WO2008016725A3 - Heat pipe with nanotstructured wicking material - Google Patents

Heat pipe with nanotstructured wicking material Download PDF

Info

Publication number
WO2008016725A3
WO2008016725A3 PCT/US2007/063337 US2007063337W WO2008016725A3 WO 2008016725 A3 WO2008016725 A3 WO 2008016725A3 US 2007063337 W US2007063337 W US 2007063337W WO 2008016725 A3 WO2008016725 A3 WO 2008016725A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat pipe
wicking material
nanotstructured
nanostructured
wick
Prior art date
Application number
PCT/US2007/063337
Other languages
French (fr)
Other versions
WO2008016725A2 (en
Inventor
Youssef M Habib
Lyman H Rickard
John G Bryan
John W Steinbeck
Original Assignee
Illuminex Corp
Youssef M Habib
Lyman H Rickard
John G Bryan
John W Steinbeck
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illuminex Corp, Youssef M Habib, Lyman H Rickard, John G Bryan, John W Steinbeck filed Critical Illuminex Corp
Priority to EP07840139A priority Critical patent/EP1996887A2/en
Priority to US12/281,511 priority patent/US20100200199A1/en
Priority to CA002657423A priority patent/CA2657423A1/en
Publication of WO2008016725A2 publication Critical patent/WO2008016725A2/en
Publication of WO2008016725A3 publication Critical patent/WO2008016725A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Abstract

A heat pipe with a nanostructured wick is disclosed, with the method of forming the nanostructured wick on a metal substrate. The wicking material is a pattern of metallic nanostructures in the form of bristles or nanowires attached to a substrate, where the bristles are substantially freestanding.
PCT/US2007/063337 2006-03-03 2007-03-05 Heat pipe with nanotstructured wicking material WO2008016725A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07840139A EP1996887A2 (en) 2006-03-03 2007-03-05 Heat pipe with nanotstructured wicking material
US12/281,511 US20100200199A1 (en) 2006-03-03 2007-03-05 Heat Pipe with Nanostructured Wick
CA002657423A CA2657423A1 (en) 2006-03-03 2007-03-05 Heat pipe with nano-structured wicking material

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US77887306P 2006-03-03 2006-03-03
US66/778,873 2006-03-03
US88839107P 2007-02-06 2007-02-06
US60/888,391 2007-02-06

Publications (2)

Publication Number Publication Date
WO2008016725A2 WO2008016725A2 (en) 2008-02-07
WO2008016725A3 true WO2008016725A3 (en) 2008-08-07

Family

ID=42537808

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/063337 WO2008016725A2 (en) 2006-03-03 2007-03-05 Heat pipe with nanotstructured wicking material

Country Status (4)

Country Link
US (1) US20100200199A1 (en)
EP (1) EP1996887A2 (en)
CA (1) CA2657423A1 (en)
WO (1) WO2008016725A2 (en)

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DE102008045072A1 (en) * 2008-08-29 2010-03-04 Robert Bosch Gmbh Cooling device manufacturing method, involves providing model of coolant channel, enclosing model with heat sink material for forming heat sink, and removing model from heat sink for forming coolant channel in heat sink
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US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
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CN101891245B (en) * 2010-07-16 2012-01-11 重庆大学 Method for preparing titanium dioxide nano-rod array materials at low temperature
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US8839659B2 (en) * 2010-10-08 2014-09-23 Board Of Trustees Of Northern Illinois University Sensors and devices containing ultra-small nanowire arrays
US20120147513A1 (en) * 2010-12-13 2012-06-14 Laird Carl P In-Line Static Electricity Removal Grounding Device
US8723205B2 (en) 2011-08-30 2014-05-13 Abl Ip Holding Llc Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism
US8759843B2 (en) 2011-08-30 2014-06-24 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
US8710526B2 (en) 2011-08-30 2014-04-29 Abl Ip Holding Llc Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
KR101225704B1 (en) * 2011-11-04 2013-01-23 잘만테크 주식회사 Evaporator for the looped heat pipe system and method for manufacturing thereof
US10371468B2 (en) * 2011-11-30 2019-08-06 Palo Alto Research Center Incorporated Co-extruded microchannel heat pipes
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US9618465B2 (en) 2013-05-01 2017-04-11 Board Of Trustees Of Northern Illinois University Hydrogen sensor
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JP2015169411A (en) * 2014-03-10 2015-09-28 富士通株式会社 Heat transport device and method of manufacturing thereof, and electronic equipment
US10660236B2 (en) 2014-04-08 2020-05-19 General Electric Company Systems and methods for using additive manufacturing for thermal management
CN104075604A (en) * 2014-07-17 2014-10-01 芜湖长启炉业有限公司 Superconductor with multiple U-shaped heat pipes in same cavity
US10731925B2 (en) 2014-09-17 2020-08-04 The Regents Of The University Of Colorado, A Body Corporate Micropillar-enabled thermal ground plane
US9921004B2 (en) 2014-09-15 2018-03-20 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US20160108301A1 (en) * 2014-10-16 2016-04-21 Hudson Gencheng Shou High-efficiency coolant for electronic systems
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US10356945B2 (en) 2015-01-08 2019-07-16 General Electric Company System and method for thermal management using vapor chamber
US10704794B2 (en) 2015-04-07 2020-07-07 Brown University Apparatus and method for passively cooling an interior
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US9909448B2 (en) 2015-04-15 2018-03-06 General Electric Company Gas turbine engine component with integrated heat pipe
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US10746478B2 (en) * 2015-12-11 2020-08-18 California Institute Of Technology Silicon biporous wick for high heat flux heat spreaders
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US10209009B2 (en) 2016-06-21 2019-02-19 General Electric Company Heat exchanger including passageways
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Also Published As

Publication number Publication date
EP1996887A2 (en) 2008-12-03
CA2657423A1 (en) 2008-02-07
US20100200199A1 (en) 2010-08-12
WO2008016725A2 (en) 2008-02-07

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