WO2008047436A1 - Ic tag - Google Patents

Ic tag Download PDF

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Publication number
WO2008047436A1
WO2008047436A1 PCT/JP2006/320844 JP2006320844W WO2008047436A1 WO 2008047436 A1 WO2008047436 A1 WO 2008047436A1 JP 2006320844 W JP2006320844 W JP 2006320844W WO 2008047436 A1 WO2008047436 A1 WO 2008047436A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
insulating substrate
tag
protrusion
layer
Prior art date
Application number
PCT/JP2006/320844
Other languages
French (fr)
Japanese (ja)
Inventor
Haruhiko Nitta
Hideo Hatanaka
Shinya Nitta
Original Assignee
Nitta Ind. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Ind. Co., Ltd. filed Critical Nitta Ind. Co., Ltd.
Priority to PCT/JP2006/320844 priority Critical patent/WO2008047436A1/en
Priority to JP2008539651A priority patent/JP4971347B2/en
Publication of WO2008047436A1 publication Critical patent/WO2008047436A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an IC tag that stores various information and is attached to an article or the like.
  • This IC tag identification system is composed of a responder called an IC tag attached to an article, etc., and an interrogator connected to the host side. Between these responders and the interrogator, magnetism, It is characterized in that it communicates in a non-contact manner via a transmission medium such as an induced magnetic field or microwave (radio wave).
  • a transmission medium such as an induced magnetic field or microwave (radio wave).
  • this IC tag for example, for the purpose of management of goods, various information about the goods, such as the name and weight of the goods, the content, the manufacture / seller name, the manufacturing place, the manufacturing date, etc. Information such as date and expiration date is recorded.
  • This IC tag is attached to an article by applying an adhesive or adhesive to the back side of a label-like tag with electronic parts attached to a base material such as plastic film, metal foil, paper, or a laminate of these. A method of attaching to an article using this adhesive or adhesive is common.
  • Patent Document 1 discloses an IC tag as shown in FIG. In Fig. 37! /, 301 ⁇ antenna antenna, 302 ⁇ electronic ⁇ tP port, 303 ⁇ is a base containing these components, 304 is an outer layer that seals this base 303 and constitutes the outer layer It is a hot melt material used as a resin.
  • the surface of the base 303 on which the antenna coil 301 and the electronic component 302 are arranged is sealed with a hot melt material 304, and the base 303 and the hot melt material 304 are integrated together.
  • Patent Document 2 discloses an IC tag as shown in FIG.
  • Reference numeral 311 denotes an IC
  • a heat-sealable resin layer 312 having the same size as the IC is bonded to both surfaces of the IC 311.
  • Patent Document 3 discloses an IC tag as shown in FIG. 39, reference numeral 321 denotes an IC tag inlet, 322 denotes a molded resin, the IC tag inlet 321 is embedded in the molded resin 322, and the IC tag inlet 321 is provided with an opening 323. Molding When the resin 322 is manufactured by injection molding, when the injected molten resin first comes into contact with the IC tag inlet 321 placed on the mold, the IC tag inlet 321 is heated close to the melting temperature. Since the force to push and spread the IC tag inlet 321 is applied by the molten resin flow, the inlet base material directly under the gate port for injecting the molten resin is likely to be broken.
  • the opening 323 in this way, the injected molten resin passes through the opening 323 and first contacts the mold, and the resin that has started to solidify by contacting the mold is IC Since it flows through the tag inlet 321, the effect of weakening the force to push and spread the IC tag inlet 321 can be expected.
  • Patent Document 4 discloses a method of manufacturing an IC tag as shown in FIG.
  • a primary molding die 333 having a groove 331 and a protrusion 332 is prepared (FIG. 40 (1)), an electronic component 334 is arranged in the groove 331, and the outer periphery of the protrusion 332 is arranged.
  • the antenna coil 335 (Fig. 40 (2))
  • the outer layer resin 336 is injected (Fig. 40 (3))
  • the built-in components 334 and 335 are covered with the outer layer resin 336.
  • Molded product 337 was obtained (Fig. 40 (4)), and then primary molded product 337 was inserted into secondary molding die 338 and outer layer grease 339 was injected (Fig. 40 (5)).
  • This is a method of obtaining an electronic tag 340 incorporating a 334 and an antenna coil 335 (FIG. 40 (6)).
  • Patent Document 1 Japanese Patent Laid-Open No. 2002-163627
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-236896
  • Patent Document 3 Japanese Patent Laid-Open No. 2002-355847
  • Patent Document 4 Japanese Unexamined Patent Publication No. 2003-36431
  • the IC tag in FIG. 37 has a structure in which a hot melt material 304, which is a different substance, is joined to the base 303. Therefore, when it is repeatedly used, the hot melt material 304 is partially peeled by an operation such as bending. Or the electronic component 302 may be damaged.
  • the IC tag of FIG. 38 has an open end of the IC 311. Therefore, the IC 311 is damaged and valuable data is destroyed immediately.
  • the IC tag inlet 321 has an opening 323 in the IC tag of FIG. 39, the bonding area between the molded resin 322 and the IC tag inlet 321 is large. It is difficult to peel off from the tag inlet 321. However, since one side of the IC tag inlet 321 is open, the IC tag inlet 321 is damaged and valuable data is destroyed immediately.
  • the electronic parts 334 may be damaged due to separation of the upper and lower outer layer resins 336 and 339 from the joint line 341 by the operation such as bending. .
  • the present invention has been made in view of such problems of the prior art.
  • the purpose of the present invention is to prevent the coating layer containing the electronic component from being peeled off easily even by an operation such as bending. It is an object to provide an IC tag having a structure in which a built-in electronic component protected by a layer is not easily damaged.
  • the IC tag of the present invention is an IC tag in which an IC module in which an electronic component having an IC chip and an antenna coil is mounted on an insulating substrate is covered with a coating layer of an elastic material.
  • the tag is characterized in that a protruding portion is formed by protruding a covering layer in the vicinity of the IC chip, and a cavity is formed between the protruding portion and the IC chip.
  • the joint between the IC chip and the antenna coil is easily broken by bending or the like when the IC tag is used.
  • the cavity is formed around the IC chip of the present invention, the cavity is bent. It functions as a buffer layer that relieves the bending stress that accompanies it, and prevents breakage at the joint between the IC chip and the antenna coil.
  • the resin core layer acts as a resistance to deformation, and it is difficult to bend the insulating substrate at a certain bending angle or more during use, so that the antenna coil can be prevented from being damaged.
  • the upper and lower resin core layers having the same plane dimensions as the insulating substrate are provided on both the upper and lower surfaces of the insulating substrate, the function as a resistance antibody against deformation increases. Since the insulating substrate is folded further, damage to the antenna coil can be suppressed almost completely.
  • a protective layer having a grease material strength on the inner side surface of the protrusion. This is because the IC chip can be protected by the impact force during use.
  • the first projecting portion and the second projecting portion are respectively formed on one side and the other side by projecting the covering layers on both sides of the insulating substrate so as to be symmetric with respect to the insulating substrate.
  • a protective layer made of a resin material on the inner side surfaces of the protruding portion and the second protruding portion, because the effect of protecting the IC chip against impact during use is increased.
  • a protective plate that also has a grease material strength is attached to the position on the insulating substrate opposite to the side where the IC chip is mounted, directly under the IC chip, This is preferable because the effect of protecting the IC chip against impact is increased.
  • the IC tag of the present invention is an IC chip over an IC tag in which an IC module in which an electronic component including an IC chip and an antenna coil is mounted on an insulating substrate is covered with a coating layer of an elastic material. Protruding portions are formed by projecting the nearby coating layer, and a cavity is provided between the projecting portion and the IC chip, so that the buffer relieves bending stress that occurs when the cavity is bent. If it functions as a layer and the breakage of the joint between the IC chip and the antenna coil is suppressed, there is an effect.
  • the IC tag of the present invention is provided with a resin core layer on the upper surface and Z or lower surface of the insulating substrate, so that the resin core layer acts as a resistance to deformation, and is used in use. Since it becomes difficult to bend the insulating substrate at a bending angle of a certain level or more, it is effective if damage to the antenna coil is suppressed.
  • the IC tag of the present invention includes a protrusion formed by protruding a coating layer in the vicinity of the IC chip.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of an IC tag according to a first embodiment of the present invention.
  • FIG. 2 is a plan view of an IC module that can be used for the IC tag of FIG.
  • FIG. 3 is a circuit diagram of an IC module that can be used for the IC tag of FIG.
  • FIG. 4 is an enlarged cross-sectional view showing an IC chip mounting portion of an IC module.
  • FIG. 5 is a cross-sectional view showing a schematic configuration of a second embodiment of the IC tag of the present invention.
  • FIG. 6 is a cross-sectional view showing a schematic configuration of a third embodiment of the IC tag of the present invention.
  • FIG. 7 is a cross-sectional view showing a schematic configuration of a fourth embodiment of the IC tag of the present invention.
  • FIG. 8 is a cross-sectional view showing a schematic configuration of a fifth embodiment of the IC tag of the present invention.
  • FIG. 9 is a cross-sectional view showing a schematic configuration of a sixth embodiment of the IC tag of the present invention.
  • FIG. 10 is a cross-sectional view showing a schematic configuration of a seventh embodiment of the IC tag of the present invention.
  • FIG. 11 is a cross-sectional view showing a schematic configuration of an eighth embodiment of the IC tag of the present invention.
  • FIG. 12 is a cross-sectional view showing a schematic configuration of a ninth embodiment of the IC tag of the present invention.
  • FIG. 13 is a cross-sectional view showing a schematic configuration of the tenth embodiment of the IC tag of the present invention.
  • FIG. 14 is a cross-sectional view showing a schematic configuration of an eleventh embodiment of the IC tag of the present invention.
  • FIG. 15 is a cross-sectional view showing a schematic configuration of a twelfth embodiment of the IC tag of the present invention.
  • FIG. 16 is a cross-sectional view showing a schematic configuration of a thirteenth embodiment of the IC tag of the present invention.
  • FIG. 17 is a cross-sectional view showing a schematic configuration of the fourteenth embodiment of the IC tag of the present invention.
  • FIG. 18 is a cross-sectional view showing a schematic configuration of the fifteenth embodiment of the IC tag of the present invention.
  • FIG. 19 is a cross-sectional view showing a schematic configuration of a sixteenth embodiment of the IC tag of the present invention.
  • FIG. 20 is a cross-sectional view showing a schematic configuration of the seventeenth embodiment of the IC tag of the present invention.
  • FIG. 21 is a cross-sectional view showing a schematic configuration of an eighteenth embodiment of an IC tag according to the present invention.
  • FIG. 22 is a cross-sectional view showing a schematic configuration of the nineteenth embodiment of the IC tag of the present invention.
  • FIG. 23 is a cross-sectional view showing a schematic configuration of a twentieth embodiment of the IC tag of the present invention.
  • FIG. 24 is a cross-sectional view showing a schematic configuration of the twenty-first embodiment of the IC tag of the present invention.
  • FIG. 25 is a cross-sectional view showing a schematic configuration of a twenty-second embodiment of the IC tag of the present invention.
  • FIG. 26 is a cross-sectional view showing a schematic configuration of the twenty-third embodiment of the IC tag of the present invention.
  • FIG. 27 is a cross-sectional view showing a schematic configuration of a twenty-fourth embodiment of the IC tag of the present invention.
  • FIG. 28 is a cross-sectional view showing a schematic configuration of the twenty-fifth embodiment of the IC tag of the present invention.
  • FIG. 29 is a cross-sectional view showing a schematic configuration of a twenty-sixth embodiment of the IC tag of the present invention.
  • FIG. 30 is a cross-sectional view showing a schematic configuration of the twenty-seventh embodiment of the IC tag of the present invention.
  • FIG. 31 is a cross-sectional view showing a schematic configuration of the twenty-eighth embodiment of the IC tag of the present invention.
  • FIG. 32 is a plan view showing a state in which the IC modules are arranged on the lower coating layer
  • FIG. 32 (b) is a plan view of the upper coating layer.
  • FIG. 33 is an exploded perspective view of an upper / middle / lower mold and an intermediate insertion mold for explaining a method of molding an IC tag according to the present invention.
  • FIG. 34 is a cross-sectional view for explaining the molding process of the IC tag of the present invention.
  • FIG. 35 is an exploded perspective view different from FIG. 33 of the upper / middle / lower molds and the intermediate insertion mold for explaining the molding method of the IC tag of the present invention.
  • FIG. 36 is a cross-sectional view different from FIG. 34 for illustrating the molding process of the IC tag of the present invention.
  • FIG. 37 is a cross-sectional view of a conventional IC tag.
  • FIG. 38 is a cross-sectional view of another conventional IC tag.
  • FIG. 39 (a) is a plan view of still another conventional IC tag
  • FIG. 39 (b) is a cross-sectional view taken along the line BB in FIG. 39 (a).
  • FIG. 40 is a diagram showing another method of manufacturing an IC tag different from the conventional IC tag of FIGS. 37 to 38.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of the first embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. There is a cavity 6 between them.
  • FIG. 2 is a plan view of an IC module 2 that can be used for the IC tag 1 of FIG. As shown in FIG. 2, the IC module 2 has a configuration in which an antenna coil 8 and an IC chip 4 are attached on an insulating substrate 7.
  • FIG. 3 is a circuit diagram of an IC module that can be used for the IC tag 1 of FIG.
  • a rectifying diode 10, a smoothing capacitor 11, and an IC chip 4 are connected to a resonance circuit composed of an antenna coil 8 and a tuning capacitor 9.
  • the tuning capacitor 9, the rectifying diode 10, and the smoothing capacitor 11 are the forces mounted in the IC chip 4 in this embodiment.
  • These components 9, 10, and 11 are different from the IC chip 4. It can also be arranged.
  • FIG. 4 is a cross-sectional view schematically showing an example of a method for connecting the electrode 4 a of the IC chip 4 and the antenna coil 8 via the adhesive layer 12.
  • the material of the adhesive layer 12 include polyurethane, acrylonitrile-styrene copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, polystyrene, polymethyl methacrylate, vinyl acetate resin, polyvinyl alcohol.
  • a single substance or a mixture of polycarbonate, phenol resin, epoxy resin, etc. can be used.
  • the material of the coating layer 3 includes styrene thermoplastic elastomer, olefin thermoplastic elastomer, urethane thermoplastic elastomer, polyester thermoplastic elastomer, polyamide thermoplastic elastomer, fluorine thermoplastic.
  • Thermoplastics such as elastomers
  • thermosetting urethane rubber, thermosetting silicone rubber, and the like can be used.
  • a mixed elastomer containing a mixture of an olefin-based thermoplastic elastomer and a styrene-based thermoplastic elastomer as an essential component is preferable.
  • Olefin-based thermoplastic elastomers have the lowest specific gravity compared to other thermoplastic elastomers, have a wide operating temperature range (about 60 to 150 ° C), and are excellent in heat resistance and weather resistance.
  • the styrenic thermoplastic elastomer is soft and easy to stretch, so it is a thermoplastic elastomer with the best resistance that is closest to the properties of vulcanized rubber, and has high strength and acid resistance. It has the feature that it is excellent in alkali resistance.
  • the hard segment is made of polyethylene or polypropylene
  • the soft segment is made of an ethylene-based thermoplastic elastomer using an ethylene propylene copolymer or ethylene propylene copolymer
  • the hard segment is made of polystyrene.
  • Preferred is a mixed elastomer containing, as an essential component, a mixture of a thermoplastic elastomer composed of a styrene-based thermoplastic elastomer using polybutadiene, polyisoprene or polyolefin.
  • thermoplastic elastomer and the styrene-based thermoplastic elastomer each have the above-mentioned characteristics.
  • Thermoplastic elastomers have the disadvantage of being somewhat inferior in wear resistance. Therefore, olefin thermoplastic elastomer and styrene thermoplastic
  • thermoplastic elastomers can complement each other's drawbacks.
  • the ratio of hard segment to soft segment in the olefin-based thermoplastic elastomer is 10 to 50 parts by weight for the hard segment and 50 to 90 parts by weight for the soft segment.
  • the weight part is preferred.
  • the ratio of the hard segment to the soft segment in the styrene thermoplastic elastomer is preferably 10 to 50 parts by weight for the hard segment, 50 to 90 parts by weight for the soft segment, and the total is 100 parts by weight.
  • the weight ratio of ethylene to propylene in the ethylene propylene copolymer is 70/30 to 50/50 girls' power! / ⁇ .
  • the third component gen of the ethylene-propylene-gen copolymer dicyclopentagen, 5-ethylidene-12-norbornene is preferably used from the viewpoint of polymerization reactivity.
  • the weight ratio of ethylene to propylene of ethylene propylene diene copolymer 80 to 20 to 40 to 60 forces Preferably, that contains Zhen 1-15 wt 0/0 have preferred.
  • the blending ratio of the olefin thermoplastic elastomer and the styrene thermoplastic elastomer is 20 to 80 parts by weight for the olefin thermoplastic elastomer and 20 to 80 parts by weight for the styrene thermoplastic elastomer.
  • the total of these two thermoplastic elastomers is preferably 100 parts by weight.
  • the thermoplastic elastomer material may be a mineral oil plasticizer, a vegetable oil plasticizer, a phthalate plasticizer, or an adipate plasticizer. It is preferable to contain an appropriate amount of a plasticizer. Further, the thermoplastic elastomer material can contain a filler and a reinforcing agent such as calcium carbonate, basic magnesium carbonate, natural key acid, and key salt as required. Further, the thermoplastic elastomer material may contain a deterioration preventing agent for preventing acid deterioration and ozone deterioration as required.
  • the thermoplastic elastomer material may contain a pigment such as a white pigment such as titanium oxide or a black pigment such as carbon black, if necessary.
  • a pigment such as a white pigment such as titanium oxide or a black pigment such as carbon black
  • thermoplastic elastomer materials require organic modifiers to improve properties such as durability and heat resistance. It can be contained as required.
  • the thermoplastic elastomer material may contain a finishing agent and a paint as required in order to improve the appearance.
  • Examples of the material of the insulating substrate 7 include polyesters such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene terephthalate Z isophthalate copolymer, polyolefin resins such as polyethylene and polypropylene, and poly (vinyl fluoride).
  • polyesters such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene terephthalate Z isophthalate copolymer, polyolefin resins such as polyethylene and polypropylene, and poly (vinyl fluoride).
  • Polyfluorinated vinylidene polytetrafluoroethylene, polytetrafluoroethylene such as ethylene-tetrafluoroethylene, polyamides such as nylon 6 and nylon 66, polyvinyl chloride, vinyl chloride Z vinyl acetate Copolymer, ethylene Z vinyl acetate copolymer, ethylene Z butyl alcohol copolymer, etc., cellulose triacetate, cellulose triacetate, cellulose, etc., polymethyl methacrylate, polymethacrylate , Polyethyl acrylate, polyacyl A simple substance or a mixture of acrylic resin such as butyl acrylate, polystyrene, polycarbonate, polyimide, etc. can be used, and any insulating organic material can be used.
  • Examples of the method of arranging the antenna coil 8 and the IC chip 4 on the insulating substrate include a method of fixing with an organic material such as thermoplastic resin or thermosetting resin.
  • a melt lamination method using a hot press can be used as a method of manufacturing the IC tag configured as described above.
  • the melt laminating method is a method in which each material of a tag is sandwiched between mirror plates larger than this, and they are integrated by a hot melt press.
  • a chrome-plated copper plate, a stainless steel plate whose surface is polished, an aluminum plate whose surface is polished, and the like can be used as the mirror plate used at this time.
  • the integrated tag is peeled off with a mirror plate and punched into a tag shape by punching with a mold.
  • the IC chip 4 is covered with the coating layer 3, and the cavity 6 is provided around the IC chip 4, so that the cavity 6 is generated along with the bending. It functions as a buffer layer that relieves bending stress and suppresses breakage of the joint between the IC chip 4 and the antenna coil 8.
  • the shape of the cavity 6 is not limited to that shown in Fig. 1 as long as it can hold air and function as a buffer layer. (2) When having a cavity and a resin core layer
  • FIG. 5 is a cross-sectional view showing a schematic configuration of the second embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are A cavity 6 is provided between them, and a lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached to the lower surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13a. It has been done.
  • the material of the adhesive layer 13a includes epoxy resin-based adhesives, polyurethane-based adhesives, acrylic resin-based adhesives, chloroprene rubber-based adhesives, nitrile rubber-based adhesives, glues, and adhesive tapes.
  • a loop or the like can be used and is not particularly limited.
  • Materials for the lower resin core layer 14 include acrylonitrile monochlorinated polyethylene monostyrene copolymer resin, acrylonitrile monoethylene 'propylene' gen monostyrene copolymer resin, acrylonitrile styrene copolymer resin, butadiene Styrene methyl methacrylate copolymer Coffin, chlorinated poly (vinyl chloride), chlorinated polyethylene, norbornene resin, fluorine resin, polyamideimide, thermoplastic polyimide, polyetherimide, polycarbonate, polyparamethylstyrene, polybul formal, Thermoplastic resins having excellent heat resistance such as polyphenylene sulfide and polymethylpentene, and thermosetting resins having excellent heat resistance such as epoxy resin, furan resin and polyimide can be used.
  • FIG. 6 is a cross-sectional view showing a schematic configuration of a third embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are In between A cavity 6 is provided, and an upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13b.
  • materials for the adhesive layer 13b and the upper resin core layer 15 the same materials as those for the adhesive layer 13a and the lower resin core layer 14 of the second embodiment can be used.
  • the upper resin core layer 15 adhered to the upper surface of the insulating substrate 7 is used. Acts as a resistance to deformation, and it becomes difficult to bend the insulating substrate 7 at a bending angle of a certain value or more during use, so that the effect of suppressing the breakage of the antenna coil can be expected.
  • FIG. 7 is a cross-sectional view showing a schematic configuration of the fourth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are A cavity 6 is provided between them, and a lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached to the lower surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13a.
  • the upper resin core layer 15 having the same plane dimensions as the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 via the adhesive layer 13b.
  • the upper resin core layer is formed on the upper surface and the lower surface of the insulating substrate 7, respectively.
  • the resistance function against deformation of the insulating substrate is further increased as compared with the second embodiment and the third embodiment, so that the insulating substrate 7 is more difficult to bend. Therefore, damage to the antenna coil can be almost completely suppressed.
  • FIG. 8 is a cross-sectional view showing a schematic configuration of the fifth embodiment of the IC tag of the present invention.
  • the IC tag 51 has a lower resin core layer 14 attached to the lower surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13a. This is different from the second embodiment.
  • the greater the area that the resin core layer covers the insulating substrate the greater the effect of suppressing the damage to the antenna coil.
  • the resin core layer only covers a part of the insulating substrate. However, there may be no practical problem.
  • the second embodiment, the twenty-sixth embodiment, the twenty-seventh embodiment, and the twenty-eighth embodiment can be applied to such a case.
  • FIG. 9 is a cross-sectional view showing a schematic configuration of the sixth embodiment of the IC tag of the present invention.
  • the IC tag 61 has an upper resin core layer 15 attached to the upper surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b. This is different from the third embodiment.
  • FIG. 10 is a cross-sectional view showing a schematic configuration of the seventh embodiment of the IC tag of the present invention.
  • an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b.
  • 2 is different from the fourth embodiment in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 constituting 2 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. .
  • FIG. 11 is a cross-sectional view showing a schematic configuration of the eighth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. Between them, a cavity 6 is provided, and a protective layer 16 is provided along the inner side surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7.
  • the material of the adhesive part 13c the same material as that of the adhesive layer 13a of the second embodiment can be used.
  • Examples of the material of the protective layer 16 include thermoplastic resin that can be used for the above-described upper resin core layer 15 and lower resin core layer 14, thermosetting resin, glass fiber, carbon fiber, and amide. Fiber, ceramic fiber (silicon carbide, boron, alumina), whisker (Al 2 O, ⁇ —SiC, graphite, Those containing potassium titanate, polyoxymethylene) or the like can be used.
