镓、 铟、 镍和铈的无镉银钎料, 特别是一种适用 于紫铜、 黄铜、 碳钢、 不锈钢以及镍基合金等金属材料钎焊的无镉银钎 料, 属于金属材料类及冶金领域的钎焊材料。 背景技术 目前使用的银钎料 BAg25CuZn、 BAg45CuZn, 其化学成分中含银量分 别为 25%、 45%左右。 虽然 BAg25CuZn、 BAg45CuZn银钎料性能优良, 但是 与含镉的 BAg35CuZnCd、 BAg45CuZnCd银钎料相比, 其润湿性、 铺展性都 逊色得多, 且固-液相线温度高出许多。 如果摒弃使用前者(BAg25CuZn、 BAg45CuZn) 而选择使用后者 (BAg35CuZnCd、 BAg45CuZnCd), 那么又势 必受到限制, 原因在于: 镉对操作者身体安全有影响及对环境具有污染, 尤其是随着欧盟 "R0HS "指令于 2006年 7月 1日的实施, 含镉材料正逐步 禁止使用。 因此, 研究开发具有与 BAg35CuZnCd、 BAg45CuZnCd钎料相当 或相同的综合性能、 含银量在 30%左右, 固-液相线温度低于 BAg25CuZn 的无镉银钎料, 不仅具有良好的实用性和重要的经济价值, 而且具有保 护环境的积极意义。 ' 发明内容 本发明的任务是要提供一种能在钎焊过程中以及钎焊后的悍接部位 完全没有有毒元素镉的、 钎悍性能优良、 具有与传统的 BAg35CuZnCd、
BAg45CuZnCd钎料相当综合性能的含镓、 铟、 镍和铈的无镉银钎料。 本发明的任务是这样来完成的。 一种含镓、 铟、 镍和铈的无镉银钎 料,其化学成分按质量百分数配比为: 28. 0%〜35. 0%的铜(01), 28. 0%〜 38. 0%的锌(Zn), 0. 1%〜2. 5%的镓(Ga), 0. 1%〜2. 5%的铟 (In), 0. 1%〜 2. 5%的镍 (Ni ), 0. 002%〜0. 1%的铈 (Ce), 其余为银(Ag)。
本发明具有以下优点: 1 )因成分中不再含有有毒的镉元素, 故能保 护操作者的身体安全和避免对环境产生影响; 2)由于综合性能与传统的 含银量为 35%、 45%的含镉银钎料相当或相似, 因此可替代 BAg35CuZnCd、 BAg45CuZnCd银钎料; 3)通过优化镓、 铟、 镍和铈以及银、 铜、 锌三种 主元素的含量, 使得本发明的钎料对母材具有良好的润湿性、 铺展性和 钎缝力学性能 (o b、 τ ); 4) 由于加入了适量的镓 (Ga) 和铟 (In), 因此在对原材料成本增加不多的情况下能降低本发明的钎料的熔点; 5) 加入适量的镍(M ), 以改善钎料在紫铜、黄铜、碳钢、 不锈钢以及镍基 合金上的润湿性和钎焊接头的抗腐蚀性能, 同时加入稀土元素铈 (Ce) 以细化本发明钎料的晶粒, 提高本发明钎料的塑性和综合力学性能。 具体实施方式
1 )、 使用市售的白银、 电解铜、 锌锭、 镍板、 金属镓、 金属铟、 金 属铈, 按需要配比, 采用常规的中频冶炼炉冶炼、浇铸, 然后通过挤压、 拉拔, 即得到所需要的钎料丝材; 2)、 根据生产需要, 可将金属镓、 金 属铟、 金属铈分别预先冶炼成合金, 然后加入银-铜-锌合金中冶炼、 浇 铸, 再通过挤压、 拉拔, 即得到所需要的钎料丝材。 所得到的钎料丝材 的固相线温度在 630°C〜645°C范围、 液相线温度在 715°C〜735°C范围 (BAg25CuZn银钎料的固相线温度为 700°C、 液相线温度为 800°C )。 配合 FB102 (QJ102)钎剂, 钎悍材料为下列组合: 紫铜一黄铜、 黄铜一碳钢、 不锈钢一镍基合金时, 钎缝力学性能分别为: 。b= 185〜365MPa, τ = 180〜355MPa。 采用常规的中频冶炼炉冶炼、 浇铸, 然后通过挤压、 拉拔, 即得到 所需要的钎料丝材; 本发明的含镓、 铟、 镍和铈的无镉银钎料以含银量 分别为 35%、 45%的 BAg35CuZnCd、 BAg45CuZnCd钎料为参照物, 配合配 合 FB102 (QJ102)钎剂, 钎焊紫铜一黄铜、 黄铜一碳钢、 不锈钢一镍基 合金等材料组合时, 对母材的润湿性、 铺展性与之相当, 钎缝力学性能 与之相当(。b=185〜365MPa, τ =180〜355MPa范围)。本发明的含镓、 铟、 镍和铈的无镉银钎料完全没有有害元素镉, 有效地保护了操作者的 身体安全, 消除了对环境的污染。 钎料的钎缝力学性能指标与 BAg35CuZnCd、 BAg45CuZnCd钎料相当。 因此, 本发明的无镉银钎料完全 可以作为对 BAg35CuZnCd、 BAg45CuZnCd钎料的替代品而应用于金属材料 类及冶金领域。
实施例一 :
按质量百分数配比,其成分为: 32. 0%铜 (Cu), 35. 0%锌 (Zn), 2. 5% 镓(Ga), 2. 5%铟 ( In), 2· 5%镍(Ni), 0. 002%铈(Ce), 其余为银(Ag)。 上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 630°C左右、液相线温度在 715Ό左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 ( o b = 210 ± 25MPa, τ =200 ± 30MPa)、 黄铜一碳钢 (。b=330 ±25MPa, τ =325 ±30MPa)、 不锈钢一镍基合金(。b=350± 15MPa, τ = 260± 10MPa)。 实施例二:
按质量百分数配比,其成分为: 32. 0%铜 (Cu), 35. 0%锌(Zn), 0. 1% 镓 (Ga), 0. 1%铟 ( In), 0. 1%镍 (Ni ), 0. 1%铈 (Ce), 其余为银(Ag)。 上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 645°C左右、液相线温度在 735Ό左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 —黄铜 (。b = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (。 b = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金( ob=350±15MPa, τ = 260±10MPa)。
实施例三:
按质量百分数配比,其成分为: 28.0%铜(Cu), 38.0%锌 (Zn), 0.1% 镓 (Ga), 2.5%铟 (In), 0.5%镍 (Ni), 0.03%铈 (Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 630°C左右、液相线温度在 725Ό左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 (。b=210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (ob=330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金( ob=350±15MPa, τ = 260±10MPa)。
