WO2008001600A1 - Method of removing conductive paste - Google Patents

Method of removing conductive paste Download PDF

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Publication number
WO2008001600A1
WO2008001600A1 PCT/JP2007/061715 JP2007061715W WO2008001600A1 WO 2008001600 A1 WO2008001600 A1 WO 2008001600A1 JP 2007061715 W JP2007061715 W JP 2007061715W WO 2008001600 A1 WO2008001600 A1 WO 2008001600A1
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WO
WIPO (PCT)
Prior art keywords
conductive paste
printing
plate material
superheated steam
conductive
Prior art date
Application number
PCT/JP2007/061715
Other languages
French (fr)
Japanese (ja)
Inventor
Tsutomu Sato
Original Assignee
Think Laboratory Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Think Laboratory Co., Ltd. filed Critical Think Laboratory Co., Ltd.
Publication of WO2008001600A1 publication Critical patent/WO2008001600A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools, brushes, or analogous members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2230/00—Other cleaning aspects applicable to all B08B range
    • B08B2230/01—Cleaning with steam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/088—Using a vapour or mist, e.g. cleaning using water vapor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Definitions

  • the present invention relates to a method for easily removing a conductive paste fixed on a plate surface using superheated steam.
  • circuit boards, ceramic electronic parts, PDP (plasma display panel) front filters, electromagnetic shielding light-transmitting window materials, etc. used in electronic devices are formed by printing conductive paste. And the formation of conductive patterns.
  • Patent Document 1 Japanese Patent No. 3090639
  • the present invention has been made in view of the above-described problems of the prior art, and easily and effectively uses a conductive paste fixed to a printing plate surface by using superheated water steam. It is an object of the present invention to provide a method for removing a conductive paste that can be removed and that does not have any adverse effect on the printing plate material after the fixed conductive paste is removed. It is.
  • the method for removing the conductive paste of the present invention is a method for removing the conductive paste fixed to the plate material surface, and spraying the conductive paste onto the plate by injecting superheated steam onto the conductive paste.
  • the material surface is also cleaned and removed.
  • the cleaning removal efficiency is further improved.
  • the plate material include plate materials for screen printing, rotary screen printing, offset printing, gravure printing, and flexographic printing.
  • the conductive paste is typically a silver paste.
  • the injection condition of the superheated steam is 100 ° C or higher, preferably 105 ° C to 300 ° C, and 1 minute to 60 minutes, preferably about 5 minutes to 15 minutes.
  • a known brush cleaning means may be used, but it is necessary to have heat resistance that can withstand the above processing temperature!
  • the conductive paste fixed to the printing plate surface can be easily and effectively removed by using superheated steam. If there is no adverse effect on the printing plate material after the conductive paste is removed, there will be a great effect!
  • the method for removing the conductive paste of the present invention is a method for removing the conductive paste fixed to the plate material surface, wherein the superheated steam is jetted onto the conductive paste, thereby removing the conductive paste.
  • the conductive paste is also cleaned and removed from the plate material surface.
  • the conductive paste is not particularly limited and can be a commercially available one.
  • the conductive particles dispersed in the conductive paste may be a metal or a metal compound such as a metal oxide or an organic metal compound that is metallized by firing. And both of the metal compounds.
  • the average particle diameter is 5 ⁇ m or less, particularly 1 ⁇ m or less, particularly 2 to 500 nm.
  • the average particle diameter of the conductive particles is metal particles of lOOnm or less and 0.5 nm or more. It is more preferable that there is a force.
  • conductive particles metals or alloys such as gold, silver, copper, nickel, palladium, aluminum, indium, chromium, vanadium, tin, cadmium, platinum, titanium, cobalt, iron, and zinc are preferable. It is.
  • a conductive paste can be obtained by mixing these metal powders, an organic resin, and a solvent.
  • the organic resin include epoxy resin, phenol resin, polyimide resin, polyamide resin, polyamideimide resin, polyethylene oxide resin, polyester resin, polyester resin, and the like. However, you may mix 2 or more types.
  • the weight ratio of metal powder to organic resin is preferably 70:30 to 99: 1!
  • a polyethylene monomethyl ether solvent a polyethylene monomethyl ether acetate solvent, a polypropylene monomethyl ether solvent, a polypropylene monomethyl ether acetate solvent, an alcohol solvent, a hydrocarbon solvent, etc. are added and dispersed.
  • a conductive paste is obtained.
  • a viscosity modifier Tatsuki Fire
  • a reducing agent may be included.
  • the conductive paste is formed by printing, gravure printing, screen printing, rotary screen printing, flexographic printing, rotary screen printing, and offset printing are suitable as printing methods. Screen printing and gravure printing are particularly preferred in terms of thick film.
  • the printing plate material is, for example, a number of gravure cells on a roll surface in the case of gravure printing.
  • the gravure roll in which is formed is designated.
  • the heating and spraying temperature of superheated steam can be 100 ° C or higher, preferably 105 ° C to 300 ° C, and may be appropriately selected according to the material of the plate material.
  • the heating treatment time for superheated steam is 1 minute to 60 minutes, preferably about 5 minutes to 15 minutes. If brush cleaning is performed together with the jet of superheated steam, the removal efficiency can be further improved and the removal processing time can be shortened.
  • a gravure printing roll (a copper plating layer is formed on an aluminum hollow cylinder with a circumference of 600 mm and a surface length of 1100 mm, a gravure cell is formed on the copper plating layer, and then covered with a chromium plating layer)
  • a conductive paste (XA9050, manufactured by Fujikura Kasei Co., Ltd., conductive particle material is silver oxide silver particle, particle size is about 500 nm) on the surface, a coating layer with a width of 5 cm, a length of 10 cm, and a thickness of 1 cm is formed.
  • the conductive paste was solidified and fixed by heat treatment at 180 ° C. for 1 hour. When 170 ° C superheated steam was sprayed onto the fixed conductive paste for 20 minutes, the conductive paste was removed without a trace.
  • Example 2 The same conductive paste as in Example 1 was applied to the same gravure plate roll as in Example 1 and solidified and fixed in the same manner. When 170 ° C superheated steam was sprayed on the fixed conductive paste and brush cleaning was used in combination, the conductive paste was removed without a trace after 10 minutes of spraying.