  • the IC chip 4 is protected by the protective layer 16.
  • the impact force at can also protect the IC chip.
  • FIG. 12 is a cross-sectional view showing a schematic configuration of the ninth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5.
  • a cavity 6 is provided between the IC chip 4 and a first protective layer 16 is provided along an inner surface of the first protrusion 5 via an adhesive 13c coated on the insulating substrate 7.
  • the second protruding portion 5a is formed by protruding the covering layer 3 on the opposite side of the first protruding portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetrical with the first protruding portion 5.
  • a cavity 6a is provided between the part 5a and the insulating substrate 7, and the second protective layer 16a is provided on the inner surface of the second protruding portion 5a via an adhesive part 13d coated on the insulating substrate 7.
  • the material of the adhesive part 13d the same material as that of the adhesive layer 13a of the second embodiment can be used.
  • the material of the first protective layer 16 and the second protective layer 16a the same material as that of the protective layer 16 of the eighth embodiment can be used.
  • the IC chip 4 in addition to the effect that the cavity portion 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the IC chip 4 includes the first protective layer 16 and the second protective layer 16a. Since it is protected, it can be expected that the IC chip protection effect is greater than that of the eighth embodiment.
  • FIG. 13 is a cross-sectional view showing a schematic configuration of the tenth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4.
  • a cavity 6 is provided between and a protective layer 16 is provided along the inner surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7.
  • an adhesive layer 13e is interposed at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted.
  • the protective plate 16b is attached.
  • the material of the adhesive layer 13e the same material as that of the adhesive layer 13a of the second embodiment can be used.
  • the material of the protective plate 16b the same material as that of the protective layer 16 of the eighth embodiment can be used.
  • the IC chip 4 in addition to the effect that the breakage of the joint between the IC chip 4 and the antenna coil 8 is suppressed by the cavity 6, the IC chip 4 is protected by the protective layer 16 and the protective plate 16b. Compared to the eighth embodiment, it can be expected that the IC chip protection effect is increased.
  • FIG. 14 is a cross-sectional view showing a schematic configuration of the eleventh embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4
  • a cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive layer 13b coated on the insulating substrate 7, and on the upper surface of the insulating substrate 7.
  • the upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13b.
  • the upper resin core layer 15 can suppress the damage of the antenna coil.
  • the effect of protecting the IC chip by the protective layer 16 can be expected.
  • FIG. 15 is a cross-sectional view showing a schematic configuration of the twelfth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4.
  • a cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive layer 13b coated on the insulating substrate 7, and on the upper surface of the insulating substrate 7.
  • the upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13b.
  • a protective plate 16b is attached via an adhesive layer 13e at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted.
  • the upper resin core layer 15 can prevent the antenna coil from being broken.
  • the protective layer 16 and the protective plate 16b increase the IC chip protection effect compared to the eleventh embodiment.
  • FIG. 16 is a cross-sectional view showing a schematic configuration of the thirteenth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5 and the first projection 5
  • a cavity 6 is provided between the IC chip 4 and the IC chip 4, and the first protective layer 16 is provided on the inner surface of the first protrusion 5 via an adhesive layer 13b applied on the insulating substrate 7.
  • An upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via an adhesive layer 13b.
  • the second projecting portion 5a is formed by projecting the coating layer 3 on the opposite side of the first projecting portion 5 across the insulating substrate 7 so as to be symmetric with the first projecting portion 5.
  • a cavity 6a is provided between 5a and the insulating substrate 7, and a second protective layer 16a is provided on the inner surface of the second protruding portion 5a via an adhesive portion 13d coated on the insulating substrate 7. It is installed.
  • the upper resin core layer 15 can prevent the antenna coil from being damaged.
  • the effect can be expected, and the first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the eleventh embodiment.
  • FIG. 17 is a sectional view showing a schematic configuration of the fourteenth embodiment of the IC tag of the present invention.
  • This IC tag 141 has an eleventh point that the upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 through the adhesive layer 13b so as to cover a part of the insulating substrate 7. Different from the embodiment. [Fifteenth embodiment]
  • FIG. 18 is a cross-sectional view showing a schematic configuration of the fifteenth embodiment of the IC tag of the present invention.
  • This IC tag 151 is characterized in that an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 via an adhesive layer 13b so as to cover a part of the insulating substrate 7.
  • FIG. 19 is a cross-sectional view showing a schematic configuration of the sixteenth embodiment of the IC tag of the present invention.
  • This IC tag 161 has a thirteenth point in that an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b.
  • an adhesive layer 13b Different from the embodiment.
  • FIG. 20 is a sectional view showing a schematic configuration of the seventeenth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4.
  • a cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive part 13c coated on the insulating substrate 7, and is provided on the lower surface of the insulating substrate 7.
  • a lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached via an adhesive layer 13a.
  • the lower resin core layer 14 can prevent the antenna coil from being damaged.
  • the effect of protecting the IC chip by the protective layer 16 can be expected.
  • FIG. 21 is a sectional view showing a schematic configuration of the eighteenth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4.
  • a cavity 6 is provided between and a protective layer 16 is provided along the inner surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7.
  • a protective plate 16b is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13a at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted.
  • the lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13a.
  • the lower resin core layer 14 can prevent the antenna coil from being broken.
  • the protective layer 16 and the protective plate 16b increase the IC chip protection effect compared to the seventeenth embodiment.
  • FIG. 22 is a cross-sectional view showing a schematic configuration of the nineteenth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4.
  • a hollow portion 6 is provided between the first protective layer 16 and the inner surface of the protruding portion 5 along the adhesive portion 13c coated on the insulating substrate 7.
  • the second projecting portion 5a is formed by projecting the coating layer 3 opposite to the first projecting portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetric with the first projecting portion 5.
  • a cavity 6a is provided between the insulating substrate 7 and the insulating substrate 7, and a second protective layer 16a is provided along the inner surface of the second protruding portion 5a via an adhesive layer 13a.
  • a lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is attached via an adhesive layer 13a.
  • the lower resin core layer 14 is expected to suppress the damage of the antenna coil.
  • the first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the seventeenth embodiment.
  • FIG. 23 is a cross-sectional view showing a schematic configuration of the twentieth embodiment of the IC tag of the present invention.
  • the IC tag 201 is characterized in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. Different from the seventh embodiment. [21st embodiment]
  • FIG. 24 is a cross-sectional view showing a schematic configuration of the twenty-first embodiment of the IC tag of the present invention.
  • the IC tag 211 has an eighteenth point that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a.
  • the embodiment is a cross-sectional view showing a schematic configuration of the twenty-first embodiment of the IC tag of the present invention.
  • the IC tag 211 has an eighteenth point that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a.
  • FIG. 25 is a cross-sectional view showing a schematic configuration of a twenty-second embodiment of the IC tag of the present invention.
  • the IC tag 221 has a nineteenth feature in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a.
  • FIG. 26 is a sectional view showing a schematic configuration of the twenty-third embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4.
  • a cavity 6 is provided between them, adhesive layers 13b and 13a are coated on the upper and lower surfaces of the insulating substrate 7, respectively, and a protective layer 16 is provided on the inner surface of the protrusion 5 via the adhesive layer 13b.
  • the upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is adhered to the upper surface of the insulating substrate 7 through the adhesive layer 13b, and the adhesive layer is disposed on the lower surface of the insulating substrate 7.
  • a lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached via 13a.
  • the upper resin core layer 15 and the lower resin core layer 14 in addition to the effect that the damage of the antenna coil can be almost completely suppressed can be expected, and the protective effect of the IC chip by the protective layer 16 can be expected.
  • FIG. 27 is a cross-sectional view showing a schematic configuration of the twenty-fourth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 A cavity 6 is provided between them, adhesive layers 13b and 13a are coated on the upper and lower surfaces of the insulating substrate 7, respectively, and a protective layer 16 is provided on the inner surface of the protrusion 5 via the adhesive layer 13b.
  • the upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via the adhesive layer 13b.
  • a protective plate 16b is attached via an adhesive layer 13a to a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted.
  • the lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is adhered to the insulating layer 7 through the adhesive layer 13a.
  • FIG. 28 is a cross-sectional view showing a schematic configuration of the twenty-fifth embodiment of the IC tag of the present invention.
  • the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5, and the first projection 5 and the IC
  • a cavity 6 is provided between the chip 4
  • adhesive layers 13 b and 13 a are applied to the upper and lower surfaces of the insulating substrate 7, and an adhesive is applied to the inner surface of the first protrusion 5.
  • the first protective layer 16 is provided along the layer 13b, and the upper resin core layer 15 having the same plane dimensions as the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via the adhesive layer 13b. Yes.
  • the second protruding portion 5a is formed by protruding the coating layer 3 on the opposite side of the first protruding portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetric with the first protruding portion 5.
  • a cavity 6a is provided between 5a and the insulating substrate 7, and a second protective layer 16a is provided along the inner surface of the second protruding portion 5a via an adhesive layer 13a.
  • the lower resin core layer 14 having the same plane dimensions as the insulating substrate 7 is adhered to the insulating layer 7 through the adhesive layer 13a.
  • the antenna coil is formed by the upper resin core layer 15 and the lower resin core layer 14.
  • the first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the twenty-third embodiment.
  • FIG. 29 is a cross-sectional view showing a schematic configuration of the twenty-sixth embodiment of the IC tag of the present invention.
  • This IC tag 261 has a lower resin core layer 14 attached to the lower surface of the insulating substrate 7 via an adhesive layer 13a so as to cover a part of the insulating substrate 7, and adhered to the upper surface of the insulating substrate 7.
  • the upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and is different from the twenty-third embodiment.
  • FIG. 30 is a cross-sectional view showing a schematic configuration of the twenty-seventh embodiment of the IC tag of the present invention.
  • a lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13 a so as to cover a part of the insulating substrate 7, and is adhered to the upper surface of the insulating substrate 7.
  • the upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and the second point is This is different from the fourteenth embodiment.
  • FIG. 31 is a cross-sectional view showing a schematic configuration of the twenty-eighth embodiment of the IC tag of the present invention.
  • a lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13 a so as to cover a part of the insulating substrate 7, and the IC tag 281 is bonded to the upper surface of the insulating substrate 7.
  • the upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and is different from the twenty-fifth embodiment.
  • An aluminum foil having a thickness of 25 ⁇ m was attached to a polyethylene terephthalate film having a thickness of 50 ⁇ m via an adhesive.
  • an antenna pattern was formed on the resist material, and the resist material was placed on the aluminum foil, and an aluminum antenna pattern (antenna coil) was formed by etching.
  • an IC chip 4 (0.4 mm X O. 4 mm X O. 15 mm) is laminated on this antenna pattern (antenna coil) 8 via an adhesive organic conductive film 12 for flip chip. Then, it was heated to about 170 ° C. to produce an IC module 2 as shown in FIG.
  • a method of forming the antenna pattern a method of forming by screen printing using a conductive paste composition and other known methods can be employed.
  • the coating layer in this embodiment is composed of a lower coating layer made of a thermoplastic elastomer and an upper coating layer made of a thermoplastic elastomer. These lower coating layer and upper coating layer were obtained as follows.
  • thermoplastic elastomer first material is polystyrene 10 weight 0/0, polybutadiene 20 by weight 0/0, polypropylene 5 weight 0/0, ethylene propylene diene copolymer 25 wt%, a plasticizer (paraffin oil) is the blending ratio of 40 wt 0/0.
  • Ethylene-propylene- Ethylene diene copolymer is 54 weight 0/0, propylene 43 wt 0/0, dicyclopenta Jen is the ratio blend of 3% by weight.
  • a styrene-based and olefin-based mixed thermoplastic elastomer having such a mixing ratio was mixed for about 2 minutes at 12 Orpm in a Banbury mixer heated to 80 ° C. During this time, the temperature of the mixture in the Banbury mixer increased to about 170 ° C. At this temperature, after another 2 minutes of mixing, the plasticizer was added and the mixture was mixed for 3 minutes. As a result, the temperature of the mixture rose to about 200 ° C. Next, the mixture in the Banbury mixer was taken out and rolled into a 2 mm thick sheet with a roller. The sheet was punched with a punching machine (not shown) to obtain a planar lower coating layer 3a and upper coating layer 3b as shown in FIGS. 32 (a) and 32 (b).
  • the nine IC modules 2 obtained as described above are arranged in alignment on the lower coating layer 3a shown in Fig. 32 (a) on the lower die D1 made of stainless steel.
  • the upper covering layer 3b shown in FIG. 32 (b) is placed thereon, and further, an intermediate insertion type Sl made of millable type silicone rubber and a millable type silicone rubber made thereon.
  • Intermediate insertion mold S2, stainless steel middle mold D2, and stainless steel upper mold D3 were stacked one after another.
  • Nine through holes h are formed in each of the intermediate insertion type Sl, the intermediate insertion type S2, and the middle mold D2.
  • each through hole h corresponds to the position directly above the IC chip 4 of the arranged IC module 2, and the action of the through hole facilitates the formation of the protrusion as will be described later.
  • the lower mold D1, the middle mold D2, and the upper mold D3 are preheated to about 100 to 120 ° C, and further, the lower mold D1, the middle mold D2, and the upper mold D3 are about 140 ° C. And press the middle mold D2 and the upper mold D3 against the lower mold D 1 to apply a pressure of about 200 kN / m 2 through the intermediate insertion mold S1 and the intermediate insertion mold S2 to form the lower coating layer 3a.
  • the lower coating layer 3a, the IC module 2 and the upper coating layer 3b are in close contact with each other, and the upper coating layer 3b at the periphery of the through hole h is raised as shown in FIG. Furthermore, by sucking the air in the through hole h through a small hole (not shown) provided in the intermediate insertion type S1 and S2, this raised portion is raised. Finally, a protrusion 5 as shown in Fig. 1 is formed along the inner wall of the middle mold D2 and the upper mold D3, and below the part where the IC module 2 is not sandwiched. The upper cover layer 3a and the upper cover layer 3b are heat-fused and mixed together.
  • IC tags 1 After the mold is cooled and opened, it is cut into IC tags of a predetermined size (length 330mm x width 480mm). A number of IC tags 1 having a cross section as shown in Fig. 1 could be obtained simultaneously. Note that an electric heater for heating is embedded in the lower mold D1, the middle mold D2, and the upper mold D3.
  • the lower coating layer 3a and the upper coating layer 3b have a thickness and heat that hardly rotate. Each thickness should be 5mm or less!
  • the heating time is generally very short (about 1 to 2 seconds), so the IC tag is not damaged by the heat, but the heating time is increased or the heating temperature is increased. If the temperature is high, the function of some or all of the IC tag may be impaired. Therefore, the heat pressing time should be kept within 5 seconds at the maximum, and the heating temperature should not exceed the melting temperature of the thermoplastic elastomer! /, It is preferable to set the temperature below the softening point.
  • the temperature during the above hot pressing is about 130 to 150 ° C for styrene, olefin and urethane thermoplastic elastomers and about 150 to 170 ° for polyester and polyamide thermoplastic elastomers.
  • C and the molding pressure is preferably 100 to 350 kNZm 2 .
  • the silicone rubber is excellent in heat resistance and releasability, it can be preferably used as the intermediate insertion type of this example. Needless to say, other materials can be used as long as they have the same heat resistance and releasability as silicone rubber.
  • the IC module 2 is the same as the insulating substrate 7 via the adhesive layer 13a (heat-resistant adhesive tape) on the lower surface side of the insulating substrate 7 as the IC module 2.
  • An IC tag 21 having a cross section as shown in FIG. 5 was obtained by the same method as above except that a flat resin-coated lower resin core layer 14 (polycarbonate) was used.
  • the adhesive layer 13b heat-resistant adhesive tape
  • the upper resin core layer 15 polycarbonate
  • the upper resin core body having the same plane dimensions as the insulating substrate 7 is respectively formed on the upper surface side and the lower surface side of the insulating substrate 7 as the IC module 2.
  • An IC tag 41 having a cross section as shown in FIG. 7 was obtained by the same method as above except that a layer 15 (polycarbonate) and a lower resin core layer 14 (polycarbonate) were used.
  • an IC tag corresponding to the first embodiment As an IC module 2, a part of the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat resistant adhesive tape).
  • An IC tag 51 having a cross section as shown in FIG. 8 was obtained by the same method as above except that a lower resin core layer 14 (polycarbonate) adhered so as to cover the surface was used.
  • an IC tag corresponding to the first embodiment As an IC module 2, a part of the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat resistant adhesive tape).
  • An IC tag 61 having a cross section as shown in FIG. 9 was obtained by the same method as above except that the upper resin core layer 15 (polycarbonate) adhered so as to cover the surface was used.
  • the upper resin is provided so as to cover a part of the insulating substrate 7 on the upper surface side and the lower surface side of the insulating substrate 7, respectively.
  • An IC tag 71 having a cross section as shown in FIG. 10 was obtained by the same method as above except that the core layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) were used.
  • IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2.
  • First protective layer 16 (epoxy resin containing glass fiber) is pasted via part 13c (heat-resistant adhesive tape), and the opposite side across insulating substrate 7 so as to be symmetrical with first protective layer 16
  • the production example corresponding to the first embodiment is different in that a second protective layer 16a (epoxy resin containing glass fiber) is pasted on an adhesive part 13d (heat-resistant adhesive tape).
  • a stainless steel middle mold D2-1 is placed on a stainless steel lower mold D1, and an intermediate insert made of millable silicone rubber is placed thereon.
  • the mold S1 is placed, and further, the lower covering layer 3a, the IC module 2 having the above-described configuration, and the upper covering layer 3b are placed in order thereon, and further, an intermediate insertion made of millable silicone rubber is placed thereon.
  • the mold S2, the stainless steel middle mold D2-2, and the stainless steel upper mold D3 were stacked one after another.
  • the intermediate insertion type Sl, the intermediate insertion type S2, the middle mold D2-1, and the middle mold D2-2 each have nine through holes h. Note that the position of each through hole h corresponds to directly above or directly below the IC chip 4 of the IC module 2 arranged in alignment, and the action of this through hole facilitates the formation of the protrusion as will be described later.
  • the lower mold D1, the middle mold D2-1, the middle mold D2-2, and the upper mold D3 are preheated to about 100 to 120 ° C, and the lower mold D1 and the middle mold are further heated.
  • middle mold D2-1—middle mold D2-2—upper mold By pressing D3 and applying a pressure of about 200 kNZm 2 to the lower coating layer 3a, IC module 2 and upper coating layer 3b through the intermediate insertion type S1 and intermediate insertion type S2, as shown in FIG.
  • the covering layer 3a, the IC module 2, and the upper covering layer 3b are in close contact with each other, and the upper covering layer 3b and the lower covering layer 3a at the periphery of the through-hole h are raised, and furthermore, the small holes (see FIG. By suctioning the air in the through-hole h through (not shown) (connected to a vacuum source of lOOkPa), this raised part is raised and finally the middle mold D2-1 and the lower mold Inner wall of D1 and middle mold D2-2— and upper mold D3 A first projecting portion 5 as shown in FIG.
  • Protective layer 16 (epoxy resin containing glass fiber) is pasted via part 13c (heat-resistant adhesive tape), and further, directly below IC chip 4 on insulating substrate 7 on the side opposite to the side where IC chip 4 is mounted
  • Fig. 13 shows the same method as above except that a protective plate 16b (epoxy resin containing glass fiber) is pasted through an adhesive layer 13e (heat-resistant adhesive tape) at a position corresponding to An IC tag 101 having such a cross section was obtained.
  • the adhesive layer 13b heat-resistant adhesive tape
  • the protective layer 16 epoxy resin containing glass fiber
  • the upper resin core layer 15 poly force
  • the IC tag 111 having a cross section as shown in FIG. 14 was obtained by the same method as above except that a paste having a carbonate) was used.
  • the adhesive layer 13b heat-resistant adhesive tape
  • a protective layer 16 epoxy resin containing glass fiber
  • an adhesive layer 13e on the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted is located at a position corresponding to directly under the IC chip 4.
  • Adhere protective plate 16b epoxy resin with glass fiber
  • upper resin core with the same plane dimensions as insulating substrate 7 via adhesive layer 13b (heat-resistant adhesive tape)
  • An IC tag 121 having a cross section as shown in FIG. 15 was obtained by the same method as above except that the body layer 15 (polycarbonate) adhered was used.
  • a first adhesive layer 13 b heat-resistant adhesive tape
  • Adhere one protective layer 16 epoxy resin containing glass fiber
  • the adhesive part 13d heat-resistant adhesive tape
  • a second protective layer 16a epoxy resin containing glass fiber
  • an upper resin core layer 15 polyyester
  • An IC tag 131 having a cross section as shown in FIG. 16 was obtained by the same method as above except that the one with carbonate) was used.
  • the IC module 2 is formed on the insulating substrate 7 via the adhesive layer 13b (heat-resistant adhesive tape) on the upper surface side of the insulating substrate 7.
  • An IC tag 141 having a cross section as shown in FIG. 17 was obtained by the same method as above except that the upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.
  • the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat-resistant adhesive tape).
  • An IC tag 151 having a cross section as shown in FIG. 18 was obtained by the same method as above except that an upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.
  • the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat-resistant adhesive tape).
  • An IC tag 161 having a cross section as shown in FIG. 19 was obtained by the same method as above except that an upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.
  • Adhere protective layer 16 epoxy resin with glass fiber
  • part 13c heat-resistant adhesive tape.
  • a lower resin core layer 14 polycarbonate
  • an IC tag 171 having a cross section as shown in FIG. 20 was obtained.
  • the protective layer 16 (epoxy resin containing glass fiber) is pasted through the part 13c (heat-resistant adhesive tape), the adhesive layer 13a is applied to the lower surface side of the insulating substrate 7, and the side on which the IC chip 4 is mounted
  • a protective plate 16b (epoxy resin containing glass fiber) is attached via an adhesive layer 13a (heat-resistant adhesive tape) at a position corresponding to the IC chip 4 on the insulating substrate 7 on the opposite side, and further,
  • the method is the same as above except that an adhesive layer 1 3a (heat-resistant adhesive tape) is used and a lower resin core layer 14 (polycarbonate) with the same plane dimensions as the insulating substrate 7 is used.
  • An IC tag 181 having a cross section as shown in 21 was obtained.
  • Adhering the protective layer 16 (epoxy resin containing glass fiber) via the part 13c (heat-resistant adhesive tape), excluding the part corresponding to the IC chip 4 directly below the insulating substrate 7! (Heat-resistant adhesive tape) is applied, and the second protective layer 16a is placed via the adhesive layer 13a (heat-resistant adhesive tape) on the opposite side across the insulating substrate 7 so as to be symmetrical with the first protective layer 16.
  • An IC tag 191 having a cross section as shown in FIG. 22 was obtained by the same method as described above except that the product was used.
  • the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat resistant adhesive tape).
  • An IC tag 201 having a cross-section as shown in FIG. 23 was obtained by the same method as above except that a part having a lower resin core layer 14 (polycarbonate) attached so as to cover a part was used.
  • the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat-resistant adhesive tape).
  • An IC tag 211 having a cross section as shown in FIG. 24 was obtained by the same method as above except that a part having a lower resin core layer 14 (polycarbonate) attached so as to cover a part was used.
  • an IC tag corresponding to the nineteenth embodiment As the IC module 2, a part of the insulating substrate 7 is attached to the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat-resistant adhesive tape).
  • An IC tag 221 having a cross section as shown in FIG. 25 was obtained by the same method as above except that a lower resin core layer 14 (polycarbonate) pasted so as to be covered was used.
