WO2008023494A1 - microlentilles, dispositif d'imagerie, et dispositif terminal portable - Google Patents

microlentilles, dispositif d'imagerie, et dispositif terminal portable Download PDF

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Publication number
WO2008023494A1
WO2008023494A1 PCT/JP2007/062290 JP2007062290W WO2008023494A1 WO 2008023494 A1 WO2008023494 A1 WO 2008023494A1 JP 2007062290 W JP2007062290 W JP 2007062290W WO 2008023494 A1 WO2008023494 A1 WO 2008023494A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging device
microlens
present
light
subject
Prior art date
Application number
PCT/JP2007/062290
Other languages
English (en)
Japanese (ja)
Inventor
Tsukuru Maruyama
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2008023494A1 publication Critical patent/WO2008023494A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G02B3/0068—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof

Definitions

  • Microlens, imaging device, and portable terminal device are Microlens, imaging device, and portable terminal device
  • the present invention relates to a microlens provided in a solid-state imaging device, an imaging device using the microlens, and a portable terminal device.
  • a conventional imaging device includes a solid-state imaging device such as a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). Yes.
  • CMOS complementary metal-oxide semiconductor
  • a microlens is provided in each light receiving portion in order to increase the light collection efficiency of the light receiving portion.
  • the solid-state imaging device since the solid-state imaging device has high sensitivity to infrared rays longer than visible light, it is necessary to block incident infrared rays in order to realize natural color reproduction.
  • a conventional solid-state imaging device includes a flat-plate reflective infrared cut filter coated with a multilayer thin film, an absorption infrared cut filter that is doped with divalent copper ions and absorbs infrared light, and the like. It was installed in front of the camera and was designed to block incident infrared rays.
  • Patent Document 1 a thin film coat of an infrared blocking dielectric multilayer film is formed on the surface of a microlens so that incident infrared rays can be blocked.
  • Patent Document 2 provides an infrared absorption layer formed of a resin coating solution having an infrared absorption function on the surface of a microlens or the surface of a solid-state imaging device, thereby making incident infrared rays. It can be blocked. Therefore, the ones disclosed in Patent Documents 1 and 2 can eliminate the infrared cut filter, and thus can reduce the size of the imaging apparatus.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2004-139035
  • Patent Document 2 JP 2004-200360 A
  • Patent Document 1 since the microlens is configured to be relatively small so as to correspond to each pixel of the fixed image sensor, the one disclosed in Patent Document 1 has a thin film coat of an infrared shielding dielectric multilayer film. It is difficult to apply with high accuracy, and the filter characteristics by blocking infrared rays are not sufficient ⁇ and ⁇ If the filter characteristics change according to the problem and the incident angle of the light incident on the micro lens ⁇ There was a problem.
  • Patent Document 2 it is known that an infrared absorption layer formed of a resin coating solution having an infrared absorption function has a problem in heat resistance, for example, When reflow soldering a solid-state image sensor on a mounting board at a temperature of 200 ° C or higher, there was a problem that the absorption characteristics of infrared rays deteriorated.
  • the present invention has been made to solve the conventional problems, and a microlens whose filter characteristics do not depend on the incident angle of incident light and has higher heat resistance than the conventional one, and this An object of the present invention is to provide an imaging device and a mobile terminal device using a clo lens. Means for solving the problem
  • the microlens of the present invention is provided in a solid-state imaging device that images a subject.
  • the glass material includes a component that absorbs infrared rays. .
  • the microlens of the present invention is formed of a glass material containing a component that absorbs infrared rays. Therefore, unlike the conventional multilayer film, the filter characteristic has an incident angle of incident light. In addition, the heat resistance is superior to the conventional one.
  • the microlens of the present invention has a configuration in which the shape with respect to the optical axis on which light from the subject is incident is spherical! / Speak.
  • the microlens of the present invention reduces the loss of incident light and has an infrared cut function.
  • the microlens of the present invention may have a configuration in which a shape with respect to an optical axis on which light from the subject is incident is an aspherical shape. With this configuration, the microlens of the present invention can reduce image quality degradation of a subject image.
  • the imaging apparatus of the present invention has a configuration including a microlens and an imaging optical system that forms a subject image by irradiating light from the subject.
  • the imaging apparatus of the present invention includes the microlens whose filter characteristics do not depend on the incident angle of incident light and has better heat resistance than the conventional one, so that the color reproduction than the conventional one is achieved. A good subject image can be obtained, and deterioration of infrared absorption characteristics due to heating in the reflow soldering process can be prevented.
  • the mobile terminal device of the present invention has a configuration including an imaging device.
  • the mobile terminal device of the present invention can improve the user authentication accuracy over the conventional one by obtaining a subject image with better color reproducibility than the conventional one.
  • the present invention provides a microlens whose filter characteristics do not depend on the incident angle of incident light and has better heat resistance than conventional ones, and an imaging device and a portable terminal device using the microlens. It is something that can be done.
