CN108091748B - Device and method for packaging LED by using block-shaped fluorescent body - Google Patents
Device and method for packaging LED by using block-shaped fluorescent body Download PDFInfo
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- CN108091748B CN108091748B CN201611047341.XA CN201611047341A CN108091748B CN 108091748 B CN108091748 B CN 108091748B CN 201611047341 A CN201611047341 A CN 201611047341A CN 108091748 B CN108091748 B CN 108091748B
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 107
- 230000005291 magnetic effect Effects 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims description 69
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 39
- 239000000741 silica gel Substances 0.000 claims description 39
- 229910002027 silica gel Inorganic materials 0.000 claims description 39
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 230000008569 process Effects 0.000 claims description 16
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000005672 electromagnetic field Effects 0.000 claims description 8
- 238000001723 curing Methods 0.000 claims description 6
- 238000013007 heat curing Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a device and a packaging method for packaging an LED by using a block-shaped fluorescent body, wherein the device comprises: the device comprises a ferromagnetic fixed buckle, an electromagnet and a control part; wherein the ferromagnetic fixing buckle can be embedded with the block-shaped fluorescent body; the control part controls the electrifying or de-electrifying of the electromagnet and controls the electrifying of direct current or alternating current to the electromagnet; the electromagnet is electrically connected with the control part, and under the control of the control part, direct current is supplied to the ferromagnetic fixed buckle to generate a constant magnetic field so as to enable the ferromagnetic fixed buckle to generate a downward electromagnetic force, or alternating current is supplied to the ferromagnetic fixed buckle to generate an alternating magnetic field so as to enable eddy current to be generated inside the ferromagnetic fixed buckle. The device and the method for packaging the LED by the block-shaped fluorescent body realize the production of the LED light source packaged by the block-shaped fluorescent body.
Description
Technical Field
The invention belongs to the technical field of LED packaging, and particularly relates to a device and a method for packaging an LED by using a block-shaped fluorescent body.
Background
The light stability of the high power density LED light source is reduced due to aging of silica gel during operation, and the application of the block-shaped phosphor in the field of LED packaging is considered as an important technical means for solving the problem.
The LED packaging mode of the block fluorescent body is different from the traditional packaging mode, but no mature solution for automatically packaging the LED by the block fluorescent body exists in the industry at present, so that the automatic production efficiency of the LED packaged by the block fluorescent body is affected.
Disclosure of Invention
In order to solve the technical problems, the invention provides a device and a packaging method for packaging an LED by adopting a block-shaped fluorescent body, and the specific scheme is as follows.
An apparatus for encapsulating an LED with a bulk phosphor, comprising: the device comprises a ferromagnetic fixed buckle, an electromagnet and a control part;
wherein the ferromagnetic fixing buckle can be embedded with the block-shaped fluorescent body;
the control part controls the electrifying or de-electrifying of the electromagnet and controls the electrifying of direct current or alternating current to the electromagnet;
the electromagnet is electrically connected with the control part, and under the control of the control part, direct current is supplied to the ferromagnetic fixed buckle to generate a constant magnetic field so as to enable the ferromagnetic fixed buckle to generate a downward electromagnetic force, or alternating current is supplied to the ferromagnetic fixed buckle to generate an alternating magnetic field so as to enable eddy current to be generated inside the ferromagnetic fixed buckle.
Further, the device also comprises a pick-up part and an identification part, wherein the pick-up part picks up and places a workpiece comprising a block-shaped fluorescent body and a ferromagnetic fixing buckle; the identification part identifies the position of the workpiece and sends the identified position information to the control part; the control section receives and processes the position information recognized by the recognition section, and controls the movement of the pickup section based on the position information.
Further, the pick-up part is an industrial robot.
Further, the industrial robot is a four-axis SCARA robot.
Further, a groove capable of being embedded into the block-shaped fluorescent body is formed on the lower surface of the ferromagnetic fixing buckle, and an opening is formed in the groove on the lower surface.
Further, fixed teeth are arranged at two ends of the groove of the ferromagnetic fixed buckle, and the distance between the fixed teeth at two ends is consistent with the external dimension of the LED substrate to be packaged along the same direction.