  • the adhesive layer 13b heat-resistant adhesive tape
  • the protective layer 16 epoxy resin containing glass fiber
  • the upper resin core layer 15 poly force
  • the lower resin core layer 14 polycarbonate
  • the adhesive layer 13b heat-resistant adhesive tape
  • the protective layer 16 epoxy resin containing glass fiber
  • the upper resin core layer 15 polycarbonate
  • adhesive layer 13a is applied to the lower surface of insulating substrate 7, and the position corresponding to the position immediately below IC chip 4 on insulating substrate 7 on the side opposite to the side where IC chip 4 is mounted
  • a protective plate 16b epoxy resin containing glass fiber
  • the adhesive layer 13a heat-resistant adhesive tape
  • the same plane dimensions as the insulating substrate 7 through the adhesive layer 13a heat-resistant adhesive tape
  • the IC module 2 is protected via an adhesive layer 13b (heat-resistant adhesive tape) applied to a portion of the insulating substrate 7 excluding the IC chip 4.
  • Adhere layer 16 epoxy resin with glass fiber
  • upper resin core layer 15 polycarbonate
  • adhesive layer 13b heat-resistant adhesive tape
  • the second protective layer 16a epoxy resin containing glass fiber
  • the adhesive layer 13a heat-resistant adhesive tape
  • the insulating substrate 7 and the adhesive layer 13a heat-resistant adhesive tape
  • the upper portion of the insulating substrate 7 is covered as the IC module 2 on the upper surface side and the lower surface side of the insulating substrate 7 respectively.
  • An IC tag 261 having a cross section as shown in FIG. 29 is obtained by the same method as above except that the one having the resin core layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) attached is used. It was.
  • the upper surface of the insulating substrate 7 is covered with the upper resin core so as to cover a part of the insulating substrate 7, respectively.
  • An IC tag 271 having a cross section as shown in FIG. 30 was obtained by the same method as above except that the body layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) were used.
  • the upper part of the insulating substrate 7 is covered as an IC module 2 on the upper surface side and the lower surface side of the insulating substrate 7 respectively.
  • An IC tag 281 having a cross section as shown in FIG. 31 was obtained by the same method as above except that the above was used.
  • the IC tag of the present invention can be used as a life cycle related application, for example, attached to a receipt at a supermarket department store or the like as a checkout management tag for a register, a book management tag for a library, or an impact resistance for courier management.
  • a tag for impact management for airline baggage management as a flexible tag for prepaid management, as a tag for various traceability, as a production management tag attached to a rotating sushi plate
  • a management tag at the time of nursing as a tag for medical instrument management at a hospital, as a tag for drug management at a pharmacy, as a care status management tag for nursing support, as a collection management tag for household waste and industrial waste, Admission to a specific area as a time measurement tag for marathon runners, as a guide tag attached to exhibits at museums, etc.
  • Integrated RFID (Radio Frequency Identification) RFID tags As a tag to be attached to the wrist for managers, as a tag for environmental management in harsh or special environments, mobile phones' personal personal digital assistants ⁇ refrigerators ⁇ digital cameras ⁇ optical discs ⁇ universal serial bus ⁇ home appliances for cooking, etc.
  • Integrated RFID (Radio Frequency Identification) RFID tags and security-related applications such as personal authentication management tags, employee entry / exit management tags, jewelry, luxury clothing, etc.
  • a tag for shoplifting 'anti-counterfeiting as a tag for recording maintenance of equipment and structures, as a tag for parking and entering / leaving management, as a tag for managing important documents, and as a tag for managing important documents, It can be used as a security control tag that manages entry and exit and prevents illegal entry.

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Abstract

Provided is an IC tag having a coat layer, which incorporates an electronic component and is not easily peeled even with operation of folding or the like, and having a structure which prevents the incorporated electronic component protected by the coat layer from easily breaking. In the IC tag, an IC module wherein the electronic component having an IC chip and an antenna coil on an insulating substrate is coated with the coat layer made of an elastic material. The coat layer in the vicinity of the IC chip is protruded to form a protruding section. Since a cavity section is formed between the protruding section and the IC chip, the cavity section functions as a buffer layer for modifying a bending stress generated when being folded, and breakage of a connecting section between the IC chip and the antenna coil is suppressed.

Description

ICタグ  IC tag
技術分野  Technical field
[0001] 本発明は、各種情報を記憶して物品等に取り付けられる ICタグに関するものである 背景技術  TECHNICAL FIELD [0001] The present invention relates to an IC tag that stores various information and is attached to an article or the like.
[0002] 近年、物品等に付与されているタグ情報を自動的に読み取って識別するためのシ ステムとして、旧来より知られているバーコード方式によるものに代えて、より大量の情 報を扱え、耐環境性に優れ、し力も、遠隔読み出し可能なデータキヤリャシステムと 呼ばれる ICタグ識別システムの開発が盛んに行われている。  [0002] In recent years, as a system for automatically reading and identifying tag information attached to articles, etc., a larger amount of information can be handled instead of the conventionally known barcode method. Development of an IC tag identification system called a data carrier system that has excellent environmental resistance and strength and can be read remotely is underway.
[0003] この ICタグ識別システムは、物品等に取り付けられる ICタグと呼ばれる応答器と、ホ スト側に接続される質問器とで構成され、これら応答器と質問器との間で、磁気、誘 導電磁界、マイクロ波 (電波)等の伝送媒体を介して非接触で交信を行う点を特徴と している。  [0003] This IC tag identification system is composed of a responder called an IC tag attached to an article, etc., and an interrogator connected to the host side. Between these responders and the interrogator, magnetism, It is characterized in that it communicates in a non-contact manner via a transmission medium such as an induced magnetic field or microwave (radio wave).
[0004] この ICタグを利用して、例えば、物品の管理などを目的として、物品に関する様々 な情報、例えば、物品の名称や重量、内容量、製造 ·販売者名、製造場所、製造年 月日、使用期限などの情報を記録することが行われている。この ICタグの物品への 取り付けは、プラスチックフィルムや金属箔、紙、これらの積層体などカゝらなる基材に 電子部品を装着したラベル状のタグの裏面に粘着剤あるいは接着剤を塗布し、この 粘着剤あるいは接着剤を利用して物品に取り付ける方式が一般的である。  [0004] By using this IC tag, for example, for the purpose of management of goods, various information about the goods, such as the name and weight of the goods, the content, the manufacture / seller name, the manufacturing place, the manufacturing date, etc. Information such as date and expiration date is recorded. This IC tag is attached to an article by applying an adhesive or adhesive to the back side of a label-like tag with electronic parts attached to a base material such as plastic film, metal foil, paper, or a laminate of these. A method of attaching to an article using this adhesive or adhesive is common.
[0005] 例えば、この ICタグとして、特許文献 1には、図 37に示すような ICタグが開示されて ヽる。図 37にお!/ヽて、 301ίまアンテナコィノレ、 302ίま電子咅 tP口であり、 303ίまこれら の部品を内蔵する基盤で、 304はこの基盤 303を封止して外層を構成する外層榭脂 となるホットメルト材である。この ICタグは、アンテナコイル 301および電子部品 302を 配置した基盤 303の表面をホットメルト材 304で封止し、基盤 303とホットメルト材 304 とを一体ィ匕したものである。  [0005] For example, as this IC tag, Patent Document 1 discloses an IC tag as shown in FIG. In Fig. 37! /, 301 ί antenna antenna, 302 咅 electronic 咅 tP port, 303 ま is a base containing these components, 304 is an outer layer that seals this base 303 and constitutes the outer layer It is a hot melt material used as a resin. In this IC tag, the surface of the base 303 on which the antenna coil 301 and the electronic component 302 are arranged is sealed with a hot melt material 304, and the base 303 and the hot melt material 304 are integrated together.
[0006] また、特許文献 2には、図 38に示すような ICタグが開示されている。図 38において 、 311は ICで、この ICと同じ大きさのヒートシール性榭脂層 312が IC311の両面に接 合されている。 [0006] Patent Document 2 discloses an IC tag as shown in FIG. In Figure 38 Reference numeral 311 denotes an IC, and a heat-sealable resin layer 312 having the same size as the IC is bonded to both surfaces of the IC 311.
[0007] また、特許文献 3には、図 39に示すような ICタグが開示されている。図 39において 、 321は ICタグインレット、 322は成形榭脂であり、 ICタグインレット 321は成形榭脂 3 22中に埋設されており、 ICタグインレット 321には開口 323が設けられている。成形 榭脂 322を射出成形で製造する場合、その射出された溶融樹脂が金型上に置かれ た ICタグインレット 321に最初に接触すると、 ICタグインレット 321は溶融温度近くに 加熱されて、その溶融榭脂流により ICタグインレット 321を押し広げようとする力が加 えられるため、溶融榭脂を射出するゲート口の直下のインレット基材の破壊が生じや すくなる。そこで、このように開口 323を設けることで、射出された溶融榭脂はその開 口 323を通過して最初に金型に接触し、金型に接触することで固化を開始した榭脂 が ICタグインレット 321を流れるので、 ICタグインレット 321を押し広げようとする力が 弱くなるという効果が期待できる。  [0007] Patent Document 3 discloses an IC tag as shown in FIG. In FIG. 39, reference numeral 321 denotes an IC tag inlet, 322 denotes a molded resin, the IC tag inlet 321 is embedded in the molded resin 322, and the IC tag inlet 321 is provided with an opening 323. Molding When the resin 322 is manufactured by injection molding, when the injected molten resin first comes into contact with the IC tag inlet 321 placed on the mold, the IC tag inlet 321 is heated close to the melting temperature. Since the force to push and spread the IC tag inlet 321 is applied by the molten resin flow, the inlet base material directly under the gate port for injecting the molten resin is likely to be broken. Thus, by providing the opening 323 in this way, the injected molten resin passes through the opening 323 and first contacts the mold, and the resin that has started to solidify by contacting the mold is IC Since it flows through the tag inlet 321, the effect of weakening the force to push and spread the IC tag inlet 321 can be expected.
[0008] そして、特許文献 4には、図 40に示すような ICタグの製造方法が開示されている。  [0008] Patent Document 4 discloses a method of manufacturing an IC tag as shown in FIG.
図 40に示す方法は、溝 331と突起部 332を有する一次成形用の金型 333を準備し（ 図 40 (1) )、溝 331内には電子部品 334を配置し、突起部 332の外周にはアンテナ コイル 335を配置し（図 40 (2) ) )、次に、外層榭脂 336を射出し（図 40 (3) )、内蔵部 品 334と 335を外層榭脂 336で覆った一次成形品 337を得（図 40 (4) )、次に、一次 成形品 337を二次成形用金型 338内に挿入して外層榭脂 339を射出し（図 40 (5) ) 、電子部品 334とアンテナコイル 335を内蔵した電子タグ 340を得るという方法である (図 40 (6) )。  In the method shown in FIG. 40, a primary molding die 333 having a groove 331 and a protrusion 332 is prepared (FIG. 40 (1)), an electronic component 334 is arranged in the groove 331, and the outer periphery of the protrusion 332 is arranged. The antenna coil 335 (Fig. 40 (2))), then the outer layer resin 336 is injected (Fig. 40 (3)), and the built-in components 334 and 335 are covered with the outer layer resin 336. Molded product 337 was obtained (Fig. 40 (4)), and then primary molded product 337 was inserted into secondary molding die 338 and outer layer grease 339 was injected (Fig. 40 (5)). This is a method of obtaining an electronic tag 340 incorporating a 334 and an antenna coil 335 (FIG. 40 (6)).
特許文献 1 :特開 2002— 163627号公報  Patent Document 1: Japanese Patent Laid-Open No. 2002-163627
特許文献 2：特開 2002— 236896号公報  Patent Document 2: Japanese Patent Laid-Open No. 2002-236896
特許文献 3：特開 2002— 355847号公報  Patent Document 3: Japanese Patent Laid-Open No. 2002-355847
特許文献 4:特開 2003— 36431号公報  Patent Document 4: Japanese Unexamined Patent Publication No. 2003-36431
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0009] し力しながら、特許文献 1ないし 4に開示された電子タグには、次に説明するような 欠点がある。 [0009] However, the electronic tags disclosed in Patent Documents 1 to 4 are described below. There are drawbacks.
[0010] すなわち、図 37の ICタグは、基盤 303に異物質であるホットメルト材 304を接合す る構造であるため、繰り返し使用すると、折り曲げなどの動作によりホットメルト材 304 が部分的に剥離したり、電子部品 302が破損することがある。  [0010] That is, the IC tag in FIG. 37 has a structure in which a hot melt material 304, which is a different substance, is joined to the base 303. Therefore, when it is repeatedly used, the hot melt material 304 is partially peeled by an operation such as bending. Or the electronic component 302 may be damaged.
[0011] また、図 38の ICタグは、 IC311の端部が開放されているため、 IC311が損傷しや すぐ貴重なデータが破壊されてしまう。  [0011] In addition, the IC tag of FIG. 38 has an open end of the IC 311. Therefore, the IC 311 is damaged and valuable data is destroyed immediately.
[0012] また、図 39の ICタグは、 ICタグインレット 321に開口 323が形成されているため、成 形榭脂 322と ICタグインレット 321との接合面積が大きくて、成形榭脂 322は ICタグ インレット 321から剥離しにくい。し力し、 ICタグインレット 321の一方の面が開放され ているため、 ICタグインレット 321が損傷しやすぐ貴重なデータが破壊されてしまう。  [0012] In addition, since the IC tag inlet 321 has an opening 323 in the IC tag of FIG. 39, the bonding area between the molded resin 322 and the IC tag inlet 321 is large. It is difficult to peel off from the tag inlet 321. However, since one side of the IC tag inlet 321 is open, the IC tag inlet 321 is damaged and valuable data is destroyed immediately.
[0013] そして、図 40の ICタグの製造方法では、一次成形用金型 333と二次成形用金型 3 38により、二度に分けて外層樹脂の成形が行われるため、成形された電子タグ 340 には接合線 341が生じるので、繰り返し使用すると、折り曲げなどの動作により、その 接合線 341を境として上下の外層榭脂 336と 339に分離し、電子部品 334が破損す ることがある。  In the IC tag manufacturing method of FIG. 40, since the outer layer resin is molded twice by the primary molding die 333 and the secondary molding die 338, the molded electronic Since the joint line 341 is generated in the tag 340, when it is repeatedly used, the electronic parts 334 may be damaged due to separation of the upper and lower outer layer resins 336 and 339 from the joint line 341 by the operation such as bending. .
[0014] 本発明は従来の技術の有するこのような問題点に鑑みてなされたものであって、そ の目的は、折り曲げなどの動作によっても電子部品を内蔵する被覆層が剥離しにくく 、被覆層で保護された内蔵電子部品が破損しにくい構造の ICタグを提供することに ある。  [0014] The present invention has been made in view of such problems of the prior art. The purpose of the present invention is to prevent the coating layer containing the electronic component from being peeled off easily even by an operation such as bending. It is an object to provide an IC tag having a structure in which a built-in electronic component protected by a layer is not easily damaged.
課題を解決するための手段  Means for solving the problem
[0015] 上記目的を達成するために、本発明の ICタグは、絶縁基板上に ICチップとアンテ ナコイルを備えた電子部品が実装された ICモジュールが弾性材料の被覆層で被覆 されてなる ICタグにおいて、 ICチップ近傍の被覆層を突出させて突出部を形成し、こ の突出部と ICチップとの間には空洞部が形成されていることを特徴としている。  In order to achieve the above object, the IC tag of the present invention is an IC tag in which an IC module in which an electronic component having an IC chip and an antenna coil is mounted on an insulating substrate is covered with a coating layer of an elastic material. The tag is characterized in that a protruding portion is formed by protruding a covering layer in the vicinity of the IC chip, and a cavity is formed between the protruding portion and the IC chip.
[0016] ICチップとアンテナコイルの接合部は ICタグ使用時の折り曲げ等によって破断しや すいが、本発明の ICチップの周りには空洞部が形成されているので、この空洞部が 折り曲げに伴って発生する曲げ応力を緩和する緩衝層としての機能を果たし、 ICチ ップとアンテナコイルの接合部の破断が抑えられる。 [0017] 絶縁基板の上面および Z又は下面には、榭脂芯体層を設けることが好ましい。榭 脂芯体層は変形に対する抵抗体として作用し、使用時において絶縁基板を一定以 上の曲げ角度に折り曲げることが困難になるので、アンテナコイルの破損が抑えられ るカゝらである。この場合、絶縁基板の上面および下面の両方に、それぞれ絶縁基板 と同一平面寸法の上部榭脂芯体層と下部榭脂芯体層を設ければ、変形に対する抵 抗体としての機能が大きくなり、絶縁基板を一層折り曲げに《なるので、アンテナコ ィルの破損をほぼ完全に抑えることができる。 [0016] The joint between the IC chip and the antenna coil is easily broken by bending or the like when the IC tag is used. However, since the cavity is formed around the IC chip of the present invention, the cavity is bent. It functions as a buffer layer that relieves the bending stress that accompanies it, and prevents breakage at the joint between the IC chip and the antenna coil. [0017] It is preferable to provide a resin core layer on the upper surface and the Z or lower surface of the insulating substrate. The resin core layer acts as a resistance to deformation, and it is difficult to bend the insulating substrate at a certain bending angle or more during use, so that the antenna coil can be prevented from being damaged. In this case, if the upper and lower resin core layers having the same plane dimensions as the insulating substrate are provided on both the upper and lower surfaces of the insulating substrate, the function as a resistance antibody against deformation increases. Since the insulating substrate is folded further, damage to the antenna coil can be suppressed almost completely.
[0018] 突出部の内側面に榭脂材料力もなる保護層を設けることが好ましい。使用時にお ける衝撃カゝら ICチップを保護することができるからである。この場合、絶縁基板を挟ん で対称をなすように、絶縁基板の両側の被覆層を突出させて一方の側と他方の側に 、それぞれ第一突出部と第二突出部を形成し、第一突出部と第二突出部の内側面 に榭脂材料カゝらなる保護層を設ければ、使用時における衝撃に対する ICチップ保護 効果が増大するので好ましい。第二突出部に代わるものとして、 ICチップが実装され た側とは反対側の絶縁基板上の ICチップ直下に相当する位置に榭脂材料力もなる 保護板を取り付ければ、同様に、使用時における衝撃に対する ICチップ保護効果が 増大するので好ましい。  [0018] It is preferable to provide a protective layer having a grease material strength on the inner side surface of the protrusion. This is because the IC chip can be protected by the impact force during use. In this case, the first projecting portion and the second projecting portion are respectively formed on one side and the other side by projecting the covering layers on both sides of the insulating substrate so as to be symmetric with respect to the insulating substrate. It is preferable to provide a protective layer made of a resin material on the inner side surfaces of the protruding portion and the second protruding portion, because the effect of protecting the IC chip against impact during use is increased. As an alternative to the second protrusion, if a protective plate that also has a grease material strength is attached to the position on the insulating substrate opposite to the side where the IC chip is mounted, directly under the IC chip, This is preferable because the effect of protecting the IC chip against impact is increased.
発明の効果  The invention's effect
[0019] 本発明の ICタグは、絶縁基板上に ICチップとアンテナコイルを備えた電子部品が 実装された ICモジュールが弾性材料の被覆層で被覆されてなる ICタグにぉ ヽて、 IC チップ近傍の被覆層を突出させて突出部を形成し、この突出部と ICチップとの間に は空洞部が設けられているので、この空洞部が折り曲げに伴って発生する曲げ応力 を緩和する緩衝層としての機能を果たし、 ICチップとアンテナコイルの接合部の破断 が抑えられると 、う効果がある。  [0019] The IC tag of the present invention is an IC chip over an IC tag in which an IC module in which an electronic component including an IC chip and an antenna coil is mounted on an insulating substrate is covered with a coating layer of an elastic material. Protruding portions are formed by projecting the nearby coating layer, and a cavity is provided between the projecting portion and the IC chip, so that the buffer relieves bending stress that occurs when the cavity is bent. If it functions as a layer and the breakage of the joint between the IC chip and the antenna coil is suppressed, there is an effect.
[0020] また、本発明の ICタグは、絶縁基板の上面および Z又は下面に、榭脂芯体層を設 けることにより、榭脂芯体層は変形に対する抵抗体として作用し、使用時において絶 縁基板を一定以上の曲げ角度に折り曲げることが困難になるので、アンテナコイルの 破損が抑えられると 、う効果がある。  [0020] In addition, the IC tag of the present invention is provided with a resin core layer on the upper surface and Z or lower surface of the insulating substrate, so that the resin core layer acts as a resistance to deformation, and is used in use. Since it becomes difficult to bend the insulating substrate at a bending angle of a certain level or more, it is effective if damage to the antenna coil is suppressed.
[0021] さらに、本発明の ICタグは、 ICチップ近傍の被覆層を突出させてなる突出部の内 側面に榭脂材料力もなる保護層を設けることにより、使用時における衝撃力 ICチッ プを保護することができるという効果がある。 [0021] Furthermore, the IC tag of the present invention includes a protrusion formed by protruding a coating layer in the vicinity of the IC chip. By providing a protective layer on the side surface that also has a grease material strength, there is an effect that it is possible to protect the impact force IC chip during use.
図面の簡単な説明 Brief Description of Drawings
[図 1]図 1は、本発明の ICタグの第一実施形態の概略構成を示す断面図である。 FIG. 1 is a cross-sectional view showing a schematic configuration of an IC tag according to a first embodiment of the present invention.
[図 2]図 2は、図 1の ICタグに用いることができる ICモジュールの平面図である。 2 is a plan view of an IC module that can be used for the IC tag of FIG.
[図 3]図 3は、図 1の ICタグに用いることができる ICモジュールの回路図である。 FIG. 3 is a circuit diagram of an IC module that can be used for the IC tag of FIG.
[図 4]図 4は、 ICモジュールの ICチップ実装部分を拡大して示す断面図である。 FIG. 4 is an enlarged cross-sectional view showing an IC chip mounting portion of an IC module.
[図 5]図 5は、本発明の ICタグの第二実施形態の概略構成を示す断面図である。 FIG. 5 is a cross-sectional view showing a schematic configuration of a second embodiment of the IC tag of the present invention.
[図 6]図 6は、本発明の ICタグの第三実施形態の概略構成を示す断面図である。 FIG. 6 is a cross-sectional view showing a schematic configuration of a third embodiment of the IC tag of the present invention.
[図 7]図 7は、本発明の ICタグの第四実施形態の概略構成を示す断面図である。 FIG. 7 is a cross-sectional view showing a schematic configuration of a fourth embodiment of the IC tag of the present invention.
[図 8]図 8は、本発明の ICタグの第五実施形態の概略構成を示す断面図である。 FIG. 8 is a cross-sectional view showing a schematic configuration of a fifth embodiment of the IC tag of the present invention.
[図 9]図 9は、本発明の ICタグの第六実施形態の概略構成を示す断面図である。 FIG. 9 is a cross-sectional view showing a schematic configuration of a sixth embodiment of the IC tag of the present invention.
[図 10]図 10は、本発明の ICタグの第七実施形態の概略構成を示す断面図である。 FIG. 10 is a cross-sectional view showing a schematic configuration of a seventh embodiment of the IC tag of the present invention.
[図 11]図 11は、本発明の ICタグの第八実施形態の概略構成を示す断面図である。 FIG. 11 is a cross-sectional view showing a schematic configuration of an eighth embodiment of the IC tag of the present invention.
[図 12]図 12は、本発明の ICタグの第九実施形態の概略構成を示す断面図である。 FIG. 12 is a cross-sectional view showing a schematic configuration of a ninth embodiment of the IC tag of the present invention.
[図 13]図 13は、本発明の ICタグの第十実施形態の概略構成を示す断面図である。 FIG. 13 is a cross-sectional view showing a schematic configuration of the tenth embodiment of the IC tag of the present invention.
[図 14]図 14は、本発明の ICタグの第十一実施形態の概略構成を示す断面図である FIG. 14 is a cross-sectional view showing a schematic configuration of an eleventh embodiment of the IC tag of the present invention.
