WO2007113139A1 - Method for positioning components with which electrical contact can be made on a circuit carrier, and mounting system suitable for carrying out this method - Google Patents

Method for positioning components with which electrical contact can be made on a circuit carrier, and mounting system suitable for carrying out this method Download PDF

Info

Publication number
WO2007113139A1
WO2007113139A1 PCT/EP2007/052803 EP2007052803W WO2007113139A1 WO 2007113139 A1 WO2007113139 A1 WO 2007113139A1 EP 2007052803 W EP2007052803 W EP 2007052803W WO 2007113139 A1 WO2007113139 A1 WO 2007113139A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
self
organization
support member
carrier
Prior art date
Application number
PCT/EP2007/052803
Other languages
German (de)
French (fr)
Inventor
Stefan Fiedler
Klaus-Peter Galuschki
Jens-Christian Holst
Bernhard Markus Schachtner
Ralf Schmidt
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to CN2007800118444A priority Critical patent/CN101416301B/en
Publication of WO2007113139A1 publication Critical patent/WO2007113139A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11332—Manufacturing methods by local deposition of the material of the bump connector in solid form using a powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13139—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95144—Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95145—Electrostatic alignment, i.e. polarity alignment with Coulomb charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for placing e- lektrisch contactable devices with a mounting side on a circuit board, wherein the desired arrangement of the components is generated by a process of self-organization by the components fixed with their Montagesei ⁇ te back facing on a support member who ⁇ , for which purpose the rear sides of the components and the O- ber Colour of the carrier component triggering surface areas previously with the self-assembly of the components provided, the carrier component with the mounting sides of the Bauele ⁇ elements relative to the circuit substrate are aligned and is placed on the latter and the components on the Scarf ⁇ tion carrier to be attached.
  • Components for example, a film for further contacting of the components on the backs of the components are placed on ⁇ .
  • un ⁇ is ter the manifold active principles a combination selects excluded that the particular selectivity of certain surfaces ⁇ areas at certain to be placed components ensures that compatibility between other surface ay not be given ⁇ chen Symposiumen to a Ensure unambiguous placement of components.
  • the individual components must also be provided with doctorsnberei ⁇ chen different functional principles, if, for example, their polarity in the electrical Kon- takt ist attention must be paid attention. This is the only way to prevent the components from being placed on the carrier component in a wrong orientation.
  • the invention also is based on the idea takes place, in addition to the process mounting a support member len available to stel ⁇ on which elements of the process of self organization of Bauele-.
  • the components are deliberately fastened with their back ⁇ sides on the support member, the holding forces must be sufficient due to the self-assembly process, so that the support member can be handled easily in the further assembly process.
  • This is in fact Concluding the self-assembly of the components mounted on the scarf ⁇ tion carrier, so that the components come to rest with their mounting sides on the circuit board (circuit carrier and support member must not be flat forms, but have only matched geometries).
  • an attachment of the components is accomplished on the circuit substrate, which can be done on the one hand by a provisional fixation, for example with a Unterglallmaterial between the components and the circuit carrier or by an electrical connection of the components on the circuit substrate, for example with solder material or conductive adhesive.
  • the main advantage of this procedure is that the surface of the circuit substrate does not have to be modified for a process of self-organization. Therefore, an unrestricted freedom of design for the surface of the circuit carrier advantageously arises because the conditions given by the design of the circuit carrier need not be taken into account for the process of self-organization.
  • the used spinachbau ⁇ part which is only used for temporary assembly of the components taking advantage of the process of self-organization, be optimally prepared for this task, since apart from the arrangement of the components no further design specifications must be observed in the design.
  • the carrier component is preferably prepared for the process of self-organization such that the attachment and detachment of the provisionally placed components takes place by a reversible process (more on this in the following). This results in a further advantage in the use of a carrier component, since a preparation of the carrier component for the temporarily placed components must be performed only once and then repeated Mon ⁇ daily processes on several circuit carriers of a series can follow. According to the prior art, each circuit carrier must be prepared for the process of self-assembly.
  • Circuit carrier completed by the soldering process, so that the support member in this process step, the position of the construction ⁇ elements still stabilized on the circuit substrate.
  • soldering solder particles of a solder ⁇ be applied by a further process of self-organization of the contact surfaces of the components before the support member is placed on the circuit substrate material.
  • the further process of self-assembly can be carried out in egg nem separate process step, so that the components to ⁇ on the support member reliably be provided with a well-defined amount of solder material.
  • the processes of self-organization for the components and the solder particles are carried out in one operation. As a result, the efficiency of the method can be advantageously increased, whereby a higher economic efficiency he ⁇ is enough.
  • solder particles are applied from a brazing material by a further process of self-organization on provided for the components contact surfaces of the circuit substrate before the support member is placed on the circuit board.
  • This has the advantage that the process of self-Orga ⁇ tion for the solder material in each case separated from the carrier component is performed and the process for placing the components denartiger on the support member with respect various ⁇ components can be made more complex.
  • the application of particles made of a solder material is a relatively simple process of self-organization, since they have an indefinite geometry and must not be present in a specific orientation on the circuit board.
  • circuit carrier (as in the prior art) must be prepared for the self-assembly process for application of the solder material, this process of self-organization is much easier to implement, thereby limiting the conditions of the circuit carrier is less effective than in the self-organized placement of components that may even be different from each other.
  • solder particles are applied to the contact surfaces.
  • the amount of applied solder can be pre-geous ren particularly fine Dosie ⁇ because the amount of solder ge ⁇ is precisely defined by the area of the contact surfaces.
  • a process of self-organization in which only one layer of solder particles can be deposited, ie the solder particles can not be attached to one another, can be carried out particularly easily.
  • solder particles have a substantially uniform size, the geometry of the solder deposit is produced by way of advantageous ⁇ predetermined particularly accurately.
  • the amount of solder to be applied per contact surface is then also specified very precisely.
  • the invention relates to a mounting system for the production of component-mounted circuit carriers.
  • this mounting system allow insertion of components on the circuit substrate with a process of self-assembly, the components must in this mounting system on the one hand and the substrate to which the construction ⁇ elements to be deposited on the other hand be prepared process of self-organization for the Pro ⁇ . According to the above This is done by a suitable preparation of surface areas on the components and the associated substrate, whereby the mounting system is formed.
  • a further object of the invention is therefore to provide a mounting system for the production of circuit boards equipped with components, in which the boundary conditions predetermined by the circuit carrier to be equipped and the components to be equipped can be observed to a comparatively large extent.
  • the mounting system consists of one on the adapted to be equipped circuit carrier support member for the to be mounted devices and to assembly plants ⁇ -bridging elements, with the side facing away from the mounting side backs of the components and the surface of the Carrier components are provided with surface areas that allow a self-organized arrangement of the components on the support member, taking into account the required assembly of the circuit substrate, with various components for fixation on the support member are seen ⁇ before, with a uniqueness of the placement of the components on the support member characterized It is ensured that an active principle of self-organization is provided for the surface areas of each type of components and the associated surface areas on the carrier component, which selectively be is the principle of self-organization of all other types of components.
  • the circuit carriers With the mounting system the benefits already mentioned the invention shown SEN process are achieved.
  • the circuit carriers it is possible in the manufacture of the mounting system the circuit carriers to be equipped only to the extent that on the support component, the components must be arranged in ge ⁇ nau order, which is required for the Bestü ⁇ ckung of the circuit carrier (circuit substrate must not be flat).
  • the surfaces which enable the self-assembly of the components on the carrier component it is not necessary to take account of the circuit carrier to be assembled. It must be ensured only a complication-free interaction between the support member and the components.
  • the mounting system consisting of carrier component and components (prepared for carrying out the process of self-assembly) can be sold as such, with the circuit carriers that are to be equipped with this mounting system, can come from any source.
  • the carrier component can advantageously also serve for a plurality of assemblies of scarf ⁇ tion carriers when the process of self-assembly of the components on the support member is configured reversible.
  • FIG. 1 to 4 selected steps of exporting ⁇ approximately examples of the method according to the invention, in which figure 1 shows an embodiment of the invention
  • FIG. 1 the first method step for placing electrically contactable components 11 is shown in FIG 1 not shown circuit carrier 12 (see Figure 4) shown.