实施例四: ' 按质量百分数配比,其成分为: 35.0%铜 (Cu), 28.0%锌 (Zn), 1.5% 镓 (Ga), 1.5%铟 (In), 0.50/0镍 (Ni), 0.05%铈 (Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 630°C左右、液相线温度在 725°C左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 —黄铜 ( ob = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (ob = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金(。b=350±15MPa, τ =260±10MPa)。
实施例五:
按质量百分数配比,其成分为: 32.0%铜(Cu), 32.0%锌(Zn), 1.5% 镓 (Ga), 0.1%铟 (In), 1.5%镍 (Ni), 0.005%铈 (Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 640°C左右、液相线温度在 730°C左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 (。b = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (ob = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金( ob=350±15MPa, τ = 260±10MPa)。
实施例六:
按质量百分数配比,其成分为: 32.0%铜(Cu), 38.0%锌(Zn), 0.3% 镓 (Ga), 0.5%铟(Ιη), 0.2%镍 (Ni), 0.05%铈 (Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 640 V左右、液相线温度在 730。C左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 (。b=210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (ob = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金( ob=350±15MPa, τ = 260±10MPa)。
实施例七:
按质量百分数配比,其成分为: 30.0%铜(Cu), 38.0%锌(Zn), 2.0% 镓 (Ga), 1.5%铟 (In), 1.2%镍 (Ni), 0.05%铈(Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 635°C左右、液相线温度在 730°C左右(考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎悍母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 (。b = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (。b = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金(。b=350±15MPa, τ = 260±10MPa)。
实施例八:
按质量百分数配比,其成分为: 29.0%铜(Cu), 36.0%锌(Zn), 1.0% 镓(Ga), 1.0%铟 (In), 1.0%镍(Ni), 0.05%铈 (Ce), 其余为银(Ag)。 上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 640Ό左右、液相线温度在 730Ό左右(考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 ( ob = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (。b = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金( ob=350±15MPa, τ = 260±10MPa)。
实施例九- 按质量百分数配比,其成分为: 33.0%铜(Cu), 34.0%锌 (Zn), 0.8% 镓(Ga), 1.6%铟 (In), 0.8%镍 (Ni), 0· 015%铈 (Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 640Ό左右、液相线温度在 73CTC左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 (。b = 210土 25MPa, τ =200±30MPa)、 黄铜一碳钢 (。b=330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金( ob=350±15MPa, τ =260±10MPa)。
实施例十- 按质量百分数配比,其成分为: 30.5%铜 (Cu), 35.2%锌 (Zn), 0.4% 镓(Ga), 0.9%铟 (In), 0.3%镍(Ni), 0.005%铈 (Ce), 其余为银 (Ag)0 上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 640°C左右、液相线温度在 730°C左右(考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 (。b = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (。b = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金(。b=350±15MPa, τ = 260±10MPa)。 实施例 H "—:
