JP2003141486A - Contactless ic card and method of manufacturing the same - Google Patents
Contactless ic card and method of manufacturing the sameInfo
- Publication number
- JP2003141486A JP2003141486A JP2001342680A JP2001342680A JP2003141486A JP 2003141486 A JP2003141486 A JP 2003141486A JP 2001342680 A JP2001342680 A JP 2001342680A JP 2001342680 A JP2001342680 A JP 2001342680A JP 2003141486 A JP2003141486 A JP 2003141486A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- base material
- reinforcing material
- card
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プラスチック材料
中にＩＣチップ、アンテナ等の電気部品を内蔵し、駆動
電力とデータのやり取りを電波でおこなう非接触ＩＣカ
ードとその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card in which electric parts such as an IC chip and an antenna are built in a plastic material and exchanges driving power and data by radio waves, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】非接触ＩＣカードは、新しい情報記録媒
体であり、カード状の形状をなし、電気絶縁性プラスチ
ック基材中にＩＣチップとアンテナ、それに必要の応じ
て搭載されるコンデンサー等、情報処理機能、通信機
能、セキュリティ機能等のための部品を埋設して構成さ
れる。2. Description of the Related Art A non-contact IC card is a new information recording medium, which has a card-like shape, and includes an IC chip and an antenna in an electrically insulating plastic base material, a capacitor mounted as necessary, and other information. It is configured by embedding parts for processing functions, communication functions, security functions, etc.
【０００３】非接触ＩＣカードは、機器本体とのデータ
のやり取りを電波を介して非接触で行なうことが特徴で
あり、例えば従来の切符、定期券、クレジットカード等
磁気記録層が片面に設けられている記録媒体に代わる新
媒体として注目されている。特に人、物、情報等に提携
すれば、これらを移動させながら非接触で書込み、読取
りによりデータの管理ができるため、利便性が大きく向
上するものと期待され大量に活用されようとしている。The non-contact IC card is characterized in that data is exchanged with the main body of the device in a non-contact manner via radio waves, and a magnetic recording layer such as a conventional ticket, commuter ticket or credit card is provided on one side. It is drawing attention as a new medium that replaces existing recording media. In particular, if people, things, information, etc. are affiliated with each other, data can be managed by writing and reading in a non-contact manner while moving them, so that convenience is expected to be greatly improved and it is being used in large quantities.
【０００４】しかしながら、このような非接触ＩＣカー
ドにおいては、以下のような問題があった。かかるカー
ドの製造方法においては、カードに内蔵するＩＣチップ
を含む内蔵部品はＩＣチップ、コンデンサー、アンテナ
コイル等から構成されるが、これらは外力等により電気
接合部が外れる等の問題のほかに、特にＩＣチップはシ
リコン結晶からなるため、衝撃にもろく、破損しやすい
問題があった。使用中に偶発的に財布のボタン等による
過大な圧力がＩＣチップ部に集中することがあり、ＩＣ
チップが損傷し又は損傷に至らなくとも電気的な接合に
不具合が生じる等の問題もあった。However, such a non-contact IC card has the following problems. In such a card manufacturing method, the built-in parts including the IC chip built in the card are composed of an IC chip, a capacitor, an antenna coil, etc. In particular, since the IC chip is made of silicon crystal, it has a problem that it is vulnerable to impact and is easily damaged. During use, excessive pressure from the wallet buttons may accidentally concentrate on the IC chip,
Even if the chip is damaged or is not damaged, there is a problem that electrical connection is defective.
【０００５】そこで、ＩＣチップの補強に関して特開昭
６２−７００９４号公報、特開２０００−４８１５１号
公報、特開２０００−１１８１７５号公報、特開２００
０−２２２５４９号公報、特開２０００−３１１２２５
号公報などに提案がある。例えば、特開２０００−３１
１２２５号公報に記載されたＩＣカードは、インレット
シートと表面シートの間に樹脂シートを介在させ、その
樹脂シートのＩＣチップイチに凹部又は貫通孔を設け、
その凹部又は貫通孔に金属補強体を嵌合し、その外側に
表面シートを積層してラミネート化することにより形成
されている。Therefore, regarding the reinforcement of the IC chip, JP-A-62-70094, JP-A-2000-48151, JP-A-2000-118175, and JP-A-200.
0-222549, JP-A-2000-311225.
There is a proposal in the gazette etc. For example, Japanese Patent Laid-Open No. 2000-31
In the IC card described in Japanese Patent No. 1225, a resin sheet is interposed between an inlet sheet and a surface sheet, and a recess or a through hole is provided in the IC chip of the resin sheet.
It is formed by fitting a metal reinforcing body into the recess or the through hole and laminating a surface sheet on the outer side of the metal reinforcing body.
【０００６】[0006]
【発明が解決しようとする課題】しかし、これらの提案
されているＩＣカードは、チップ部の補強を考慮してい
るが、その構造から製造工程が複雑で、補強材の貼付け
圧力等チップに負担がかかる問題がある。本発明は、か
かる実状に鑑み、外的圧力によるＩＣチップ等の損傷を
防止するためにチップ部の機械的強度向上のための補強
構造をもつ簡便な構造のＩＣカードと、効率よく製造で
きる方法を提供することを目的とするものである。However, in these proposed IC cards, although the chip portion is considered to be reinforced, the manufacturing process is complicated due to its structure, and the chip is burdened by the pressure of attaching the reinforcing material. There is a problem that takes. In view of such circumstances, the present invention provides an IC card with a simple structure having a reinforcing structure for improving the mechanical strength of the chip portion in order to prevent damage to the IC chip or the like due to external pressure, and a method that can be efficiently manufactured. It is intended to provide.