  • circuit carrier 12 see Figure 4
  • a support member 13 is used, with surfaces 13 on the components 11 and on the support member 13 having complimentary surface areas initiating the process of self-assembly.
  • the components 11 and the support member 13 are placed in a container 16, which is filled, for example, with water (wherein the through Surface regions 14a, 14b become effective processes of self-organization in water).
  • the process of self-organization results in that the ge ⁇ desired arrangement of the components on the ger 11 GmbHungsträ ⁇ 12 is generated without the components 11 thereto a ⁇ would be handled individually.
  • the process of self-organization can be assisted by moving the container, facilitating the transport of the components 11 to the surface 15.
  • solder particles 17 can be applied to contact surfaces 18a by a further process of self-organization. If this process of self-organization is to take place simultaneously with the former, then the two processes must not be compatible with one another so that the solder particles 17 are repelled by the surface regions 14b of the carrier component 13 in the manner indicated by the double arrows 19. Similarly, the solder particles may 17 not attach to the surface regions 14a ⁇ to the Bauele elements, which are intended for the surface portions 14b of the support member. However, the O- Surface of the contact surfaces 18a and the solder particles 17, so that the spherical solder particles are placed at the intended location.
  • solder particles 17 can be applied to the circuit substrate 12 in a separate step. This step also takes place in a container 16 filled with water.
  • the solder particles 17 are deposited according to the already explained the mechanism on the contact surfaces 18b of Heidelbergungsträ ⁇ gers on. Accordingly, the addition of solder particles 17 according to FIG. 1 becomes superfluous.
  • the solder particles 17 have a size that they are sufficient as Lotde ⁇ pot for Kunststoffbumps, in particular for the flip-chip mounting. This means that exactly one solder particle is deposited on each contact surface 18a or 18b.
  • FIG. 2 also shows an alternative with solder particles 17 a, the solder particles having a substantially smaller diameter than the solder particles 17. Therefore, these can be deposited on the contact surfaces 18b in the form of a monolayer, wherein advantageously solder deposits with a substantial lower volume can be generated.
  • the illustration of the solder particles 17a used as an alternative is omitted in FIGS. 1, 3 and 4, wherein the method is otherwise to be carried out analogously with solder deposits produced in this way.
  • the solder particles 17a may have, instead of a spherical shape even when ⁇ play, cylindrical or irregular shapes, it being advantageous when the solder particles having substantially the same size as a whole, because so monolayers are formed with a constant thickness.
  • Self-organization on the spontaneous formation of ordered structures at interfaces in the exemplary embodiment solid, conceivable, however, is also solid-gaseous or liquid-gas).
  • An energetic minimum is achieved when the desired form of self-organization is achieved.
  • the individual, self-organizing components arrange themselves in the desired manner due to repulsive and attractive forces, said forces being of shape, surface properties, charge, polarity, magnetic moment or mass or even other arbitrary coded information.
  • the contact surfaces are made of gold, silver or copper.
  • the thiol groups of different molecules are chemically attached to them can be.
  • a hydrogen atom is split off from the thiol group and a metal thiolate compound is formed.
  • Examples of possible thiols are the alkanethiones which have an alkane chain at the end of which is the thiol group.
  • the solder particles are provided, for example, with a wax layer, then a bond between the alkane chains, which now determine the surface properties of the contact surface and the surface of the solder particles due to the particular lipophilic properties of these substances, is greatly promoted, for which reason self-organized attachment the solder particle occurs on the contact surfaces.
  • the Alkanothiole can of course also with their long-chain alkane moiety in a first process step are stored in the wax surface of the solder particles at ⁇ so that they attach, when introduced into the container 16 to the contact surfaces 18a, which need not be further prepared in this case.
  • the alkanethiols may also be applied to suitable metal surfaces on the back side 20 of the devices 11, thus providing a means of coupling to other oligonucleotides.
  • each COM ⁇ -complementary pairs can be selected, wherein one partner of the components 11 can be applied to the contact surfaces 14b of the support member and the other partner on the contact surfaces 14a on the rear sides twentieth As a result, the self-organized placement of the components 11 on the
  • Carrier component 13 ensured.
  • a plurality of complementary pairs may be selected from oligonucleotides allow the self-organized placement of components only in one orientation.
  • FIG. 3 shows how the carrier component 13 with the provisionally attached components 11 and its mounting side 21 are placed on the circuit carrier 12 first.
  • the solder particles ⁇ Untitled 17 thereby buildin at the contact surfaces 18a or 18b ⁇ .
  • a contact results merely by resting the components 11 on the circuit carrier 12.
  • the carrier component 13 can first for stabilizing the components and for increasing the contact pressure due to the weight on the components
  • soldering process has been carried out which has made solder joints 22 from the solder particles 17, which produce a material bond with the contact surfaces 18a and 18b.
  • the carrier plate 13 can be removed.
  • the heat generated due to the soldering process has also led to a solution of the preliminary connection between the support member 13 and the components 11.
  • the bond between the carrier component 13 and the components 11 is of lesser strength than the solder joints

Abstract

The invention relates to a method for positioning components (11) with which electrical contact can be made on a carrier element (13). In this case, the invention involves these components being temporarily positioned in a prescribed arrangement by a process of self-organization, so that, possibly after solder particles (17) are applied to contact areas (18a), the components can be deposited onto a circuit carrier (not shown) by means of the carrier element (13). The components are soldered to this circuit carrier, so that a multiplicity of components which are difficult to handle individually can advantageously be mounted on the circuit carrier in one production step. The method of positioning is therefore suitable primarily for very small components.

Description

Beschreibungdescription
Verfahren zum Platzieren von elektrisch kontaktierbaren Bauelementen auf einem Schaltungsträger sowie zur Durchführung dieses Verfahrens geeignetes MontagesystemMethod for placing electrically contactable components on a circuit carrier as well as for carrying out this method suitable mounting system
Die Erfindung betrifft ein Verfahren zum Platzieren von e- lektrisch kontaktierbaren Bauelementen mit einer Montageseite auf einem Schaltungsträger, wobei die gewünschte Anordnung der Bauelemente durch einen Prozess der Selbstorganisation erzeugt wird, indem die Bauelemente mit ihrer der Montagesei¬ te abgekehrten Rückseite auf einem Trägerbauteil fixiert wer¬ den, wobei hierfür die Rückseiten der Bauelemente und die O- berfläche des Trägerbauteils zuvor mit die Selbstorganisation der Bauelemente auslösenden Oberflächenbereichen versehen wurden, das Trägerbauteil mit den Montageseiten der Bauele¬ mente gegenüber dem Schaltungsträger ausgerichtet und auf diesen aufgesetzt wird und die Bauelemente auf dem Schal¬ tungsträger befestigt werden.The invention relates to a method for placing e- lektrisch contactable devices with a mounting side on a circuit board, wherein the desired arrangement of the components is generated by a process of self-organization by the components fixed with their Montagesei ¬ te back facing on a support member who ¬, for which purpose the rear sides of the components and the O- berfläche of the carrier component triggering surface areas previously with the self-assembly of the components provided, the carrier component with the mounting sides of the Bauele ¬ elements relative to the circuit substrate are aligned and is placed on the latter and the components on the Scarf ¬ tion carrier to be attached.