A packaging method for packaging an LED by using a block-shaped fluorescent body comprises the following steps:
step S1, a mounting and fixing step: placing and fixing a block-shaped fluorescent body at a designated position of an LED substrate to be packaged, wherein the LED substrate is spot-bonded with silica gel;
step S2, a heating and curing step: the adhesive silica gel between the block phosphor and the LED substrate is heated to be cured.
Further, the packaging method is implemented using the apparatus as described above: the LED substrate to be packaged is positioned on the electromagnet, and the block-shaped fluorescent body and the ferromagnetic fixing buckle are arranged on the LED substrate together;
the control part controls the direct current which is conducted to the electromagnet for a period of time, the electromagnet generates a constant magnetic field and provides the constant magnetic field for the ferromagnetic fixing buckle, so that the ferromagnetic fixing buckle generates a downward electromagnetic force to fix the blocky fluorescent body on the LED substrate, and the downward electromagnetic force enables the adhesive silica gel on the LED substrate to diffuse, extrude air and be uniformly distributed on the whole contact surface of the blocky fluorescent body and the LED substrate;
the control part controls to apply a period of alternating current to the electromagnet, the alternating current enables the electromagnet to generate an alternating magnetic field to be provided for the ferromagnetic fixed buckle, the electromagnetic field changes to enable eddy currents to be generated inside the ferromagnetic fixed buckle, and therefore the ferromagnetic fixed buckle is heated, heat is transmitted to the adhesive silica gel through the block-shaped fluorescent body, and the adhesive silica gel is solidified.
Further, the packaging method is implemented by using the device as described above, and the step S1 of mounting and fixing specifically includes the following substeps:
step S11: the identification part acquires the position information of the block-shaped fluorescent body, the control part controls the pick-up part to pick up the ferromagnetic fixed buckle, and the ferromagnetic fixed buckle is placed on the block-shaped fluorescent body according to the position information of the block-shaped fluorescent body acquired by the identification part, so that the block-shaped fluorescent body can be accurately embedded into a groove on the ferromagnetic fixed buckle in the placing process;
step S12: the identification part acquires position information of an LED substrate to be packaged, wherein the LED substrate is dotted with adhesive silica gel and is positioned on an electromagnet; the control part controls the pick-up part to pick up the block-shaped fluorescent body and the ferromagnetic fixed buckle together through the opening on the ferromagnetic fixed buckle, and sends the block-shaped fluorescent body and the ferromagnetic fixed buckle to the LED substrate to be packaged together for placement according to the position information of the LED substrate to be packaged, and the fixed teeth on the ferromagnetic fixed buckle can be ensured to be accurately clamped on two sides of the LED substrate in the placement process;
step S13: the control part controls the direct current which is conducted to the electromagnet for a period of time, the electromagnet generates a constant magnetic field and provides the constant magnetic field for the ferromagnetic fixing buckle, so that the ferromagnetic fixing buckle generates a downward electromagnetic force, the block-shaped fluorescent body embedded in the groove is fixed on the LED substrate, and the downward electromagnetic force enables the adhesive silica gel on the LED substrate to diffuse, extrude air and be uniformly distributed on the whole contact surface of the block-shaped fluorescent body and the LED substrate.
Further, the step S2 of heat curing specifically includes the following substeps:
step S21: the control part controls the electromagnet to be electrified with alternating current for a period of time, the alternating current enables the electromagnet to generate an alternating magnetic field to be provided for the ferromagnetic fixed buckle, the electromagnetic field changes to enable eddy currents to be generated in the ferromagnetic fixed buckle, so that the ferromagnetic fixed buckle is heated, heat is transmitted to the adhesive silica gel through the heating block-shaped fluorescent body, and the adhesive silica gel is solidified;
step S22: the control part controls the direct current which is conducted to the electromagnet for a period of time, the electromagnet generates a constant magnetic field to provide the ferromagnetic fixing buckle, so that the ferromagnetic fixing buckle generates a downward electromagnetic force, the block-shaped fluorescent body embedded in the groove is fixed on the LED substrate, and the downward electromagnetic force enables the adhesive silica gel on the LED substrate to diffuse, extrude air and be uniformly distributed on the whole contact surface of the block-shaped fluorescent body and the LED substrate, thereby preventing air from entering due to retraction of the silica gel layer uniformly pressed in the step S13;
step S23: the steps S21 and S22 are repeatedly performed until the adhesive silicone is completely cured in step S21.