Abstract

A method of removing a conductive paste, in which a conductive paste adhering fast to a surface of printing plate material can be removed easily and effectively by the use of superheated steam without any detriment to the printing plate material after removal of the fast adhering conductive paste. There is provided a method of removing a conductive paste adhering fast to a surface of printing plate material, comprising applying a jet of superheated steam to the conductive paste so as to attain washing removal of the conductive paste from the surface of printing plate material.

Description

明 細 書  Specification
導電性ペーストの除去方法  Method for removing conductive paste
技術分野  Technical field
[0001] 本発明は版材面に固着した導電性ペーストを過熱水蒸気を用いて簡易に除去す る方法に関する。  [0001] The present invention relates to a method for easily removing a conductive paste fixed on a plate surface using superheated steam.
背景技術  Background art
[0002] 従来、電子機器に使用される回路基板、セラミックス電子部品、 PDP (プラズマディ スプレーパネル）の前面フィルタ、電磁波シールド性光透過窓材等においては、導電 性ペーストを印刷することにより回路形成や導電性パターンの形成がおこなわれてい る。  [0002] Conventionally, circuit boards, ceramic electronic parts, PDP (plasma display panel) front filters, electromagnetic shielding light-transmitting window materials, etc. used in electronic devices are formed by printing conductive paste. And the formation of conductive patterns.
[0003] 前記した印刷方式としては、スクリーン印刷、ロータリースクリーン印刷、オフセット 印刷、グラビア印刷、フレキソ印刷等の各種の印刷方式が適用されている。これらの 印刷方式によって導電性ペーストを回路基板等の被処理材に所定の回路パターン に従って印刷するには、印刷用の版材面に導電性ペーストを供給し、版材面に着い ている導電性ペーストを被処理材面上に転移させるという態様がとられる。  [0003] As the printing method described above, various printing methods such as screen printing, rotary screen printing, offset printing, gravure printing, flexographic printing, and the like are applied. In order to print the conductive paste on a material to be processed such as a circuit board according to a predetermined circuit pattern by these printing methods, the conductive paste is supplied to the printing plate surface and the conductive material that is attached to the plate surface. A mode is adopted in which the paste is transferred onto the surface of the workpiece.
[0004] 多数個の回路基板等の被処理材を製造するにあたっては、必然的に多数回の印 刷を行うことになる力 その印刷中に導電性ペーストが徐々に固化する傾向があり、 その結果として印刷用版材面には最終的に固化した導電性ペーストが固着してしま つて精密な回路パターンの印刷ができなくなってしまうという不都合が生じてしまう。  [0004] In manufacturing a large number of processed materials such as circuit boards, the force that inevitably performs many times of printing tends to gradually solidify the conductive paste during the printing. As a result, the conductive paste finally solidified adheres to the printing plate surface, resulting in inconvenience that a precise circuit pattern cannot be printed.
[0005] この版材面に固着した導電性ペーストを除去する手段としては、溶剤によって溶解 して拭き取るという方法が試みられているが (例えば、特許文献 1等参照）、版材面に 残留する溶剤がのちに行う印刷によって形成された回路パターンに悪影響をあたえ る恐れがあるためあまり好ましいとはいえない。また、その他の手段についても好適な 結果は得られておらず、版材面に固着した導電性ペーストを効果的に除去できる方 法の出現が待たれているのが現状である。  [0005] As a means for removing the conductive paste fixed to the plate material surface, a method of dissolving and wiping with a solvent has been tried (for example, see Patent Document 1), but remains on the plate material surface. Since the solvent may adversely affect the circuit pattern formed by subsequent printing, it is not preferable. In addition, no suitable results have been obtained for other means, and the present situation is that the emergence of a method capable of effectively removing the conductive paste fixed to the plate surface is awaited.
