WO2008043264A8 - Light-emitting component package, light-emitting component packaging apparatus, and light source device - Google Patents

Light-emitting component package, light-emitting component packaging apparatus, and light source device

Info

Publication number
WO2008043264A8
WO2008043264A8 PCT/CN2007/002840 CN2007002840W WO2008043264A8 WO 2008043264 A8 WO2008043264 A8 WO 2008043264A8 CN 2007002840 W CN2007002840 W CN 2007002840W WO 2008043264 A8 WO2008043264 A8 WO 2008043264A8
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting component
heat
source device
conductor
Prior art date
Application number
PCT/CN2007/002840
Other languages
French (fr)
Other versions
WO2008043264A1 (en
Inventor
Ming-Te Lin
Original Assignee
Ind Tech Res Inst
Ming-Te Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2006101599468A external-priority patent/CN101154702B/en
Priority claimed from CN 200710101858 external-priority patent/CN101295684B/en
Application filed by Ind Tech Res Inst, Ming-Te Lin filed Critical Ind Tech Res Inst
Publication of WO2008043264A1 publication Critical patent/WO2008043264A1/en
Publication of WO2008043264A8 publication Critical patent/WO2008043264A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A light-emitting component package includes a light-emitting component (1511), a heat-conductor (1513), a set of electric-conducting leads (1512), and a heat dissipation base (1052). The light-emitting component (1511) is disposed on the heat-conductor (1513) and electrically coupled to the set of electric-conducting leads (1512). The heat-conductor (1513) is insulated from the set of electric-conducting leads (1512) and inserted in a hole (1523) of the heat dissipation base (1052). Meanwhile, the set of electric-conducting leads (1512) is located between at least two heat-conducting portions of the heat-conductor (1513) to form the package with heat outside and electricity inside. A light-emitting component packaging apparatus including a leadframe and a molding base, and a light source device are provided.
PCT/CN2007/002840 2006-09-28 2007-09-28 Light-emitting component package, light-emitting component packaging apparatus, and light source device WO2008043264A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN2006101599468A CN101154702B (en) 2006-09-28 2006-09-28 Packaging tool of light emitting diode
CN200610159946.8 2006-09-28
CN200710101858.7 2007-04-25
CN 200710101858 CN101295684B (en) 2007-04-25 2007-04-25 Cooling encapsulation of heating element

Publications (2)

Publication Number Publication Date
WO2008043264A1 WO2008043264A1 (en) 2008-04-17
WO2008043264A8 true WO2008043264A8 (en) 2008-07-24

Family

ID=39282412

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2007/002840 WO2008043264A1 (en) 2006-09-28 2007-09-28 Light-emitting component package, light-emitting component packaging apparatus, and light source device

Country Status (1)

Country Link
WO (1) WO2008043264A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8497560B2 (en) 2006-10-06 2013-07-30 Industrial Technology Research Institute LED package and method of assembling the same
DE102008024780A1 (en) * 2008-05-23 2009-11-26 Osram Gesellschaft mit beschränkter Haftung Wireless light source
KR101018119B1 (en) 2008-09-04 2011-02-25 삼성엘이디 주식회사 LED package
KR101053049B1 (en) * 2008-12-17 2011-08-01 삼성엘이디 주식회사 LED package
DE102010029249B4 (en) * 2010-05-25 2013-03-28 Osram Gmbh Semiconductor lamp
EP2702644A1 (en) * 2011-04-26 2014-03-05 The Procter and Gamble Company Intelligent light bulb base
US9504099B2 (en) 2011-04-26 2016-11-22 Nthdegree Technologies Worldwide Inc. Lighting system with flexible lighting sheet and intelligent light bulb base
ITTO20111212A1 (en) * 2011-12-23 2013-06-24 Gs Plastics S A S Di Giovanni Gerv Asio & C POWER LED
CN103280507B (en) * 2013-05-17 2015-09-09 深圳龙多电子科技有限公司 The device for automatically molding of the direct insertion LED with altitude location and method
CN205141843U (en) 2015-10-26 2016-04-06 泰科电子(上海)有限公司 Wireless power transmission device and electrical equipment
CN108091748B (en) * 2016-11-23 2023-06-09 中国科学院福建物质结构研究所 Device and method for packaging LED by using block-shaped fluorescent body
CN209496712U (en) 2018-12-27 2019-10-15 泰科电子(上海)有限公司 Wireless power supply and electrical equipment with the wireless power supply

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4340862C2 (en) * 1993-12-01 2002-04-11 Vishay Semiconductor Gmbh Potting device for the production of optoelectronic components
CN2517112Y (en) * 2002-01-24 2002-10-16 葛世潮 High power light-emitting diode
RU2341840C2 (en) * 2003-05-02 2008-12-20 ЛИМПКИН Джордж Алан Device for power supply to load and system connected to it
CN1635640A (en) * 2003-12-29 2005-07-06 林文钦 LED chip module
CN100444415C (en) * 2004-07-06 2008-12-17 旭山光电股份有限公司 Air tight high-heat conducting chip packaging assembly
CN2785305Y (en) * 2004-12-31 2006-05-31 王根荣 Neon light high frequency magnetic leakage electronic transformer
KR100631903B1 (en) * 2005-02-17 2006-10-11 삼성전기주식회사 High power LED housing and its manufacturing method
TWM285041U (en) * 2005-08-31 2006-01-01 Leotek Electronics Corp Package fixture structure of an LED

Also Published As

Publication number Publication date
WO2008043264A1 (en) 2008-04-17

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