The invention has the beneficial effects that: the device for packaging the LED by the block-shaped fluorescent body provided by the invention realizes the fixation of the block-shaped fluorescent body and the heating and curing of the adhesive silica gel by utilizing the electromagnetic field through the ferromagnetic fixing buckle, thereby realizing the production of the LED light source packaged by the block-shaped fluorescent body. Furthermore, the invention completes the automatic mounting of the block-shaped fluorescent body by using a mechanical arm, thereby realizing the automatic production of the LED light source packaged by the block-shaped fluorescent body.
Drawings
FIG. 1 is a schematic diagram of an apparatus for encapsulating LEDs with a bulk phosphor according to the present invention;
FIG. 2 is a schematic view of a partial enlarged structure of an apparatus for encapsulating LEDs with a block phosphor according to the present invention;
fig. 3 is a flow chart of a method for packaging LEDs using a bulk phosphor according to the present invention.
Detailed Description
The present invention will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent. Those skilled in the art will recognize that the present invention is not limited to the drawings and the following examples.
The device for packaging an LED with a block phosphor according to the present invention, as shown in fig. 1, includes: the device comprises a mechanical arm 1, a ferromagnetic fixing buckle 2, an electromagnet 3, a recognition part 4 and a control part 5.
The mechanical arm 1 is used for picking and placing the ferromagnetic fixing buckle 2, the block fluorescent body 6 and the block fluorescent body 6 embedded in the ferromagnetic fixing buckle 2. The robotic arm is an industrial robot, preferably a four-axis SCARA robot.
The ferromagnetic fixing buckle 2 is made of ferromagnetic materials, and can induce the magnetic field generated by the electromagnet 3. The lower surface of the ferromagnetic fixed buckle 2 is formed with a groove 21 into which the block-shaped fluorescent body 6 can be inserted, and the lower surface is provided with an opening 22 in the groove, when the block-shaped fluorescent body 6 is inserted into the groove 21, the robot arm 1 can suck the block-shaped fluorescent body 6 from above the ferromagnetic fixed buckle 2 through the opening 22, thereby picking up the block-shaped fluorescent body 6 and the ferromagnetic fixed buckle 2 together. Preferably, the two ends of the groove 21 of the ferromagnetic fixing buckle 2 are provided with fixing teeth 23, and the distance between the fixing teeth 23 at the two ends is basically consistent with the external dimension of the LED substrate 7 to be packaged along the same direction. The ferromagnetic fixing buckle 2 can be designed differently according to different LED substrates 7 and block-shaped fluorophores 6, so as to adapt to the requirements of the different LED substrates 7 and block-shaped fluorophores 6 on the appearance and the size of the ferromagnetic fixing buckle 2.
The electromagnet 3 provides a constant magnetic field for the ferromagnetic fixed buckle 2 under the control of the control part 5 to enable the ferromagnetic fixed buckle 2 to generate a downward electromagnetic force, or provides an alternating magnetic field for the ferromagnetic fixed buckle 2 to enable eddy currents to be generated inside the ferromagnetic fixed buckle 2. When the control part 5 supplies direct current to the electromagnet 3, the electromagnet 3 provides a constant magnetic field for the ferromagnetic fixed buckle 2 and provides a piezoelectric magnetic force for the ferromagnetic fixed buckle 2; when the control part 5 supplies alternating current to the electromagnet 3, the electromagnetic field change caused by the alternating current causes eddy current to be generated inside the ferromagnetic fixed buckle 2, so that the ferromagnetic fixed buckle 2 is heated.
The identification unit 4 identifies the position of the block-shaped fluorescent body 6, the ferromagnetic fixing clip 2, and/or the LED board 7, and transmits the identified position information to the control unit 5.
The control part 5 is used for receiving and processing the position information identified by the identification part 4 and controlling the movement of the mechanical arm 1 according to the position information; the control unit 5 is also used for controlling the energization and de-energization of the electromagnet 3 and controlling the energization of the electromagnet with direct current or alternating current.
The method for packaging the LED by adopting the block-shaped fluorescent body provided by the invention comprises the following steps:
step S1, a mounting and fixing step: placing and fixing a block-shaped fluorescent body 6 at a designated position of an LED substrate 7 to be packaged, wherein the LED substrate 7 is spot-bonded with silica gel;
step S2, a heating and curing step: the adhesive silica gel between the block phosphor 6 and the LED substrate 7 is heated and cured.
