TW200626863A - Wick structure, method of manufacturing the wick structure, and heat pipe - Google Patents
Wick structure, method of manufacturing the wick structure, and heat pipeInfo
- Publication number
- TW200626863A TW200626863A TW094102627A TW94102627A TW200626863A TW 200626863 A TW200626863 A TW 200626863A TW 094102627 A TW094102627 A TW 094102627A TW 94102627 A TW94102627 A TW 94102627A TW 200626863 A TW200626863 A TW 200626863A
- Authority
- TW
- Taiwan
- Prior art keywords
- wick structure
- mesh layer
- branches
- heat pipe
- manufacturing
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Abstract
A wick structure for a heat pipe includes a mesh layer woven by metal wires. The metal wires have a number of branches formed on the surfaces thereof. The branches can reduce the size of the mesh holes of the mesh layer, thereby improving the capillary force of the wick structure. A method of forming the branches is to spray an amount of metal powder on the mesh layer while the mesh layer is being heated. An alternative method of forming the branches is to pressingly place a heated mesh layer on a worktable that has an amount of metal powder disposed thereon, so that the metal powder is attached on the mesh layer.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094102627A TWI275765B (en) | 2005-01-28 | 2005-01-28 | Wick structure, method of manufacturing the wick structure, and heat pipe |
US11/164,457 US20060196641A1 (en) | 2005-01-28 | 2005-11-23 | Screen mesh wick and method for producing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094102627A TWI275765B (en) | 2005-01-28 | 2005-01-28 | Wick structure, method of manufacturing the wick structure, and heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200626863A true TW200626863A (en) | 2006-08-01 |
TWI275765B TWI275765B (en) | 2007-03-11 |
Family
ID=36943017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094102627A TWI275765B (en) | 2005-01-28 | 2005-01-28 | Wick structure, method of manufacturing the wick structure, and heat pipe |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060196641A1 (en) |
TW (1) | TWI275765B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105588464A (en) * | 2014-11-14 | 2016-05-18 | 富瑞精密组件(昆山)有限公司 | Capillary wire, capillary structure and heat pipe |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI259895B (en) * | 2005-03-18 | 2006-08-11 | Foxconn Tech Co Ltd | Heat pipe |
US20060260786A1 (en) * | 2005-05-23 | 2006-11-23 | Faffe Limited | Composite wick structure of heat pipe |
KR100795753B1 (en) * | 2006-06-26 | 2008-01-21 | (주)셀시아테크놀러지스한국 | Flat type heat transfer device and its manufacturing method |
ITMI20071332A1 (en) * | 2007-07-04 | 2009-01-05 | Fic S P A | RADIATOR, PARTICULARLY FOR HEATING OR SIMILAR SYSTEMS, AT HIGH THERMAL PERFORMANCES AND AT HIGH OPERATING SILENCE. |
WO2009049397A1 (en) * | 2007-10-19 | 2009-04-23 | Metafoam Technologies Inc. | Heat management device using inorganic foam |
US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
TW201036527A (en) * | 2009-03-19 | 2010-10-01 | Acbel Polytech Inc | Large-area liquid-cooled heat-dissipation device |
CN101900507B (en) * | 2010-01-15 | 2011-12-21 | 富瑞精密组件(昆山)有限公司 | Flat and thin type heat pipe |
US20120048517A1 (en) * | 2010-08-31 | 2012-03-01 | Kunshan Jue-Chung Electronics Co., | Heat pipe with composite wick structure |
TWI428554B (en) | 2011-09-30 | 2014-03-01 | Foxconn Tech Co Ltd | Heat pipe |
TW201525398A (en) * | 2013-12-25 | 2015-07-01 | Hao Pai | Wick structure having braided flat fiber and ultrathin heat pipe having the same |
JP6477254B2 (en) | 2014-05-30 | 2019-03-06 | 三菱マテリアル株式会社 | Porous aluminum composite and method for producing porous aluminum composite |
JP6237500B2 (en) * | 2014-07-02 | 2017-11-29 | 三菱マテリアル株式会社 | Porous aluminum heat exchange member |
US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
CN109773434A (en) * | 2014-09-17 | 2019-05-21 | 科罗拉多州立大学董事会法人团体 | Enable the hot ground plane of microtrabeculae |
CN110192273B (en) | 2016-11-08 | 2023-07-28 | 开尔文热技术股份有限公司 | Method and apparatus for spreading high heat flux in a thermal ground plane |
CN110763057A (en) * | 2019-10-16 | 2020-02-07 | 东莞领杰金属精密制造科技有限公司 | Ultrathin heat pipe and manufacturing method thereof |
EP3812684B1 (en) * | 2019-10-24 | 2023-06-07 | Albakri, Sami Abdulrahman A. | Planar heat transfer device, use thereof and method for its manufacture |
KR102168097B1 (en) * | 2020-01-21 | 2020-10-20 | 에이블메탈 주식회사 | Sintering hybrid wick based screen mesh and method for manufacturing thereof |
WO2021258028A1 (en) | 2020-06-19 | 2021-12-23 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
KR102568890B1 (en) * | 2020-10-12 | 2023-08-21 | 한국항공대학교산학협력단 | Manufacturing method for low temperature sintering hybrid wick, hybrid wick and heat pipe including the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4565243A (en) * | 1982-11-24 | 1986-01-21 | Thermacore, Inc. | Hybrid heat pipe |
US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
US4964457A (en) * | 1988-10-24 | 1990-10-23 | The United States Of America As Represented By The Secretary Of The Air Force | Unidirectional heat pipe and wick |
US6460612B1 (en) * | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
US20050247435A1 (en) * | 2004-04-21 | 2005-11-10 | Hul-Chun Hsu | Wick structure of heat pipe |
US6997243B2 (en) * | 2004-04-23 | 2006-02-14 | Hul-Chun Hsu | Wick structure of heat pipe |
WO2006007721A1 (en) * | 2004-07-21 | 2006-01-26 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
-
2005
- 2005-01-28 TW TW094102627A patent/TWI275765B/en active
- 2005-11-23 US US11/164,457 patent/US20060196641A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105588464A (en) * | 2014-11-14 | 2016-05-18 | 富瑞精密组件(昆山)有限公司 | Capillary wire, capillary structure and heat pipe |
Also Published As
Publication number | Publication date |
---|---|
US20060196641A1 (en) | 2006-09-07 |
TWI275765B (en) | 2007-03-11 |
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