【０００７】[0007]
【問題を解決するための手段】本発明は、ＩＣチップ及
びアンテナを少なくとも搭載したインレットシートを内
部に含み、外側に表側基材及び裏側基材を備えて全体と
して積層一体化された非接触ＩＣカードであり、ＩＣチ
ップ位置の表側と裏側の少なくとも一方の内部には、前
記基材に少なくとも一部が埋設された状態で剛性補強材
が埋設されているものである。According to the present invention, there is provided an inlet sheet having at least an IC chip and an antenna mounted therein, a front side base material and a back side base material being provided on the outside, and a non-contact IC integrated as a whole as a whole. The card is a card in which a rigid reinforcing material is embedded in at least one of the front side and the back side of the IC chip position in a state of being at least partially embedded in the base material.
【０００８】インレットシートを内部に含み、外側に表
側基材及び裏側基材を備えて全体として積層一体化され
たＩＣカードは、厚さの制約を受けるため、基材とイン
レットシートの間に補強板を挟み込むことにより介在さ
せる従来のものでは、使用できる補強板の厚さにも制約
がある。それに比べて、本発明のＩＣカードでは、補強
板の少なくとも一部が基材に埋設された状態となってい
るので、従来のものに比べて補強板の厚さに対する制約
が少なくなり、より補強効果の高いものを使用できるよ
うになる。[0008] An IC card that includes an inlet sheet inside and has a front side substrate and a back side substrate on the outside and is laminated and integrated as a whole is subject to thickness restrictions, and therefore is reinforced between the substrate and the inlet sheet. In the conventional structure in which the plates are sandwiched to intervene, the thickness of the reinforcing plate that can be used is also limited. On the other hand, in the IC card of the present invention, since at least a part of the reinforcing plate is embedded in the base material, there is less restriction on the thickness of the reinforcing plate as compared with the conventional one, and the reinforcing plate is further reinforced. You will be able to use the most effective one.
【０００９】このＩＣカードを製造する本発明の方法
は、表側基材と裏側基材のうちの少なくとも一方のＩＣ
チップ位置に剛性補強材を少なくとも一部が埋設された
状態に予め固着しておく工程と、その両基材が表側と裏
側の外側になり、少なくともインレットシートを含む部
材が内側になるように配置して積層一体化する工程とを
含んでいる。According to the method of the present invention for producing this IC card, the IC of at least one of the front substrate and the back substrate is used.
A step of pre-fixing the rigid reinforcing material to the chip position in a state where at least a part of it is embedded, and arranging both base materials on the outside of the front side and the back side and at least the member including the inlet sheet inside And laminating and integrating.
【００１０】本発明は、カードの外側に配置される表裏
基材の少なくとも一方にはＩＣチップに対応する位置に
予め補強材を少なくとも一部が埋設して部分的に機械的
強度を改善したカード基材を使用することで達成され
る。ＩＣカードの最も基本的な構成は３枚のシートから
なる。すなわち、印刷等の商品として必要な情報を設け
る表裏の基材と、少なくともＩＣチップとアンテナを保
持するインレットシートである。一般にはこれらのシー
トは接着剤を用いて、又は接着剤を用いないで融着によ
り貼り合わされてカード化される。一般的にシート上に
複数の同一ＩＣカードを作成する場合、インレットシー
ト上に、規格化されたカードピッチ毎に複数のＩＣチッ
プを配置するため、チップの位置関係は事前に予め決定
できる。よって補強材をＩＣカードの外側表裏基材の少
なくとも一方のシート中の複数の所定の位置に予め固着
しておき、各シートを重ねて貼り合わせることで、各チ
ップ位置に補強材を極めて効率よく設置して外圧からチ
ップ部の破損防止を行なうことができる。According to the present invention, at least one of the front and back base materials arranged on the outside of the card has a reinforcing material embedded in advance at a position corresponding to the IC chip so as to partially improve the mechanical strength. This is achieved by using a substrate. The most basic structure of an IC card consists of three sheets. That is, it is a front and back base material on which information necessary for a product such as printing is provided, and an inlet sheet holding at least an IC chip and an antenna. In general, these sheets are bonded with or without an adhesive to form a card. In general, when a plurality of identical IC cards are created on a sheet, a plurality of IC chips are arranged on the inlet sheet at standardized card pitches, so the positional relationship of the chips can be determined in advance. Therefore, the reinforcing material is preliminarily fixed to a plurality of predetermined positions in at least one sheet of the outer front and back substrates of the IC card, and the sheets are overlapped and bonded to each other, so that the reinforcing material can be extremely efficiently attached to each chip position. It can be installed to prevent damage to the chip from external pressure.
【００１１】本発明の製造方法は、チップ上に補強材を
搭載していく方法に比べ、基材のシートに予め固着して
おくため、補強材の水平化が容易で、加圧して結着して
もチップが破損しない等の利点がある。In the manufacturing method of the present invention, the reinforcing material is fixed to the sheet of the base material in advance as compared with the method of mounting the reinforcing material on the chip. Even so, there is an advantage that the chip is not damaged.