特許文献 1：特許第 3090639号  Patent Document 1: Japanese Patent No. 3090639
発明の開示 発明が解決しょうとする課題 Disclosure of the invention Problems to be solved by the invention
[0006] 本発明は、上記した従来技術の問題点に鑑みてなされたものであって、過熱水蒸 気を用いることによって印刷用の版材面に固着した導電性ペーストを簡便かつ効果 的に除去することができ、かつ固着した導電性ペーストを除去した後の印刷用版材 にはなんらの悪影響も存在しないようにすることができる導電性ペーストの除去方法 を提供することを目的とするものである。  [0006] The present invention has been made in view of the above-described problems of the prior art, and easily and effectively uses a conductive paste fixed to a printing plate surface by using superheated water steam. It is an object of the present invention to provide a method for removing a conductive paste that can be removed and that does not have any adverse effect on the printing plate material after the fixed conductive paste is removed. It is.
課題を解決するための手段  Means for solving the problem
[0007] 本発明の導電性ペーストの除去方法は、版材面に固着した導電性ペーストを除去 する方法であって、前記導電性ペーストに過熱水蒸気を噴射することによって前記 導電性ペーストを前記版材面カも洗浄除去するようにしたことを特徴とする。  [0007] The method for removing the conductive paste of the present invention is a method for removing the conductive paste fixed to the plate material surface, and spraying the conductive paste onto the plate by injecting superheated steam onto the conductive paste. The material surface is also cleaned and removed.
[0008] 前記過熱水蒸気の噴射とともにブラシ洗浄を行うようにすると洗浄除去効率はさら に向上する。前記版材としては、スクリーン印刷、ロータリースクリーン印刷、オフセッ ト印刷、グラビア印刷、及びフレキソ印刷の各印刷用の版材をあげることができる。前 記導電性ペーストは、銀ペーストが代表的なものである。  [0008] When the brush cleaning is performed together with the jet of the superheated steam, the cleaning removal efficiency is further improved. Examples of the plate material include plate materials for screen printing, rotary screen printing, offset printing, gravure printing, and flexographic printing. The conductive paste is typically a silver paste.
[0009] 前記過熱水蒸気の噴射条件は、 100°C以上、好ましくは 105°C〜300°Cの温度範 囲で、 1分〜 60分、好ましくは 5分〜 15分程度で十分である。また、この過熱水蒸気 の噴射と併用してブラシ洗浄を行うとさらに効果的に固着した導電性ペーストの洗浄 除去が行われる。上記ブラシ洗浄には公知のブラシ洗浄手段を用いればよいが、上 記処理温度に耐える耐熱性を有する必要があることは!、うまでもな!/、。  [0009] The injection condition of the superheated steam is 100 ° C or higher, preferably 105 ° C to 300 ° C, and 1 minute to 60 minutes, preferably about 5 minutes to 15 minutes. Further, when brush cleaning is performed in combination with this superheated steam jet, the conductive paste that has been fixed more effectively is removed by cleaning. For the above brush cleaning, a known brush cleaning means may be used, but it is necessary to have heat resistance that can withstand the above processing temperature!
発明の効果  The invention's effect
[0010] 本発明の導電性ペーストの除去方法によれば、過熱水蒸気を用いることによって印 刷用の版材面に固着した導電性ペーストを簡便かつ効果的に除去することができ、 かつ固着した導電性ペーストを除去した後の印刷用版材にはなんらの悪影響も存在 しな 、ようにすることができると!/、う大きな効果を奏する。  [0010] According to the method for removing a conductive paste of the present invention, the conductive paste fixed to the printing plate surface can be easily and effectively removed by using superheated steam. If there is no adverse effect on the printing plate material after the conductive paste is removed, there will be a great effect!