  • FIG. 1 is a conceptual diagram showing a configuration example of a main part of an imaging apparatus according to the present invention.
  • FIG. 2 is a conceptual diagram showing a configuration example of a solid-state image sensor in an imaging device according to the present invention.
  • FIG. 2 (a) is a conceptual plan view of a solid-state imaging device according to the present invention.
  • FIG. 2 (b) is a conceptual cross-sectional view of a solid-state imaging device according to the present invention.
  • FIG. 2 (c) is a conceptual cross-sectional view of another aspect of the solid-state imaging device according to the present invention.
  • FIG. 3 is a diagram showing spectral characteristics of a conventional imaging device.
  • FIG. 4 is a diagram showing the spectral characteristics of the imaging apparatus according to the present invention.
  • FIG. 5 is a conceptual diagram showing a configuration example of a mobile phone device according to the present invention.
  • Optical aperture 12 (12a, 12b) lens (imaging optics)
  • an imaging apparatus 10 includes an optical aperture 11 that adjusts the amount of light from a subject, and a lens 12 (including 12a and 12b) that collects the subject light. And a solid-state imaging device 20.
  • FIG. 1 is a conceptual diagram of the main part of the imaging device 10.
  • the imaging device 10 is configured in detail as follows.
  • the optical aperture 11 is formed of a shielding plate that limits the range of light rays to be transmitted in order to improve imaging performance.
  • the lens 12 is formed of, for example, a glass or plastic material, and captures a subject image as a solid image. An image is formed on a light receiving portion (not shown) of the element 20.
  • the lens 12 constitutes the imaging optical system of the present invention.
  • the solid-state imaging device 20 includes a microlens array 21 provided on a surface on the subject side, and an imaging unit 22 that images the subject.
  • the imaging unit 22 is composed of, for example, a CCD or CMOS image sensor, and has a plurality of pixels arranged in a matrix. 32mm) and includes 1.3 million pixel bay array elements.
  • the solid-state imaging device 20 is configured as shown in FIG. Fig. 2 (a) is a plan view showing a conceptual configuration of the solid-state imaging device 20, Fig. 2 (b) is a sectional view conceptually showing a partial cross-section of the solid-state imaging device 20, and Fig. 2 (c) is a solid-state imaging. 12 is a cross-sectional view conceptually showing a partial cross section of another aspect of the element 20.
  • FIG. Fig. 2 (a) is a plan view showing a conceptual configuration of the solid-state imaging device 20
  • Fig. 2 (b) is a sectional view conceptually showing a partial cross-section of the solid-state imaging device 20
  • Fig. 2 (c) is a solid-state imaging.
  • 12 is a cross-sectional view conceptually showing a partial cross section of another aspect of the element 20.
  • the microlens array 21 includes a plurality of microlenses 21a arranged in a matrix.
  • the imaging unit 22 includes a color filter 22a, a light shielding layer 22b, and a pixel 22c.
  • Each of the microlenses 21a is formed in a convex lens shape having a certain curvature on the surface on which the subject light is incident and the surface on the imaging unit 22 side, and is provided at a position corresponding to each pixel 22c. Therefore, the light collection rate of the subject light incident on each pixel 22c is increased.
  • the shape of the microlens 21a is not limited to that shown in FIG. 2 (b) .For example, as shown in FIG. The surface on the part 22 side may be planar.
  • the microlens 21a can be manufactured by the same glass transfer method as that of a normal glass forming lens.
  • the microlens 21a is formed using a glass material containing a component that absorbs infrared rays, for example, a glass material doped with divalent copper ions, and has a function of an infrared cut filter.
  • a glass material containing a component that absorbs infrared rays for example, a glass material doped with divalent copper ions, and has a function of an infrared cut filter.
  • specific glass materials for example, BS series from Matsunami Glass Industrial Co., Ltd., NF-50 from Asahi Techno Glass Co., Ltd. can be used.
  • Fig. 3 shows the transmittance data for light wavelengths with incident angles of 0, 10, 20, and 30 degrees. In the conventional device, the transmittance varies depending on the incident angle of the incident light. is doing.
  • the spectral characteristics of the microlens 21a according to the present embodiment have characteristics that do not depend on the incident angle of incident light, as shown in FIG.
  • the microlens 21a in the present embodiment is configured using a glass material containing a component that absorbs infrared rays, the microlens 21a is more than the conventional one in which an infrared ray absorbing layer is formed with a resin coating solution having an infrared absorption function.
  • the infrared absorption characteristics will not deteriorate.
  • FIG. 1 is a conceptual diagram showing the main part of the imaging device 10.
  • the force imaging device 10 includes a mechanism part and an electric circuit part (not shown) as a configuration other than the main part. Yes.
  • the mechanism include a lens adjustment mechanism that is attached to the lens 12 and adjusts the focus and angle of view of the subject image.
  • Examples of the electric circuit unit include a drive circuit that drives each mechanism unit and a pulse generation circuit that generates a timing pulse for driving the solid-state imaging device 20.
  • the subject light passes through the optical aperture 11 and enters the lens 12.
  • the subject light is collected by the lens 12 and emitted to the microlens array 21.
  • the infrared light component of the subject light incident on the microlens array 21 is absorbed by the microlens 21 a and is condensed on the pixel 22 c of the imaging unit 22.
  • the solid-state image pickup device 20 outputs data of a subject image with good image quality that is superior in color reproducibility than the conventional one.
