TW200626863A - Wick structure, method of manufacturing the wick structure, and heat pipe - Google Patents

Wick structure, method of manufacturing the wick structure, and heat pipe

Info

Publication number
TW200626863A
TW200626863A TW094102627A TW94102627A TW200626863A TW 200626863 A TW200626863 A TW 200626863A TW 094102627 A TW094102627 A TW 094102627A TW 94102627 A TW94102627 A TW 94102627A TW 200626863 A TW200626863 A TW 200626863A
Authority
TW
Taiwan
Prior art keywords
wick structure
mesh layer
branches
heat pipe
manufacturing
Prior art date
Application number
TW094102627A
Other languages
Chinese (zh)
Other versions
TWI275765B (en
Inventor
Chu-Wan Hong
Ching-Tai Cheng
Jung-Yuan Wu
Chang-Ting Lo
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW094102627A priority Critical patent/TWI275765B/en
Priority to US11/164,457 priority patent/US20060196641A1/en
Publication of TW200626863A publication Critical patent/TW200626863A/en
Application granted granted Critical
Publication of TWI275765B publication Critical patent/TWI275765B/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Abstract

A wick structure for a heat pipe includes a mesh layer woven by metal wires. The metal wires have a number of branches formed on the surfaces thereof. The branches can reduce the size of the mesh holes of the mesh layer, thereby improving the capillary force of the wick structure. A method of forming the branches is to spray an amount of metal powder on the mesh layer while the mesh layer is being heated. An alternative method of forming the branches is to pressingly place a heated mesh layer on a worktable that has an amount of metal powder disposed thereon, so that the metal powder is attached on the mesh layer.
TW094102627A 2005-01-28 2005-01-28 Wick structure, method of manufacturing the wick structure, and heat pipe TWI275765B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094102627A TWI275765B (en) 2005-01-28 2005-01-28 Wick structure, method of manufacturing the wick structure, and heat pipe
US11/164,457 US20060196641A1 (en) 2005-01-28 2005-11-23 Screen mesh wick and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094102627A TWI275765B (en) 2005-01-28 2005-01-28 Wick structure, method of manufacturing the wick structure, and heat pipe

Publications (2)

Publication Number Publication Date
TW200626863A true TW200626863A (en) 2006-08-01
TWI275765B TWI275765B (en) 2007-03-11

Family

ID=36943017

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102627A TWI275765B (en) 2005-01-28 2005-01-28 Wick structure, method of manufacturing the wick structure, and heat pipe

Country Status (2)

Country Link
US (1) US20060196641A1 (en)
TW (1) TWI275765B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105588464A (en) * 2014-11-14 2016-05-18 富瑞精密组件(昆山)有限公司 Capillary wire, capillary structure and heat pipe