Die Nutzung von Prozessen zur Selbstorganisation (auch self- assembly genannt) wird bereits für das Platzieren von elekt¬ risch kontaktierbaren Bauelementen auf Schaltungsträgern verwendet. Gemäß A. O'Riordan: „Field-configured self-assembly : manufacturing at the mesoscale", Materials Science and Engi¬ neering C 23 (2003) , Seiten 3-6 ist beispielsweise ein Ver¬ fahren bekannt, mit dem lichtemittierende Dioden in einer großen Menge auf einem Schaltungsträger platziert werden können. Hierdurch lassen sich mit geringem Fertigungsaufwand beispielsweise großflächige Displays herstellen. Der Prozess der Selbstorganisation wird durch geeignete elektrische Fel¬ der unterstützt, die die zu montierenden Leuchtdioden auf die vorbereiteten Montageplätze leiten, da hierdurch ein energetisch günstiger Zustand erreicht wird. Weiterhin beschreiben H. O. Jacobs und andere in „Fabrication of a Cylindrical Display by Patterned Assembly", Science, VoI 296, 12. April 2002, Seiten 323 bis 325 ein Verfahren, bei dem zu montierende Bauelemente (Leuchtdioden) in Wasser sus¬ pendiert werden und diese sich auf einem Substrat mit geeig¬ net vorbereiteter Oberfläche ablegen. Hierbei werden Goldkontaktflächen der Bauelemente genutzt, die sich auf dem Array geeigneter Oberflächenbereiche des Substrates anlagern. Nach der selbst organisierten Bestückung kann auf die bestücktenThe use of processes for self-assembly (also called self-assembly) is already used for the placement of elekt ¬ risch contactable devices on circuit boards. According to A. O'Riordan: "Field-configured self-assembly: manufacturing at the mesoscale," Materials Science and Engi ¬ neering C 23 (2003), pages 3-6, for example, a Ver ¬ ride known with the light-emitting diodes The process of self-organization is supported by suitable electric Fel ¬ who direct the LEDs to be mounted on the prepared assembly sites, as a result, an energetically cheaper State is reached. Furthermore, describe HO Jacobs and others in "Fabrication of a Cylindrical Display by Patterned Assembly", Science, VoI 296, April 12, 2002, pages 323 to 325, a method in which to be mounted components (light-emitting diodes) suspended in water sus ¬ and this is put on a substrate with geeig ¬ net prepared surface. this gold contact areas are used as the components, which are deposited on the array of appropriate surface regions of the substrate after the self-organized assembly can be fitted to the.
Bauelemente beispielsweise eine Folie zur weiteren Kontaktie- rung der Bauelemente auf die Rückseiten der Bauelemente auf¬ gebracht werden.Components, for example, a film for further contacting of the components on the backs of the components are placed on ¬ .
Gemäß Yeh und Smith, „Fluidic Self-Assembly of Microstructu- res and its Application to the Integration of GaAs on Si", IEEE (1994), Seiten 279 bis 284 ist es weiterhin bekannt, einen selbst organisierten Bestückungsprozess von Leuchtdioden dadurch zu erreichen, dass spezielle Leuchtdioden mit einem trapezförmigen Querschnitt hergestellt werden, welche sich in geeigneten Vertiefungen eines Substrates ablegen lassen. Die Selbstorganisation wird damit mittels eines Formschlusses (Schlüssel-Schloss-Prinzip) erreicht. Anschließend muss noch eine elektrische Kontaktierung der platzierten Leuchtdioden erfolgen.According to Yeh and Smith, "Fluidic Self-Assembly of Microstructures and its Application to the Integration of GaAs on Si", IEEE (1994), pages 279 to 284, it is further known to achieve a self-organized placement process of light-emitting diodes by that special light-emitting diodes are produced with a trapezoidal cross section, which can be stored in suitable recesses of a substrate.The self-organization is thus achieved by means of a positive connection (key-lock principle), followed by an electrical contacting of the placed light-emitting diodes.
Xiong und andere beschreiben in „Controlled Multibatch Self- Assembly of Microdevices", IEEE (2003), Seiten 117 bis 127 ein Verfahren, mit dem ein selbst organisiertes Platzieren mit Hilfe geeignet vorbereiteter Flächen jeweils mit hydrophilen bzw. hydrophoben Eigenschaften erreicht werden kann. Die Bauelemente werden zur Durchführung dieses Prozes¬ ses in Wasser gegeben, wobei in aufeinander folgenden Platzierungsschritten verschiedenartige Bauelemente auf die je- weils zu diesem Zweck modifizierten Oberflächenbereiche des Substrates aufgebracht werden können. Weiterhin ist eine e- lektrische Kontaktierung der einmal platzierten Bauelemente auf elektrochemischem Wege möglich. Dabei wächst das elektri- sehe Verbindungsmaterial auf hierzu vorgesehenen Flächen der Bauelemente und des Substrates elektrochemisch auf, bis die Distanz zwischen den Bauelementen und dem Substrat durch den aufwachsenden Kontaktwerkstoff verbunden ist. Alle der ge¬ nannten Verfahren erfordern eine geeignete Vorbereitung des Substrates, um den Prozess der Selbstorganisation beim Platzieren der Bauelemente zu erzwingen. Allerdings müssen beim Vorbereiten der Schaltungsträger für den Prozess der Selbstorganisation auch die Gegebenheiten berücksichtigt werden, die sich beispielsweise durch die Geometrie oder andere Funk- tionsbereiche des Schaltungsträgers ergeben.Xiong and others describe in Controlled Multibatch Self-Assembly of Microdevices, IEEE (2003), pages 117 to 127, a method by which self-organized placement can be achieved with suitably prepared areas, each having hydrophilic or hydrophobic properties components are given for implementing this Prozes ¬ ses in water, wherein various successive steps of placing components on the JE because modified surface areas of the substrate can be applied for this purpose. Furthermore, an electrical contact with the once placed components is possible by electrochemical means. In this case, the electrical connection material grows electrochemically on surfaces of the components and of the substrate provided for this purpose, until the distance between the components and the substrate is connected by the growing contact material. All the ge ¬ called methods require appropriate preparation of the substrate to the process of self-assembly to force during placement of the components. However, when preparing the circuit carriers for the process of self-organization, the circumstances which result, for example, from the geometry or other functional areas of the circuit carrier must also be taken into account.
J. Fang und K. Böhringer beschreiben in „High Yield Batch Pa- ckaging of Micro Devices with Uniquely Orienting SeIf- Assembly", 18th IEEE International Conference on Micro E- lectro Mechanical Sysems (MEMS), 30.01. - 03.02.2005, Seiten 12-15 die Möglichkeit, kleinste, geometrisch gleichartige Probekörper und eine für diese vorgesehene Trägerplatte ei¬ nerseits mit einer Art Stift-Vertiefung-Passung und andererseits mit korrespondierenden hydrophilen Flächenpaaren zu versehen. Mittels der Passung ist eine selbstorganisierte Groborientierung der Probekörper auf der Trägerplatte möglich, wobei eine genaue Orientierung unter Einsatz von Wasser mittels der hydrophilen Oberflächenbereiche erfolgt.J. Fang and K. Böhringer describe in "High Yield Batch Packaging of Micro Devices with Uniquely Orienting Seal Assemblies", 18th IEEE International Conference on Micro Electro Mechanical Sysems (MEMS), 30.01.-03.02.2005, pages 12-15 the possibility smallest, geometrically similar sample body and a form intended for this carrier plate ei ¬ nerseits with a sort of pin-recess-fitting and on the other hand with corresponding hydrophilic surface pairs to be provided. by means of the fit is a self-organized rough orientation of the specimen on the support plate possible in which accurate orientation using water is provided by means of the hydrophilic surface areas.
Aus der DE 10 2004 058 201 Al ist bekannt, dass unter Verwen¬ dung elektrophotografischer Methoden Bauelemente auf Trägerbauteilen mit einer Genauigkeit von bis zu einem μm positio¬ niert werden können. Gemäß der US 6,089,853 ist beschrieben, wie funktionalisierte Oberflächenbereiche auf eine Oberfläche beispielsweise eines Trägerbauteils mittels Maskentechnologie aufgebracht werden können .From DE 10 2004 058 201 Al is known that dung electrophotographic graphical under USAGE ¬ methods elements can be defined to support members with an accuracy of up to one micron positio ¬. No. 6,089,853 describes how functionalized surface regions can be applied to a surface, for example of a carrier component, by means of mask technology.
Hiervon ausgehend ergibt sich die Aufgabe der Erfindung, ein Verfahren zum Platzieren von elektrisch kontaktierbaren Bauelementen auf einem Schaltungsträger anzugeben, bei dem der zum Platzieren verwendete Prozess der Selbstorganisation ver- gleichsweise unabhängig von den durch den Schaltungsträger und den verwendeten Bauelementen vorgegebenen Gegebenheiten durchgeführt werden kann.On this basis, it is the object of the invention to provide a method for placing electrically contactable components on a circuit carrier, in which the process of self-organization used for placing can be performed comparatively independently of the conditions given by the circuit carrier and the components used.