【００１２】[0012]
【発明の実施の形態】補強材はＩＣチップを外力などか
ら保護するものであるが、補強材がＩＣチップに接触す
ると補強材によってＩＣチップに損傷を与える虞があ
る。その虞を抑えるためには、補強材とＩＣチップの間
に樹脂シートや接着剤など、他の部材が介在して補強材
とＩＣチップが互いに非接触状態で埋設されていること
が好ましい。BEST MODE FOR CARRYING OUT THE INVENTION The reinforcing material protects the IC chip from external force, but if the reinforcing material contacts the IC chip, the reinforcing material may damage the IC chip. In order to suppress the risk, it is preferable that the reinforcing material and the IC chip be embedded in a non-contact state with each other by interposing another member such as a resin sheet or an adhesive between the reinforcing material and the IC chip.
【００１３】本発明で使用する表裏基材用のシートとし
ては、既知の種々のプラスチックシートが使用できる。
熱可塑性樹脂シートとしては、ＰＥＴ（ポリエチレンテ
レフタレート）、ＰＥＴＧ（少なくともエチレングリコ
ール、テレフタル酸及び１，４−シクロヘキサンジメタ
ノールの３成分を重合した変性ポリエステル樹脂）、Ｐ
ＶＣ（ポリビニルクロライド）、ＰＣ（ポリカーボネー
ト）、ＡＢＳ（アクリロニトリル−ブタジエン−スチレ
ン）、ＰＥＮ（ポリナフタレンテレフタレート）、合成
紙類で、厚みが０．０２５〜０．５ｍｍのものが適当で
ある。基材用のシートは透明であっても不透明であって
もよい。Various known plastic sheets can be used as the sheet for the front and back substrates used in the present invention.
As the thermoplastic resin sheet, PET (polyethylene terephthalate), PETG (modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol), P
VC (polyvinyl chloride), PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene), PEN (polynaphthalene terephthalate), synthetic papers having a thickness of 0.025 to 0.5 mm are suitable. The substrate sheet may be transparent or opaque.
【００１４】インレット基材シートとしては、既知のプ
ラスチックシート、例えば、ＰＥＴ、ＰＥＴＧ、ＰＶ
Ｃ、ＰＣ、ＡＢＳ、ＰＥＮ、ポリイミドシート、紙等の
シートからなり、厚みが０．０２５〜０．５ｍｍのもの
が適当である。インレット基材シートも透明であっても
不透明であってもよい。As the inlet substrate sheet, known plastic sheets such as PET, PETG, PV
A sheet made of C, PC, ABS, PEN, a polyimide sheet, paper or the like and having a thickness of 0.025 to 0.5 mm is suitable. The inlet base sheet may also be transparent or opaque.
【００１５】インレットシートは電波で通信を行なうた
めのアンテナコイルが設けられるが、アンテナコイルは
エッチング、導線、印刷、転写方法等により銅、アル
ミ、導電ペースト等の導電体を用いてコイル状に設けら
れる。アンテナコイルの端子にはＩＣチップがハンダ、
導電性接着剤、溶接、かしめ、ワイヤーボンディング等
の方法により接続される。かかるＩＣチップとしては、
ベアチップでもモジュール化されたチップでも使用する
ことができる。The inlet sheet is provided with an antenna coil for communicating by radio waves, and the antenna coil is provided in a coil shape by using a conductor such as copper, aluminum or a conductive paste by etching, conducting wire, printing, transfer method or the like. To be The IC chip is soldered to the terminal of the antenna coil,
Connection is made by a method such as a conductive adhesive, welding, caulking, or wire bonding. As such an IC chip,
Both bare chips and modular chips can be used.
【００１６】剛性補強材としては、鉄、亜鉛、クロム、
アルミ、マンガン、モリブデン、タングステン、チタ
ン、シリカ、カーボン、ボロンからなるステンレス鋼等
の鉄類、４２アロイ等のニッケル合金類等の金属類、セ
ラミック類、アラミド、ガラスエポキシ、カーボン系樹
脂板等の融点３００℃以上、弾性率１０００ｋｇｆ／ｍ
ｍ2（ＡＳＴＭ Ｄ８８２）以上の固体材料が適する。As the rigidity reinforcing material, iron, zinc, chrome,
Aluminum, manganese, molybdenum, tungsten, titanium, silica, carbon, iron such as stainless steel made of boron, metals such as nickel alloys such as 42 alloy, ceramics, aramid, glass epoxy, carbon-based resin plate, etc. Melting point 300 ° C or higher, elastic modulus 1000 kgf / m
Solid materials of m 2 (ASTM D882) or higher are suitable.
【００１７】補強材はシート状のものから金型を使用し
て目的の円形、矩形等の形状に打ち抜いて使用する。更
にバリ取り、腐食防止、繊維強化等の処理を施してもよ
い。弾性率１０００ｋｇｆ／ｍｍ2以上の金属類は、補
強強度の点でも、接着剤を使用せずに抵抗溶接で基材に
固着できる点でも好ましい。補強材の寸法としては厚み
２０〜５００μｍ、巾０．５〜１００ｍｍの円形、楕円
形又は方形の板状のものが適当である。The reinforcing material is used by punching a sheet-shaped material into a desired circular shape, rectangular shape or the like using a mold. Furthermore, deburring, corrosion prevention, fiber reinforcement, etc. may be applied. Metals having an elastic modulus of 1000 kgf / mm 2 or more are preferable in terms of reinforcing strength and in that they can be fixed to a base material by resistance welding without using an adhesive. As the dimension of the reinforcing material, a circular, elliptical or rectangular plate having a thickness of 20 to 500 μm and a width of 0.5 to 100 mm is suitable.