[図 15]図 15は、本発明の ICタグの第十二実施形態の概略構成を示す断面図である FIG. 15 is a cross-sectional view showing a schematic configuration of a twelfth embodiment of the IC tag of the present invention.
[図 16]図 16は、本発明の ICタグの第十三実施形態の概略構成を示す断面図である FIG. 16 is a cross-sectional view showing a schematic configuration of a thirteenth embodiment of the IC tag of the present invention.
[図 17]図 17は、本発明の ICタグの第十四実施形態の概略構成を示す断面図である FIG. 17 is a cross-sectional view showing a schematic configuration of the fourteenth embodiment of the IC tag of the present invention.
[図 18]図 18は、本発明の ICタグの第十五実施形態の概略構成を示す断面図である FIG. 18 is a cross-sectional view showing a schematic configuration of the fifteenth embodiment of the IC tag of the present invention.
[図 19]図 19は、本発明の ICタグの第十六実施形態の概略構成を示す断面図である [図 20]図 20は、本発明の ICタグの第十七実施形態の概略構成を示す断面図である FIG. 19 is a cross-sectional view showing a schematic configuration of a sixteenth embodiment of the IC tag of the present invention. FIG. 20 is a cross-sectional view showing a schematic configuration of the seventeenth embodiment of the IC tag of the present invention.
[図 21]図 21は、本発明の ICタグの第十八実施形態の概略構成を示す断面図である FIG. 21 is a cross-sectional view showing a schematic configuration of an eighteenth embodiment of an IC tag according to the present invention.
[図 22]図 22は、本発明の ICタグの第十九実施形態の概略構成を示す断面図である FIG. 22 is a cross-sectional view showing a schematic configuration of the nineteenth embodiment of the IC tag of the present invention.
[図 23]図 23は、本発明の ICタグの第二十実施形態の概略構成を示す断面図である FIG. 23 is a cross-sectional view showing a schematic configuration of a twentieth embodiment of the IC tag of the present invention.
[図 24]図 24は、本発明の ICタグの第二十一実施形態の概略構成を示す断面図であ る。 FIG. 24 is a cross-sectional view showing a schematic configuration of the twenty-first embodiment of the IC tag of the present invention.
[図 25]図 25は、本発明の ICタグの第二十二実施形態の概略構成を示す断面図であ る。  FIG. 25 is a cross-sectional view showing a schematic configuration of a twenty-second embodiment of the IC tag of the present invention.
[図 26]図 26は、本発明の ICタグの第二十三実施形態の概略構成を示す断面図であ る。  FIG. 26 is a cross-sectional view showing a schematic configuration of the twenty-third embodiment of the IC tag of the present invention.
[図 27]図 27は、本発明の ICタグの第二十四実施形態の概略構成を示す断面図であ る。  FIG. 27 is a cross-sectional view showing a schematic configuration of a twenty-fourth embodiment of the IC tag of the present invention.
[図 28]図 28は、本発明の ICタグの第二十五実施形態の概略構成を示す断面図であ る。  FIG. 28 is a cross-sectional view showing a schematic configuration of the twenty-fifth embodiment of the IC tag of the present invention.
[図 29]図 29は、本発明の ICタグの第二十六実施形態の概略構成を示す断面図であ る。  FIG. 29 is a cross-sectional view showing a schematic configuration of a twenty-sixth embodiment of the IC tag of the present invention.
[図 30]図 30は、本発明の ICタグの第二十七実施形態の概略構成を示す断面図であ る。  FIG. 30 is a cross-sectional view showing a schematic configuration of the twenty-seventh embodiment of the IC tag of the present invention.
[図 31]図 31は、本発明の ICタグの第二十八実施形態の概略構成を示す断面図であ る。  FIG. 31 is a cross-sectional view showing a schematic configuration of the twenty-eighth embodiment of the IC tag of the present invention.
[図 32]図 32 (a)は下部被覆層上に ICモジュールを整列して配置した状態を示す平 面図、図 32 (b)は上部被覆層の平面図である。  [FIG. 32] FIG. 32 (a) is a plan view showing a state in which the IC modules are arranged on the lower coating layer, and FIG. 32 (b) is a plan view of the upper coating layer.
[図 33]図 33は、本発明の ICタグの成形方法を説明するための上 ·中 ·下金型と中間 挿入型の分解斜視図である。 [図 34]図 34は、本発明の ICタグの成形過程を説明するための断面図である。 FIG. 33 is an exploded perspective view of an upper / middle / lower mold and an intermediate insertion mold for explaining a method of molding an IC tag according to the present invention. FIG. 34 is a cross-sectional view for explaining the molding process of the IC tag of the present invention.
[図 35]図 35は、本発明の ICタグの成形方法を説明するための上 ·中 ·下金型と中間 挿入型の図 33とは異なる分解斜視図である。  FIG. 35 is an exploded perspective view different from FIG. 33 of the upper / middle / lower molds and the intermediate insertion mold for explaining the molding method of the IC tag of the present invention.
[図 36]図 36は、本発明の ICタグの成形過程を説明するための図 34とは異なる断面 図である。  FIG. 36 is a cross-sectional view different from FIG. 34 for illustrating the molding process of the IC tag of the present invention.
[図 37]図 37は、従来の ICタグの断面図である。  FIG. 37 is a cross-sectional view of a conventional IC tag.
[図 38]図 38は、従来の別の ICタグの断面図である。 FIG. 38 is a cross-sectional view of another conventional IC tag.
[図 39]図 39 (a)は従来のさらに別の ICタグの平面図、図 39 (b)は図 39 (a)の B— B 矢視断面図である。  FIG. 39 (a) is a plan view of still another conventional IC tag, and FIG. 39 (b) is a cross-sectional view taken along the line BB in FIG. 39 (a).
[図 40]図 40は、図 37ないし図 38の従来の ICタグとは異なるさらに別の ICタグの製造 方法を示す図である。  FIG. 40 is a diagram showing another method of manufacturing an IC tag different from the conventional IC tag of FIGS. 37 to 38.
符号の説明 Explanation of symbols
1 ICタグ  1 IC tag
2 ICモジユーノレ  2 IC module
3 被覆層  3 Coating layer
3a 下部被覆層  3a Lower coating layer
3b 上部被覆層  3b Upper coating layer
4 ICチップ  4 IC chip
4a 電極  4a electrode
5 突出部 (第一突出部）  5 Protrusion (first protrusion)
5a 第二突出部  5a Second protrusion
6 空洞部  6 Cavity
6a 空洞部  6a Cavity
7 絶縁基板  7 Insulating substrate
8 アンテナコィノレ  8 Antenna coin
9 同調用コンデンサ  9 Tuning capacitor
10 整流用ダイオード  10 Rectifier diode
11 平滑用コンデンサ 接着剤層11 Smoothing capacitor Adhesive layer
a 接着剤層a Adhesive layer
b 接着剤層b Adhesive layer
c 接着剤部c Adhesive part
d 接着剤部d Adhesive part
e 接着剤層 e Adhesive layer
下部樹脂芯体層 上部榭脂芯体層 保護層 (第一保護層)a 第二保護層 Lower resin core layer Upper resin core layer Protective layer (first protective layer) a Second protective layer
b 保護板 b Protection plate
ICタグ  IC tag
ICタグ  IC tag
ICタグ  IC tag
ICタグ  IC tag
ICタグ  IC tag
ICタグ  IC tag
ICタグ  IC tag
ICタグ IC tag
1 ICタグ1 IC tag
1 ICタグ1 IC tag
1 ICタグ1 IC tag
1 ICタグ1 IC tag
1 ICタグ1 IC tag
1 ICタグ1 IC tag
1 ICタグ1 IC tag
1 ICタグ1 IC tag
1 ICタグ 191 ICタグ 1 IC tag 191 IC tag
201 ICタグ  201 IC tag
211 ICタグ  211 IC tag
221 ICタグ  221 IC tag
231 ICタグ  231 IC tag
241 ICタグ  241 IC tag
251 ICタグ  251 IC tag
261 ICタグ  261 IC tag
271 ICタグ  271 IC tag
281 ICタグ  281 IC tag
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0024] 以下、本発明の ICタグの好ましい実施形態について説明するが、本発明は下記実 施形態に限定されるものではなぐ本発明の技術的範囲を逸脱しない範囲において 適宜変更と修正が可能である。  Hereinafter, preferred embodiments of the IC tag of the present invention will be described, but the present invention is not limited to the following embodiments, and can be appropriately changed and modified without departing from the technical scope of the present invention. It is.
(1)空洞部を有する場合  (1) When having a cavity
〔第一実施形態〕  [First embodiment]
図 1は、本発明の ICタグの第一実施形態の概略構成を示す断面図である。この IC タグ 1は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチップ 4 近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間には 空洞部 6が設けられている。  FIG. 1 is a cross-sectional view showing a schematic configuration of the first embodiment of the IC tag of the present invention. In this IC tag 1, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. There is a cavity 6 between them.
[0025] 図 2は、図 1の ICタグ 1に用いることができる ICモジュール 2の平面図である。図 2に 示すように、 ICモジュール 2は絶縁基板 7上にアンテナコイル 8と ICチップ 4が貼り付 けられた構成である。 FIG. 2 is a plan view of an IC module 2 that can be used for the IC tag 1 of FIG. As shown in FIG. 2, the IC module 2 has a configuration in which an antenna coil 8 and an IC chip 4 are attached on an insulating substrate 7.
[0026] 図 3は、図 1の ICタグ 1に用いることができる ICモジュールの回路図である。図 3に 示すように、アンテナコイル 8と同調用コンデンサ 9とからなる共振回路に、整流用ダ ィオード 10、平滑用コンデンサ 11および ICチップ 4が接続されている。なお、これら 同調用コンデンサ 9、整流用ダイオード 10および平滑用コンデンサ 11は本実施形態 では ICチップ 4内に搭載されている力 これらの部品 9、 10、 11は ICチップ 4とは別 に配置することもできる。 FIG. 3 is a circuit diagram of an IC module that can be used for the IC tag 1 of FIG. As shown in FIG. 3, a rectifying diode 10, a smoothing capacitor 11, and an IC chip 4 are connected to a resonance circuit composed of an antenna coil 8 and a tuning capacitor 9. The tuning capacitor 9, the rectifying diode 10, and the smoothing capacitor 11 are the forces mounted in the IC chip 4 in this embodiment. These components 9, 10, and 11 are different from the IC chip 4. It can also be arranged.
[0027] 図 4は、 ICチップ 4の電極 4aとアンテナコイル 8とを、接着剤層 12を介して接続する 方法の一例を概略的に示す断面図である。接着剤層 12の材料としては、例えば、ポ リウレタン、アクリロニトリル一スチレン共重合榭脂、アクリロニトリル一ブタジエン一ス チレン共重合榭脂、ポリスチレン、ポリメチルメタタリレート、酢酸ビニル榭脂、ポリビ- ルアルコール、ポリカーボネート、フエノール榭脂、エポキシ榭脂などの単体または混 合物を用いることができる。  FIG. 4 is a cross-sectional view schematically showing an example of a method for connecting the electrode 4 a of the IC chip 4 and the antenna coil 8 via the adhesive layer 12. Examples of the material of the adhesive layer 12 include polyurethane, acrylonitrile-styrene copolymer resin, acrylonitrile-butadiene-styrene copolymer resin, polystyrene, polymethyl methacrylate, vinyl acetate resin, polyvinyl alcohol. A single substance or a mixture of polycarbonate, phenol resin, epoxy resin, etc. can be used.
[0028] 被覆層 3の材料としては、スチレン系熱可塑性エラストマ一、ォレフィン系熱可塑性 エラストマ一、ウレタン系熱可塑性エラストマ一、ポリエステル系熱可塑性エラストマ一 、ポリアミド系熱可塑性エラストマ一、フッ素系熱可塑性エラストマ一などの熱可塑性 エラストマ一の他に、熱硬化性ウレタンゴム、熱硬化性シリコーンゴムなどを用いるこ とができる。この場合、ォレフィン系熱可塑性エラストマ一とスチレン系熱可塑性エラ ストマーの混合物を必須成分として含有する混合エラストマ一が好ましい。  [0028] The material of the coating layer 3 includes styrene thermoplastic elastomer, olefin thermoplastic elastomer, urethane thermoplastic elastomer, polyester thermoplastic elastomer, polyamide thermoplastic elastomer, fluorine thermoplastic. Thermoplastics such as elastomers In addition to elastomers, thermosetting urethane rubber, thermosetting silicone rubber, and the like can be used. In this case, a mixed elastomer containing a mixture of an olefin-based thermoplastic elastomer and a styrene-based thermoplastic elastomer as an essential component is preferable.
[0029] ォレフィン系熱可塑性エラストマ一は他の熱可塑性エラストマ一に比べて比重が最 も軽ぐ使用温度範囲が広く（ 60〜150°C程度）、耐熱性と耐候性に優れていると いう特長を有しており、また、スチレン系熱可塑性エラストマ一は、軟らかくて伸びや すいため、加硫ゴムの性質に最も近ぐノ ランスのよい熱可塑性エラストマ一であって 、高強度で耐酸性、耐アルカリ性に優れているという特長を有している。そこで、ハー ドセグメントとしてポリエチレンまたはポリプロピレンを用い、ソフトセグメントとしてェチ レン プロピレン共重合体またはエチレン プロピレン ジェン共重合体を用いたォ レフイン系熱可塑性エラストマ一と、ハードセグメントとしてポリスチレンを用い、ソフト セグメントとしてポリブタジエン、ポリイソプレンまたはポリオレフインを用いたスチレン 系熱可塑性エラストマ一とからなる熱可塑性エラストマ一の混合物を必須成分として 含有する混合エラストマ一が好まし 、。  [0029] Olefin-based thermoplastic elastomers have the lowest specific gravity compared to other thermoplastic elastomers, have a wide operating temperature range (about 60 to 150 ° C), and are excellent in heat resistance and weather resistance. The styrenic thermoplastic elastomer is soft and easy to stretch, so it is a thermoplastic elastomer with the best resistance that is closest to the properties of vulcanized rubber, and has high strength and acid resistance. It has the feature that it is excellent in alkali resistance. Therefore, the hard segment is made of polyethylene or polypropylene, the soft segment is made of an ethylene-based thermoplastic elastomer using an ethylene propylene copolymer or ethylene propylene copolymer, and the hard segment is made of polystyrene. Preferred is a mixed elastomer containing, as an essential component, a mixture of a thermoplastic elastomer composed of a styrene-based thermoplastic elastomer using polybutadiene, polyisoprene or polyolefin.
[0030] ォレフィン系熱可塑性エラストマ一とスチレン系熱可塑性エラストマ一は、それぞれ 上記したような特長を有している力 一方、ォレフィン系熱可塑性エラストマ一はやや 強度が低いという欠点があり、スチレン系熱可塑性エラストマ一は耐摩耗性がやや劣 るという欠点がある。そこで、ォレフィン系熱可塑性エラストマ一とスチレン系熱可塑 性エラストマ一とを混合した熱可塑性エラストマ一の混合物を必須成分として含有す る混合エラストマ一を用いることにより、これらの熱可塑性エラストマ一が互いの欠点 を補完することができる。その効果を享受するためには、ォレフィン系熱可塑性エラス トマ一におけるハードセグメントとソフトセグメントの比率は、ハードセグメントが 10〜5 0重量部でソフトセグメントが 50〜90重量部で、その合計が 100重量部であるのが好 ましい。また、スチレン熱可塑性エラストマ一におけるハードセグメントとソフトセグメン トの比率は、ハードセグメントが 10〜50重量部でソフトセグメントが 50〜90重量部で 、その合計が 100重量部であるのが好ましい。 [0030] The olefin-based thermoplastic elastomer and the styrene-based thermoplastic elastomer each have the above-mentioned characteristics. Thermoplastic elastomers have the disadvantage of being somewhat inferior in wear resistance. Therefore, olefin thermoplastic elastomer and styrene thermoplastic By using a mixed elastomer containing a mixture of thermoplastic elastomers mixed with an elastomeric elastomer as an essential component, these thermoplastic elastomers can complement each other's drawbacks. In order to enjoy the effect, the ratio of hard segment to soft segment in the olefin-based thermoplastic elastomer is 10 to 50 parts by weight for the hard segment and 50 to 90 parts by weight for the soft segment. The weight part is preferred. The ratio of the hard segment to the soft segment in the styrene thermoplastic elastomer is preferably 10 to 50 parts by weight for the hard segment, 50 to 90 parts by weight for the soft segment, and the total is 100 parts by weight.
[0031] エチレン プロピレン共重合体のエチレン対プロピレンの重量比は、 70対 30乃至 50対 50力女子まし!/ヽ。 [0031] The weight ratio of ethylene to propylene in the ethylene propylene copolymer is 70/30 to 50/50 girls' power! / ヽ.
[0032] エチレン プロピレン ジェン共重合体の第三成分のジェンとしては、重合反応性 の点から、ジシクロペンタジェン、 5 ェチリデン一 2 ノルボルネンを用いるのが好 ましい。また、エチレン プロピレン ジェン共重合体のエチレン対プロピレンの重量 比は 80対 20乃至 40対 60力好ましく、 1〜15重量0 /0のジェンを含有するのが好まし い。 [0032] As the third component gen of the ethylene-propylene-gen copolymer, dicyclopentagen, 5-ethylidene-12-norbornene is preferably used from the viewpoint of polymerization reactivity. The weight ratio of ethylene to propylene of ethylene propylene diene copolymer 80 to 20 to 40 to 60 forces Preferably, that contains Zhen 1-15 wt 0/0 have preferred.
[0033] また、ォレフィン系熱可塑性エラストマ一とスチレン系熱可塑性エラストマ一の配合 比は、ォレフィン系熱可塑性エラストマ一が 20〜80重量部で、スチレン系熱可塑性 エラストマ一が 20〜80重量部で、これら両熱可塑性エラストマ一の合計が 100重量 部であるのが好ましい。  [0033] The blending ratio of the olefin thermoplastic elastomer and the styrene thermoplastic elastomer is 20 to 80 parts by weight for the olefin thermoplastic elastomer and 20 to 80 parts by weight for the styrene thermoplastic elastomer. The total of these two thermoplastic elastomers is preferably 100 parts by weight.
[0034] また、各種配合剤の混入'分散を助け、成形作業を容易にするために、熱可塑性ェ ラストマー材料は、鉱油系可塑剤、植物油系可塑剤、フタレート系またはアジペート 系可塑剤等の可塑剤を適量含有することが好ましい。また、熱可塑性エラストマー材 料は、炭酸カルシウム、塩基性炭酸マグネシウム、天然ケィ酸、ケィ酸塩等の充填剤 、補強剤を必要に応じて含有することができる。また、熱可塑性エラストマ一材料は、 酸ィ匕劣化とオゾン劣化を防止するための劣化防止剤を必要に応じて含有することが できる。また、熱可塑性エラストマ一材料は、酸ィ匕チタン等の白色顔料、カーボンブラ ック等の黒色顔料などの顔料を必要に応じて含有することができる。また、熱可塑性 エラストマ一材料は、耐久性、耐熱性などの特性を改良するための有機改質剤を必 要に応じて含有することができる。さらに、熱可塑性エラストマ一材料は、外観を良好 にするために、仕上げ剤や塗料を必要に応じて含有することができる。 [0034] Further, in order to facilitate the mixing and dispersion of various compounding agents and facilitate the molding operation, the thermoplastic elastomer material may be a mineral oil plasticizer, a vegetable oil plasticizer, a phthalate plasticizer, or an adipate plasticizer. It is preferable to contain an appropriate amount of a plasticizer. Further, the thermoplastic elastomer material can contain a filler and a reinforcing agent such as calcium carbonate, basic magnesium carbonate, natural key acid, and key salt as required. Further, the thermoplastic elastomer material may contain a deterioration preventing agent for preventing acid deterioration and ozone deterioration as required. The thermoplastic elastomer material may contain a pigment such as a white pigment such as titanium oxide or a black pigment such as carbon black, if necessary. In addition, thermoplastic elastomer materials require organic modifiers to improve properties such as durability and heat resistance. It can be contained as required. Further, the thermoplastic elastomer material may contain a finishing agent and a paint as required in order to improve the appearance.
[0035] 絶縁基板 7の材料としては、例えば、ポリエチレンテレフタレート、ポリエチレンナフ タレート、ポリブチレンテレフタレート、ポリエチレンテレフタレート Zイソフタレート共重 合体などのポリエステル類、ポリエチレン、ポリプロピレン等のポリオレフイン榭脂、ポリ フッ化ビュル、ポリフッ化ビ-リデン、ポリ 4フッ化工チレン、エチレンー4フッ化工チレ ン共重合体等のポリフッ化工チレン系榭脂、ナイロン 6、ナイロン 66等のポリアミド、ポ リ塩化ビニル、塩化ビニル Z酢酸ビニル共重合体、エチレン Z酢酸ビニル共重合体 、エチレン Zビュルアルコール共重合体等のビュル系榭脂、三酢酸セルロース、セロ ハン等のセルロース系榭脂、ポリメタアクリル酸メチル、ポリメタアクリル酸ェチル、ポリ アクリル酸ェチル、ポリアクリル酸ブチル等のアクリル系榭脂、ポリスチレン、ポリカー ボネート、ポリイミド等の単体または混合物を用いることができ、絶縁性の有機材料で あれば使用することができる。  [0035] Examples of the material of the insulating substrate 7 include polyesters such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene terephthalate Z isophthalate copolymer, polyolefin resins such as polyethylene and polypropylene, and poly (vinyl fluoride). Polyfluorinated vinylidene, polytetrafluoroethylene, polytetrafluoroethylene such as ethylene-tetrafluoroethylene, polyamides such as nylon 6 and nylon 66, polyvinyl chloride, vinyl chloride Z vinyl acetate Copolymer, ethylene Z vinyl acetate copolymer, ethylene Z butyl alcohol copolymer, etc., cellulose triacetate, cellulose triacetate, cellulose, etc., polymethyl methacrylate, polymethacrylate , Polyethyl acrylate, polyacyl A simple substance or a mixture of acrylic resin such as butyl acrylate, polystyrene, polycarbonate, polyimide, etc. can be used, and any insulating organic material can be used.
[0036] アンテナコイル 8および ICチップ 4などを絶縁基板上に配置する方法としては、熱 可塑性榭脂、熱硬化性榭脂などの有機材料により固定する方法を挙げることができ る。  [0036] Examples of the method of arranging the antenna coil 8 and the IC chip 4 on the insulating substrate include a method of fixing with an organic material such as thermoplastic resin or thermosetting resin.
[0037] 以上のように構成される ICタグを製造する方法としては、加熱プレスによる溶融ラミ ネート方式を用いることができる。溶融ラミネート方式は、タグの各素材をこれより大き い鏡面板で挟み込み、それらを加熱溶融プレスにより一体ィ匕する方法である。このと きに用いる鏡面板としては、クロムメツキした銅板、表面を研磨したステンレス鋼板、 表面を研磨したアルミニウム板などを用いることができる。溶融ラミネート後は、一体 ィ匕されたタグを鏡面板力 剥がし、金型による打ち抜きでタグ形状に打ち抜く。  [0037] As a method of manufacturing the IC tag configured as described above, a melt lamination method using a hot press can be used. The melt laminating method is a method in which each material of a tag is sandwiched between mirror plates larger than this, and they are integrated by a hot melt press. As the mirror plate used at this time, a chrome-plated copper plate, a stainless steel plate whose surface is polished, an aluminum plate whose surface is polished, and the like can be used. After melt lamination, the integrated tag is peeled off with a mirror plate and punched into a tag shape by punching with a mold.