Diese Aufgabe wird mit den eingangs genannten Verfahren er- findungsgemäß dadurch gelöst, dass verschiedenartige Bauele¬ mente auf dem Trägerbauteil fixiert werden, wobei eine Ein¬ deutigkeit der Platzierung der Bauelemente auf dem Trägerbauteil dadurch gewährleistet wird, dass für die Erzeugung der Oberflächenbereiche jeder Art von Bauelementen und der zugehörigen Oberflächenbereiche auf dem Trägerbauteil einThis object is achieved with the method mentioned ER- inventively achieved in that various Bauele ¬ elements are fixed on the support member, wherein a one ¬ ambiguity of the placement of the components is ensured on the carrier member characterized in that for the generation of the surface areas of each type of Components and the associated surface areas on the support member
Wirkprinzip der Selbstorganisation ausgewählt wird, das selektiv bezüglich der Wirkprinzipien der Selbstorganisation aller anderen Arten von Bauelementen ist.Selective principle of self-organization is selected, which is selective in terms of the principles of self-assembly of all other types of components.
Allgemein kann man die zum Einsatz kommenden Wirkprinzipien in physikalische, chemische und biochemische unterteilen, wo¬ bei in der genannten Reihenfolge die erreichbare Selektivität möglicher Anordnungen aufgrund der Adressierung der Grenzflächen steigt. Als physikalische Wirkprinzipien kommen bei- spielsweise Oberflächenspannung (Nutzung der Kapillarkräfte) sowie mechanische, elektrostatische und magnetische Kräfte infrage. Chemische Wirkprinzipien können auf nicht kovalen- ten, teilkovalenten oder kovalenten Wechselwirkungen, Komplexbildungen bis hin zur chemischen Bindung oder einem Io- nenaustausch bis hin zur Schiff-schen Base beruhen. Als biochemische Wirkprinzipien kommen beispielsweise die Antigen- Antikörperbindungen, Bindungen zwischen Oligonukleotiden oder Enzym-Substrat-Bindungen infrage. Zur Nutzung der genannten Effekte müssen die Oberflächenbereiche, die zur Durchführung des Prozesses der Selbstorganisation vorgesehen werden, geeignete Oberflächeneigenschaften aufweisen. Dies kann einmal durch Wahl des Werkstoffes der Oberfläche erfolgen, ist je¬ doch auch zu erreichen, indem die Oberflächenbereiche in ei- ner geeigneten Weise mit einer funktionellen Beschichtung versehen werden.Generally, one can use in the coming to active principles in physical, chemical and biochemical divide where ¬ at the achievable selectivity possible in the order mentioned arrangements increases due to the addressing of the interfaces. For example, surface tension (use of capillary forces) as well as mechanical, electrostatic and magnetic forces may be considered as physical principles of action. Chemical principles of action can be applied to non-covalenced, partially covalent or covalent interactions, complex formation to chemical bonding or an ionic reaction. exchange up to the ship's base. Examples of suitable biochemical active principles are the antigen-antibody bonds, bonds between oligonucleotides or enzyme-substrate bonds. To utilize the above effects, the surface areas provided for carrying out the process of self-assembly must have suitable surface properties. This can be done even by the choice of the material of the surface, depending ¬ but is also achieved by the surface portions are provided in a suitable manner with a functional coating.
Um verschiedenartige Bauteile platzieren zu können, wird un¬ ter den mannigfachen Wirkprinzipien eine Kombination ausge- wählt, die die jeweilige Selektivität bestimmter Oberflächen¬ bereiche zu bestimmten zu platzierenden Bauelementen sicherstellt, d. h. eine Kompatibilität zwischen anderen Oberflä¬ chenbereichen darf nicht gegeben sein, um eine Eindeutigkeit der Platzierung der Bauelemente sicherzustellen. Weiterhin müssen die einzelnen Bauelemente auch mit Oberflächenberei¬ chen unterschiedlicher Funktionsprinzipien versehen werden, wenn beispielsweise ihre Polarität bei der elektrischen Kon- taktierung Beachtung finden muss. Nur so kann verhindert werden, dass sich die Bauelemente in einer falschen Orientierung auf dem Trägerbauteil platzieren.To be able to place different types of components, un ¬ is ter the manifold active principles a combination selects excluded that the particular selectivity of certain surfaces ¬ areas at certain to be placed components ensures that compatibility between other surface ay not be given ¬ chenbereichen to a Ensure unambiguous placement of components. Furthermore, the individual components must also be provided with Oberflächenberei ¬ chen different functional principles, if, for example, their polarity in the electrical Kon- taktierung attention must be paid attention. This is the only way to prevent the components from being placed on the carrier component in a wrong orientation.
Die Erfindung beruht außerdem auf der Idee, für den Montage- prozess zusätzlich ein Trägerbauteil zur Verfügung zu stel¬ len, auf dem der Prozess der Selbstorganisation der Bauele- mente erfolgt. Die Bauelemente werden bewusst mit ihren Rück¬ seiten an dem Trägerbauteil befestigt, wobei die Haltekräfte aufgrund des Selbstorganisationsprozesses ausreichen müssen, damit das Trägerbauteil problemlos bei dem weiteren Montage- prozess gehandhabt werden kann. Dieses wird nämlich nach Ab- Schluss der Selbstorganisation der Bauelemente auf den Schal¬ tungsträger aufgesetzt, so dass die Bauelemente mit ihren Montageseiten auf dem Schaltungsträger zu liegen kommen (Schaltungsträger und Trägerbauteil müssen nicht eben ausge- bildet sein, sondern lediglich aufeinander angepasste Geometrien aufweisen) . Anschließend wird eine Befestigung der Bauelemente auf dem Schaltungsträger bewerkstelligt, wobei dies einerseits durch eine vorläufige Fixierung beispielsweise mit einem Unterfüllmaterial zwischen den Bauelementen und dem Schaltungsträger erfolgen kann oder durch eine elektrische Verbindung der Bauelemente auf dem Schaltungsträger, beispielsweise mit Lotwerkstoff oder Leitkleber.The invention also is based on the idea takes place, in addition to the process mounting a support member len available to stel ¬ on which elements of the process of self organization of Bauele-. The components are deliberately fastened with their back ¬ sides on the support member, the holding forces must be sufficient due to the self-assembly process, so that the support member can be handled easily in the further assembly process. This is in fact Concluding the self-assembly of the components mounted on the scarf ¬ tion carrier, so that the components come to rest with their mounting sides on the circuit board (circuit carrier and support member must not be flat forms, but have only matched geometries). Subsequently, an attachment of the components is accomplished on the circuit substrate, which can be done on the one hand by a provisional fixation, for example with a Unterfüllmaterial between the components and the circuit carrier or by an electrical connection of the components on the circuit substrate, for example with solder material or conductive adhesive.
Der wesentliche Vorteil bei diesem Vorgehen liegt darin, dass die Oberfläche des Schaltungsträgers nicht für einen Prozess der Selbstorganisation modifiziert werden muss. Daher entsteht vorteilhaft eine uneingeschränkte Gestaltungsfreiheit für die Oberfläche des Schaltungsträgers, weil die durch die Gestaltung des Schaltungsträgers vorgegebenen Gegebenheiten für den Prozess der Selbstorganisation nicht berücksichtigt werden müssen. Andererseits kann das verwendete Trägerbau¬ teil, was lediglich zur zwischenzeitigen Montage der Bauelemente unter Ausnutzung des Prozesses der Selbstorganisation genutzt wird, optimal auf diese Aufgabe vorbereitet werden, da außer der Anordnung der Bauelemente keine weiteren konstruktiven Vorgaben bei der Gestaltung beachtet werden müssen .The main advantage of this procedure is that the surface of the circuit substrate does not have to be modified for a process of self-organization. Therefore, an unrestricted freedom of design for the surface of the circuit carrier advantageously arises because the conditions given by the design of the circuit carrier need not be taken into account for the process of self-organization. On the other hand, the used Trägerbau ¬ part, which is only used for temporary assembly of the components taking advantage of the process of self-organization, be optimally prepared for this task, since apart from the arrangement of the components no further design specifications must be observed in the design.