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0011] 本発明の導電性ペーストの除去方法は、版材面に固着した導電性ペーストを除去 する方法であって、前記導電性ペーストに過熱水蒸気を噴射することによって前記 導電性ペーストを前記版材面カも洗浄除去するようにしたものである。 [0011] The method for removing the conductive paste of the present invention is a method for removing the conductive paste fixed to the plate material surface, wherein the superheated steam is jetted onto the conductive paste, thereby removing the conductive paste. The conductive paste is also cleaned and removed from the plate material surface.
[0012] 上記導電性ペーストとしては特に限定はなぐ市販のものを対象とすることができる  [0012] The conductive paste is not particularly limited and can be a commercially available one.
[0013] 導電性ペースト中に分散されている導電性粒子としては、金属であってもよぐ焼成 により金属化する金属酸化物や有機金属化合物等のような金属化合物であってもよ ぐ金属と該金属化合物の両方であってもよい。 [0013] The conductive particles dispersed in the conductive paste may be a metal or a metal compound such as a metal oxide or an organic metal compound that is metallized by firing. And both of the metal compounds.
[0014] 導電性粒子としては、通常は、その平均粒径が 5 μ m以下、特に 1 μ m以下、とりわ け 2〜500nmが用いられる。特に微細な配線回路を形成するためには、導電性粒子 の平均径が lOOnm以下 0. 5nm以上の金属粒子であることが好ましぐ配線回路の 導通抵抗を低下させる為に 50nm以下 2nm以上であること力 さらに好ましい。  [0014] As the conductive particles, usually, the average particle diameter is 5 μm or less, particularly 1 μm or less, particularly 2 to 500 nm. In particular, in order to form a fine wiring circuit, it is preferable that the average particle diameter of the conductive particles is metal particles of lOOnm or less and 0.5 nm or more. It is more preferable that there is a force.
[0015] この導電性粒子としては、金、銀、銅、ニッケル、パラジュゥム、アルミニウム、インジ ゥム、クロム、バナジウム、スズ、カドミウム、プラチナ、チタン、コバルト、鉄、亜鉛等の 金属又は合金が好適である。  [0015] As the conductive particles, metals or alloys such as gold, silver, copper, nickel, palladium, aluminum, indium, chromium, vanadium, tin, cadmium, platinum, titanium, cobalt, iron, and zinc are preferable. It is.
[0016] これらの金属粉と、有機樹脂と、溶剤とを混合することにより導電性ペーストが得ら れる。有機榭脂としては、エポキシ榭脂、フエノール榭脂、ポリイミド榭脂、ポリアミド榭 脂、ポリアミドイミド榭脂、ポリフエ二レンオキサイド榭脂、ポリシァネート榭脂、ポリエス テル榭脂等が挙げられ、これらは単独でも 2種以上混合してもよい。金属粉と有機榭 脂の重量比は 70： 30〜99： 1が好まし!/、。  [0016] A conductive paste can be obtained by mixing these metal powders, an organic resin, and a solvent. Examples of the organic resin include epoxy resin, phenol resin, polyimide resin, polyamide resin, polyamideimide resin, polyethylene oxide resin, polyester resin, polyester resin, and the like. However, you may mix 2 or more types. The weight ratio of metal powder to organic resin is preferably 70:30 to 99: 1!
[0017] 溶剤としては、ポリエチレンモノメチルエーテル系溶剤、ポリエチレンモノメチルエー テルアセテート系溶剤、ポリプロピレンモノメチルエーテル系溶剤、ポリプロピレンモノ メチルエーテルアセテート系溶剤、アルコール系溶剤、炭化水素系溶剤等を加えて 分散することにより導電性ペーストがえられる。さらに、粘度調整剤、タツキファイア一 [0017] As the solvent, a polyethylene monomethyl ether solvent, a polyethylene monomethyl ether acetate solvent, a polypropylene monomethyl ether solvent, a polypropylene monomethyl ether acetate solvent, an alcohol solvent, a hydrocarbon solvent, etc. are added and dispersed. Thus, a conductive paste is obtained. In addition, a viscosity modifier, Tatsuki Fire
、還元剤等を含む場合もある。 In some cases, a reducing agent may be included.