[0038] 本実施形態にぉ ヽては、 ICチップ 4は被覆層 3で被覆され、 ICチップ 4の周りには 空洞部 6が設けられているので、この空洞部 6が折り曲げに伴って発生する曲げ応力 を緩和する緩衝層としての機能を果たし、 ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果が期待できる。  [0038] For the present embodiment, the IC chip 4 is covered with the coating layer 3, and the cavity 6 is provided around the IC chip 4, so that the cavity 6 is generated along with the bending. It functions as a buffer layer that relieves bending stress and suppresses breakage of the joint between the IC chip 4 and the antenna coil 8.
[0039] 空洞部 6の形状としては、図 1に示すものに何ら限定されることなぐ空気を保有し て緩衝層としての機能を果たすことができるものであればよい。 (2)空洞部と榭脂芯体層を有する場合 [0039] The shape of the cavity 6 is not limited to that shown in Fig. 1 as long as it can hold air and function as a buffer layer. (2) When having a cavity and a resin core layer
〔第二実施形態〕  [Second Embodiment]
図 5は、本発明の ICタグの第二実施形態の概略構成を示す断面図である。この IC タグ 21は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間には 空洞部 6が設けられるとともに、 ICモジュール 2を構成する絶縁基板 7の下面には接 着剤層 13aを介して絶縁基板 7と同一平面寸法の下部榭脂芯体層 14が貼着されて いる。  FIG. 5 is a cross-sectional view showing a schematic configuration of the second embodiment of the IC tag of the present invention. In this IC tag 21, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are A cavity 6 is provided between them, and a lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached to the lower surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13a. It has been done.
[0040] 接着剤層 13aの材料としては、エポキシ榭脂系接着剤、ポリウレタン系接着剤、ァク リル榭脂系接着剤、クロロプレンゴム系接着剤、二トリルゴム系接着剤、糊料、粘着テ ープなどを用いることができ、特に限定されない。  [0040] The material of the adhesive layer 13a includes epoxy resin-based adhesives, polyurethane-based adhesives, acrylic resin-based adhesives, chloroprene rubber-based adhesives, nitrile rubber-based adhesives, glues, and adhesive tapes. A loop or the like can be used and is not particularly limited.
[0041] 下部榭脂芯体層 14の材料としては、アクリロニトリル一塩素化ポリエチレン一スチレ ン共重合榭脂、アクリロニトリル一エチレン'プロピレン'ジェン一スチレン共重合榭脂 、アクリロニトリルスチレン共重合榭脂、ブタジエンスチレンメチルメタタリレート共重合 榭脂、塩素化ポリ塩ィ匕ビニル、塩素化ポリエチレン、ノルボルネン榭脂、フッ素榭脂、 ポリアミドイミド、熱可塑性ポリイミド、ポリエーテルイミド、ポリカーボネート、ポリパラメ チルスチレン、ポリビュルホルマール、ポリフエ-レンサルファイド、ポリメチルペンテ ンなどの耐熱性に優れた熱可塑性榭脂や、エポキシ榭脂、フラン榭脂、ポリイミドなど の耐熱性に優れた熱硬化性榭脂を用いることができる。  [0041] Materials for the lower resin core layer 14 include acrylonitrile monochlorinated polyethylene monostyrene copolymer resin, acrylonitrile monoethylene 'propylene' gen monostyrene copolymer resin, acrylonitrile styrene copolymer resin, butadiene Styrene methyl methacrylate copolymer Coffin, chlorinated poly (vinyl chloride), chlorinated polyethylene, norbornene resin, fluorine resin, polyamideimide, thermoplastic polyimide, polyetherimide, polycarbonate, polyparamethylstyrene, polybul formal, Thermoplastic resins having excellent heat resistance such as polyphenylene sulfide and polymethylpentene, and thermosetting resins having excellent heat resistance such as epoxy resin, furan resin and polyimide can be used.
[0042] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部 の破断が抑えられるという効果に加えて、絶縁基板 7の下面に貼着した下部榭脂芯 体層 14は変形に対する抵抗体として作用し、使用時において絶縁基板 7を一定以 上の曲げ角度に折り曲げることが困難になるので、アンテナコイルの破損が抑えられ るという効果が期待できる。  In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the lower resin core layer 14 adhered to the lower surface of the insulating substrate 7. Acts as a resistance to deformation, and it becomes difficult to bend the insulating substrate 7 at a bending angle of a certain level or more during use, so that the effect of suppressing the breakage of the antenna coil can be expected.
〔第三実施形態〕  [Third embodiment]
図 6は、本発明の ICタグの第三実施形態の概略構成を示す断面図である。この IC タグ 31は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間には 空洞部 6が設けられるとともに、 ICモジュール 2を構成する絶縁基板 7の上面には接 着剤層 13bを介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15が貼着されて いる。接着剤層 13bおよび上部榭脂芯体層 15の材料としては、第二実施形態の接 着剤層 13aおよび下部榭脂芯体層 14と同じものを用いることができる。 FIG. 6 is a cross-sectional view showing a schematic configuration of a third embodiment of the IC tag of the present invention. In this IC tag 31, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are In between A cavity 6 is provided, and an upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13b. . As materials for the adhesive layer 13b and the upper resin core layer 15, the same materials as those for the adhesive layer 13a and the lower resin core layer 14 of the second embodiment can be used.
[0043] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部 の破断が抑えられるという効果に加えて、絶縁基板 7の上面に貼着した上部榭脂芯 体層 15は変形に対する抵抗体として作用し、使用時にお ヽて絶縁基板 7を一定以 上の曲げ角度に折り曲げることが困難になるので、アンテナコイルの破損が抑えられ るという効果が期待できる。 In the present embodiment, in addition to the effect that the cavity 6 suppresses the breakage of the joint between the IC chip 4 and the antenna coil 8, the upper resin core layer 15 adhered to the upper surface of the insulating substrate 7 is used. Acts as a resistance to deformation, and it becomes difficult to bend the insulating substrate 7 at a bending angle of a certain value or more during use, so that the effect of suppressing the breakage of the antenna coil can be expected.
〔第四実施形態〕  [Fourth embodiment]
図 7は、本発明の ICタグの第四実施形態の概略構成を示す断面図である。この IC タグ 41は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間には 空洞部 6が設けられるとともに、 ICモジュール 2を構成する絶縁基板 7の下面には接 着剤層 13aを介して絶縁基板 7と同一平面寸法の下部榭脂芯体層 14が貼着され、 I Cモジュール 2を構成する絶縁基板 7の上面には接着剤層 13bを介して絶縁基板 7と 同一平面寸法の上部榭脂芯体層 15が貼着されて 、る。  FIG. 7 is a cross-sectional view showing a schematic configuration of the fourth embodiment of the IC tag of the present invention. In this IC tag 41, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 are A cavity 6 is provided between them, and a lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached to the lower surface of the insulating substrate 7 constituting the IC module 2 via an adhesive layer 13a. The upper resin core layer 15 having the same plane dimensions as the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 via the adhesive layer 13b.
[0044] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部 の破断が抑えられるという効果に加えて、絶縁基板 7の上面と下面に、それぞれ上部 榭脂芯体層 15と下部榭脂芯体層 14を貼着することにより、絶縁基板の変形に対す る抵抗機能は第二実施形態ならびに第三実施形態に比べてさらに増加するので、 絶縁基板 7を一層曲げにくくなり、アンテナコイルの破損をほぼ完全に抑えることがで きる。 In the present embodiment, in addition to the effect that the breakage of the joint between the IC chip 4 and the antenna coil 8 is suppressed by the cavity 6, the upper resin core layer is formed on the upper surface and the lower surface of the insulating substrate 7, respectively. By attaching 15 and the lower resin core layer 14, the resistance function against deformation of the insulating substrate is further increased as compared with the second embodiment and the third embodiment, so that the insulating substrate 7 is more difficult to bend. Therefore, damage to the antenna coil can be almost completely suppressed.
〔第五実施形態〕  [Fifth embodiment]
図 8は、本発明の ICタグの第五実施形態の概略構成を示す断面図である。この IC タグ 51は、 ICモジュール 2を構成する絶縁基板 7の下面には接着剤層 13aを介して 絶縁基板 7の一部を覆うように下部榭脂芯体層 14が貼着されて ヽる点が第二実施形 態とは異なる。 榭脂芯体層が絶縁基板を覆う面積は多い方がアンテナコイルの破損抑制効果は 大きくなるが、 ICタグの用途あるいは使用条件によっては、榭脂芯体層が絶縁基板 の一部を覆うだけでも実用上問題ない場合がある。本実施形態、後記する第六実施 形態、第七実施形態、第十四実施形態、第十五実施形態、第十六実施形態、第二 十実施形態、第二十一実施形態、第二十二実施形態、第二十六実施形態、第二十 七実施形態、第二十八実施形態はそのような場合に適用することができる。 FIG. 8 is a cross-sectional view showing a schematic configuration of the fifth embodiment of the IC tag of the present invention. The IC tag 51 has a lower resin core layer 14 attached to the lower surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13a. This is different from the second embodiment. The greater the area that the resin core layer covers the insulating substrate, the greater the effect of suppressing the damage to the antenna coil. However, depending on the application or use conditions of the IC tag, the resin core layer only covers a part of the insulating substrate. However, there may be no practical problem. The present embodiment, the sixth embodiment, the seventh embodiment, the fourteenth embodiment, the fifteenth embodiment, the sixteenth embodiment, the twenty-second embodiment, the twenty-first embodiment, the twenty-second embodiment to be described later. The second embodiment, the twenty-sixth embodiment, the twenty-seventh embodiment, and the twenty-eighth embodiment can be applied to such a case.
〔第六実施形態〕 [Sixth embodiment]
図 9は、本発明の ICタグの第六実施形態の概略構成を示す断面図である。この IC タグ 61は、 ICモジュール 2を構成する絶縁基板 7の上面には接着剤層 13bを介して 絶縁基板 7の一部を覆うように上部榭脂芯体層 15が貼着されて 、る点が第三実施形 態とは異なる。  FIG. 9 is a cross-sectional view showing a schematic configuration of the sixth embodiment of the IC tag of the present invention. The IC tag 61 has an upper resin core layer 15 attached to the upper surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b. This is different from the third embodiment.
〔第七実施形態〕 [Seventh embodiment]
図 10は、本発明の ICタグの第七実施形態の概略構成を示す断面図である。この I Cタグ 71は、 ICモジュール 2を構成する絶縁基板 7の上面には接着剤層 13bを介し て絶縁基板 7の一部を覆うように上部榭脂芯体層 15が貼着され、 ICモジュール 2を 構成する絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7の一部を覆うよう に下部榭脂芯体層 14が貼着されている点が第四実施形態とは異なる。  FIG. 10 is a cross-sectional view showing a schematic configuration of the seventh embodiment of the IC tag of the present invention. In this IC tag 71, an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 constituting the IC module 2 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b. 2 is different from the fourth embodiment in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 constituting 2 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. .
(3)空洞部と保護層を有する場合 (3) When having a cavity and protective layer
〔第八実施形態〕 [Eighth embodiment]
図 11は、本発明の ICタグの第八実施形態の概略構成を示す断面図である。この I Cタグ 81は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチッ プ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間に は空洞部 6が設けられるとともに、突出部 5の内側面には絶縁基板 7上に塗工した接 着剤部 13cを介して保護層 16が沿設されている。接着剤部 13cの材料としては、第 二実施形態の接着剤層 13aと同じものを用いることができる。保護層 16の材料として は、上記した上部榭脂芯体層 15や下部榭脂芯体層 14に用いることができる熱可塑 性榭脂ゃ熱硬化性榭脂に、ガラス繊維、カーボン繊維、ァラミド繊維、セラミック繊維 (シリコンカーバイド、ボロン、アルミナ）、ゥイスカー（Al O、 β— SiC、グラフアイト、 チタン酸カリウム、ポリオキシメチレン)などを含有するものを用いることができる。 FIG. 11 is a cross-sectional view showing a schematic configuration of the eighth embodiment of the IC tag of the present invention. In this IC tag 81, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. Between them, a cavity 6 is provided, and a protective layer 16 is provided along the inner side surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7. As the material of the adhesive part 13c, the same material as that of the adhesive layer 13a of the second embodiment can be used. Examples of the material of the protective layer 16 include thermoplastic resin that can be used for the above-described upper resin core layer 15 and lower resin core layer 14, thermosetting resin, glass fiber, carbon fiber, and amide. Fiber, ceramic fiber (silicon carbide, boron, alumina), whisker (Al 2 O, β—SiC, graphite, Those containing potassium titanate, polyoxymethylene) or the like can be used.
[0046] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、 ICチップ 4は保護層 16で保護されるので、使 用時における衝撃力も ICチップを保護することができる。  In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the IC chip 4 is protected by the protective layer 16. The impact force at can also protect the IC chip.
〔第九実施形態〕  [Ninth embodiment]
図 12は、本発明の ICタグの第九実施形態の概略構成を示す断面図である。この I Cタグ 91は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチッ プ 4近傍の被覆層 3を突出させて第一突出部 5が形成され、第一突出部 5と ICチップ 4との間には空洞部 6が設けられるとともに、第一突出部 5の内側面には絶縁基板 7 上に塗工した接着剤部 13cを介して第一保護層 16が沿設されている。また、第一突 出部 5と対称をなすように絶縁基板 7を挟んで第一突出部 5とは反対側にある被覆層 3を突出させて第二突出部 5aが形成され、第二突出部 5aと絶縁基板 7との間には空 洞部 6aが設けられるとともに、第二突出部 5aの内側面には絶縁基板 7上に塗工した 接着剤部 13dを介して第二保護層 16aが沿設されている。接着剤部 13dの材料とし ては、第二実施形態の接着剤層 13aと同じものを用いることができる。第一保護層 16 および第二保護層 16aの材料としては、第八実施形態の保護層 16と同じものを用い ることがでさる。  FIG. 12 is a cross-sectional view showing a schematic configuration of the ninth embodiment of the IC tag of the present invention. In this IC tag 91, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5. A cavity 6 is provided between the IC chip 4 and a first protective layer 16 is provided along an inner surface of the first protrusion 5 via an adhesive 13c coated on the insulating substrate 7. ing. Further, the second protruding portion 5a is formed by protruding the covering layer 3 on the opposite side of the first protruding portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetrical with the first protruding portion 5. A cavity 6a is provided between the part 5a and the insulating substrate 7, and the second protective layer 16a is provided on the inner surface of the second protruding portion 5a via an adhesive part 13d coated on the insulating substrate 7. Has been established. As the material of the adhesive part 13d, the same material as that of the adhesive layer 13a of the second embodiment can be used. As the material of the first protective layer 16 and the second protective layer 16a, the same material as that of the protective layer 16 of the eighth embodiment can be used.
[0047] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、 ICチップ 4は第一保護層 16および第二保護 層 16aで保護されるので、第八実施形態に比べて、 ICチップ保護効果が大きくなるこ とが期待できる。  In the present embodiment, in addition to the effect that the cavity portion 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the IC chip 4 includes the first protective layer 16 and the second protective layer 16a. Since it is protected, it can be expected that the IC chip protection effect is greater than that of the eighth embodiment.
〔第十実施形態〕  [Tenth embodiment]
図 13は、本発明の ICタグの第十実施形態の概略構成を示す断面図である。この I Cタグ 101は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチ ップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間 には空洞部 6が設けられるとともに、突出部 5の内側面には絶縁基板 7上に塗工した 接着剤部 13cを介して保護層 16が沿設されている。また、 ICチップ 4が実装された側 とは反対側の絶縁基板 7上の ICチップ 4直下に相当する位置に接着剤層 13eを介し て保護板 16bが貼着されている。接着剤層 13eの材料としては、第二実施形態の接 着剤層 13aと同じものを用いることができる。保護板 16bの材料としては、第八実施形 態の保護層 16と同じものを用いることができる。 FIG. 13 is a cross-sectional view showing a schematic configuration of the tenth embodiment of the IC tag of the present invention. In this IC tag 101, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between and a protective layer 16 is provided along the inner surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7. In addition, an adhesive layer 13e is interposed at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted. The protective plate 16b is attached. As the material of the adhesive layer 13e, the same material as that of the adhesive layer 13a of the second embodiment can be used. As the material of the protective plate 16b, the same material as that of the protective layer 16 of the eighth embodiment can be used.
[0048] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、 ICチップ 4は保護層 16および保護板 16bで 保護されるので、第八実施形態に比べて、 ICチップ保護効果が大きくなることが期待 できる。 In the present embodiment, in addition to the effect that the breakage of the joint between the IC chip 4 and the antenna coil 8 is suppressed by the cavity 6, the IC chip 4 is protected by the protective layer 16 and the protective plate 16b. Compared to the eighth embodiment, it can be expected that the IC chip protection effect is increased.
(4)空洞部と保護層と榭脂芯体を有する場合  (4) When having a cavity, protective layer, and resin core
〔第十一実施形態〕  [Eleventh embodiment]
図 14は、本発明の ICタグの第十一実施形態の概略構成を示す断面図である。この ICタグ 111は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチ ップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間 には空洞部 6が設けられるとともに、突出部 5の内側面には絶縁基板 7上に塗工した 接着剤層 13bを介して保護層 16が沿設され、絶縁基板 7の上面には接着剤層 13b を介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15が貼着されている。  FIG. 14 is a cross-sectional view showing a schematic configuration of the eleventh embodiment of the IC tag of the present invention. In this IC tag 111, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 A cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive layer 13b coated on the insulating substrate 7, and on the upper surface of the insulating substrate 7. The upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13b.
[0049] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、上部榭脂芯体層 15によりアンテナコイルの破 損が抑えられるという効果が期待でき、保護層 16による ICチップ保護効果が期待で きる。 [0049] In the present embodiment, in addition to the effect that the cavity 6 can suppress the breakage of the joint between the IC chip 4 and the antenna coil 8, the upper resin core layer 15 can suppress the damage of the antenna coil. The effect of protecting the IC chip by the protective layer 16 can be expected.
〔第十二実施形態〕  [Twelfth embodiment]
図 15は、本発明の ICタグの第十二実施形態の概略構成を示す断面図である。この ICタグ 121は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチ ップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間 には空洞部 6が設けられるとともに、突出部 5の内側面には絶縁基板 7上に塗工した 接着剤層 13bを介して保護層 16が沿設され、絶縁基板 7の上面には接着剤層 13b を介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15が貼着されている。また、 I Cチップ 4が実装された側とは反対側の絶縁基板 7上の ICチップ 4直下に相当する位 置に接着剤層 13eを介して保護板 16bが貼着されている。 [0050] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、上部榭脂芯体層 15によりアンテナコイルの破 損が抑えられるという効果が期待でき、保護層 16と保護板 16bにより第十一実施形 態に比べて ICチップ保護効果が大きくなる。 FIG. 15 is a cross-sectional view showing a schematic configuration of the twelfth embodiment of the IC tag of the present invention. In this IC tag 121, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive layer 13b coated on the insulating substrate 7, and on the upper surface of the insulating substrate 7. The upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13b. Further, a protective plate 16b is attached via an adhesive layer 13e at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted. [0050] In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion of the IC chip 4 and the antenna coil 8 from being broken, the upper resin core layer 15 can prevent the antenna coil from being broken. Thus, the protective layer 16 and the protective plate 16b increase the IC chip protection effect compared to the eleventh embodiment.
〔第十三実施形態〕  [13th embodiment]
図 16は、本発明の ICタグの第十三実施形態の概略構成を示す断面図である。この ICタグ 131は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチ ップ 4近傍の被覆層 3を突出させて第一突出部 5が形成され、第一突出部 5と ICチッ プ 4との間には空洞部 6が設けられるとともに、第一突出部 5の内側面には絶縁基板 7上に塗工した接着剤層 13bを介して第一保護層 16が沿設され、絶縁基板 7の上面 には接着剤層 13bを介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15が貼着 されている。また、第一突出部 5と対称をなすように絶縁基板 7を挟んで第一突出部 5 とは反対側にある被覆層 3を突出させて第二突出部 5aが形成され、第二突出部 5aと 絶縁基板 7との間には空洞部 6aが設けられるとともに、第二突出部 5aの内側面には 絶縁基板 7上に塗工した接着剤部 13dを介して第二保護層 16aが沿設されている。  FIG. 16 is a cross-sectional view showing a schematic configuration of the thirteenth embodiment of the IC tag of the present invention. In this IC tag 131, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5 and the first projection 5 A cavity 6 is provided between the IC chip 4 and the IC chip 4, and the first protective layer 16 is provided on the inner surface of the first protrusion 5 via an adhesive layer 13b applied on the insulating substrate 7. An upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via an adhesive layer 13b. Further, the second projecting portion 5a is formed by projecting the coating layer 3 on the opposite side of the first projecting portion 5 across the insulating substrate 7 so as to be symmetric with the first projecting portion 5. A cavity 6a is provided between 5a and the insulating substrate 7, and a second protective layer 16a is provided on the inner surface of the second protruding portion 5a via an adhesive portion 13d coated on the insulating substrate 7. It is installed.
[0051] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部 の破断が抑えられるという効果に加えて、上部榭脂芯体層 15によりアンテナコイルの 破損が抑えられるという効果が期待でき、第一保護層 16と第二保護層 16aにより第 十一実施形態に比べて ICチップ保護効果が大きくなる。 [0051] In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the upper resin core layer 15 can prevent the antenna coil from being damaged. The effect can be expected, and the first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the eleventh embodiment.
〔第十四実施形態〕  [14th embodiment]
図 17は、本発明の ICタグの第十四実施形態の概略構成を示す断面図である。この ICタグ 141は、絶縁基板 7の上面には接着剤層 13bを介して絶縁基板 7の一部を覆 うように上部榭脂芯体層 15が貼着されている点が、第十一実施形態とは異なる。 〔第十五実施形態〕  FIG. 17 is a sectional view showing a schematic configuration of the fourteenth embodiment of the IC tag of the present invention. This IC tag 141 has an eleventh point that the upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 through the adhesive layer 13b so as to cover a part of the insulating substrate 7. Different from the embodiment. [Fifteenth embodiment]
図 18は、本発明の ICタグの第十五実施形態の概略構成を示す断面図である。この ICタグ 151は、絶縁基板 7の上面には接着剤層 13bを介して絶縁基板 7の一部を覆 うように上部榭脂芯体層 15が貼着されている点が、第十二実施形態とは異なる。 〔第十六実施形態〕 図 19は、本発明の ICタグの第十六実施形態の概略構成を示す断面図である。この ICタグ 161は、絶縁基板 7の上面には接着剤層 13bを介して絶縁基板 7の一部を覆 うように上部榭脂芯体層 15が貼着されている点が、第十三実施形態とは異なる。 〔第十七実施形態〕 FIG. 18 is a cross-sectional view showing a schematic configuration of the fifteenth embodiment of the IC tag of the present invention. This IC tag 151 is characterized in that an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 via an adhesive layer 13b so as to cover a part of the insulating substrate 7. Different from the embodiment. [Sixteenth embodiment] FIG. 19 is a cross-sectional view showing a schematic configuration of the sixteenth embodiment of the IC tag of the present invention. This IC tag 161 has a thirteenth point in that an upper resin core layer 15 is attached to the upper surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via an adhesive layer 13b. Different from the embodiment. [17th embodiment]
図 20は、本発明の ICタグの第十七実施形態の概略構成を示す断面図である。この ICタグ 171は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチ ップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間 には空洞部 6が設けられるとともに、突出部 5の内側面には絶縁基板 7上に塗工した 接着剤部 13cを介して保護層 16が沿設され、絶縁基板 7の下面には接着剤層 13a を介して絶縁基板 7と同一平面寸法の下部榭脂芯体層 14が貼着されている。  FIG. 20 is a sectional view showing a schematic configuration of the seventeenth embodiment of the IC tag of the present invention. In this IC tag 171, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between and a protective layer 16 is provided on the inner surface of the protruding part 5 via an adhesive part 13c coated on the insulating substrate 7, and is provided on the lower surface of the insulating substrate 7. A lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached via an adhesive layer 13a.