Gemäß einer vorteilhaften Ausgestaltung der Erfindung ist vorgesehen, dass das Trägerbauteil nach dem Befestigen derAccording to an advantageous embodiment of the invention it is provided that the support member after attaching the
Bauelemente auf dem Schaltungsträger von den Bauelementen abgelöst wird. Dies hat den Vorteil, dass das Trägerbauteil an¬ schließend einem weiteren Selbstorganisationsprozess zur Ver¬ fügung gestellt werden kann, wodurch die Effizienz des Ver- fahrens gesteigert wird. Das Trägerbauteil wird vorzugsweise derart auf den Prozess der Selbstorganisation vorbereitet, dass das Anlagern und Ablösen der vorläufig platzierten Bauelemente durch einen reversiblen Prozess erfolgt (hierzu im Folgenden mehr) . Hierdurch entsteht ein weiterer Vorteil bei der Verwendung eines Trägerbauteils, da eine Vorbereitung des Trägerbauteils für die vorläufig zu platzierenden Bauelemente nur einmal durchgeführt werden muss und dann wiederholte Mon¬ tageprozesse auf mehreren Schaltungsträgern einer Serie er- folgen können. Gemäß dem Stand der Technik muss jeder Schaltungsträger für den Prozess der Selbstmontage vorbereitet werden .Components on the circuit board is detached from the components. This has the advantage that the support member at ¬ may be provided closing a further self-organization process Ver ¬ addition, reducing the efficiency of the comparison driving is increased. The carrier component is preferably prepared for the process of self-organization such that the attachment and detachment of the provisionally placed components takes place by a reversible process (more on this in the following). This results in a further advantage in the use of a carrier component, since a preparation of the carrier component for the temporarily placed components must be performed only once and then repeated Mon ¬ daily processes on several circuit carriers of a series can follow. According to the prior art, each circuit carrier must be prepared for the process of self-assembly.
Weiterhin ist es vorteilhaft, wenn das Befestigen der Bauele- mente auf dem Schaltungsträger durch Löten erfolgt. Lötverbindungen erzeugen vorteilhaft sehr zuverlässige und belast¬ bare Verbindungen zwischen den Bauelementen und dem Schaltungsträger, so dass ein eventuelles Entfernen des Trägerbau¬ teils nach der Befestigung durch Löten unproblematisch ist. Außerdem wird der Montageprozess der Bauelemente auf demFurthermore, it is advantageous if the fastening of the components on the circuit carrier takes place by means of soldering. Produce solder joints advantageously very reliable and belast ¬ bare connections between the components and the circuit substrate, so that a possible removal of the beam assembly ¬ partly after the attachment by soldering is unproblematic. In addition, the assembly process of the components on the
Schaltungsträger durch den Lötvorgang abgeschlossen, so dass das Trägerbauteil bei diesem Prozessschritt die Lage der Bau¬ elemente auf dem Schaltungsträger noch stabilisiert.Circuit carrier completed by the soldering process, so that the support member in this process step, the position of the construction ¬ elements still stabilized on the circuit substrate.
Es ist vorteilhaft, wenn zum Löten Lotpartikel aus einem Lot¬ werkstoff durch einen weiteren Prozess der Selbstorganisation auf die Kontaktflächen der Bauelemente aufgetragen werden, bevor das Trägerbauteil auf den Schaltungsträger aufgesetzt wird. Der weitere Prozess der Selbstorganisation kann in ei- nem gesonderten Verfahrensschritt durchgeführt werden, so dass die auf dem Trägerbauteil befindlichen Bauelemente zu¬ verlässig mit einer genau definierten Menge an Lotwerkstoff versehen werden. Besonders vorteilhaft ist es jedoch, wenn die Prozesse der Selbstorganisation für die Bauelemente und die Lotpartikel in einem Arbeitsgang durchgeführt werden. Hierdurch lässt sich die Effizienz des Verfahrens vorteilhaft steigern, wodurch auch eine höhere Wirtschaftlichkeit er¬ reicht wird. Bei der Zusammenfassung der Prozesse der Selbst- Organisation ist es notwendig, dass für jeden Prozess ein ei¬ gener Mechanismus der Selbstorganisation genutzt wird, so dass eine Selektivität gewährleistet wird. Auf diese Weise organisieren sich die Lotpartikel auf den Kontaktflächen der Bauelemente unabhängig von der Organisation der Bauelemente auf dem Schaltungsträger, so dass z. B. ausgeschlossen werden kann, dass sich anstelle der Bauelemente Lotpartikel auf dem Trägerbauteil ablegen. Sollten in dem Prozess der Selbstorga¬ nisation für die Bauelemente mehrere Sorten von Bauelementen gleichzeitig auf dem Schaltungsträger platziert werden, so muss auch zwischen den verschiedenartigen Bauelementen einIt is advantageous if for soldering solder particles of a solder ¬ be applied by a further process of self-organization of the contact surfaces of the components before the support member is placed on the circuit substrate material. The further process of self-assembly can be carried out in egg nem separate process step, so that the components to ¬ on the support member reliably be provided with a well-defined amount of solder material. However, it is particularly advantageous if the processes of self-organization for the components and the solder particles are carried out in one operation. As a result, the efficiency of the method can be advantageously increased, whereby a higher economic efficiency he ¬ is enough. When combining the processes of self-organization, it is necessary that for each process an egg ¬ gener mechanism of self-assembly is used, so that selectivity is ensured. In this way, the solder particles organize themselves on the contact surfaces of the components regardless of the organization of the components on the circuit board, so that z. B. can be ruled out that deposit instead of the components of solder particles on the support member. If in the process of self-Orga ¬ tion for the components several varieties are placed by the same components on the circuit board, it must also between the various components
Unterschied in dem Mechanismus des Prozesses der Selbstorga¬ nisation vorliegen, zwischen denen eine Kompatibilität ausgeschlossen ist. Nur so kann gewährleistet werden, dass die entsprechenden Plätze auf dem Trägerbauteil nur von den Bau- elementen belegt werden, für die sie vorgesehen sind.Difference in the mechanism of the process of self-Orga ¬ present tion between which compatibility is excluded. Only in this way can it be ensured that the corresponding places on the carrier component are only occupied by the components for which they are intended.
Eine andere Ausgestaltung der Erfindung sieht vor, dass Lotpartikel aus einem Lotwerkstoff durch einen weiteren Prozess der Selbstorganisation auf für die Bauelemente vorgesehene Kontaktflächen des Schaltungsträgers aufgetragen werden, bevor das Trägerbauteil auf den Schaltungsträger aufgesetzt wird. Dies hat den Vorteil, dass der Prozess der Selbstorga¬ nisation für den Lotwerkstoff in jedem Fall getrennt von dem Trägerbauteil erfolgt und so der Prozess für das Platzieren der Bauelemente auf dem Trägerbauteil hinsichtlich verschie¬ denartiger Bauteile komplexer gestaltet werden kann. Andererseits ist die Applikation von Partikeln aus einem Lotwerkstoff ein verhältnismäßig einfacher Prozess der Selbstorganisation, da diese eine unbestimmte Geometrie aufweisen und da- her nicht in einer bestimmten Ausrichtung auf dem Schaltungsträger vorliegen müssen. Bei dieser Ausgestaltung der Erfindung muss zwar der Schaltungsträger (ähnlich wie gemäß dem Stand der Technik) für den Selbstorganisationsprozess zur Ap- plikation des Lotwerkstoffs vorbereitet werden, dieser Pro- zess der Selbstorganisation ist aber wesentlich einfacher durchzuführen, wodurch eine Einschränkung durch die Gegebenheiten des Schaltungsträgers weniger wirksam ist als bei der selbst organisierten Platzierung von Bauelementen, die evtl. sogar verschieden voneinander sind.Another embodiment of the invention provides that solder particles are applied from a brazing material by a further process of self-organization on provided for the components contact surfaces of the circuit substrate before the support member is placed on the circuit board. This has the advantage that the process of self-Orga ¬ tion for the solder material in each case separated from the carrier component is performed and the process for placing the components denartiger on the support member with respect various ¬ components can be made more complex. On the other hand, the application of particles made of a solder material is a relatively simple process of self-organization, since they have an indefinite geometry and must not be present in a specific orientation on the circuit board. Although in this embodiment of the invention the circuit carrier (as in the prior art) must be prepared for the self-assembly process for application of the solder material, this process of self-organization is much easier to implement, thereby limiting the conditions of the circuit carrier is less effective than in the self-organized placement of components that may even be different from each other.