按质量百分数配比,其成分为: 30.5%铜(Cu), 35.0%锌(Zn), 1.2% 镓(Ga), 0.9%铟 (In), 0.5%镍 (Ni), 0.002%铈(Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 635Ό左右、液相线温度在 730°C左右(考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 —黄铜 ( ob = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (。b = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金(。b=350±15MPa, τ = 260±10MPa)。
实施例十二:
按质量百分数配比,其成分为: 32.5%铜 (Cu), 36.0%锌 (Zn), 2.2% 镓 (Ga), 0.2%铟 (In), 1.5%镍 (Ni), 0.008%铈(Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 645Ό左右、液相线温度在 730Ό左右(考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 —黄铜 (。b = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (。b = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金(。b=350±15MPa, τ =260±10MPa:)。
实施例十三:
按质量百分数配比,其成分为: 32.5%铜(01), 36.0%锌(Zn), 1.3% 镓 (Ga), 1.2%铟 (In), 1.5%镍 (Ni), 0.008%铈 (Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 64CTC左右、液相线温度在 735°C左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 (。b = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 ( σ„ = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金(。b=350±15MPa, τ = 260±10MPa)。
实施例十四:
按质量百分数配比,其成分为: 31.5%铜(01), 36.0%锌(Zn), 1.1% 镓(Ga), 1.2%铟 (In), 0.9%镍 (Ni), 0.003%铈 (Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 64(TC左右、液相线温度在 730°C左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 ( ob=210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (ob = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金( ab=350±15MPa, τ = 260±10MPa)。
实施例十五:
按质量百分数配比,其成分为: 29.5%铜(Cu), 36.5%锌 (Zn), 2.3% 镓(Ga), 1.2%铟 (In), 1.8%镍(Ni), 0.002%铈(Ce), 其余为银 (Ag)。 上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温度在 640°C左右、 液相线温度在 73CTC左右 (考虑了实验误差), 配合 FB102 (QJ102)钎剂, 钎悍母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 (。b = 210±25MPa, τ =200±30MPa)、 黄铜一碳钢 (。b = 330 ±25MPa, τ =325土 30MPa)、 不锈钢一镍基合金(。b=350±15MPa, τ =260±10MPa)。
实施例十六:
按质量百分数配比,其成分为: 29.5%铜 (Cu), 36.5%锌 (Zn), 0.3% 镓(Ga), 1.2%铟 (In), 1.2%镍 (Ni), 0.002%铈 (Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 640 V左右、液相线温度在 735 °C左右 (考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 一黄铜 ( o b = 210 ± 25MPa, τ =200 ±30MPa)、 黄铜一碳钢 ( o b = 330 ±25MPa, τ =325± 30MPa)、 不锈钢一镍基合金(。b=350± 15MPa, τ = 260± 10MPa)。
实施例十七:
按质量百分数配比,其成分为: 30. 5%铜 (Cu), 34. 5%锌 (Zn), 2. 3% 镓(Ga), 2. 0%铟 (In), 1. 0%镍(Ni), 0. 002%铈(Ce), 其余为银(Ag)。
上述成分配比得到的 "含镓、 铟、 镍和铈的无镉银钎料"固相线温 度在 630Ό左右、液相线温度在 715°C左右(考虑了实验误差),配合 FB102 (QJ102)钎剂, 钎焊母材为下列组合时的钎缝强度见括号内数据: 紫铜 —黄铜 (。b = 210± 25MPa, τ =200± 30MPa)、 黄铜丄碳钢 (。b = 330 ±25MPa, τ =325±30MPa)、 不锈钢一镍基合金(。b=350± 15MPa, τ =260± 10MPa)。
由本发明的含镓、铟、镍和铈的无镉银钎料对钎悍母材紫铜、黄铜、 碳钢、 不锈钢、 镍基合金分别都具有良好的润湿性能, 上述实施例一至 实施例十七中的任何一种含镓、 铟、 镍和铈的无镉银钎料, 在钎悍紫铜 一紫铜、 紫铜一黄铜、 黄铜一碳钢、 黄铜一不锈钢、 碳钢一不锈钢、 碳 钢一镍基合金、 不锈钢一镍基合金、 紫铜一镍基合金、 黄铜一镍基合金 等不同的组合材料 (母材) 时, 对所钎焊的组合材料(母材)均具有良 好的润湿性, 且钎焊接头具有良好的综合力学性能。

Claims

权 利 要 求 书
1、一种含镓、铟、镍和铈的无镉银钎料, 其特征在于其化学成分按 质量百分数配比为: 28. 0%〜35. 0%的铜(Cu), 28. 0%〜38. 0%的锌(Zn), 0. 1%〜2. 5%的镓 (Ga), 0. 1%〜2. 5%的铟 ( In), 0. 1%〜2. 5%的镍 (Ni ), 0. 002%〜0. 1%的铈 (Ce), 其余为银 (Ag) o
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