[0052] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果にカ卩えて、下部榭脂芯体層 14によってアンテナコイルの 破損が抑えられるという効果が期待でき、保護層 16による ICチップ保護効果が期待 できる。 In the present embodiment, in consideration of the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the lower resin core layer 14 can prevent the antenna coil from being damaged. The effect of protecting the IC chip by the protective layer 16 can be expected.
〔第十八実施形態〕  [Eighteenth embodiment]
図 21は、本発明の ICタグの第十八実施形態の概略構成を示す断面図である。この ICタグ 181は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチ ップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間 には空洞部 6が設けられるとともに、突出部 5の内側面には絶縁基板 7上に塗工した 接着剤部 13cを介して保護層 16が沿設されている。また、 ICチップ 4が実装された側 とは反対側の絶縁基板 7上の ICチップ 4直下に相当する位置に接着剤層 13aを介し て保護板 16bが貼着され、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7 と同一平面寸法の下部榭脂芯体層 14が貼着されて 、る。  FIG. 21 is a sectional view showing a schematic configuration of the eighteenth embodiment of the IC tag of the present invention. In this IC tag 181, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between and a protective layer 16 is provided along the inner surface of the protrusion 5 via an adhesive part 13c coated on the insulating substrate 7. In addition, a protective plate 16b is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13a at a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted. The lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is stuck through the adhesive layer 13a.
[0053] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、下部榭脂芯体層 14によりアンテナコイルの破 損が抑えられるという効果が期待でき、保護層 16と保護板 16bにより第十七実施形 態に比べて ICチップ保護効果が大きくなる。 In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the lower resin core layer 14 can prevent the antenna coil from being broken. The protective layer 16 and the protective plate 16b increase the IC chip protection effect compared to the seventeenth embodiment.
〔第十九実施形態〕 図 22は、本発明の ICタグの第十九実施形態の概略構成を示す断面図である。この ICタグ 191は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 ICチ ップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4との間 には空洞部 6が設けられるとともに、突出部 5の内側面には絶縁基板 7上に塗工した 接着剤部 13cを介して第一保護層 16が沿設されている。また、第一突出部 5と対称 をなすように絶縁基板 7を挟んで第一突出部 5とは反対側の被覆層 3を突出させて第 二突出部 5aが形成され、第二突出部 5aと絶縁基板 7との間には空洞部 6aが設けら れるとともに、第二突出部 5aの内側面には接着剤層 13aを介して第二保護層 16aが 沿設され、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7と同一平面寸法 の下部榭脂芯体層 14が貼着されて 、る。 [Nineteenth embodiment] FIG. 22 is a cross-sectional view showing a schematic configuration of the nineteenth embodiment of the IC tag of the present invention. In this IC tag 191, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A hollow portion 6 is provided between the first protective layer 16 and the inner surface of the protruding portion 5 along the adhesive portion 13c coated on the insulating substrate 7. Further, the second projecting portion 5a is formed by projecting the coating layer 3 opposite to the first projecting portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetric with the first projecting portion 5. A cavity 6a is provided between the insulating substrate 7 and the insulating substrate 7, and a second protective layer 16a is provided along the inner surface of the second protruding portion 5a via an adhesive layer 13a. A lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is attached via an adhesive layer 13a.
本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部 の破断が抑えられるという効果に加えて、下部榭脂芯体層 14によりアンテナコイルの 破損が抑えられるという効果が期待でき、第一保護層 16と第二保護層 16aにより第 十七実施形態に比べて ICチップ保護効果が大きくなる。  In the present embodiment, in addition to the effect that the cavity 6 can suppress the breakage of the joint between the IC chip 4 and the antenna coil 8, the lower resin core layer 14 is expected to suppress the damage of the antenna coil. In addition, the first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the seventeenth embodiment.
〔第二十実施形態〕 [20th embodiment]
図 23は、本発明の ICタグの第二十実施形態の概略構成を示す断面図である。この ICタグ 201は、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7の一部を覆 うように下部榭脂芯体層 14が貼着されて ヽる点が、第十七実施形態とは異なる。 〔第二十一実施形態〕  FIG. 23 is a cross-sectional view showing a schematic configuration of the twentieth embodiment of the IC tag of the present invention. The IC tag 201 is characterized in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. Different from the seventh embodiment. [21st embodiment]
図 24は、本発明の ICタグの第二十一実施形態の概略構成を示す断面図である。 この ICタグ 211は、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7の一部 を覆うように下部榭脂芯体層 14が貼着されて ヽる点が、第十八実施形態とは異なる  FIG. 24 is a cross-sectional view showing a schematic configuration of the twenty-first embodiment of the IC tag of the present invention. The IC tag 211 has an eighteenth point that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. Different from the embodiment
〔第二十二実施形態〕 [22nd embodiment]
図 25は、本発明の ICタグの第二十二実施形態の概略構成を示す断面図である。 この ICタグ 221は、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7の一部 を覆うように下部榭脂芯体層 14が貼着されて ヽる点が、第十九実施形態と異なる。 〔第二十三実施形態〕 図 26は、本発明の ICタグの第二十三実施形態の概略構成を示す断面図である。 この ICタグ 231は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 I Cチップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4と の間には空洞部 6が設けられるとともに、絶縁基板 7の上面と下面にはそれぞれ接着 剤層 13bと 13aが塗工され、突出部 5の内側面には接着剤層 13bを介して保護層 16 が沿設され、絶縁基板 7の上面には接着剤層 13bを介して絶縁基板 7と同一平面寸 法の上部榭脂芯体層 15が貼着され、絶縁基板 7の下面には接着剤層 13aを介して 絶縁基板 7と同一平面寸法の下部榭脂芯体層 14が貼着されている。 FIG. 25 is a cross-sectional view showing a schematic configuration of a twenty-second embodiment of the IC tag of the present invention. The IC tag 221 has a nineteenth feature in that the lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 so as to cover a part of the insulating substrate 7 via the adhesive layer 13a. Different from the embodiment. [23rd embodiment] FIG. 26 is a sectional view showing a schematic configuration of the twenty-third embodiment of the IC tag of the present invention. In this IC tag 231, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the protruding layer 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4. A cavity 6 is provided between them, adhesive layers 13b and 13a are coated on the upper and lower surfaces of the insulating substrate 7, respectively, and a protective layer 16 is provided on the inner surface of the protrusion 5 via the adhesive layer 13b. The upper resin core layer 15 having the same plane dimensions as that of the insulating substrate 7 is adhered to the upper surface of the insulating substrate 7 through the adhesive layer 13b, and the adhesive layer is disposed on the lower surface of the insulating substrate 7. A lower resin core layer 14 having the same plane dimensions as that of the insulating substrate 7 is attached via 13a.
[0055] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、上部榭脂芯体層 15と下部榭脂芯体層 14に よりアンテナコイルの破損がほぼ完全に抑えられるという効果が期待でき、保護層 16 による ICチップ保護効果が期待できる。  In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion of the IC chip 4 and the antenna coil 8 from being broken, the upper resin core layer 15 and the lower resin core layer 14 In addition, the effect that the damage of the antenna coil can be almost completely suppressed can be expected, and the protective effect of the IC chip by the protective layer 16 can be expected.
〔第二十四実施形態〕  [24th embodiment]
図 27は、本発明の ICタグの第二十四実施形態の概略構成を示す断面図である。 この ICタグ 241は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 I Cチップ 4近傍の被覆層 3を突出させて突出部 5が形成され、突出部 5と ICチップ 4と の間には空洞部 6が設けられるとともに、絶縁基板 7の上面と下面にはそれぞれ接着 剤層 13bと 13aが塗工され、突出部 5の内側面には接着剤層 13bを介して保護層 16 が沿設され、絶縁基板 7の上面には接着剤層 13bを介して絶縁基板 7と同一平面寸 法の上部榭脂芯体層 15が貼着されている。また、 ICチップ 4が実装された側とは反 対側の絶縁基板 7上の ICチップ 4直下に相当する位置に接着剤層 13aを介して保護 板 16bが貼着され、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7と同一 平面寸法の下部榭脂芯体層 14が貼着されて 、る。  FIG. 27 is a cross-sectional view showing a schematic configuration of the twenty-fourth embodiment of the IC tag of the present invention. In this IC tag 241, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, the protruding portion 5 is formed by protruding the covering layer 3 in the vicinity of the IC chip 4, and the protruding portion 5 and the IC chip 4 A cavity 6 is provided between them, adhesive layers 13b and 13a are coated on the upper and lower surfaces of the insulating substrate 7, respectively, and a protective layer 16 is provided on the inner surface of the protrusion 5 via the adhesive layer 13b. The upper resin core layer 15 having the same plane dimension as that of the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via the adhesive layer 13b. In addition, a protective plate 16b is attached via an adhesive layer 13a to a position corresponding to the IC chip 4 directly below the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted. The lower resin core layer 14 having the same plane dimension as that of the insulating substrate 7 is adhered to the insulating layer 7 through the adhesive layer 13a.
[0056] 本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、上部榭脂芯体層 15と下部榭脂芯体層 14に よりアンテナコイルの破損がほぼ完全に抑えられるという効果が期待でき、保護層 16 と保護板 16bにより第二十三実施形態に比べて ICチップ保護効果が大きくなる。 〔第二十五実施形態〕 図 28は、本発明の ICタグの第二十五実施形態の概略構成を示す断面図である。 この ICタグ 251は、 ICモジュール 2が熱可塑性エラストマ一の被覆層 3で被覆され、 I Cチップ 4近傍の被覆層 3を突出させて第一突出部 5が形成され、第一突出部 5と IC チップ 4との間には空洞部 6が設けられるとともに、絶縁基板 7の上面と下面にはそれ ぞれ接着剤層 13bと 13aが塗工され、第一突出部 5の内側面には接着剤層 13bを介 して第一保護層 16が沿設され、絶縁基板 7の上面には接着剤層 13bを介して絶縁 基板 7と同一平面寸法の上部榭脂芯体層 15が貼着されている。また、第一突出部 5 と対称をなすように絶縁基板 7を挟んで第一突出部 5とは反対側の被覆層 3を突出さ せて第二突出部 5aが形成され、第二突出部 5aと絶縁基板 7との間には空洞部 6aが 設けられるとともに、第二突出部 5aの内側面には接着剤層 13aを介して第二保護層 16aが沿設され、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7と同一平 面寸法の下部榭脂芯体層 14が貼着されて ヽる。 In the present embodiment, in addition to the effect that the cavity portion 6 can prevent the joint portion between the IC chip 4 and the antenna coil 8 from being broken, the upper resin core layer 15 and the lower resin core layer 14 Further, the effect that the damage of the antenna coil can be almost completely suppressed can be expected, and the protective effect of the IC chip is enhanced by the protective layer 16 and the protective plate 16b as compared with the twenty-third embodiment. [25th embodiment] FIG. 28 is a cross-sectional view showing a schematic configuration of the twenty-fifth embodiment of the IC tag of the present invention. In this IC tag 251, the IC module 2 is covered with the coating layer 3 of the thermoplastic elastomer, and the coating layer 3 in the vicinity of the IC chip 4 is projected to form the first projection 5, and the first projection 5 and the IC A cavity 6 is provided between the chip 4, adhesive layers 13 b and 13 a are applied to the upper and lower surfaces of the insulating substrate 7, and an adhesive is applied to the inner surface of the first protrusion 5. The first protective layer 16 is provided along the layer 13b, and the upper resin core layer 15 having the same plane dimensions as the insulating substrate 7 is attached to the upper surface of the insulating substrate 7 via the adhesive layer 13b. Yes. Further, the second protruding portion 5a is formed by protruding the coating layer 3 on the opposite side of the first protruding portion 5 with the insulating substrate 7 interposed therebetween so as to be symmetric with the first protruding portion 5. A cavity 6a is provided between 5a and the insulating substrate 7, and a second protective layer 16a is provided along the inner surface of the second protruding portion 5a via an adhesive layer 13a. The lower resin core layer 14 having the same plane dimensions as the insulating substrate 7 is adhered to the insulating layer 7 through the adhesive layer 13a.
本実施形態においては、空洞部 6によって ICチップ 4とアンテナコイル 8の接合部の 破断が抑えられるという効果に加えて、上部榭脂芯体層 15と下部榭脂芯体層 14に よりアンテナコイルの破損がほぼ完全に抑えられるという効果が期待でき、第一保護 層 16と第二保護層 16aにより第二十三実施形態に比べて ICチップ保護効果が大き くなる。  In the present embodiment, in addition to the effect that the cavity 6 can prevent the joint portion of the IC chip 4 and the antenna coil 8 from being broken, the antenna coil is formed by the upper resin core layer 15 and the lower resin core layer 14. The first protective layer 16 and the second protective layer 16a increase the IC chip protection effect compared to the twenty-third embodiment.
〔第二十六実施形態〕  [26th embodiment]
図 29は、本発明の ICタグの第二十六実施形態の概略構成を示す断面図である。 この ICタグ 261は、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7の一部 を覆うように下部榭脂芯体層 14が貼着され、絶縁基板 7の上面には接着剤層 13bを 介して絶縁基板 7の一部を覆うように上部榭脂芯体層 15が貼着されて 、る点が第二 十三実施形態とは異なる。  FIG. 29 is a cross-sectional view showing a schematic configuration of the twenty-sixth embodiment of the IC tag of the present invention. This IC tag 261 has a lower resin core layer 14 attached to the lower surface of the insulating substrate 7 via an adhesive layer 13a so as to cover a part of the insulating substrate 7, and adhered to the upper surface of the insulating substrate 7. The upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and is different from the twenty-third embodiment.
〔第二十七実施形態〕 [27th embodiment]
図 30は、本発明の ICタグの第二十七実施形態の概略構成を示す断面図である。 この ICタグ 271は、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7の一部 を覆うように下部榭脂芯体層 14が貼着され、絶縁基板 7の上面には接着剤層 13bを 介して絶縁基板 7の一部を覆うように上部榭脂芯体層 15が貼着されて 、る点が第二 十四実施形態とは異なる。 FIG. 30 is a cross-sectional view showing a schematic configuration of the twenty-seventh embodiment of the IC tag of the present invention. In this IC tag 271, a lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13 a so as to cover a part of the insulating substrate 7, and is adhered to the upper surface of the insulating substrate 7. The upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and the second point is This is different from the fourteenth embodiment.
〔第二十八実施形態〕  [28th embodiment]
図 31は、本発明の ICタグの第二十八実施形態の概略構成を示す断面図である。 この ICタグ 281は、絶縁基板 7の下面には接着剤層 13aを介して絶縁基板 7の一部 を覆うように下部榭脂芯体層 14が貼着され、絶縁基板 7の上面には接着剤層 13bを 介して絶縁基板 7の一部を覆うように上部榭脂芯体層 15が貼着されて 、る点が第二 十五実施形態とは異なる。  FIG. 31 is a cross-sectional view showing a schematic configuration of the twenty-eighth embodiment of the IC tag of the present invention. In this IC tag 281, a lower resin core layer 14 is attached to the lower surface of the insulating substrate 7 via an adhesive layer 13 a so as to cover a part of the insulating substrate 7, and the IC tag 281 is bonded to the upper surface of the insulating substrate 7. The upper resin core layer 15 is attached so as to cover a part of the insulating substrate 7 through the agent layer 13b, and is different from the twenty-fifth embodiment.
実施例  Example
[0058] 以下に、本発明の実施例を説明する。本発明は下記実施例の具体的な数値に限 定されるものではなぐ本発明の技術的範囲を逸脱しない範囲において、適宜変更 と修正が可能である。  [0058] Examples of the present invention will be described below. The present invention is not limited to the specific numerical values of the following examples, and various changes and modifications can be made without departing from the technical scope of the present invention.
(1) ICモジュールの製造  (1) Manufacture of IC modules
厚み 50 μ mのポリエチレンテレフタレートフィルム上に接着剤を介して厚さ 25 μ m のアルミニウム箔を貼り付けた。次に、レジスト材にアンテナパターンを形成し、このレ ジスト材を上記アルミニウム箔上に載置してエッチング処理によってアルミニウムのァ ンテナパターン (アンテナコイル)を形成した。そして、図 4に示すように、このアンテナ ノ ターン (アンテナコイル) 8にフリップチップ用接着性有機導電膜 12を介して ICチッ プ 4 (0. 4mm X O. 4mm X O. 15mm)を積層し、約 170°Cに加熱して図 2に示すような ICモジュール 2を作製した。  An aluminum foil having a thickness of 25 μm was attached to a polyethylene terephthalate film having a thickness of 50 μm via an adhesive. Next, an antenna pattern was formed on the resist material, and the resist material was placed on the aluminum foil, and an aluminum antenna pattern (antenna coil) was formed by etching. Then, as shown in FIG. 4, an IC chip 4 (0.4 mm X O. 4 mm X O. 15 mm) is laminated on this antenna pattern (antenna coil) 8 via an adhesive organic conductive film 12 for flip chip. Then, it was heated to about 170 ° C. to produce an IC module 2 as shown in FIG.
[0059] なお、アンテナパターンの形成方法としては、導電性ペースト組成物を用いてスクリ ーン印刷により形成する方法やその他の公知の方法を採用することができる。 [0059] As a method of forming the antenna pattern, a method of forming by screen printing using a conductive paste composition and other known methods can be employed.
(2)熱可塑性エラストマ一力もなる被覆層の製造  (2) Manufacture of a coating layer that can be used as a thermoplastic elastomer
本実施例における被覆層は熱可塑性エラストマ一からなる下部被覆層と熱可塑性 エラストマ一力ゝらなる上部被覆層から構成されている。これら下部被覆層と上部被覆 層は、以下のようにして得た。  The coating layer in this embodiment is composed of a lower coating layer made of a thermoplastic elastomer and an upper coating layer made of a thermoplastic elastomer. These lower coating layer and upper coating layer were obtained as follows.
[0060] この熱可塑性エラストマ一材料はポリスチレンが 10重量0 /0、ポリブタジエンが 20重 量0 /0、ポリプロピレンが 5重量0 /0、エチレン プロピレン ジェン共重合体が 25重量 %、可塑剤（パラフィン油）が 40重量0 /0の配合比率である。エチレン—プロピレン— ジェン共重合体中のエチレンは 54重量0 /0、プロピレンは 43重量0 /0、ジシクロペンタ ジェンは 3重量％の配合比率である。このような配合比率のスチレン系とォレフィン系 の混合熱可塑性エラストマ一を、 80°Cに加熱しておいたバンバリ一ミキサー中で、 12 Orpmにおいて約 2分間混合した。この間に、バンバリ一ミキサー内の混合物の温度 は約 170°Cに上昇した。この温度において、さらに 2分間混合した後、上記可塑剤を 加え、この混合物を 3分間混合した。その結果、その混合物の温度は約 200°Cに上 昇した。次に、バンバリ一ミキサー内の混合物を取り出して、ローラにより厚さ 2mmの シート状に圧延した。そのシートを打ち抜き機（図示せず)で打ち抜いて、図 32 (a) (b )に示すような平面形状の下部被覆層 3aと上部被覆層 3bを得た。 [0060] The thermoplastic elastomer first material is polystyrene 10 weight 0/0, polybutadiene 20 by weight 0/0, polypropylene 5 weight 0/0, ethylene propylene diene copolymer 25 wt%, a plasticizer (paraffin oil) is the blending ratio of 40 wt 0/0. Ethylene-propylene- Ethylene diene copolymer is 54 weight 0/0, propylene 43 wt 0/0, dicyclopenta Jen is the ratio blend of 3% by weight. A styrene-based and olefin-based mixed thermoplastic elastomer having such a mixing ratio was mixed for about 2 minutes at 12 Orpm in a Banbury mixer heated to 80 ° C. During this time, the temperature of the mixture in the Banbury mixer increased to about 170 ° C. At this temperature, after another 2 minutes of mixing, the plasticizer was added and the mixture was mixed for 3 minutes. As a result, the temperature of the mixture rose to about 200 ° C. Next, the mixture in the Banbury mixer was taken out and rolled into a 2 mm thick sheet with a roller. The sheet was punched with a punching machine (not shown) to obtain a planar lower coating layer 3a and upper coating layer 3b as shown in FIGS. 32 (a) and 32 (b).
(3) ICタグの製造 (3) Manufacture of IC tags
〔第一実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the first embodiment]
図 33に示すように、ステンレス鋼製の下金型 D1の上に、図 32 (a)に示す下部被覆 層 3a上に上記のようにして得た 9個の ICモジュール 2を整列して配置したものを載置 し、その上に、図 32 (b)に示す上部被覆層 3bを載置し、さらに、その上に、ミラブル 型シリコーンゴム製の中間挿入型 Sl、ミラブル型シリコーンゴム製の中間挿入型 S 2、 ステンレス鋼製の中金型 D2、ステンレス鋼製の上金型 D3を順次重ねた。中間挿入 型 Sl、中間挿入型 S2、中金型 D2には、それぞれ 9個の貫通孔 hが形成されている 。なお、この各貫通孔 hの位置は整列した配置した ICモジュール 2の ICチップ 4の直 上に相当し、この貫通孔の作用により、後記するように突出部の形成が容易になる。 次に、下金型 D1と中金型 D2と上金型 D3を約 100〜120°Cに予熱し、さらに、下 金型 D 1と中金型 D2と上金型 D3を約 140°Cに加熱して、下金型 D 1に対して中金型 D2と上金型 D3を押圧して約 200kN/m2の圧力を中間挿入型 S1と中間挿入型 S2 を介して下部被覆層 3aと ICモジュール 2と上部被覆層 3bに加えることにより、図 34 に示すように、下部被覆層 3aと ICモジュール 2と上部被覆層 3bは密着し、貫通孔 h の周縁の上部被覆層 3bは盛り上がり、さらに、中間挿入型 S1と S2に設けた小孔（図 示せず)を経て貫通孔 h内の空気を吸引することにより（lOOkPaの真空源に接続し て）、この盛り上がり部分は***して、最終的に中金型 D2と上金型 D3の内壁面に沿 つて図 1に示すような突出部 5が形成され、 ICモジュール 2を間に挟まない部分の下 部被覆層 3aと上部被覆層 3bは熱融着して混然一体となり、金型を冷却して開放後、 所定の大きさ（縦 330mm X横 480mm)の ICタグに裁断することにより、図 1に示すよ うな断面を有する ICタグ 1を同時に多数得ることができた。なお、下金型 D1と中金型 D2と上金型 D3には、加熱用の電気ヒータが埋め込まれている。 As shown in Fig. 33, the nine IC modules 2 obtained as described above are arranged in alignment on the lower coating layer 3a shown in Fig. 32 (a) on the lower die D1 made of stainless steel. The upper covering layer 3b shown in FIG. 32 (b) is placed thereon, and further, an intermediate insertion type Sl made of millable type silicone rubber and a millable type silicone rubber made thereon. Intermediate insertion mold S2, stainless steel middle mold D2, and stainless steel upper mold D3 were stacked one after another. Nine through holes h are formed in each of the intermediate insertion type Sl, the intermediate insertion type S2, and the middle mold D2. Note that the position of each through hole h corresponds to the position directly above the IC chip 4 of the arranged IC module 2, and the action of the through hole facilitates the formation of the protrusion as will be described later. Next, the lower mold D1, the middle mold D2, and the upper mold D3 are preheated to about 100 to 120 ° C, and further, the lower mold D1, the middle mold D2, and the upper mold D3 are about 140 ° C. And press the middle mold D2 and the upper mold D3 against the lower mold D 1 to apply a pressure of about 200 kN / m 2 through the intermediate insertion mold S1 and the intermediate insertion mold S2 to form the lower coating layer 3a. When added to the IC module 2 and the upper coating layer 3b, the lower coating layer 3a, the IC module 2 and the upper coating layer 3b are in close contact with each other, and the upper coating layer 3b at the periphery of the through hole h is raised as shown in FIG. Furthermore, by sucking the air in the through hole h through a small hole (not shown) provided in the intermediate insertion type S1 and S2, this raised portion is raised. Finally, a protrusion 5 as shown in Fig. 1 is formed along the inner wall of the middle mold D2 and the upper mold D3, and below the part where the IC module 2 is not sandwiched. The upper cover layer 3a and the upper cover layer 3b are heat-fused and mixed together. After the mold is cooled and opened, it is cut into IC tags of a predetermined size (length 330mm x width 480mm). A number of IC tags 1 having a cross section as shown in Fig. 1 could be obtained simultaneously. Note that an electric heater for heating is embedded in the lower mold D1, the middle mold D2, and the upper mold D3.