【００１８】補強材の設置位置としては、チップ位置上
の基材シートの厚み方向の表面層、内側チップ側等のチ
ップ上の位置であればよい。厚み方向の位置は特に限定
しないが、表面に露出しないように埋設するのがカード
化後の外観に優れるため好ましい。The reinforcing member may be installed at any position on the chip such as the surface layer in the thickness direction of the base sheet on the chip position, the inner chip side or the like. The position in the thickness direction is not particularly limited, but it is preferable to embed it so as not to be exposed on the surface because the appearance after forming into a card is excellent.
【００１９】両基材の少なくとも一方のＩＣチップ位置
に剛性補強材を少なくとも一部が埋設された状態に予め
固着しておく方法として、種々の方法をとることができ
る。例えば、接着剤を用いて又は用いないで所定の位置
に固着する。また、他ザグリ加工により凹部を形成した
後、その凹部に固着するようにしてもよい。熱プレスで
押し込む、溶接等の方法で基材の表面層を溶融して固着
してもよい。また、ＩＣチップと補強材間との結着を安
定化するために、凹部に補強材を嵌めこみ、接着剤を用
いて充填してもよい。Various methods can be adopted as a method of preliminarily fixing the rigid reinforcing material to the IC chip position of at least one of both base materials in a state where at least a part of the material is embedded. For example, it is fixed in place with or without an adhesive. Alternatively, the recess may be formed by another counterboring process and then fixed to the recess. The surface layer of the substrate may be melted and fixed by a method such as pressing with a hot press or welding. Further, in order to stabilize the binding between the IC chip and the reinforcing material, a reinforcing material may be fitted in the recess and filled with an adhesive.
【００２０】カード化のための積層一体化の方法として
は、カード基材シートとインレットシートを、接着剤を
用いて又は用いないで熱融着により接合する方法を挙げ
ることができる。接着剤を用いる場合は、カード基材シ
ート間にインレットシートと共に接着剤を挿入し、加熱
圧着口一ラー又は平板に挟んでプレス成形することによ
り接合することができる。このとき、接着剤により適度
の貼り合わせ温度が選択されるが、ホットメルト接着と
しては９０℃以上、加圧条件としては１〜１００ｋｇ／
ｃｍ2、加圧時間１〜１０００秒程度が適当である。Examples of the method for laminating and integrating the card to form a card include a method in which a card base sheet and an inlet sheet are joined by heat fusion with or without an adhesive. When an adhesive is used, it can be joined by inserting the adhesive together with the inlet sheet between the card base sheets, sandwiching it with a thermocompression bonder or a flat plate, and press-molding. At this time, an appropriate bonding temperature is selected depending on the adhesive, but the hot melt adhesion is 90 ° C. or higher, and the pressure condition is 1 to 100 kg /
A cm 2 and a pressing time of about 1 to 1000 seconds are suitable.
【００２１】ＩＣチップを固着する接着剤と及びカード
化のための積層一体化の際に使用する接着剤とは同様の
ものが使用できる。かかる接着剤としては既知の熱乾燥
型、ホットメルト型、熱硬化性樹脂、紫外線硬化樹脂等
を用いることができる。例えばポリスチレン、ポリエス
テル、酢酸ビニル樹脂、塩化ビニル樹脂、アクリル樹
脂、オレフイン系樹脂、ジエン系樹脂、ポリエステル系
樹脂、エポキシ樹脂、ビニルブチラール樹脂、ウレタン
樹脂、ポリアミド系樹脂、アルキッド樹脂、メラミン系
樹脂、尿素系樹脂、フエノールホルマリン系樹脂、石油
樹脂、マレイン酸共重合体等の単独、混合体、共重合体
等を用いることができる。The same adhesive can be used as the adhesive for fixing the IC chip and the adhesive used for laminating and integrating the IC chips. As such an adhesive, a known heat-drying type, hot-melt type, thermosetting resin, ultraviolet curing resin or the like can be used. For example, polystyrene, polyester, vinyl acetate resin, vinyl chloride resin, acrylic resin, olefin resin, diene resin, polyester resin, epoxy resin, vinyl butyral resin, urethane resin, polyamide resin, alkyd resin, melamine resin, urea Resins, phenol formalin resins, petroleum resins, maleic acid copolymers, and the like can be used alone, as a mixture, or as a copolymer.
【００２２】これらの接着剤は、粉体、フィルム状固
体、水系、溶剤系として適用することができ、少量の揮
発性溶媒、可塑剤、硬化促進剤、触媒、開始剤、硬化
剤、安定剤、触媒、分散剤、増粘剤、油脂類、離型材、
酸化防止剤、紫外線吸収剤、スチルト、発泡粒子、導電
剤、ファイバーフイラー、着色顔料、不透明化材などを
添加してもよい。These adhesives can be applied as powders, film-like solids, water-based and solvent-based adhesives, and a small amount of volatile solvents, plasticizers, curing accelerators, catalysts, initiators, curing agents, stabilizers. , Catalysts, dispersants, thickeners, fats and oils, release agents,
Antioxidants, ultraviolet absorbers, stilts, expanded particles, conductive agents, fiber fillers, coloring pigments, opacifying agents and the like may be added.