Besonders vorteilhaft ist es, wenn mit dem weiteren Prozess der Selbstorganisation eine Monolage von Lotpartikeln auf die Kontaktflächen aufgebracht wird. Hierdurch lässt sich vor- teilhaft die Menge an aufgebrachtem Lot besonders fein dosie¬ ren, weil über die Fläche der Kontaktflächen die Lotmenge ge¬ nau definiert ist. Außerdem lässt sich ein Prozess der Selbstorganisation, bei dem sich lediglich eine Lage von Lotpartikeln abscheiden lässt, d. h. die Lotpartikel sich nicht aneinander anlagern können, besonders einfach durchführen.It is particularly advantageous if, with the further process of self-assembly, a monolayer of solder particles is applied to the contact surfaces. In this way, the amount of applied solder can be pre-geous ren particularly fine Dosie ¬ because the amount of solder ge ¬ is precisely defined by the area of the contact surfaces. In addition, a process of self-organization in which only one layer of solder particles can be deposited, ie the solder particles can not be attached to one another, can be carried out particularly easily.
Wenn die Lotpartikel eine im Wesentlichen gleichmäßige Größe aufweisen, ist die Geometrie der erzeugten Lotdepots vorteil¬ haft besonders genau vorgegeben. Auch die zu applizierende Lotmenge pro Kontaktfläche ist dann besonders genau vorgege- ben.If the solder particles have a substantially uniform size, the geometry of the solder deposit is produced by way of advantageous ¬ predetermined particularly accurately. The amount of solder to be applied per contact surface is then also specified very precisely.
Weiterhin bezieht sich die Erfindung auf ein Montagesystem für die Herstellung von mit Bauelementen bestückten Schaltungsträgern. Soll dieses Montagesystem eine Bestückung der Bauelemente auf dem Schaltungsträger mit einem Prozess der Selbstorganisation erlauben, müssen in diesem Montagesystem die Bauelemente einerseits und das Substrat, auf das die Bau¬ elemente aufgebracht werden sollen andererseits für den Pro¬ zess der Selbstorganisation vorbereitet sein. Gemäß dem oben genannten Stand der Technik erfolgt dies durch eine geeignete Vorbereitung von Oberflächenbereichen an den Bauelementen sowie dem zugehörigen Substrat, wodurch das Montagesystem entsteht .Furthermore, the invention relates to a mounting system for the production of component-mounted circuit carriers. Should this mounting system allow insertion of components on the circuit substrate with a process of self-assembly, the components must in this mounting system on the one hand and the substrate to which the construction ¬ elements to be deposited on the other hand be prepared process of self-organization for the Pro ¬. According to the above This is done by a suitable preparation of surface areas on the components and the associated substrate, whereby the mounting system is formed.
Eine weitere Aufgabe der Erfindung besteht daher darin, ein Montagesystem für die Herstellung von mit Bauteilen bestückten Schaltungsträgern anzugeben, bei dem die durch den zu bestückenden Schaltungsträger und die zu bestückenden Bauele- mente vorgegebenen Randbedingungen vergleichsweise weitgehend beachtet werden können.A further object of the invention is therefore to provide a mounting system for the production of circuit boards equipped with components, in which the boundary conditions predetermined by the circuit carrier to be equipped and the components to be equipped can be observed to a comparatively large extent.
Diese Aufgabe wird mit dem genannten Montagesystem erfindungsgemäß dadurch gelöst, dass das Montagesystem aus einem auf die zu bestückenden Schaltungsträger angepassten Trägerbauteil für die zu bestückenden Bauelemente und den zu bestü¬ ckenden Bauelementen besteht, wobei die von der Montageseite abgekehrten Rückseiten der Bauelemente und die Oberfläche des Trägerbauteils mit Oberflächenbereichen versehen sind, die eine selbst organisierte Anordnung der Bauelemente auf dem Trägerbauteil unter Berücksichtigung der erforderlichen Bestückung des Schaltungsträgers erlauben, wobei verschiedenartige Bauelemente für die Fixierung auf dem Trägerbauteil vor¬ gesehen sind, wobei eine Eindeutigkeit der Platzierung der Bauelemente auf dem Trägerbauteil dadurch gewährleistet ist, dass für die Oberflächenbereiche jeder Art von Bauelementen und die zugehörigen Oberflächenbereiche auf dem Trägerbauteil ein Wirkprinzip der Selbstorganisation vorgesehen ist, das selektiv bezüglich der Wirkprinzipien der Selbstorganisation aller anderen Arten von Bauelementen ist.This object is achieved with said mounting system according to the invention characterized in that the mounting system consists of one on the adapted to be equipped circuit carrier support member for the to be mounted devices and to assembly plants ¬-bridging elements, with the side facing away from the mounting side backs of the components and the surface of the Carrier components are provided with surface areas that allow a self-organized arrangement of the components on the support member, taking into account the required assembly of the circuit substrate, with various components for fixation on the support member are seen ¬ before, with a uniqueness of the placement of the components on the support member characterized It is ensured that an active principle of self-organization is provided for the surface areas of each type of components and the associated surface areas on the carrier component, which selectively be is the principle of self-organization of all other types of components.
Mit dem Montagesystem werden die bereits zum erfindungsgemä¬ ßen Verfahren genannten Vorteile erreicht. Insbesondere ist es nämlich möglich, bei der Herstellung des Montagesystems die zu bestückenden Schaltungsträger nur insoweit zu berücksichtigen, dass auf dem Trägerbauteil die Bauelemente in ge¬ nau der Ordnung angeordnet sein müssen, welche für die Bestü¬ ckung des Schaltungsträgers erforderlich ist (Schaltungsträ- ger muss nicht eben sein) . Hinsichtlich der Oberflächen, die die Selbstorganisation der Bauelemente auf dem Trägerbauteil ermöglichen, muss auf den zu bestückenden Schaltungsträger nicht Rücksicht genommen werden. Es muss lediglich ein komplikationsloses Zusammenwirken zwischen dem Trägerbauteil und den Bauelementen gewährleistet sein. Das Montagesystem, bestehend aus Trägerbauteil und Bauelementen (vorbereitet für die Durchführung des Prozesses der Selbstorganisation) kann als solches verkauft werden, wobei die Schaltungsträger, die mit diesem Montagesystem bestückt werden sollen, aus einer beliebigen Quelle stammen können. Dabei kann das Trägerbauteil vorteilhaft auch für mehrere Bestückungen von Schal¬ tungsträgern dienen, wenn der Prozess der Selbstorganisation der Bauelemente auf dem Trägerbauteil reversibel ausgestaltet ist .With the mounting system the benefits already mentioned the invention shown SEN process are achieved. In particular, it is possible in the manufacture of the mounting system the circuit carriers to be equipped only to the extent that on the support component, the components must be arranged in ge ¬ nau order, which is required for the Bestü ¬ ckung of the circuit carrier (circuit substrate must not be flat). With regard to the surfaces which enable the self-assembly of the components on the carrier component, it is not necessary to take account of the circuit carrier to be assembled. It must be ensured only a complication-free interaction between the support member and the components. The mounting system consisting of carrier component and components (prepared for carrying out the process of self-assembly) can be sold as such, with the circuit carriers that are to be equipped with this mounting system, can come from any source. In this case, the carrier component can advantageously also serve for a plurality of assemblies of scarf ¬ tion carriers when the process of self-assembly of the components on the support member is configured reversible.
Weitere Einzelheiten der Erfindung werden im Folgenden anhand der Zeichnung beschrieben. Gleiche und sich entsprechende Zeichnungselemente sind in den Figuren mit jeweils den glei¬ chen Bezugszeichen versehen und werden nur insoweit mehrfach erläutert, wie sich Unterschiede zwischen den einzelnen Figu¬ ren ergeben. Es zeigenFurther details of the invention will be described below with reference to the drawing. Like and corresponding drawing elements are provided in the figures, each with the moving ¬ reference symbols and will only be described in so far multiple, such as arise ren differences between the individual Figu ¬. Show it
Figur 1 bis 4 ausgewählte Verfahrensschritte von Ausfüh¬ rungsbeispielen des erfindungsgemäßen Verfahrens, wobei in Figur 1 ein Ausführungsbeispiel des erfindungsgemäßenFigure 1 to 4 selected steps of exporting ¬ approximately examples of the method according to the invention, in which figure 1 shows an embodiment of the invention
Montagesystems dargestellt ist.Mounting system is shown.