[0062] 上記したような熱プレスにより ICタグを製造しょうとする場合、下部被覆層 3aと上部 被覆層 3bが厚 ヽと熱が回りにく ヽので、下部被覆層 3aと上部被覆層 3bのそれぞれ の厚みは 5mm以下であることが好まし!/、。  [0062] When an IC tag is to be manufactured by hot pressing as described above, the lower coating layer 3a and the upper coating layer 3b have a thickness and heat that hardly rotate. Each thickness should be 5mm or less!
[0063] 熱プレスによる加熱を施されても、一般に加熱時間は極めて短いので (約 1〜2秒） 、その熱により ICタグが損傷することはないが、加熱時間が長くなつたり、加熱温度が 高いと、 ICタグの一部または全部の機能が損なわれることがあるので、熱プレス時間 は長くても 5秒以内に収めるとともに、加熱温度は熱可塑性エラストマ一の溶融温度 を超えな！/、ように、軟化点以下の温度とすることが好ま ヽ。  [0063] Even when heated by a heat press, the heating time is generally very short (about 1 to 2 seconds), so the IC tag is not damaged by the heat, but the heating time is increased or the heating temperature is increased. If the temperature is high, the function of some or all of the IC tag may be impaired. Therefore, the heat pressing time should be kept within 5 seconds at the maximum, and the heating temperature should not exceed the melting temperature of the thermoplastic elastomer! /, It is preferable to set the temperature below the softening point.
[0064] 上記の熱プレス時の温度は、スチレン系、ォレフィン系、ウレタン系の熱可塑性エラ ストマーでは約 130〜150°Cとし、ポリエステル系、ポリアミド系の熱可塑性エラストマ 一では約 150〜170°Cとし、成形圧力は 100〜350kNZm2とするのが好ましい。 [0064] The temperature during the above hot pressing is about 130 to 150 ° C for styrene, olefin and urethane thermoplastic elastomers and about 150 to 170 ° for polyester and polyamide thermoplastic elastomers. C and the molding pressure is preferably 100 to 350 kNZm 2 .
[0065] また、シリコーンゴムは耐熱性と離型性に優れて 、るので、本実施例の中間挿入型 とし好ましく用いることができる。なお、シリコーンゴムと同程度の耐熱性と離型性を有 する材料であれば、他の材料を用いることができることは言うまでもな 、。  [0065] Further, since the silicone rubber is excellent in heat resistance and releasability, it can be preferably used as the intermediate insertion type of this example. Needless to say, other materials can be used as long as they have the same heat resistance and releasability as silicone rubber.
〔第二実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the second embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7の下面側に接着剤層 13a (耐熱粘着テープ)を介して絶縁基板 7と同 一平面寸法の下部榭脂芯体層 14 (ポリカーボネート)を貼着したものを用いた点を除 いて、同上方法により図 5に示すような断面を有する ICタグ 21を得た。  In the case of manufacturing the IC tag corresponding to the first embodiment, the IC module 2 is the same as the insulating substrate 7 via the adhesive layer 13a (heat-resistant adhesive tape) on the lower surface side of the insulating substrate 7 as the IC module 2. An IC tag 21 having a cross section as shown in FIG. 5 was obtained by the same method as above except that a flat resin-coated lower resin core layer 14 (polycarbonate) was used.
〔第三実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the third embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7上の ICチップ 4を除く部分に塗工した接着剤層 13b (耐熱粘着テープ )を介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15 (ポリカーボネート)を貼 着したものを用いた点を除いて、同上方法により図 6に示すような断面を有する ICタ グ 31を得た。 In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. IC board having a cross section as shown in FIG. 6 by the same method as above except that the upper resin core layer 15 (polycarbonate) having the same plane dimensions as the insulating substrate 7 is used. Got 31.
〔第四実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the fourth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7の上面側と下面側に、それぞれ絶縁基板 7と同一平面寸法の上部榭 脂芯体層 15 (ポリカーボネート）と下部榭脂芯体層 14 (ポリカーボネート)を貼着した ものを用いた点を除いて、同上方法により図 7に示すような断面を有する ICタグ 41を 得た。  In the case of manufacturing an IC tag corresponding to the first embodiment, the upper resin core body having the same plane dimensions as the insulating substrate 7 is respectively formed on the upper surface side and the lower surface side of the insulating substrate 7 as the IC module 2. An IC tag 41 having a cross section as shown in FIG. 7 was obtained by the same method as above except that a layer 15 (polycarbonate) and a lower resin core layer 14 (polycarbonate) were used.
〔第五実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the fifth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7の下面側に接着剤層 13a (耐熱粘着テープ)を介して絶縁基板 7の一 部を覆うように下部榭脂芯体層 14 (ポリカーボネート）を貼着したものを用いた点を除 いて、同上方法により図 8に示すような断面を有する ICタグ 51を得た。  In the case of manufacturing an IC tag corresponding to the first embodiment, as an IC module 2, a part of the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat resistant adhesive tape). An IC tag 51 having a cross section as shown in FIG. 8 was obtained by the same method as above except that a lower resin core layer 14 (polycarbonate) adhered so as to cover the surface was used.
〔第六実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the sixth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7の上面側に接着剤層 13b (耐熱粘着テープ)を介して絶縁基板 7の一 部を覆うように上部榭脂芯体層 15 (ポリカーボネート）を貼着したものを用いた点を除 いて、同上方法により図 9に示すような断面を有する ICタグ 61を得た。  In the case of manufacturing an IC tag corresponding to the first embodiment, as an IC module 2, a part of the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat resistant adhesive tape). An IC tag 61 having a cross section as shown in FIG. 9 was obtained by the same method as above except that the upper resin core layer 15 (polycarbonate) adhered so as to cover the surface was used.
〔第七実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the seventh embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7の上面側と下面側に、それぞれ絶縁基板 7の一部を覆うように上部榭 脂芯体層 15 (ポリカーボネート）と下部榭脂芯体層 14 (ポリカーボネート)を貼着した ものを用いた点を除いて、同上方法により図 10に示すような断面を有する ICタグ 71 を得た。  In the case of manufacturing the IC tag corresponding to the first embodiment, as the IC module 2, the upper resin is provided so as to cover a part of the insulating substrate 7 on the upper surface side and the lower surface side of the insulating substrate 7, respectively. An IC tag 71 having a cross section as shown in FIG. 10 was obtained by the same method as above except that the core layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) were used.
〔第八実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the eighth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、 ICチップ 4との間に僅かの距離をあけて ICチップ 4を囲むように塗工した接着剤 部 13c (耐熱粘着テープ)を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し たものを用いた点を除 、て、同上方法により図 11に示すような断面を有する ICタグ 8 1を得た。 In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. IC tag having a cross section as shown in FIG. 11 by the same method as above except that a protective layer 16 (epoxy resin containing glass fiber) is pasted through part 13c (heat-resistant adhesive tape) is used. 8 Got one.
〔第九実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the ninth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、 ICチップ 4との間に僅かの距離をあけて ICチップ 4を囲むように塗工した接着剤 部 13c (耐熱粘着テープ)を介して第一保護層 16 (ガラス繊維入りエポキシ榭脂)を 貼着し、さらに、第一保護層 16と対称をなすように、絶縁基板 7を挟んで反対側に接 着剤部 13d (耐熱粘着テープ)を介して第二保護層 16a (ガラス繊維入りエポキシ榭 脂)を貼着したものを用いた点が、第一実施形態に対応する製造例と異なる。  In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. First protective layer 16 (epoxy resin containing glass fiber) is pasted via part 13c (heat-resistant adhesive tape), and the opposite side across insulating substrate 7 so as to be symmetrical with first protective layer 16 The production example corresponding to the first embodiment is different in that a second protective layer 16a (epoxy resin containing glass fiber) is pasted on an adhesive part 13d (heat-resistant adhesive tape).
[0066] そして、図 35に示すように、ステンレス鋼製の下金型 D1の上にステンレス鋼製の中 金型 D2— 1を載置し、その上に、ミラブル型シリコーンゴム製の中間挿入型 S1を載 置し、さらに、その上に、下部被覆層 3aと上記構成の ICモジュール 2と上部被覆層 3 bを順に載置し、さらに、その上に、ミラブル型シリコーンゴム製の中間挿入型 S2、ス テンレス鋼製の中金型 D2— 2、ステンレス鋼製の上金型 D3を順次重ねた。中間挿 入型 Sl、中間挿入型 S2、中金型 D2— 1、中金型 D2— 2には、それぞれ 9個の貫通 孔 hが形成されている。なお、この各貫通孔 hの位置は整列した配置した ICモジユー ル 2の ICチップ 4の直上または直下に相当し、この貫通孔の作用により、後記するよう に突出部の形成が容易になる。  [0066] Then, as shown in FIG. 35, a stainless steel middle mold D2-1 is placed on a stainless steel lower mold D1, and an intermediate insert made of millable silicone rubber is placed thereon. The mold S1 is placed, and further, the lower covering layer 3a, the IC module 2 having the above-described configuration, and the upper covering layer 3b are placed in order thereon, and further, an intermediate insertion made of millable silicone rubber is placed thereon. The mold S2, the stainless steel middle mold D2-2, and the stainless steel upper mold D3 were stacked one after another. The intermediate insertion type Sl, the intermediate insertion type S2, the middle mold D2-1, and the middle mold D2-2 each have nine through holes h. Note that the position of each through hole h corresponds to directly above or directly below the IC chip 4 of the IC module 2 arranged in alignment, and the action of this through hole facilitates the formation of the protrusion as will be described later.
[0067] 次に、下金型 D1と中金型 D2— 1と中金型 D2— 2と上金型 D3を約 100〜120°Cに 予熱し、さらに、下金型 D1と中金型 D2— 1と中金型 D2— 2と上金型 D3を約 140°C に加熱して、下金型 D 1と中金型 D2— 1に対して中金型 D2— 2と上金型 D3を押圧し て約 200kNZm2の圧力を中間挿入型 S 1と中間挿入型 S2を介して下部被覆層 3aと ICモジュール 2と上部被覆層 3bに加えることにより、図 36に示すように、下部被覆層 3aと ICモジュール 2と上部被覆層 3bは密着し、貫通孔 hの周縁の上部被覆層 3bと下 部被覆層 3aは盛り上がり、さらに、中間挿入型 S1と S2に設けた小孔（図示せず)を 経て貫通孔 h内の空気を吸引することにより（lOOkPaの真空源に接続して）、この盛 り上がり部分は***して、最終的に中金型 D2— 1と下金型 D1および中金型 D2— 2 と上金型 D3の内壁面に沿って図 12に示すような第一突出部 5と第二突出部 5aが形 成され、 ICモジュール 2を間に挟まない部分の下部被覆層 3aと上部被覆層 3bは熱 融着して混然一体となり、金型を冷却して開放後、所定の大きさ（縦 330mm X横 480 mm)の ICタグに裁断することにより、図 12に示すような断面を有する ICタグ 91を同時 に多数得ることができた。なお、中金型 D2— 1と中金型 D2— 2には、加熱用の電気 ヒータが埋め込まれて 、る。 [0067] Next, the lower mold D1, the middle mold D2-1, the middle mold D2-2, and the upper mold D3 are preheated to about 100 to 120 ° C, and the lower mold D1 and the middle mold are further heated. D2-1—Middle mold D2-2—Upper mold D3 is heated to about 140 ° C to lower mold D1, middle mold D2-1—middle mold D2-2—upper mold By pressing D3 and applying a pressure of about 200 kNZm 2 to the lower coating layer 3a, IC module 2 and upper coating layer 3b through the intermediate insertion type S1 and intermediate insertion type S2, as shown in FIG. The covering layer 3a, the IC module 2, and the upper covering layer 3b are in close contact with each other, and the upper covering layer 3b and the lower covering layer 3a at the periphery of the through-hole h are raised, and furthermore, the small holes (see FIG. By suctioning the air in the through-hole h through (not shown) (connected to a vacuum source of lOOkPa), this raised part is raised and finally the middle mold D2-1 and the lower mold Inner wall of D1 and middle mold D2-2— and upper mold D3 A first projecting portion 5 as shown in FIG. 12 along the second projecting portion 5a is made form undercoat layer 3a and the top coat layer 3b of portion not sandwiched between the IC module 2 heat IC tag with a cross-section as shown in Fig. 12 by fusing and becoming united, cooling the mold and opening it, then cutting it into IC tags of a predetermined size (length 330mm x width 480mm) I was able to get a lot of 91 at the same time. Note that an electric heater for heating is embedded in the middle mold D2-1 and middle mold D2-2.
〔第十実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the tenth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、 ICチップ 4との間に僅かの距離をあけて ICチップ 4を囲むように塗工した接着剤 部 13c (耐熱粘着テープ)を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し 、さらに、 ICチップ 4が実装された側とは反対側の絶縁基板 7上の ICチップ 4直下に 相当する位置に接着剤層 13e (耐熱粘着テープ)を介して保護板 16b (ガラス繊維入 りエポキシ榭脂）を貼着したものを用いた点を除いて、同上方法により図 13に示すよ うな断面を有する ICタグ 101を得た。  In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. Protective layer 16 (epoxy resin containing glass fiber) is pasted via part 13c (heat-resistant adhesive tape), and further, directly below IC chip 4 on insulating substrate 7 on the side opposite to the side where IC chip 4 is mounted Fig. 13 shows the same method as above except that a protective plate 16b (epoxy resin containing glass fiber) is pasted through an adhesive layer 13e (heat-resistant adhesive tape) at a position corresponding to An IC tag 101 having such a cross section was obtained.
〔第十一実施形態に対応する ICタグの製造〕 [Manufacturing of an IC tag corresponding to the eleventh embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7上の ICチップ 4を除く部分に塗工した接着剤層 13b (耐熱粘着テープ )を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し、さらに、接着剤層 13b ( 耐熱粘着テープ)を介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15 (ポリ力 ーボネート)を貼着したものを用いた点を除いて、同上方法により図 14に示すような 断面を有する ICタグ 111を得た。  In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. Then, the protective layer 16 (epoxy resin containing glass fiber) is attached, and the upper resin core layer 15 (poly force) having the same plane dimensions as the insulating substrate 7 is provided via the adhesive layer 13b (heat-resistant adhesive tape). The IC tag 111 having a cross section as shown in FIG. 14 was obtained by the same method as above except that a paste having a carbonate) was used.
〔第十二実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the twelfth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7上の ICチップ 4を除く部分に塗工した接着剤層 13b (耐熱粘着テープ )を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し、 ICチップ 4が実装され た側とは反対側の絶縁基板 7上の ICチップ 4直下に相当する位置に接着剤層 13e ( 耐熱粘着テープ)を介して保護板 16b (ガラス繊維入りエポキシ榭脂)を貼着し、さら に、接着剤層 13b (耐熱粘着テープ)を介して絶縁基板 7と同一平面寸法の上部榭 脂芯体層 15 (ポリカーボネート)を貼着したものを用いた点を除いて、同上方法により 図 15に示すような断面を有する ICタグ 121を得た。 〔第十三実施形態に対応する ICタグの製造〕 In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. Then, a protective layer 16 (epoxy resin containing glass fiber) is attached, and an adhesive layer 13e (on the insulating substrate 7 on the side opposite to the side on which the IC chip 4 is mounted is located at a position corresponding to directly under the IC chip 4. Adhere protective plate 16b (epoxy resin with glass fiber) via heat-resistant adhesive tape), and upper resin core with the same plane dimensions as insulating substrate 7 via adhesive layer 13b (heat-resistant adhesive tape) An IC tag 121 having a cross section as shown in FIG. 15 was obtained by the same method as above except that the body layer 15 (polycarbonate) adhered was used. [Manufacture of IC tags corresponding to the thirteenth embodiment]
上記第九実施形態に対応する ICタグの製造の場合において、 ICモジュール 2とし て、絶縁基板 7上の ICチップ 4を除く部分に塗工した接着剤層 13b (耐熱粘着テープ )を介して第一保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し、第一保護層 16と 対称をなすように、絶縁基板 7を挟んで反対側に接着剤部 13d (耐熱粘着テープ)を 介して第二保護層 16a (ガラス繊維入りエポキシ榭脂)を貼着し、さらに、接着剤層 13 b (耐熱粘着テープ)を介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15 (ポリ カーボネート)を貼着したものを用いた点を除いて、同上方法により図 16に示すよう な断面を有する ICタグ 131を得た。  In the case of manufacturing an IC tag corresponding to the ninth embodiment, as the IC module 2, a first adhesive layer 13 b (heat-resistant adhesive tape) applied to the portion excluding the IC chip 4 on the insulating substrate 7 is used. Adhere one protective layer 16 (epoxy resin containing glass fiber), and sandwich the insulating substrate 7 so that it is symmetrical with the first protective layer 16, with the adhesive part 13d (heat-resistant adhesive tape) on the opposite side A second protective layer 16a (epoxy resin containing glass fiber) is adhered, and an upper resin core layer 15 (polyester) having the same plane dimensions as the insulating substrate 7 is bonded via an adhesive layer 13b (heat-resistant adhesive tape). An IC tag 131 having a cross section as shown in FIG. 16 was obtained by the same method as above except that the one with carbonate) was used.
〔第十四実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the fourteenth embodiment]
上記第 ^—実施形態に対応する ICタグの製造の場合にお 、て、 ICモジュール 2と して、絶縁基板 7の上面側に接着剤層 13b (耐熱粘着テープ)を介して絶縁基板 7の 一部を覆うように上部榭脂芯体層 15 (ポリカーボネート）を貼着したものを用いた点を 除いて、同上方法により図 17に示すような断面を有する ICタグ 141を得た。  In the case of the manufacture of the IC tag corresponding to the above-mentioned ^-embodiment, the IC module 2 is formed on the insulating substrate 7 via the adhesive layer 13b (heat-resistant adhesive tape) on the upper surface side of the insulating substrate 7. An IC tag 141 having a cross section as shown in FIG. 17 was obtained by the same method as above except that the upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.
〔第十五実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the fifteenth embodiment]
上記第十二実施形態に対応する ICタグの製造の場合にお 、て、 ICモジュール 2と して、絶縁基板 7の上面側に接着剤層 13b (耐熱粘着テープ)を介して絶縁基板 7の 一部を覆うように上部榭脂芯体層 15 (ポリカーボネート）を貼着したものを用いた点を 除いて、同上方法により図 18に示すような断面を有する ICタグ 151を得た。  In the case of manufacturing an IC tag corresponding to the above twelfth embodiment, as the IC module 2, the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat-resistant adhesive tape). An IC tag 151 having a cross section as shown in FIG. 18 was obtained by the same method as above except that an upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.
〔第十六実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the sixteenth embodiment]
上記第十三実施形態に対応する ICタグの製造の場合にお 、て、 ICモジュール 2と して、絶縁基板 7の上面側に接着剤層 13b (耐熱粘着テープ)を介して絶縁基板 7の 一部を覆うように上部榭脂芯体層 15 (ポリカーボネート）を貼着したものを用いた点を 除いて、同上方法により図 19に示すような断面を有する ICタグ 161を得た。  In the case of manufacturing an IC tag corresponding to the thirteenth embodiment, as the IC module 2, the insulating substrate 7 is provided on the upper surface side of the insulating substrate 7 via an adhesive layer 13b (heat-resistant adhesive tape). An IC tag 161 having a cross section as shown in FIG. 19 was obtained by the same method as above except that an upper resin core layer 15 (polycarbonate) adhered so as to cover a part was used.
〔第十七実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the seventeenth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、 ICチップ 4との間に僅かの距離をあけて ICチップ 4を囲むように塗工した接着剤 部 13c (耐熱粘着テープ)を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し 、絶縁基板 7の下面側に塗工した接着剤層 13aを介して絶縁基板 7と同一平面寸法 の下部榭脂芯体層 14 (ポリカーボネート)を貼着したものを用いた点を除いて、同上 方法により図 20に示すような断面を有する ICタグ 171を得た。 In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. Adhere protective layer 16 (epoxy resin with glass fiber) through part 13c (heat-resistant adhesive tape). The same as above except that a lower resin core layer 14 (polycarbonate) having the same plane dimensions as that of the insulating substrate 7 is attached via the adhesive layer 13a applied to the lower surface side of the insulating substrate 7. By the method, an IC tag 171 having a cross section as shown in FIG. 20 was obtained.
〔第十八実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the eighteenth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、 ICチップ 4との間に僅かの距離をあけて ICチップ 4を囲むように塗工した接着剤 部 13c (耐熱粘着テープ)を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し 、絶縁基板 7の下面側に接着剤層 13aを塗工し、 ICチップ 4が実装された側とは反対 側の絶縁基板 7上の ICチップ 4直下に相当する位置の接着剤層 13a (耐熱粘着テー プ)を介して保護板 16b (ガラス繊維入りエポキシ榭脂)を貼着し、さらに、接着剤層 1 3a (耐熱粘着テープ)を介して絶縁基板 7と同一平面寸法の下部榭脂芯体層 14 (ポ リカーボネート）を貼着したものを用いた点を除いて、同上方法により図 21に示すよう な断面を有する ICタグ 181を得た。  In the case of manufacturing an IC tag corresponding to the first embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. The protective layer 16 (epoxy resin containing glass fiber) is pasted through the part 13c (heat-resistant adhesive tape), the adhesive layer 13a is applied to the lower surface side of the insulating substrate 7, and the side on which the IC chip 4 is mounted A protective plate 16b (epoxy resin containing glass fiber) is attached via an adhesive layer 13a (heat-resistant adhesive tape) at a position corresponding to the IC chip 4 on the insulating substrate 7 on the opposite side, and further, The method is the same as above except that an adhesive layer 1 3a (heat-resistant adhesive tape) is used and a lower resin core layer 14 (polycarbonate) with the same plane dimensions as the insulating substrate 7 is used. An IC tag 181 having a cross section as shown in 21 was obtained.
〔第十九実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the nineteenth embodiment]
上記第九実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、 ICチップ 4との間に僅かの距離をあけて ICチップ 4を囲むように塗工した接着剤 部 13c (耐熱粘着テープ)を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し 、絶縁基板 7の下面側に ICチップ 4直下に相当する部分を除!、て接着剤層 13a (耐 熱粘着テープ)を塗工し、第一保護層 16と対称をなすように、絶縁基板 7を挟んで反 対側の接着剤層 13a (耐熱粘着テープ)を介して第二保護層 16a (ガラス繊維入りェ ポキシ榭脂)を貼着し、さらに、接着剤層 13a (耐熱粘着テープ)を介して絶縁基板 7 と同一平面寸法の下部榭脂芯体層 14 (ポリカーボネート)を貼着したものを用いた点 を除いて、同上方法により図 22に示すような断面を有する ICタグ 191を得た。  In the case of manufacturing an IC tag corresponding to the ninth embodiment, the adhesive applied to surround the IC chip 4 with a slight distance between the IC chip 4 and the IC module 2. Adhering the protective layer 16 (epoxy resin containing glass fiber) via the part 13c (heat-resistant adhesive tape), excluding the part corresponding to the IC chip 4 directly below the insulating substrate 7! (Heat-resistant adhesive tape) is applied, and the second protective layer 16a is placed via the adhesive layer 13a (heat-resistant adhesive tape) on the opposite side across the insulating substrate 7 so as to be symmetrical with the first protective layer 16. (Epoxy resin containing glass fiber) was adhered, and further, a lower resin core layer 14 (polycarbonate) having the same plane dimensions as the insulating substrate 7 was adhered via an adhesive layer 13a (heat resistant adhesive tape). An IC tag 191 having a cross section as shown in FIG. 22 was obtained by the same method as described above except that the product was used.