【００２３】更に印刷保護層、ホログラム、サインパネ
ル、バーコード、レーザナンバリング加工、磁気ストラ
イプ加工、写真貼付け等の工程をへて各用途のＩＣカー
ドに加工される。本発明の表裏基材シートの表面は、オ
フセット印刷、シルクスクリーン印刷により所望の絵
柄、説明文字等が印刷されるが、印刷前に補強材を固着
する加工を行なってもよい。カード化のための積層一体
化後、打ち抜いて力一ド化されるが、印刷は打抜きの直
前又は打抜き後に行なってもよい。Further, it is processed into an IC card for each purpose through processes such as a print protection layer, hologram, sign panel, bar code, laser numbering process, magnetic stripe process and photo sticking process. On the surface of the front and back substrate sheet of the present invention, desired patterns, explanatory characters and the like are printed by offset printing or silk screen printing, but a process of fixing a reinforcing material may be performed before printing. After stacking and unifying for card formation, it is punched out to obtain a force, but printing may be performed immediately before punching or after punching.
【００２４】[0024]
【実施例】図１は一実施例を表したものである。２はイ
ンレットシートであり、厚さ２５μｍのＰＥＴフィルム
（帝人製テトロンシート）を基材として、その表面に厚
さ１８μｍの銅箔にてなるアンテナ４が形成されてい
る。インレットシート２の基材上には厚さ２００μｍの
ベアＩＣチップ６が搭載されており、ベアＩＣチップ６
とアンテナ４の間はＡＣＦ（異方導電性フィルム）を使
用したフリップチップボンディングにて電気的に接続さ
れている。Embodiment FIG. 1 shows an embodiment. An inlet sheet 2 has a 25 μm thick PET film (Teijin Tetoron sheet) as a base material, and an antenna 4 made of 18 μm thick copper foil is formed on the surface thereof. The bare IC chip 6 having a thickness of 200 μm is mounted on the base material of the inlet sheet 2.
The antenna 4 and the antenna 4 are electrically connected by flip chip bonding using ACF (anisotropic conductive film).
【００２５】インレットシート２のＩＣチップ６が搭載
されている側には接着剤層８ａを介して表基材１０ａが
接合されており、インレットシート２の反対側には接着
剤層８ｂを介して裏基材１０ｂが接合されている。表基
材１０ａの内側でＩＣチップ６に対向する位置には、補
強材１２ａとして厚さ５０μｍ、直径８ｍｍのステンレ
ス（ＳＵＳ３０４）板（弾性率１８０００ｋｇｆ／ｍｍ
2）が埋設されており、裏基材１０ｂの内側でインレッ
トシート基材を介してＩＣチップ６に対向する位置に
も、補強材１２ａと同材質で同形状の補強材１２ｂが埋
設されている。The front substrate 10a is bonded to the side of the inlet sheet 2 on which the IC chip 6 is mounted via an adhesive layer 8a, and the other side of the inlet sheet 2 is bonded to the side of the inlet sheet 2 via an adhesive layer 8b. The back substrate 10b is joined. A stainless steel (SUS304) plate (elastic modulus 18000 kgf / mm) having a thickness of 50 μm and a diameter of 8 mm is used as a reinforcing material 12a at a position facing the IC chip 6 inside the front substrate 10a.
2 ) is embedded, and a reinforcing material 12b of the same material as the reinforcing material 12a and having the same shape as that of the reinforcing material 12a is also embedded inside the back base material 10b at a position facing the IC chip 6 via the inlet sheet base material. .
【００２６】図２は両基材１０ａ，１０ｂに補強材１２
ａ，１２ｂを固着する形態を示したものである。表基材
１０ａと裏基材１０ｂは同じ構造であるので、ここで
は、一方のみを示し、両基材１０ａ，１０ｂを基材１０
と表わし、両補強材１２ａ，１２ｂを補強材１２と表わ
す。FIG. 2 shows that both the base materials 10a and 10b are provided with a reinforcing material 12.
It shows a mode in which a and 12b are fixed. Since the front base material 10a and the back base material 10b have the same structure, only one of them is shown here and both base materials 10a and 10b are referred to as the base material 10a.
Both the reinforcing members 12a and 12b are referred to as a reinforcing member 12.
【００２７】（Ａ）は図１の実施例に示したものであ
り、補強材１２の表面が基材１０の表面と同一面となる
ように基材１０に嵌めこまれて固着されている。（Ｂ）
は基材１０に補強材１２の厚みよりも深い凹部を形成
し、その凹部に補強材１２を嵌めこみ接着剤２０で埋め
込んだものである。(A) is shown in the embodiment of FIG. 1, and the reinforcing material 12 is fitted and fixed to the base material 10 so that the surface thereof is flush with the surface of the base material 10. (B)
Is one in which a concave portion deeper than the thickness of the reinforcing material 12 is formed in the base material 10, and the reinforcing material 12 is fitted into the concave portion and embedded with the adhesive 20.
【００２８】（Ｃ）は基材１０に補強材１２の厚みより
も深い凹部を形成し、その凹部に接着剤２０で補強材１
２を固着し、補強材１２の表面が基材１０の表面と同一
面となるようにしたものである。In (C), a concave portion deeper than the thickness of the reinforcing material 12 is formed in the base material 10, and the reinforcing material 1 is formed in the concave portion with the adhesive 20.