[0018] 導電性ペーストを印刷により形成する場合、印刷手法としてはグラビア印刷、スクリ ーン印刷、ロータリースクリーン印刷、フレキソ印刷、ロータリースクリーン印刷、オフ セット印刷が好適である力 線幅の微細化及び厚膜ィ匕の面でとりわけスクリーン印刷 及びグラビア印刷が好まし 、。 [0018] When the conductive paste is formed by printing, gravure printing, screen printing, rotary screen printing, flexographic printing, rotary screen printing, and offset printing are suitable as printing methods. Screen printing and gravure printing are particularly preferred in terms of thick film.
[0019] 印刷用版材とは、例えばグラビア印刷の場合にはロール面に多数のグラビアセル を形成したグラビアロールを指称する。 [0019] The printing plate material is, for example, a number of gravure cells on a roll surface in the case of gravure printing. The gravure roll in which is formed is designated.
[0020] 過熱水蒸気の加熱噴射温度は 100°C以上、好ましくは 105°C〜300°Cを使用する ことが可能であり、版材の材質に応じて適宜選択すればよい。また、過熱水蒸気の加 熱噴射処理時間は 1分〜 60分、好ましくは 5分〜 15分程度で十分である。前記過熱 水蒸気の噴射とともにブラシ洗浄を行うようにすれば除去効率はさらに向上し、除去 処理時間の短縮を図ることができる。  [0020] The heating and spraying temperature of superheated steam can be 100 ° C or higher, preferably 105 ° C to 300 ° C, and may be appropriately selected according to the material of the plate material. The heating treatment time for superheated steam is 1 minute to 60 minutes, preferably about 5 minutes to 15 minutes. If brush cleaning is performed together with the jet of superheated steam, the removal efficiency can be further improved and the removal processing time can be shortened.
実施例  Example
[0021] 以下に実施例を挙げて、本発明をより具体的に説明する。  [0021] The present invention will be described more specifically with reference to the following examples.
[0022] (実施例 1) [0022] (Example 1)
株式会社シンク ·ラボラトリー製グラビア製版ロール（円周 600mm、面長 1100mm のアルミ中空シリンダーに銅メツキ層を形成し、銅メツキ層にグラビアセルを形成し、 つ 、でクロムメツキ層で被覆したもの）の表面に導電性ペースト (藤倉化成株式会社 製 XA9050、導電性粒子材料は酸ィ匕銀粒子、粒子径は 500nm程度)を用いて、幅 5cm、長さ 10cm、厚さ lcmの塗布層を形成し、次いで 180°Cで 1時間加熱処理して 導電性ペーストを固化固着した。この固着した導電性ペーストに 170°Cの過熱水蒸 気を 20分間噴射したところその導電性ペーストは跡形もなく除去されていた。  Sink Laboratories' gravure printing roll (a copper plating layer is formed on an aluminum hollow cylinder with a circumference of 600 mm and a surface length of 1100 mm, a gravure cell is formed on the copper plating layer, and then covered with a chromium plating layer) Using a conductive paste (XA9050, manufactured by Fujikura Kasei Co., Ltd., conductive particle material is silver oxide silver particle, particle size is about 500 nm) on the surface, a coating layer with a width of 5 cm, a length of 10 cm, and a thickness of 1 cm is formed. Then, the conductive paste was solidified and fixed by heat treatment at 180 ° C. for 1 hour. When 170 ° C superheated steam was sprayed onto the fixed conductive paste for 20 minutes, the conductive paste was removed without a trace.
[0023] (実施例 2) [0023] (Example 2)
実施例 1と同様のグラビア製版ロールに実施例 1と同様の導電性ペーストを塗布し て同様に固化固着した。この固着した導電性ペーストに 170°Cの過熱水蒸気を噴射 するとともにブラシ洗浄を併用したところ 10分の噴射処理でその導電性ペーストは跡 形もなく除去されていた。  The same conductive paste as in Example 1 was applied to the same gravure plate roll as in Example 1 and solidified and fixed in the same manner. When 170 ° C superheated steam was sprayed on the fixed conductive paste and brush cleaning was used in combination, the conductive paste was removed without a trace after 10 minutes of spraying.