In Figur 1 ist der erste Verfahrensschritt zum Platzieren von elektrisch kontaktierbaren Bauelementen 11 auf einem in Figur 1 noch nicht dargestellten Schaltungsträger 12 (siehe Figur 4) dargestellt. Zum Durchführen eines Prozesses der Selbstorganisation, um die gewünschte Anordnung der Bauelemente 11 zu erzeugen, wird ein Trägerbauteil 13 verwendet, wobei auf den Bauelementen 11 sowie auf dem Trägerbauteil 13 komplementäre Oberflächenbereiche angebracht wurden, die den Prozess der Selbstorganisation auslösen. Um den Prozess der Selbstorganisation, d. h. das Erzeugen einer gewünschten Anordnung von Bauelementen 11 auf der Oberfläche 15 des Trägerbauteils 13 zu erreichen, werden die Bauelemente 11 und das Trägerbauteil 13 in einen Behälter 16 eingelegt, der beispielsweise mit Wasser gefüllt ist (wobei die durch die Oberflächenbereiche 14a, 14b erzwungenen Prozesse der Selbstorganisation in Wasser wirksam werden) .In FIG. 1, the first method step for placing electrically contactable components 11 is shown in FIG 1 not shown circuit carrier 12 (see Figure 4) shown. To perform a process of self-assembly to produce the desired arrangement of the devices 11, a support member 13 is used, with surfaces 13 on the components 11 and on the support member 13 having complimentary surface areas initiating the process of self-assembly. In order to achieve the process of self-organization, ie the generation of a desired arrangement of components 11 on the surface 15 of the support member 13, the components 11 and the support member 13 are placed in a container 16, which is filled, for example, with water (wherein the through Surface regions 14a, 14b become effective processes of self-organization in water).
Der Prozess der Selbstorganisation führt dazu, dass die ge¬ wünschte Anordnung der Bauelemente 11 auf dem Schaltungsträ¬ ger 12 erzeugt wird, ohne dass die Bauelemente 11 hierzu ein¬ zeln gehandhabt werden müssten. Der Prozess der Selbstorgani- sation kann allerdings durch ein Bewegen des Behälters unterstützt werden, wobei der Transport der Bauelemente 11 zur O- berfläche 15 erleichtert wird.The process of self-organization results in that the ge ¬ desired arrangement of the components on the ger 11 Schaltungsträ ¬ 12 is generated without the components 11 thereto a ¬ would be handled individually. However, the process of self-organization can be assisted by moving the container, facilitating the transport of the components 11 to the surface 15.
Gleichzeitig können Lotpartikel 17 auf Kontaktflächen 18a durch einen weiteren Prozess der Selbstorganisation aufgebracht werden. Soll dieser Prozess der Selbstorganisation gleichzeitig zu dem erstgenannten erfolgen, so dürfen die beiden Prozesse nicht kompatibel zueinander sein, damit die Lotpartikel 17 entsprechend der durch die Doppelpfeile 19 an- gedeuteten Weise von den Oberflächenbereichen 14b des Trägerbauteils 13 abgestoßen werden. Ebenso dürfen sich die Lotpartikel 17 nicht an die Oberflächenbereiche 14a an den Bauele¬ menten anlagern, die für die Oberflächenbereiche 14b auf den Trägerbauteil gedacht sind. Dafür ziehen sich jedoch die O- berflächen der Kontaktflächen 18a und der Lotpartikel 17 an, so dass die kugelförmigen Lotpartikel am vorgesehenen Einsatzort platziert werden.At the same time, solder particles 17 can be applied to contact surfaces 18a by a further process of self-organization. If this process of self-organization is to take place simultaneously with the former, then the two processes must not be compatible with one another so that the solder particles 17 are repelled by the surface regions 14b of the carrier component 13 in the manner indicated by the double arrows 19. Similarly, the solder particles may 17 not attach to the surface regions 14a ¬ to the Bauele elements, which are intended for the surface portions 14b of the support member. However, the O- Surface of the contact surfaces 18a and the solder particles 17, so that the spherical solder particles are placed at the intended location.
Gemäß Figur 2 ist dargestellt, dass alternativ zum zweitenAccording to FIG. 2, it is shown that, as an alternative to the second
Teil des Verfahrensschrittes gemäß Figur 1 die Lotpartikel 17 auch in einem gesonderten Schritt auf den Schaltungsträger 12 aufgebracht werden können. Dieser Schritt findet ebenfalls in einem Behälter 16 statt, der mit Wasser gefüllt ist. Die Lot- partikel 17 lagern sich entsprechend des bereits erläuterten Mechanismusses an den Kontaktflächen 18b des Schaltungsträ¬ gers an. Dementsprechend wird die Anlagerung von Lotpartikeln 17 gemäß Figur 1 überflüssig.Part of the process step according to Figure 1, the solder particles 17 can be applied to the circuit substrate 12 in a separate step. This step also takes place in a container 16 filled with water. The solder particles 17 are deposited according to the already explained the mechanism on the contact surfaces 18b of Schaltungsträ ¬ gers on. Accordingly, the addition of solder particles 17 according to FIG. 1 becomes superfluous.
Nicht dargestellt ist die Möglichkeit, die Lotpartikel in ei¬ nem gesonderten Schritt auf die bereits auf dem Trägerbauteil 13 fixierten Bauelemente 11 aufzubringen. Diese Variante des Verfahrens kann in einer Anordnung gemäß Figur 1 durchgeführt werden und unterscheidet sich lediglich dadurch, dass in ei- nem ersten Schritt die Bauelemente 11 in den Behälter 11 ge¬ geben werden und die Lotpartikel erst hinzugegeben werden, wenn alle Bauelemente auf dem Trägerbauteil platziert sind. Die Applikation der Lotpartikel 17 kann natürlich auch in einem gesonderten Behälter erfolgen.Not shown is the ability to apply the solder particles in ei ¬ nem separate step on the already fixed to the support member 13 components 11. This variant of the process Figure 1 are carried out in an arrangement according to and only in that the components are 11 to give 11 ge ¬ into the container in egg nem first step and the solder particles are only added differs if all devices on the support member are placed. Of course, the application of the solder particles 17 can also take place in a separate container.
Die Lotpartikel 17 weisen eine Größe auf, dass sie als Lotde¬ pot für Kontaktbumps, insbesondere für die Flip-Chip-Montage ausreichen. Dies bedeutet, dass sich auf jeder Kontaktfläche 18a oder 18b jeweils genau ein Lotpartikel absetzt. In Figur 2 ist jedoch auch eine Alternative mit Lotpartikeln 17a dargestellt, wobei die Lotpartikel einen wesentlich geringeren Durchmesser als die Lotpartikel 17 aufweisen. Daher können diese sich auf den Kontaktflächen 18b in Form einer Monolage anlagern, wobei vorteilhaft Lotdepots mit einem wesentlich geringeren Volumen erzeugbar werden. Auf die Darstellung der alternativ verwendeten Lotpartikel 17a wird in den Figuren 1, 3 und 4 verzichtet, wobei das Verfahren mit auf diese Weise erzeugten Lotdepots ansonsten analog durchzuführen ist. Die Lotpartikel 17a können anstelle einer Kugelform auch bei¬ spielsweise zylindrische oder unregelmäßige Formen aufweisen, wobei es vorteilhaft ist, wenn die Lotpartikel insgesamt im Wesentlichen die gleiche Größe aufweisen, da so Monolagen mit konstanter Dicke entstehen.The solder particles 17 have a size that they are sufficient as Lotde ¬ pot for Kontaktbumps, in particular for the flip-chip mounting. This means that exactly one solder particle is deposited on each contact surface 18a or 18b. However, FIG. 2 also shows an alternative with solder particles 17 a, the solder particles having a substantially smaller diameter than the solder particles 17. Therefore, these can be deposited on the contact surfaces 18b in the form of a monolayer, wherein advantageously solder deposits with a substantial lower volume can be generated. The illustration of the solder particles 17a used as an alternative is omitted in FIGS. 1, 3 and 4, wherein the method is otherwise to be carried out analogously with solder deposits produced in this way. The solder particles 17a may have, instead of a spherical shape even when ¬ play, cylindrical or irregular shapes, it being advantageous when the solder particles having substantially the same size as a whole, because so monolayers are formed with a constant thickness.