2 is fixed so that the surface of the reinforcing material 12 is flush with the surface of the base material 10.
【００２９】（Ｄ）は基材１０に補強材１２の厚みより
も浅い凹部を形成し、その凹部に補強材１２を嵌めこみ
補強材１２の表面が基材１０の表面から突出する状態に
固着したものである。（Ｅ）は基材１０に補強材１２の
厚みよりも深い凹部を形成し、その凹部に接着剤２０ａ
で補強材１２を固着し、さらにその凹部に接着剤２０ｂ
を充填して補強材１２を埋め込んだものである。（Ａ）
から（Ｅ）の基材１０は、補強材１２を設けた側がイン
レットシート２と対向するように配置してインレットシ
ート２と接合する。In (D), a recess is formed in the base material 10 so as to be shallower than the thickness of the reinforcement material 12, and the reinforcement material 12 is inserted into the recessed portion to fix the surface of the reinforcement material 12 in a state of protruding from the surface of the base material 10. It was done. In (E), a concave portion deeper than the thickness of the reinforcing material 12 is formed in the base material 10, and the adhesive 20a is formed in the concave portion.
Reinforce the reinforcing material 12 with the adhesive 20b
Is filled with the reinforcing material 12. (A)
From (E) to (E), the base material 10 is arranged so that the side provided with the reinforcing material 12 faces the inlet sheet 2, and is joined to the inlet sheet 2.
【００３０】（Ｆ）は（Ａ）と同様に補強材１２の表面
が基材１０の表面と同一面となるように基材１０に嵌め
こまれて固着されたものであるが、この基材１０は補強
材１２を設けた側がインレットシート２とは反対側にな
るように配置してインレットシート２と接合する。As in (A), (F) is one in which the reinforcing material 12 is fitted and fixed to the base material 10 so that the surface of the reinforcing material 12 is flush with the surface of the base material 10. 10 is arranged so that the side provided with the reinforcing material 12 is the side opposite to the inlet sheet 2, and is joined to the inlet sheet 2.
【００３１】（Ｇ）は基材１０に貫通孔を形成し、その
貫通孔に基材１０の厚みよりも厚い補強材１２を嵌めこ
み、補強材１２の一方の面が基材１０の面と同一面とな
り、補強材１２の他方の面が基材１０の面から突出する
ように固着したものである。この基材１０は補強材１２
の面と基材１０の面が同一面となっている側がインレッ
トシート２と対向するように配置してインレットシート
２と接合する。In (G), a through hole is formed in the base material 10, and a reinforcing material 12 thicker than the thickness of the base material 10 is fitted into the through hole, and one surface of the reinforcing material 12 is the surface of the base material 10. The same surface is formed, and the other surface of the reinforcing material 12 is fixed so as to project from the surface of the base material 10. This base material 10 is a reinforcing material 12.
The side where the surface of the substrate 10 and the surface of the base material 10 are flush with each other are arranged so as to face the inlet sheet 2 and are joined to the inlet sheet 2.
【００３２】（実施例１）図１に示されたＩＣカードと
同様のＩＣカードの製造方法を示す。
（１）両基材１０ａ，１０ｂ用のシートとして厚さ２０
０μｍのＰＥＴＧフィルム（太平化学製エビロンシー
ト）を用い、その表に絵柄、裏にチップ位置の目印を印
刷した。そのシートにエンドミルを用いてチップ位置に
深さ１５０μｍ、直径８ｍｍの円形のザグリを入れ凹部
を形成した。その凹部に補強材１２ａ，１２ｂとして厚
さ５０μｍ、直径８ｍｍのステンレス（ＳＵＳ３０４）
板（弾性率１８０００ｋｇｆ／ｍｍ2）を嵌めこみ、抵
抗溶接機にてそのステンレス板を加熱しプレスして、基
材を少量溶融して基材にそのステンレス板を仮止めし
た。これにより、複数枚のＩＣカード分の基材シートが
形成する。Example 1 A method of manufacturing an IC card similar to the IC card shown in FIG. 1 will be described. (1) Thickness of 20 as a sheet for both base materials 10a and 10b
Using a 0 μm PETG film (Ebiron sheet manufactured by Taihei Chemical Co., Ltd.), a pattern was printed on the front side and a mark for the chip position was printed on the back side. A circular counterbore having a depth of 150 μm and a diameter of 8 mm was put into the sheet at the chip position using an end mill to form a recess. Stainless steel (SUS304) having a thickness of 50 μm and a diameter of 8 mm as the reinforcing materials 12a and 12b in the recesses.
A plate (elastic modulus 18000 kgf / mm 2 ) was fitted, and the stainless steel plate was heated and pressed by a resistance welding machine to melt a small amount of the base material and temporarily fix the stainless steel plate to the base material. As a result, base sheets for a plurality of IC cards are formed.
【００３３】（２）これとは別に、インレットシート２
用の基材として厚さ２５μｍのＰＥＴフィルム（帝人製
テトロンシート）を用い、それに厚さ１８μｍの銅箔を
接着剤としてポリビニルアルコールを使用して積層し
た。その銅箔をアルカリエッチング法にてパターン化し
てアンテナ４を形成した。(2) Separately from this, the inlet sheet 2
A PET film (Tetoron sheet manufactured by Teijin Ltd.) having a thickness of 25 μm was used as a substrate for use, and a copper foil having a thickness of 18 μm was laminated thereon using polyvinyl alcohol as an adhesive. The copper foil was patterned by an alkali etching method to form the antenna 4.