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI259895B (en) * 2005-03-18 2006-08-11 Foxconn Tech Co Ltd Heat pipe
US20060260786A1 (en) * 2005-05-23 2006-11-23 Faffe Limited Composite wick structure of heat pipe
KR100795753B1 (en) * 2006-06-26 2008-01-21 (주)셀시아테크놀러지스한국 Flat type heat transfer device and its manufacturing method
ITMI20071332A1 (en) * 2007-07-04 2009-01-05 Fic S P A RADIATOR, PARTICULARLY FOR HEATING OR SIMILAR SYSTEMS, AT HIGH THERMAL PERFORMANCES AND AT HIGH OPERATING SILENCE.
WO2009049397A1 (en) * 2007-10-19 2009-04-23 Metafoam Technologies Inc. Heat management device using inorganic foam
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
CN101900507B (en) * 2010-01-15 2011-12-21 富瑞精密组件(昆山)有限公司 Flat and thin type heat pipe
US20120048517A1 (en) * 2010-08-31 2012-03-01 Kunshan Jue-Chung Electronics Co., Heat pipe with composite wick structure
TWI428554B (en) 2011-09-30 2014-03-01 Foxconn Tech Co Ltd Heat pipe
TW201525398A (en) * 2013-12-25 2015-07-01 Hao Pai Wick structure having braided flat fiber and ultrathin heat pipe having the same
JP6477254B2 (en) 2014-05-30 2019-03-06 三菱マテリアル株式会社 Porous aluminum composite and method for producing porous aluminum composite
JP6237500B2 (en) * 2014-07-02 2017-11-29 三菱マテリアル株式会社 Porous aluminum heat exchange member
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
CN109773434A (en) * 2014-09-17 2019-05-21 科罗拉多州立大学董事会法人团体 Enable the hot ground plane of microtrabeculae
CN110192273B (en) 2016-11-08 2023-07-28 开尔文热技术股份有限公司 Method and apparatus for spreading high heat flux in a thermal ground plane
CN110763057A (en) * 2019-10-16 2020-02-07 东莞领杰金属精密制造科技有限公司 Ultrathin heat pipe and manufacturing method thereof
EP3812684B1 (en) * 2019-10-24 2023-06-07 Albakri, Sami Abdulrahman A. Planar heat transfer device, use thereof and method for its manufacture
KR102168097B1 (en) * 2020-01-21 2020-10-20 에이블메탈 주식회사 Sintering hybrid wick based screen mesh and method for manufacturing thereof
WO2021258028A1 (en) 2020-06-19 2021-12-23 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
KR102568890B1 (en) * 2020-10-12 2023-08-21 한국항공대학교산학협력단 Manufacturing method for low temperature sintering hybrid wick, hybrid wick and heat pipe including the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565243A (en) * 1982-11-24 1986-01-21 Thermacore, Inc. Hybrid heat pipe
US5101560A (en) * 1988-10-24 1992-04-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making an anisotropic heat pipe and wick
US4964457A (en) * 1988-10-24 1990-10-23 The United States Of America As Represented By The Secretary Of The Air Force Unidirectional heat pipe and wick
US6460612B1 (en) * 2002-02-12 2002-10-08 Motorola, Inc. Heat transfer device with a self adjusting wick and method of manufacturing same
US20050247435A1 (en) * 2004-04-21 2005-11-10 Hul-Chun Hsu Wick structure of heat pipe
US6997243B2 (en) * 2004-04-23 2006-02-14 Hul-Chun Hsu Wick structure of heat pipe
WO2006007721A1 (en) * 2004-07-21 2006-01-26 Xiao Huang Hybrid wicking materials for use in high performance heat pipes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105588464A (en) * 2014-11-14 2016-05-18 富瑞精密组件(昆山)有限公司 Capillary wire, capillary structure and heat pipe

Also Published As

Publication number Publication date
US20060196641A1 (en) 2006-09-07
TWI275765B (en) 2007-03-11

Similar Documents

Publication Publication Date Title
TW200626863A (en) Wick structure, method of manufacturing the wick structure, and heat pipe
WO2008016725A3 (en) Heat pipe with nanotstructured wicking material
TW200737474A (en) Leadframe comprising tin plating or an intermetallic layer formed therefrom
TW200634280A (en) Method for making wick structure of heat pipe
TW200620615A (en) A substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same
PL2195885T3 (en) Electrical contact element and a method of producing the same
TW200733863A (en) Thermal transfer coating
TW200636203A (en) Manufacturing method of heat pipe
UA92791C2 (en) Method for manufacturing welded component with very high mechanical characteristics from coated lamination
TW200636200A (en) Sintered heat pipe and manufacturing method thereof
TW200616250A (en) Manufacturing method of flip-chip light-emitting device
TW200708705A (en) Heat pipe containing sintered powder wick and manufacturing method for the same
EP2617869A3 (en) Process of fabricating a thermal barrier coating and an article having a cold sprayed thermal barrier coating
TW200607598A (en) Composition of a solder, and method of manufacturing a solder connection
TW200715548A (en) Integrated inductor
TW200746276A (en) Method for bonding a semiconductor substrate to a metal substrate
GB201213165D0 (en) Fabrication of three-dimensional heat transfer enhancing features on a substrate
TW200702189A (en) Method of manufacturing multi-layered substrate
TW200701374A (en) Semiconductor device and manufacturing method thereof
TW200705582A (en) Semiconductor device and manufacturing method therefor
ZA200804323B (en) Cooling element and method for manufacturing the same
SG113495A1 (en) Thermally enhanced stacked die package
TW200715895A (en) Mounting substrate and microphone mounted on the same
EP1939929A4 (en) Solder layer, heat sink using such solder layer and method for manufacturing such heat sink
ATE401382T1 (en) COMPOSITION FOR PRODUCING A HEAT INSULATION COATING