  • each microlens 21a constituting the microlens array 21 is configured with a glass material containing a component that absorbs infrared rays. As a result, spectral characteristics that do not depend on the incident angle can be obtained. It is possible to prevent blurring of the contour of the subject image due to the influence, redness on the entire subject image, and the like, and improve the image quality of the subject image.
  • the imaging apparatus 10 in the present embodiment unlike the conventional apparatus, there is no need for a space for providing a reflective infrared cut filter, an absorption infrared cut filter, or the like. Can be miniaturized.
  • the microlens 21a in the present embodiment is configured using a glass material containing a component that absorbs infrared rays
  • a conventional infrared absorption layer is formed with a resin coating solution having an infrared absorption function. It can improve the heat resistance compared to other devices, and the infrared absorption characteristics will not deteriorate even if the solid-state image sensor 20 or electronic components are reflow soldered on the mounting board at a temperature of 200 ° C or higher. ⁇ .
  • the configuration of the imaging device in the present embodiment is different from the imaging device 10 (see FIG. 1) in the first embodiment in the shape of the microlens constituting the microlens array. That is, the imaging device 10 in the first embodiment includes the microlens 21a formed in a convex lens shape having a constant curvature.
  • the imaging device in the present embodiment has a microlens shape as an axis. It is characterized by a symmetric aspherical surface.
  • the configuration other than the microlens is the same as that of the imaging device 10 in the first embodiment, and a description thereof is omitted.
  • the shape of the microlens in the present embodiment is an aspherical lens generally represented by a high-order polynomial in equation (1).
  • Z is the coordinate in the optical axis direction of the microlens
  • r is the coordinate from the optical axis in the radial direction of the microphone lens
  • c is the curvature at the apex of the microlens
  • K and An are aspheric coefficients
  • the optical performance of the imaging apparatus according to the present embodiment is that the performance of the lens 12 is a major force.
  • the shape of the micro lens is a general aspheric lens
  • the imaging apparatus in this embodiment can reduce the aberration and improve the image quality of the subject image.
  • a mobile phone device as a mobile terminal device according to the present invention will be described.
  • a mobile phone device 30 in the present embodiment is obtained by mounting the imaging device 10 in the first embodiment on a known mobile phone device with a camera.
  • the mobile phone device 30 includes the imaging device 10 that captures an image of the subject, the upper housing 31, the lower housing 32, and the hinge portion 33 that connects the upper housing 31 and the lower housing 32.
  • the cellular phone device 30 in the present embodiment includes the imaging device 10 in the first embodiment, so that when used as a camera, spectral characteristics independent of the incident angle can be obtained.
  • the mobile phone device 30 is configured such that the upper housing 31 and the lower housing 32 can be folded via a hinge 33, and the mobile phone device 30 is shown in FIG.
  • the imaging device 10 can take an image of the user of the mobile phone device 30 in the opened state.
  • the mobile phone device 30 has a face image authentication function for authenticating whether or not the person is a person registered in advance as a regular user based on the user's imaging data acquired by the imaging device 10. Security is ensured so that only authorized persons can use it.
  • the imaging apparatus 10 can acquire subject image data with good image quality that is superior in color reproducibility than the conventional one.
  • Mobile phone device 30 in the form of It can be carried out.
  • the cellular phone device 30 according to the present embodiment includes the imaging device 10 as described above, the function of the face image authentication can be more complicated than that of the conventional device, thereby further improving the security. Even in such a case, the convenience as a mobile phone device cannot be reduced!
  • the imaging device 10 is provided, so that when used as a camera, spectral characteristics that do not depend on the incident angle can be obtained. At the same time, it is possible to prevent blurring of the contour of the subject image due to the influence of infrared rays, redness on the entire subject image, and the like, thereby improving the image quality of the subject image.
  • the imaging device 10 that can improve the image quality of the subject image is provided, the accuracy is higher in a shorter time than the conventional one. Authentication can be performed.
  • the imaging device 10 that does not require a space for providing a reflective infrared cut filter, an absorption infrared cut filter, or the like is provided. Therefore, it is possible to reduce the size of the apparatus.
  • the mobile phone device 30 has a configuration in which the upper housing 31 and the lower housing 32 can be folded via the hinge 33, and the imaging device 10 is the upper housing.
  • the present invention is not limited to this and can be applied to various types of portable information devices. For example, it can be applied to PDAs (Personal Digital Assistants), personal computers, and portable information devices such as personal computer external devices.
  • PDAs Personal Digital Assistants
  • personal computers Personal computers
  • portable information devices such as personal computer external devices.
  • the imaging device 10 of the present invention can also be applied to these cameras.
  • the imaging apparatus of the present invention can be applied to devices such as DSCs (digital still cameras) and camcorders that place importance on color reproducibility, and devices such as surveillance cameras that place importance on improving visibility. Can be applied to reduce the size of these devices.
  • the filter characteristics depend on the incident angle of incident light. It has an effect that it has better heat resistance than conventional ones, and is useful as a microlens provided in a solid-state image sensor, an imaging device using the microlens, a portable terminal device, and the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)