【００３４】（３）アンテナ４を形成した側のインレッ
トシート基材上に厚さ２００μｍのベアＩＣチップ６を
ＡＣＦ（異方導電性フィルム）を使用したフリップチッ
プボンディングにて実装した。ＡＣＦによりＩＣチップ
６はインレットシート基材上に搭載されるとともに、ア
ンテナ４に電気的に接続される。これにより、複数枚の
ＩＣカード分のインレットシート２を含むインレットシ
ート基材が形成される。(3) A bare IC chip 6 having a thickness of 200 μm was mounted on the inlet sheet substrate on the side where the antenna 4 was formed by flip chip bonding using ACF (anisotropic conductive film). The IC chip 6 is mounted on the inlet sheet base material by the ACF and is electrically connected to the antenna 4. As a result, an inlet sheet base including the inlet sheets 2 for a plurality of IC cards is formed.
【００３５】（４）（３）で形成したインレットシート
基材を内側に配置し、その両側に（１）で形成した基材
シートを補強材がインレットシート基材側になるように
配置し、インレットシート基材と両基材シートの間にフ
ィルム状のホットメルト接着剤（東亜合成製アロンメル
ト）を挟み込んで、１４０℃×６０秒、圧力５ｋｇ／ｃ
ｍ2で熱板プレスで貼り合わせて一体化し積層体とし
た。その積層体を５４．０ｍｍ×８５．６ｍｍ角に切断
してカードとした。カード表面は平坦であった。(4) The inlet sheet base material formed in (3) is placed inside, and the base sheet formed in (1) is placed on both sides of the inlet sheet base material so that the reinforcing material is on the inlet sheet base material side. A film-shaped hot melt adhesive (Toagosei Aron Melt) is sandwiched between the inlet sheet base material and both base material sheets, 140 ° C. × 60 seconds, pressure 5 kg / c
The pieces were laminated by a hot plate press at m 2 and integrated to form a laminated body. The laminate was cut into a 54.0 mm × 85.6 mm square to give a card. The card surface was flat.
【００３６】チップ位置での直径１０ｍｍの鋼球による
点圧強度は、３５ニュートン（Ｎ）であった。比較のた
めに、補強材を備えない場合の同じ測定方法による点圧
強度は５ニュートン（Ｎ）であった。この結果から、こ
の実施例によるステンレス板の補強材を備えたことによ
り、点圧強度が大幅に増大しており、ＩＣチップ部の機
械的強度が向上していることが分かる。このＩＣカード
の通信距離は、補強材を備えた場合と備えない場合とで
変化がなかった。The point pressure strength of a steel ball having a diameter of 10 mm at the tip position was 35 Newton (N). For comparison, the point pressure strength obtained by the same measurement method without the reinforcing material was 5 Newton (N). From this result, it can be seen that the point pressure strength is significantly increased and the mechanical strength of the IC chip portion is improved by providing the reinforcing material of the stainless steel plate according to this embodiment. The communication distance of this IC card did not change between with and without the reinforcing material.
【００３７】（実施例２）カード基材として実施例１の
ＰＥＴＧフィルムに代えてＰＥＴフィルムを使用し、補
強材として実施例１のステンレス板に代えて厚み１００
μｍのガラスエポキシフィルム（弾性率３０００ｋｇｆ
／ｍｍ2）を使用した。点圧強度は１５ニュートン
（Ｎ）であった。補強材を備えない場合の点圧強度は５
ニュートン（Ｎ）であるので、この実施例によるガラス
エポキシ補強材を使用した場合でもＩＣチップ部の機械
的強度が向上していることが分かる。(Example 2) A PET film was used as the card substrate instead of the PETG film of Example 1, and a stainless steel plate of Example 1 was used as a reinforcing material in a thickness of 100.
μm glass epoxy film (elastic modulus 3000 kgf
/ Mm 2 ) was used. The point pressure strength was 15 Newton (N). The point pressure strength without the reinforcement is 5
Since it is Newton (N), it can be seen that the mechanical strength of the IC chip portion is improved even when the glass epoxy reinforcing material according to this example is used.
【００３８】（比較例１）補強材として実施例１のステ
ンレス板に代えて厚み１００μｍのポリエチレンテレフ
タレートフィルム（弾性率４００ｋｇｆ／ｍｍ2）を使
用した。点圧強度は７ニュートン（Ｎ）であり、補強材
を備えない場合は５ニュートン（Ｎ）であるのと比べる
と、ＩＣチップ部の機械的強度がほとんど向上していな
いことが分かる。実施例はＩＣチップ位置の表側と裏側
の両方に補強板を設けているが、本発明はいずれか一方
のみとする形態も含んでいる。(Comparative Example 1) As a reinforcing material, a polyethylene terephthalate film having a thickness of 100 μm (elastic modulus of 400 kgf / mm 2 ) was used instead of the stainless steel plate of Example 1. It can be seen that the mechanical strength of the IC chip portion is hardly improved as compared with the point pressure strength of 7 Newtons (N) and 5 Newtons (N) when the reinforcing material is not provided. In the embodiment, the reinforcing plates are provided on both the front side and the back side of the IC chip position, but the present invention includes a mode in which only one of them is provided.