Claims

請求の範囲 The scope of the claims
[1] 版材面に固着した導電性ペーストを除去する方法であって、前記導電性ペーストに 過熱水蒸気を噴射することによって前記導電性ペーストを前記版材面力 洗浄除去 するようにしたことを特徴とする導電性ペーストの除去方法。  [1] A method for removing a conductive paste adhered to a plate material surface, wherein the conductive paste is washed and removed by spraying superheated steam onto the conductive paste. A method for removing a conductive paste, which is characterized.
[2] 前記過熱水蒸気の噴射とともにブラシ洗浄を行うようにしたことを特徴とする請求項 1記載の導電性ペーストの除去方法。  [2] The method for removing a conductive paste according to [1], wherein brush cleaning is performed together with the jet of the superheated steam.
[3] 前記版材が、スクリーン印刷、ロータリースクリーン印刷、オフセット印刷、グラビア印 刷、及びフレキソ印刷の各印刷用の版材であることを特徴とする請求項 1又は 2記載 の導電性ペーストの除去方法。  [3] The conductive paste according to claim 1 or 2, wherein the plate material is a plate material for printing of screen printing, rotary screen printing, offset printing, gravure printing, and flexographic printing. Removal method.
[4] 前記導電性ペーストが、銀ペーストであることを特徴とする請求項 1〜3のいずれか 1項記載の導電性ペーストの除去方法。  [4] The method for removing a conductive paste according to any one of claims 1 to 3, wherein the conductive paste is a silver paste.
PCT/JP2007/061715 2006-06-30 2007-06-11 Method of removing conductive paste WO2008001600A1 (en)

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JP2006-181685 2006-06-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095672A1 (en) * 2009-02-18 2010-08-26 東洋紡績株式会社 Metal thin film production method and metal thin film

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPS56173450U (en) * 1980-05-28 1981-12-21
JPH0322493A (en) * 1989-06-20 1991-01-30 Ado Union Kenkyusho:Kk Manufacture of printed wiring board
JPH03137977A (en) * 1989-10-24 1991-06-12 Shinichi Mori Washing apparatus
JP2003251627A (en) * 2002-03-07 2003-09-09 Jfe Steel Kk Cleaning method for material-recycling waste plastics and apparatus therefor
WO2004108416A1 (en) * 2003-06-05 2004-12-16 Omet Srl Method and device for cleaning a cylinder of a printing press

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56173450U (en) * 1980-05-28 1981-12-21
JPH0322493A (en) * 1989-06-20 1991-01-30 Ado Union Kenkyusho:Kk Manufacture of printed wiring board
JPH03137977A (en) * 1989-10-24 1991-06-12 Shinichi Mori Washing apparatus
JP2003251627A (en) * 2002-03-07 2003-09-09 Jfe Steel Kk Cleaning method for material-recycling waste plastics and apparatus therefor
WO2004108416A1 (en) * 2003-06-05 2004-12-16 Omet Srl Method and device for cleaning a cylinder of a printing press

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095672A1 (en) * 2009-02-18 2010-08-26 東洋紡績株式会社 Metal thin film production method and metal thin film
JP4853590B2 (en) * 2009-02-18 2012-01-11 東洋紡績株式会社 Metal thin film manufacturing method and metal thin film

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