The method for packaging the LED by using the block-shaped fluorescent body can be realized by using the device for packaging the LED by using the block-shaped fluorescent body, and the step S1 of mounting and fixing specifically comprises the following substeps:
step S11: the identification part 4 acquires the position information of the block-shaped fluorescent body 6, the control part 5 controls the mechanical arm 1 to pick up the ferromagnetic fixed buckle 2, and the ferromagnetic fixed buckle 2 is placed on the block-shaped fluorescent body 6 according to the position information of the block-shaped fluorescent body 6 acquired by the identification part 4, so that the block-shaped fluorescent body 6 can be accurately embedded into the groove 21 on the ferromagnetic fixed buckle 2 in the placing process;
step S12: the identification part 4 acquires the position information of an LED substrate 7 to be packaged, wherein the LED substrate 7 is dotted with adhesive silica gel and is positioned on the electromagnet 3; the control part 5 controls the mechanical arm 1 to pick up the block-shaped fluorescent body 6 and the ferromagnetic fixed buckle 2 together through the opening 22 on the ferromagnetic fixed buckle 2, and sends the block-shaped fluorescent body 6 and the ferromagnetic fixed buckle 2 to the position of the LED substrate 7 to be packaged together according to the position information of the LED substrate 7 to be packaged, which is acquired by the identification part 4, and the fixed teeth 23 on the ferromagnetic fixed buckle 2 can be ensured to be accurately clamped at two sides of the LED substrate 7 in the placing process;
step S13: the control part 5 controls the direct current which is conducted to the electromagnet 3 for a period of time, the electromagnet 3 generates a constant magnetic field to provide for the ferromagnetic fixing buckle 2, so that the ferromagnetic fixing buckle 2 generates a downward electromagnetic force, the block-shaped fluorescent body 6 embedded in the groove 21 is fixed on the LED substrate 7, and the downward electromagnetic force causes the adhesive silica gel on the LED substrate 7 to diffuse, extrude air and be uniformly distributed on the whole contact surface of the block-shaped fluorescent body 6 and the LED substrate 7; because the fixed teeth 23 on the ferromagnetic fixed buckle 2 are accurately clamped at the two sides of the LED substrate 7, the ferromagnetic fixed buckle 2 and the LED substrate 7 cannot relatively displace in the pressing process, so that the massive fluorescent body 6 pressed between the ferromagnetic fixed buckle 2 and the LED substrate 7 cannot displace along with the flowing of adhesive silica gel; after the adhesive silica gel between the block phosphor 6 and the LED substrate 7 is pressed uniformly and air is discharged, the process proceeds to a heat curing step in step S2 described below. The duration of the direct current is set according to the process conditions and the process requirements.
The step S2 of heating and curing specifically comprises the following substeps:
step S21: the control part 5 controls the electromagnet 3 to be electrified with alternating current for a period of time, the alternating current enables the electromagnet 3 to generate an alternating magnetic field to be provided for the ferromagnetic fixed buckle 2, the electromagnetic field changes to enable eddy currents to be generated inside the ferromagnetic fixed buckle 2, so that the ferromagnetic fixed buckle 2 is heated, heat is transmitted to the adhesive silica gel through the block-shaped fluorescent body 6, and the adhesive silica gel is solidified; the duration of the alternating current is set according to the process conditions and the process requirements;
step S22: the control part 5 controls the direct current which is supplied to the electromagnet 3 for a period of time, the electromagnet 3 generates a constant magnetic field to provide the ferromagnetic fixing buckle 2, so that the ferromagnetic fixing buckle 2 generates a downward electromagnetic force, the block-shaped fluorescent body 6 embedded in the groove 21 is fixed on the LED substrate 7, and the downward electromagnetic force causes the adhesive silica gel on the LED substrate 7 to diffuse, extrude air and be uniformly distributed on the whole contact surface of the block-shaped fluorescent body 6 and the LED substrate 7, thereby preventing the retraction of the silica gel layer uniformly pressed in the step S13 to lead the air to enter; the duration of the direct current is set according to the process conditions and the process requirements;
step S23: the steps S21 and S22 are repeatedly performed until the adhesive silicone is completely cured in step S21.
The embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiment. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. An apparatus for encapsulating an LED with a bulk phosphor, comprising: the device comprises a ferromagnetic fixed buckle, an electromagnet and a control part;
wherein the ferromagnetic fixing buckle can be embedded with the block-shaped fluorescent body;
the control part controls the electrifying or de-electrifying of the electromagnet and controls the electrifying of direct current or alternating current to the electromagnet;
the electromagnet is electrically connected with the control part, and under the control of the control part, direct current is supplied to the ferromagnetic fixed buckle to generate a constant magnetic field so as to enable the ferromagnetic fixed buckle to generate a downward electromagnetic force, or alternating current is supplied to the ferromagnetic fixed buckle to generate an alternating magnetic field so as to enable eddy current to be generated inside the ferromagnetic fixed buckle;
wherein, the LED substrate to be packaged is positioned on the electromagnet, and the block-shaped fluorescent body and the ferromagnetic fixed buckle are arranged on the LED substrate together;
the control part controls the direct current which is conducted to the electromagnet for a period of time, the electromagnet generates a constant magnetic field and provides the constant magnetic field for the ferromagnetic fixing buckle, so that the ferromagnetic fixing buckle generates a downward electromagnetic force to fix the blocky fluorescent body on the LED substrate, and the downward electromagnetic force enables the adhesive silica gel on the LED substrate to diffuse, extrude air and be uniformly distributed on the whole contact surface of the blocky fluorescent body and the LED substrate;
the control part controls to apply a period of alternating current to the electromagnet, the alternating current enables the electromagnet to generate an alternating magnetic field to be provided for the ferromagnetic fixed buckle, the electromagnetic field changes to enable eddy currents to be generated inside the ferromagnetic fixed buckle, and therefore the ferromagnetic fixed buckle is heated, heat is transmitted to the adhesive silica gel through the block-shaped fluorescent body, and the adhesive silica gel is solidified.
2. The apparatus of claim 1, further comprising a pick-up portion that picks up and places a workpiece comprising a bulk phosphor and a ferromagnetic securing clasp; the identification part identifies the position of the workpiece and sends the identified position information to the control part; the control section receives and processes the position information recognized by the recognition section, and controls the movement of the pickup section based on the position information.
3. The apparatus of claim 2, wherein the pick-up is an industrial robot.
4. The apparatus of claim 3, wherein the industrial robot is a four-axis SCARA robot.
5. The device of claim 2, wherein the lower surface of the ferromagnetic fixing buckle is formed with a recess into which the block-shaped phosphor can be inserted, and the lower surface is provided with an opening in the recess.
6. The device of claim 5, wherein the two ends of the groove of the ferromagnetic fixing buckle are provided with fixing teeth, and the distance between the fixing teeth at the two ends is consistent with the external dimension of the LED substrate to be packaged along the same direction.
7. A packaging method for packaging an LED with a block phosphor, characterized in that the packaging method is implemented using the device according to any one of claims 1-5, comprising the steps of:
step S1, a mounting and fixing step: placing and fixing a block-shaped fluorescent body at a designated position of an LED substrate to be packaged, wherein the LED substrate is spot-bonded with silica gel;
step S2, a heating and curing step: heating and solidifying the adhesive silica gel between the block fluorescent body and the LED substrate;
the LED substrate to be packaged is positioned on the electromagnet, and the block-shaped fluorescent body and the ferromagnetic fixing buckle are arranged on the LED substrate together;
the control part controls the direct current which is conducted to the electromagnet for a period of time, the electromagnet generates a constant magnetic field and provides the constant magnetic field for the ferromagnetic fixing buckle, so that the ferromagnetic fixing buckle generates a downward electromagnetic force to fix the blocky fluorescent body on the LED substrate, and the downward electromagnetic force enables the adhesive silica gel on the LED substrate to diffuse, extrude air and be uniformly distributed on the whole contact surface of the blocky fluorescent body and the LED substrate;
the control part controls to apply a period of alternating current to the electromagnet, the alternating current enables the electromagnet to generate an alternating magnetic field to be provided for the ferromagnetic fixed buckle, the electromagnetic field changes to enable eddy currents to be generated inside the ferromagnetic fixed buckle, and therefore the ferromagnetic fixed buckle is heated, heat is transmitted to the adhesive silica gel through the block-shaped fluorescent body, and the adhesive silica gel is solidified.