【００３９】[0039]
【発明の効果】本発明の非接触ＩＣカードでは、ＩＣチ
ップ位置の表側と裏側の少なくとも一方の内部には、基
材に少なくとも一部が埋設された状態で剛性補強材が埋
設されているので、チップ部の補強が簡便で効率よく行
なわれ、しかも補強板の厚さに対する制約が少ないの
で、補強効果を高めるのが容易である。本発明の製造方
法では、表側基材及び裏側基材の少なくとも一方のＩＣ
チップ位置に剛性補強材を少なくとも一部が埋設された
状態に予め固着しておくので、製造途中でＩＣチップに
補強材の貼付け圧力がかかるというようなこともなく、
ＩＣチップにかかる負担を少なくして、しかも簡単な工
程でＩＣカードを製造することができる。In the non-contact IC card of the present invention, the rigidity reinforcing material is embedded in at least one of the front side and the back side of the IC chip position while being embedded in the base material. Since the tip portion is simply and efficiently reinforced, and the thickness of the reinforcing plate is not restricted, it is easy to enhance the reinforcing effect. In the manufacturing method of the present invention, the IC of at least one of the front side substrate and the back side substrate
Since the rigid reinforcing material is fixed in advance at the chip position in a state where at least a part of the reinforcing material is embedded, there is no need to apply pressure of the reinforcing material to the IC chip during manufacturing.
An IC card can be manufactured by reducing the load on the IC chip and by a simple process.
【図１】一実施例を表わす断面図である。FIG. 1 is a cross-sectional view showing an example.
【図２】補強材を配置する種々の態様を示す基材の断面
図である。FIG. 2 is a cross-sectional view of a base material showing various modes of arranging a reinforcing material.
２ インレットシート ４ アンテナ ６ ＩＣチップ ８ａ，８ｂ 接着剤層 １０，１０ａ，１０ｂ 表裏基材 １２，１２ａ，１２ｂ 補強材 2 inlet sheets 4 antenna 6 IC chip 8a, 8b adhesive layer 10, 10a, 10b front and back substrate 12, 12a, 12b Reinforcing material
Claims (7)
載したインレットシートを内部に含み、外側に表側基材
及び裏側基材を備えて全体として積層一体化された非接
触ＩＣカードにおいて、 前記ＩＣチップ位置の表側と裏側の少なくとも一方の内
部には、前記基材に少なくとも一部が埋設された状態で
剛性補強材が埋設されていることを特徴とする非接触Ｉ
Ｃカード。1. A non-contact IC card which includes an inlet sheet having at least an IC chip and an antenna mounted therein, and has a front side base material and a back side base material on the outer side and is integrally laminated as a whole. Non-contact I characterized in that a rigid reinforcing material is embedded in at least a part of the base material inside at least one of the front side and the back side.
C card.
の部材が介在して互いに非接触状態で埋設されている請
求項１に記載の非接触ＩＣカード。2. The non-contact IC card according to claim 1, wherein the reinforcing material and the IC chip are embedded in a non-contact state with each other with another member interposed therebetween.
載したインレットシートを内部に配置し、外側に表側基
材及び裏側基材を配置して全体として積層一体化する非
接触ＩＣカードの製造方法において、 前記両基材の少なくとも一方には前記ＩＣチップ位置に
剛性補強材を少なくとも一部が埋設された状態に予め固
着しておく工程と、 その両基材が表側と裏側の外側になり、少なくとも前記
インレットシートを含む部材が内側になるように配置し
て積層一体化する工程とを含むことを特徴とする非接触
ＩＣカードの製造方法。3. A method for manufacturing a non-contact IC card in which an inlet sheet having at least an IC chip and an antenna mounted therein is arranged inside, and a front side base material and a back side base material are arranged outside and laminated and integrated as a whole. A step of pre-fixing at least one of the two base materials with a rigid reinforcing material at the IC chip position so that at least a part thereof is embedded, and both base materials are outside on the front side and the back side, and at least the inlet A method of manufacturing a non-contact IC card, comprising the step of arranging a member including a sheet so as to be inside and stacking and integrating the members.
接又は熱プレスにより前記基材に固着する請求項３に記
載の製造方法。4. The manufacturing method according to claim 3, wherein, in the step of fixing the reinforcing material, the reinforcing material is fixed to the base material by welding or hot pressing.
形成した後、その凹部に前記補強材を固着する請求項４
に記載の製造方法。5. The reinforcing member is fixed to the concave portion after the concave portion is formed at the IC chip position of the base material.
The manufacturing method described in.
前記ＩＣチップ位置に凹部を形成した後、その凹部に前
記補強材を接着剤にて固着する請求項３に記載の製造方
法。6. The manufacturing method according to claim 3, wherein in the step of fixing the reinforcing material, after forming a concave portion at the IC chip position of the base material, the reinforcing material is fixed to the concave portion with an adhesive.
前記ＩＣチップ位置に貫通孔を形成した後、その貫通孔
に前記補強材を嵌め込んで固着する請求項３に記載の製
造方法。7. The manufacturing method according to claim 3, wherein in the step of fixing the reinforcing material, after forming a through hole at the IC chip position of the base material, the reinforcing material is fitted and fixed in the through hole. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001342680A JP2003141486A (en) | 2001-11-08 | 2001-11-08 | Contactless ic card and method of manufacturing the same |
Applications Claiming Priority (1)
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