〔第二十実施形態に対応する ICタグの製造〕 [Manufacturing of IC tag corresponding to 20th embodiment]
上記第十七実施形態に対応する ICタグの製造の場合にお 、て、 ICモジュール 2と して、絶縁基板 7の下面側に接着剤層 13a (耐熱粘着テープ)を介して絶縁基板 7の 一部を覆うように下部榭脂芯体層 14 (ポリカーボネート）を貼着したものを用いた点を 除いて、同上方法により図 23に示すような断面を有する ICタグ 201を得た。 〔第二十一実施形態に対応する ICタグの製造〕 In the case of manufacturing an IC tag corresponding to the above seventeenth embodiment, as the IC module 2, the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat resistant adhesive tape). An IC tag 201 having a cross-section as shown in FIG. 23 was obtained by the same method as above except that a part having a lower resin core layer 14 (polycarbonate) attached so as to cover a part was used. [Manufacture of IC tags corresponding to the 21st embodiment]
上記第十八実施形態に対応する ICタグの製造の場合にお 、て、 ICモジュール 2と して、絶縁基板 7の下面側に接着剤層 13a (耐熱粘着テープ)を介して絶縁基板 7の 一部を覆うように下部榭脂芯体層 14 (ポリカーボネート）を貼着したものを用いた点を 除いて、同上方法により図 24に示すような断面を有する ICタグ 211を得た。  In the case of manufacturing an IC tag corresponding to the eighteenth embodiment, as the IC module 2, the insulating substrate 7 is provided on the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat-resistant adhesive tape). An IC tag 211 having a cross section as shown in FIG. 24 was obtained by the same method as above except that a part having a lower resin core layer 14 (polycarbonate) attached so as to cover a part was used.
〔第二十二実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the twenty-second embodiment]
上記第十九実施形態に対応する ICタグの製造の場合において、 ICモジュール 2と して、絶縁基板 7の下面側に接着剤層 13a (耐熱粘着テープ)を介して絶縁基板 7の 一部を覆うように下部榭脂芯体層 14 (ポリカーボネート）を貼着したものを用いた点を 除いて、同上方法により図 25に示すような断面を有する ICタグ 221を得た。  In the case of manufacturing an IC tag corresponding to the nineteenth embodiment, as the IC module 2, a part of the insulating substrate 7 is attached to the lower surface side of the insulating substrate 7 via an adhesive layer 13a (heat-resistant adhesive tape). An IC tag 221 having a cross section as shown in FIG. 25 was obtained by the same method as above except that a lower resin core layer 14 (polycarbonate) pasted so as to be covered was used.
〔第二十三実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the 23rd embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7上の ICチップ 4を除く部分に塗工した接着剤層 13b (耐熱粘着テープ )を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し、さらに、接着剤層 13b ( 耐熱粘着テープ)を介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15 (ポリ力 ーボネート)を貼着し、絶縁基板 7の下面側に塗工した接着剤層 13aを介して絶縁基 板 7と同一平面寸法の下部榭脂芯体層 14 (ポリカーボネート)を貼着したものを用い た点を除いて、同上方法により図 26に示すような断面を有する ICタグ 231を得た。 〔第二十四実施形態に対応する ICタグの製造〕  In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. Then, the protective layer 16 (epoxy resin containing glass fiber) is attached, and the upper resin core layer 15 (poly force) having the same plane dimensions as the insulating substrate 7 is provided via the adhesive layer 13b (heat-resistant adhesive tape). -Bonate) is used, and the lower resin core layer 14 (polycarbonate) with the same plane dimensions as the insulating substrate 7 is attached via the adhesive layer 13a applied to the lower surface of the insulating substrate 7. Except for the above, an IC tag 231 having a cross section as shown in FIG. 26 was obtained by the same method as above. [Manufacture of IC tags corresponding to the twenty-fourth embodiment]
上記第一実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2とし て、絶縁基板 7上の ICチップ 4を除く部分に塗工した接着剤層 13b (耐熱粘着テープ )を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し、接着剤層 13b (耐熱粘 着テープ)を介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15 (ポリカーボネ ート）を貼着し、絶縁基板 7の下面側に接着剤層 13aを塗工し、 ICチップ 4が実装さ れた側とは反対側の絶縁基板 7上の ICチップ 4直下に相当する位置の接着剤層 13a (耐熱粘着テープ)を介して保護板 16b (ガラス繊維入りエポキシ榭脂)を貼着し、さら に、接着剤層 13a (耐熱粘着テープ)を介して絶縁基板 7と同一平面寸法の下部榭 脂芯体層 14 (ポリカーボネート)を貼着したものを用いた点を除 、て、同上方法により 図 27に示すような断面を有する ICタグ 241を得た。 In the case of manufacturing the IC tag corresponding to the first embodiment, the adhesive layer 13b (heat-resistant adhesive tape) applied to the part excluding the IC chip 4 on the insulating substrate 7 is used as the IC module 2. Then, the protective layer 16 (epoxy resin containing glass fiber) is attached, and the upper resin core layer 15 (polycarbonate) having the same plane dimensions as the insulating substrate 7 is provided via the adhesive layer 13b (heat-resistant adhesive tape). ), And adhesive layer 13a is applied to the lower surface of insulating substrate 7, and the position corresponding to the position immediately below IC chip 4 on insulating substrate 7 on the side opposite to the side where IC chip 4 is mounted A protective plate 16b (epoxy resin containing glass fiber) is pasted through the adhesive layer 13a (heat-resistant adhesive tape), and the same plane dimensions as the insulating substrate 7 through the adhesive layer 13a (heat-resistant adhesive tape) The same method as above, except that the lower resin core layer 14 (polycarbonate) attached was used. An IC tag 241 having a cross section as shown in FIG. 27 was obtained.
〔第二十五実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the 25th embodiment]
上記第九実施形態に対応する ICタグの製造の場合において、 ICモジュール 2とし て、絶縁基板 7上の ICチップ 4を除く部分に塗工した接着剤層 13b (耐熱粘着テープ )を介して保護層 16 (ガラス繊維入りエポキシ榭脂)を貼着し、接着剤層 13b (耐熱粘 着テープ)を介して絶縁基板 7と同一平面寸法の上部榭脂芯体層 15 (ポリカーボネ ート）を貼着し、絶縁基板 7の下面側に ICチップ 4直下に相当する部分を除いて接着 剤層 13aを塗工し、第一保護層 16と対称をなすように、絶縁基板 7を挟んで反対側 の接着剤層 13a (耐熱粘着テープ)を介して第二保護層 16a (ガラス繊維入りェポキ シ榭脂)を貼着し、さらに、接着剤層 13a (耐熱粘着テープ)を介して絶縁基板 7と同 一平面寸法の下部榭脂芯体層 14 (ポリカーボネート)を貼着したものを用いた点を除 いて、同上方法により図 28に示すような断面を有する ICタグ 251を得た。  In the case of manufacturing an IC tag corresponding to the ninth embodiment, the IC module 2 is protected via an adhesive layer 13b (heat-resistant adhesive tape) applied to a portion of the insulating substrate 7 excluding the IC chip 4. Adhere layer 16 (epoxy resin with glass fiber) and upper resin core layer 15 (polycarbonate) with the same plane dimensions as insulating substrate 7 via adhesive layer 13b (heat-resistant adhesive tape). Apply the adhesive layer 13a to the lower surface of the insulating substrate 7 except for the part directly under the IC chip 4, and the opposite side of the insulating substrate 7 so that it is symmetrical with the first protective layer 16. The second protective layer 16a (epoxy resin containing glass fiber) is pasted through the adhesive layer 13a (heat-resistant adhesive tape), and the insulating substrate 7 and the adhesive layer 13a (heat-resistant adhesive tape). Except for the fact that a lower resin core layer 14 (polycarbonate) with the same planar dimensions was used, the same It was obtained IC tag 251 having the cross section shown in FIG. 28 by the method.
〔第二十六実施形態に対応する ICタグの製造〕 [Manufacture of IC tags corresponding to the 26th embodiment]
上記第二十三実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2 として、絶縁基板 7の上面側と下面側に、それぞれ絶縁基板 7の一部を覆うように上 部榭脂芯体層 15 (ポリカーボネート）と下部榭脂芯体層 14 (ポリカーボネート)を貼着 したものを用いた点を除いて、同上方法により図 29に示すような断面を有する ICタグ 261を得た。  In the case of manufacturing an IC tag corresponding to the above-described twenty-third embodiment, the upper portion of the insulating substrate 7 is covered as the IC module 2 on the upper surface side and the lower surface side of the insulating substrate 7 respectively. An IC tag 261 having a cross section as shown in FIG. 29 is obtained by the same method as above except that the one having the resin core layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) attached is used. It was.
〔第二十七実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the 27th embodiment]
上記第二十四実施形態に対応する ICタグの製造の場合において、 ICモジュール 2 として、絶縁基板 7の上面側と下面側に、それぞれ絶縁基板 7の一部を覆うように上 部榭脂芯体層 15 (ポリカーボネート）と下部榭脂芯体層 14 (ポリカーボネート)を貼着 したものを用いた点を除いて、同上方法により図 30に示すような断面を有する ICタグ 271を得た。  In the case of manufacturing the IC tag corresponding to the twenty-fourth embodiment, as the IC module 2, the upper surface of the insulating substrate 7 is covered with the upper resin core so as to cover a part of the insulating substrate 7, respectively. An IC tag 271 having a cross section as shown in FIG. 30 was obtained by the same method as above except that the body layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) were used.
〔第二十八実施形態に対応する ICタグの製造〕  [Manufacture of IC tags corresponding to the 28th embodiment]
上記第二十五実施形態に対応する ICタグの製造の場合にぉ 、て、 ICモジュール 2 として、絶縁基板 7の上面側と下面側に、それぞれ絶縁基板 7の一部を覆うように上 部榭脂芯体層 15 (ポリカーボネート）と下部榭脂芯体層 14 (ポリカーボネート)を貼着 したものを用いた点を除 、て、同上方法により図 31に示すような断面を有する ICタグ 281を得た。 In the case of manufacturing an IC tag corresponding to the above twenty-fifth embodiment, the upper part of the insulating substrate 7 is covered as an IC module 2 on the upper surface side and the lower surface side of the insulating substrate 7 respectively. Adhesion of the resin core layer 15 (polycarbonate) and the lower resin core layer 14 (polycarbonate) An IC tag 281 having a cross section as shown in FIG. 31 was obtained by the same method as above except that the above was used.
産業上の利用可能性 Industrial applicability
本発明の ICタグは、ライフサイクル関連の用途としては、例えば、スーパーマーケッ トゃデパートなどでレシートに付着させてレジスターの精算管理タグとして、図書館の 書籍管理タグとして、宅配便管理用の耐衝撃性タグとして、航空手荷物管理用の耐 衝撃性タグとして、プリペイド方式管理用の可撓性タグとして、各種トレーサビリティの タグとして、回転寿司の皿に付着させた生産管理用タグとして、レンタル服のタリー- ング時の管理用タグとして、病院での医療器械管理用タグとして、薬局での薬品管理 用タグとして、介護支援の介護状況管理タグとして、家庭ゴミおよび産業廃棄物の収 集管理用タグとして、マラソンランナーの時間計測タグとして、美術館'博物館等の展 示物に付着する案内タグとして、特定地域内への入場者管理用に手首に取り付ける タグとして、過酷な環境や特殊な環境の環境管理用のタグとして、携帯電話 '個人用 携帯情報端末 ·冷蔵庫 ·デジタルカメラ ·光ディスク ·ユニバーサルシリアルバス ·調理 用家電製品等の一体 '連携'接続型 RFID (Radio Frequency Identification)タグとし て、また、セキュリティ関連の用途としては、例えば、個人認証用管理タグとして、社 員の入退室管理用タグとして、宝石'高級衣類等の真偽判別タグとして、万引き'偽 造防止タグとして、機器や構造物のメンテナンス記録用タグとして、駐車場の入退室 管理用タグとして、重要書類の管理用タグとして、学校や各種施設への入退室を管 理して不法侵入を防ぐ防犯管理用タグとして用いることができる。  The IC tag of the present invention can be used as a life cycle related application, for example, attached to a receipt at a supermarket department store or the like as a checkout management tag for a register, a book management tag for a library, or an impact resistance for courier management. As a tag for impact management for airline baggage management, as a flexible tag for prepaid management, as a tag for various traceability, as a production management tag attached to a rotating sushi plate, As a management tag at the time of nursing, as a tag for medical instrument management at a hospital, as a tag for drug management at a pharmacy, as a care status management tag for nursing support, as a collection management tag for household waste and industrial waste, Admission to a specific area as a time measurement tag for marathon runners, as a guide tag attached to exhibits at museums, etc. As a tag to be attached to the wrist for managers, as a tag for environmental management in harsh or special environments, mobile phones' personal personal digital assistants · refrigerators · digital cameras · optical discs · universal serial bus · home appliances for cooking, etc. Integrated RFID (Radio Frequency Identification) RFID tags, and security-related applications such as personal authentication management tags, employee entry / exit management tags, jewelry, luxury clothing, etc. As a tag for shoplifting 'anti-counterfeiting, as a tag for recording maintenance of equipment and structures, as a tag for parking and entering / leaving management, as a tag for managing important documents, and as a tag for managing important documents, It can be used as a security control tag that manages entry and exit and prevents illegal entry.

Claims

請求の範囲 The scope of the claims
[1] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れて 、ることを特徴とする ICタグ。  [1] An IC module in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. An IC tag, wherein a protruding portion is formed by protruding, and a hollow portion is provided between the protruding portion and the IC chip.
[2] 絶縁基板の下面には下部榭脂芯体層が取り付けられていることを特徴とする請求 項 1記載の ICタグ。  2. The IC tag according to claim 1, wherein a lower resin core layer is attached to the lower surface of the insulating substrate.
[3] 絶縁基板の上面には上部榭脂芯体層が取り付けられていることを特徴とする請求 項 1記載の ICタグ。  [3] The IC tag according to claim 1, wherein an upper resin core layer is attached to the upper surface of the insulating substrate.
[4] 絶縁基板の上面と下面には、それぞれ上部榭脂芯体層と下部榭脂芯体層が取り 付けられていることを特徴とする請求項 1記載の ICタグ。  [4] The IC tag according to claim 1, wherein an upper resin core layer and a lower resin core layer are attached to the upper surface and the lower surface of the insulating substrate, respectively.
[5] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れるとともに突出部の内側面に榭脂材料力もなる保護層が設けられていることを特徴 とする ICタグ。  [5] An IC module in which an electronic component having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and then a coating layer in the vicinity of the IC chip is formed. Protrusions are formed by projecting, and a cavity is provided between the projecting part and the IC chip, and a protective layer is also provided on the inner surface of the projecting part, which also has a grease material strength. IC tag.
[6] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて第一突出部を形成し、第一突出部と ICチップとの間には空洞部が設 けられるとともに第一突出部の内側面に榭脂材料力 なる保護層が設けられ、第一 突出部と対称をなすように絶縁基板を挟んで第一突出部とは反対側にある被覆層を 突出させて第二突出部を形成し、第二突出部と絶縁基板との間には空洞部が設けら れるとともに第二突出部の内側面に榭脂材料力もなる保護層が設けられていることを 特徴とする ICタグ。  [6] An IC module in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is covered with a coating layer made of a natural material. The first protrusion is formed to protrude, and a cavity is provided between the first protrusion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the first protrusion, (1) Form the second protrusion by projecting the coating layer on the opposite side of the first protrusion, sandwiching the insulating substrate so as to be symmetrical with the protrusion, and between the second protrusion and the insulating substrate An IC tag, characterized in that a hollow portion is provided and a protective layer having a resin material strength is provided on the inner surface of the second protruding portion.
[7] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れるとともに突出部の内側面に榭脂材料力 なる保護層が設けられ、 ICチップが実 装された側とは反対側の絶縁基板上の ICチップ直下に相当する位置に榭脂材料か らなる保護板が取り付けられていることを特徴とする ICタグ。 [7] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, so that the IC chip is actually implemented. An IC tag characterized in that a protective plate made of a resin material is attached at a position corresponding to an IC chip directly below an insulating substrate on the side opposite to the mounted side.
[8] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れるとともに突出部の内側面に榭脂材料力 なる保護層が設けられ、絶縁基板の上 面には上部榭脂芯体層が取り付けられていることを特徴とする ICタグ。 [8] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protrusion is formed, and a cavity is provided between the protrusion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protrusion, and the upper surface of the insulating substrate is provided. Is an IC tag characterized in that an upper resin core layer is attached.
[9] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れるとともに突出部の内側面に榭脂材料力 なる保護層が設けられ、 ICチップが実 装された側とは反対側の絶縁基板上の ICチップ直下に相当する位置に榭脂材料か らなる保護板が取り付けられ、絶縁基板の上面には上部榭脂芯体層が取り付けられ て 、ることを特徴とする ICタグ。 [9] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a natural material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, and the IC chip is mounted. A protective plate made of a resin material is installed at a position corresponding to the IC chip on the insulating substrate opposite to the opposite side, and an upper resin core layer is installed on the upper surface of the insulating substrate. IC tag characterized by
[10] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて第一突出部を形成し、第一突出部と ICチップとの間には空洞部が設 けられるとともに第一突出部の内側面に榭脂材料力 なる保護層が設けられ、第一 突出部と対称をなすように絶縁基板を挟んで第一突出部とは反対側にある被覆層を 突出させて第二突出部を形成し、第二突出部と絶縁基板との間には空洞部が設けら れるとともに第二突出部の内側面に榭脂材料力 なる保護層が設けられ、絶縁基板 の上面には上部榭脂芯体層が取り付けられていることを特徴とする ICタグ。 [10] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. The first protrusion is formed to protrude, and a cavity is provided between the first protrusion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the first protrusion, (1) Form the second protrusion by projecting the coating layer on the opposite side of the first protrusion, sandwiching the insulating substrate so as to be symmetrical with the protrusion, and between the second protrusion and the insulating substrate An IC tag characterized in that a cavity is provided, a protective layer made of a resin material force is provided on the inner surface of the second protrusion, and an upper resin core layer is attached to the upper surface of the insulating substrate. .
[11] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れるとともに突出部の内側面に榭脂材料力 なる保護層が設けられ、絶縁基板の下 面には下部榭脂芯体層が取り付けられていることを特徴とする ICタグ。 [11] An IC module in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, and the lower surface of the insulating substrate is provided. Is an IC tag characterized in that a lower resin core layer is attached.
[12] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れるとともに突出部の内側面に榭脂材料力 なる保護層が設けられ、 ICチップが実 装された側とは反対側の絶縁基板上の ICチップ直下に相当する位置に榭脂材料か らなる保護板が取り付けられ、絶縁基板の下面には下部榭脂芯体層が取り付けられ て 、ることを特徴とする ICタグ。 [12] IC module in which electronic components with IC chip and antenna coil are mounted on an insulating substrate An IC tag formed by coating one surface with a coating layer of a coasting material is formed by projecting the coating layer in the vicinity of the IC chip to form a projection, and a cavity is formed between the projection and the IC chip. In addition, a protective layer with a grease material strength is provided on the inner side surface of the protrusion, and the resin material is placed in a position corresponding to directly under the IC chip on the insulating substrate opposite to the side where the IC chip is mounted. An IC tag, wherein a protective plate is attached, and a lower resin core layer is attached to the lower surface of the insulating substrate.
[13] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて第一突出部を形成し、第一突出部と ICチップとの間には空洞部が設 けられるとともに第一突出部の内側面に榭脂材料力 なる保護層が設けられ、第一 突出部と対称をなすように絶縁基板を挟んで第一突出部とは反対側にある被覆層を 突出させて第二突出部を形成し、第二突出部と絶縁基板との間には空洞部が設けら れるとともに第二突出部の内側面に榭脂材料力 なる保護層が設けられ、絶縁基板 の下面には下部榭脂芯体層が取り付けられていることを特徴とする ICタグ。 [13] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is covered with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. The first protrusion is formed to protrude, and a cavity is provided between the first protrusion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the first protrusion, (1) Form the second protrusion by projecting the coating layer on the opposite side of the first protrusion, sandwiching the insulating substrate so as to be symmetrical with the protrusion, and between the second protrusion and the insulating substrate An IC tag characterized in that a cavity is provided, a protective layer having a resin material strength is provided on the inner surface of the second protrusion, and a lower resin core layer is attached to the lower surface of the insulating substrate. .
[14] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れるとともに突出部の内側面に榭脂材料力 なる保護層が設けられ、絶縁基板の上 面と下面には、それぞれ上部榭脂芯体層と下部榭脂芯体層が取り付けられているこ とを特徴とする ICタグ。 [14] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is covered with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, and the upper surface of the insulating substrate An IC tag characterized in that an upper and lower resin core layers are respectively attached to the lower surface.
[15] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて突出部を形成し、この突出部と ICチップとの間には空洞部が設けら れるとともに突出部の内側面に榭脂材料力 なる保護層が設けられ、 ICチップが実 装された側とは反対側の絶縁基板上の ICチップ直下に相当する位置に榭脂材料か らなる保護板が取り付けられ、絶縁基板の上面と下面には、それぞれ上部榭脂芯体 層と下部榭脂芯体層が取り付けられていることを特徴とする ICタグ。  [15] An IC tag in which an electronic module having an IC chip and an antenna coil mounted on an insulating substrate is coated with a coating layer of a neutral material, and a coating layer in the vicinity of the IC chip is formed. A protruding portion is formed by projecting, and a cavity is provided between the protruding portion and the IC chip, and a protective layer made of a resin material is provided on the inner surface of the protruding portion, and the IC chip is mounted. A protective plate made of a resin material is attached at a position corresponding to the IC chip directly on the opposite side of the insulating substrate, and the upper and lower surfaces of the insulating substrate are respectively formed on the upper and lower surfaces of the insulating substrate. An IC tag characterized in that a fat core layer is attached.
[16] 絶縁基板上に ICチップとアンテナコイルを備えた電子部品が実装された ICモジュ 一ルが弹性材料の被覆層で被覆されてなる ICタグにぉ 、て、 ICチップ近傍の被覆 層を突出させて第一突出部を形成し、第一突出部と ICチップとの間には空洞部が設 けられるとともに第一突出部の内側面に榭脂材料力 なる保護層が設けられ、第一 突出部と対称をなすように絶縁基板を挟んで第一突出部とは反対側にある被覆層を 突出させて第二突出部を形成し、第二突出部と絶縁基板との間には空洞部が設けら れるとともに第二突出部の内側面に榭脂材料力 なる保護層が設けられ、絶縁基板 の上面と下面には、それぞれ上部榭脂芯体層と下部榭脂芯体層が取り付けられてい ることを特徴とする ICタグ。 [16] IC module in which electronic components with IC chip and antenna coil are mounted on an insulating substrate The first tag is formed by projecting the coating layer in the vicinity of the IC chip, and the first projecting part is formed between the first projecting part and the IC chip. A cavity is provided, and a protective layer made of a resin material is provided on the inner surface of the first protrusion, and on the opposite side of the first protrusion with the insulating substrate interposed therebetween so as to be symmetrical with the first protrusion. A coating layer is protruded to form a second protrusion, a cavity is provided between the second protrusion and the insulating substrate, and a protective layer made of a resin material is provided on the inner surface of the second protrusion. An IC tag, wherein an upper and lower resin core layers are attached to an upper surface and a lower surface of an insulating substrate, respectively.
PCT/JP2006/320844 2006-10-19 2006-10-19 Ic tag WO2008047436A1 (en)

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