Abstract

L'invention concerne des microlentilles présentant des caractéristiques de filtre non liées à l'angle incident de la lumière incidente et présentant des caractéristiques de résistance thermique supérieures aux produits conventionnels, et un dispositif d'imagerie et un dispositif terminal portable utilisant les microlentilles. Le dispositif d'imagerie (10) présente une ouverture optique (11) pour régler la quantité de lumière provenant d'un objet, une lentille (12) permettant de recueillir la lumière provenant de l'objet, et un élément d'imagerie solide (20). L'élément d'imagerie solide (20) possède des microlentilles (21a) disposées selon unmotif matriciel. Les microlentilles (21a) sont réalisées en utilisant un matériau de verre contenant un composant absorbant les infrarouges et possèdent une fonction de filtre de blocage des infrarouges.
PCT/JP2007/062290 2006-08-22 2007-06-19 microlentilles, dispositif d'imagerie, et dispositif terminal portable WO2008023494A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-225436 2006-08-22
JP2006225436A JP2008051877A (ja) 2006-08-22 2006-08-22 マイクロレンズ、撮像装置及び携帯端末装置

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Publication Number Publication Date
WO2008023494A1 true WO2008023494A1 (fr) 2008-02-28

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WO (1) WO2008023494A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102740088A (zh) * 2011-04-06 2012-10-17 云南北方奥雷德光电科技股份有限公司 一种便携式3d播放终端
WO2014091076A1 (fr) * 2012-12-12 2014-06-19 Ledil Oy Surface optique, lentille, réflecteur, agencement optique et illuminateur
CN104749739A (zh) * 2015-04-08 2015-07-01 浙江舜宇光学有限公司 一种阵列式镜头的组装方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009119478A1 (ja) * 2008-03-27 2011-07-21 コニカミノルタオプト株式会社 光学素子集合体、撮像モジュール及び電子機器の製造方法
JP5597979B2 (ja) * 2009-12-03 2014-10-01 凸版印刷株式会社 表示体及び表示体付き物品
KR101730142B1 (ko) * 2010-04-10 2017-04-25 엘지이노텍 주식회사 조명 유닛용 렌즈
KR20200076937A (ko) 2018-12-20 2020-06-30 삼성전자주식회사 후면조사형 이미지 센서 및 이를 포함하는 전자 기기

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2004200360A (ja) * 2002-12-18 2004-07-15 Toppan Printing Co Ltd 固体撮像素子及びその製造方法
JP2005082406A (ja) * 2003-09-04 2005-03-31 Hoya Corp 精密プレス成形用プリフォームおよびその製造方法並びに光学素子およびその製造方法
JP2006066912A (ja) * 2004-08-24 2006-03-09 Agilent Technol Inc 統合型電気光学デバイスを含むイメージセンサ及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200360A (ja) * 2002-12-18 2004-07-15 Toppan Printing Co Ltd 固体撮像素子及びその製造方法
JP2005082406A (ja) * 2003-09-04 2005-03-31 Hoya Corp 精密プレス成形用プリフォームおよびその製造方法並びに光学素子およびその製造方法
JP2006066912A (ja) * 2004-08-24 2006-03-09 Agilent Technol Inc 統合型電気光学デバイスを含むイメージセンサ及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102740088A (zh) * 2011-04-06 2012-10-17 云南北方奥雷德光电科技股份有限公司 一种便携式3d播放终端
WO2014091076A1 (fr) * 2012-12-12 2014-06-19 Ledil Oy Surface optique, lentille, réflecteur, agencement optique et illuminateur
CN104749739A (zh) * 2015-04-08 2015-07-01 浙江舜宇光学有限公司 一种阵列式镜头的组装方法

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