8. A packaging method for packaging an LED with a block phosphor, characterized in that the packaging method is implemented using the apparatus according to claim 6, comprising the steps of:
step S1, a mounting and fixing step: placing and fixing a block-shaped fluorescent body at a designated position of an LED substrate to be packaged, wherein the LED substrate is spot-bonded with silica gel;
step S2, a heating and curing step: heating and solidifying the adhesive silica gel between the block fluorescent body and the LED substrate;
the step S1 of mounting and fixing specifically comprises the following substeps:
step S11: the identification part acquires the position information of the block-shaped fluorescent body, the control part controls the pick-up part to pick up the ferromagnetic fixed buckle, and the ferromagnetic fixed buckle is placed on the block-shaped fluorescent body according to the position information of the block-shaped fluorescent body acquired by the identification part, so that the block-shaped fluorescent body can be accurately embedded into a groove on the ferromagnetic fixed buckle in the placing process;
step S12: the identification part acquires position information of an LED substrate to be packaged, wherein the LED substrate is dotted with adhesive silica gel and is positioned on an electromagnet; the control part controls the pick-up part to pick up the block-shaped fluorescent body and the ferromagnetic fixed buckle together through the opening on the ferromagnetic fixed buckle, and sends the block-shaped fluorescent body and the ferromagnetic fixed buckle to the LED substrate to be packaged together for placement according to the position information of the LED substrate to be packaged, and the fixed teeth on the ferromagnetic fixed buckle can be ensured to be accurately clamped on two sides of the LED substrate in the placement process;
step S13: the control part controls the direct current which is conducted to the electromagnet for a period of time, the electromagnet generates a constant magnetic field and provides the constant magnetic field for the ferromagnetic fixing buckle, so that the ferromagnetic fixing buckle generates a downward electromagnetic force, the block-shaped fluorescent body embedded in the groove is fixed on the LED substrate, and the downward electromagnetic force enables the adhesive silica gel on the LED substrate to diffuse, extrude air and be uniformly distributed on the whole contact surface of the block-shaped fluorescent body and the LED substrate.
9. The packaging method according to claim 8, wherein the step S2 of heat curing comprises the following sub-steps:
step S21: the control part controls the electromagnet to be electrified with alternating current for a period of time, the alternating current enables the electromagnet to generate an alternating magnetic field to be provided for the ferromagnetic fixed buckle, the electromagnetic field changes to enable eddy currents to be generated in the ferromagnetic fixed buckle, so that the ferromagnetic fixed buckle is heated, heat is transmitted to the adhesive silica gel through the heating block-shaped fluorescent body, and the adhesive silica gel is solidified;
step S22: the control part controls the direct current which is conducted to the electromagnet for a period of time, the electromagnet generates a constant magnetic field to provide the ferromagnetic fixing buckle, so that the ferromagnetic fixing buckle generates a downward electromagnetic force, the block-shaped fluorescent body embedded in the groove is fixed on the LED substrate, and the downward electromagnetic force enables the adhesive silica gel on the LED substrate to diffuse, extrude air and be uniformly distributed on the whole contact surface of the block-shaped fluorescent body and the LED substrate, thereby preventing air from entering due to retraction of the silica gel layer uniformly pressed in the step S13;
step S23: the steps S21 and S22 are repeatedly performed until the adhesive silicone is completely cured in step S21.
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| CN201611047341.XA CN108091748B (en) | 2016-11-23 | 2016-11-23 | Device and method for packaging LED by using block-shaped fluorescent body |
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| CN201611047341.XA CN108091748B (en) | 2016-11-23 | 2016-11-23 | Device and method for packaging LED by using block-shaped fluorescent body |
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| JP2015021102A (en) * | 2013-07-22 | 2015-02-02 | 豊田合成株式会社 | Magnetic phosphor particle, wavelength conversion member and method for manufacturing light emitting device |
| CN104801810A (en) * | 2014-01-27 | 2015-07-29 | 三星电机株式会社 | Reflow apparatus |
| JP2015185762A (en) * | 2014-03-25 | 2015-10-22 | スタンレー電気株式会社 | Manufacturing method and manufacturing apparatus of semiconductor light emitting device |
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