Auf den gemäß der Figuren 1 und 2 stattfindenden Prozess der Selbstorganisation soll im Folgenden genauer eingegangen werden. Als Selbstorganisation ist ein thermodynamischer Prozess zu verstehen, bei dem eine Ordnung scheinbar von selbst ent- steht. In Wirklichkeit beruht das Wesen der hier genutztenThe process of self-organization taking place according to FIGS. 1 and 2 will be discussed in more detail below. Self-organization is a thermodynamic process in which an order seems to arise by itself. In reality, the essence of the used here
Selbstorganisation auf der spontanen Herausbildung geordneter Strukturen an Grenzflächen (im Ausführungsbeispiel festflüssig, denkbar ist jedoch auch fest-gasförmig oder flüssiggasförmig) . Dabei wird ein energetisches Minimum erreicht, wenn die gewünschte Form der Selbstorganisation erreicht wird. Mit anderen Worten: Die individuellen, sich selbst organisierenden Komponenten ordnen sich aufgrund von Absto- ßungs- und Anziehungskräften in der gewünschten Weise an, wobei die genannten Kräfte sich aus Form, Oberflächeneigen- Schäften, Ladung, Polarität, magnetischem Moment oder der Masse oder auch anderer beliebiger codierter Informationen ergeben können.Self-organization on the spontaneous formation of ordered structures at interfaces (in the exemplary embodiment solid, conceivable, however, is also solid-gaseous or liquid-gas). An energetic minimum is achieved when the desired form of self-organization is achieved. In other words, the individual, self-organizing components arrange themselves in the desired manner due to repulsive and attractive forces, said forces being of shape, surface properties, charge, polarity, magnetic moment or mass or even other arbitrary coded information.
Ein besonderes Beispiel für einen selbst organisierenden Pro- zess, der zur Platzierung der Lotpartikel auf den Kontaktflä¬ chen geeignet ist, soll im Folgenden angegeben werden. Die Kontaktflächen sind aus Gold, Silber oder Kupfer hergestellt. Für Oberflächen aus diesen Metallen gilt, dass auf ihnen die Thiol-Gruppen unterschiedlicher Moleküle chemisch angelagert werden können. Dabei wird ein Wasserstoffatom aus der Thiol- Gruppe abgespalten und eine Metall-Thiolatverbindung gebildet. Als mögliche Thiole kommen beispielsweise die Alkanthio- Ie infrage, die eine Alkan-Kette aufweisen, an deren Ende sich die Thiol-Gruppe befindet. Durch benachbartes Anlagern der Thiol-Gruppen an der Oberfläche der Kontaktflächen bilden sich daher parallel ausgerichtete Alkan-Ketten, die von der Oberfläche der Kontaktflächen abstehen. Wenn man andererseits die Lotpartikel beispielsweise mit einer Wachsschicht ver- sieht, so wird eine Bindung zwischen den Alkanketten, die nun die Oberflächeneigenschaften der Kontaktfläche bestimmen und der Oberfläche der Lotpartikel aufgrund der jeweils lipophi- len Eigenschaften dieser Substanzen stark gefördert, weswegen eine selbst organisierte Anlagerung der Lotpartikel auf den Kontaktflächen erfolgt. Alternativ können die Alkanothiole natürlich auch mit ihrem langkettigen Alkanteil in einem ersten Prozessschritt an die Wachsoberfläche der Lotpartikel an¬ gelagert werden, so dass diese bei Einbringen in den Behälter 16 an die Kontaktflächen 18a anlagern, welche in diesem Fall nicht weiter vorbereitet werden müssen.A particular example of a self-organizing process, which is suitable for the placement of the solder particles on the Kontaktflä ¬ Chen, will be given below. The contact surfaces are made of gold, silver or copper. For surfaces made from these metals, the thiol groups of different molecules are chemically attached to them can be. In this case, a hydrogen atom is split off from the thiol group and a metal thiolate compound is formed. Examples of possible thiols are the alkanethiones which have an alkane chain at the end of which is the thiol group. By adjacent attachment of the thiol groups on the surface of the contact surfaces therefore form parallel aligned alkane chains that protrude from the surface of the contact surfaces. If, on the other hand, the solder particles are provided, for example, with a wax layer, then a bond between the alkane chains, which now determine the surface properties of the contact surface and the surface of the solder particles due to the particular lipophilic properties of these substances, is greatly promoted, for which reason self-organized attachment the solder particle occurs on the contact surfaces. Alternatively, the Alkanothiole can of course also with their long-chain alkane moiety in a first process step are stored in the wax surface of the solder particles at ¬ so that they attach, when introduced into the container 16 to the contact surfaces 18a, which need not be further prepared in this case.
Die Alkanthiole können jedoch auch auf geeignete Metalloberflächen auf der Rückseite 20 der Bauelemente 11 angebracht werden und schaffen auf diese Weise eine Kopplungsmöglichkeit für weitere Oligonukleotide . Unter diesen können jeweils kom¬ plementäre Paare ausgewählt werden, wobei der eine Partner auf den Kontaktflächen 14b des Trägerbauteils und der andere Partner auf den Kontaktflächen 14a auf den Rückseiten 20 der Bauelemente 11 aufgebracht werden kann. Hierdurch wird das selbst organisierte Platzieren der Bauelemente 11 auf demHowever, the alkanethiols may also be applied to suitable metal surfaces on the back side 20 of the devices 11, thus providing a means of coupling to other oligonucleotides. Among these, each COM ¬-complementary pairs can be selected, wherein one partner of the components 11 can be applied to the contact surfaces 14b of the support member and the other partner on the contact surfaces 14a on the rear sides twentieth As a result, the self-organized placement of the components 11 on the
Trägerbauteil 13 sichergestellt. Um eine eindeutige Ausrich¬ tung der Bauteile 11 zu erreichen, können auch mehrere komplementäre Paare von Oligonukleotiden ausgewählt werden, die die selbst organisierte Platzierung der Bauelemente nur in einer Ausrichtung erlauben.Carrier component 13 ensured. To a unique Reg ¬ tung 11 to reach the components, a plurality of complementary pairs may be selected from oligonucleotides allow the self-organized placement of components only in one orientation.
In Figur 3 ist dargestellt, wie das Trägerbauteil 13 mit den vorläufig angelagerten Bauelementen 11 und ihrer Montageseite 21 voran auf den Schaltungsträger 12 aufgesetzt werden. Je nach Verfahrensweise gemäß der Figuren 1 und 2 sind die Lot¬ partikel 17 dabei an den Kontaktflächen 18a oder 18b befes¬ tigt. Auf den jeweiligen anderen Kontaktflächen ergibt sich ein Kontakt lediglich durch Aufliegen der Bauelemente 11 auf dem Schaltungsträger 12. Das Trägerbauteil 13 kann zunächst zur Stabilisierung der Bauelemente und zur Erhöhung der Anpresskraft aufgrund des Eigengewichtes auf den BauelementenFIG. 3 shows how the carrier component 13 with the provisionally attached components 11 and its mounting side 21 are placed on the circuit carrier 12 first. Depending on the procedure according to the figures 1 and 2, the solder particles ¬ Untitled 17 thereby buildin at the contact surfaces 18a or 18b ¬. On the respective other contact surfaces, a contact results merely by resting the components 11 on the circuit carrier 12. The carrier component 13 can first for stabilizing the components and for increasing the contact pressure due to the weight on the components
11 verbleiben.11 remain.
Gemäß Figur 4 ist ein Lötprozess durchgeführt worden, der aus den Lotpartikeln 17 Lötverbindungen 22 gemacht hat, die einen Stoffschluss mit den Kontaktflächen 18a und 18b erzeugen. Nach dem erfolgten Verlöten der Bauelemente 11 mit dem Schal- tungsträger 12 kann die Trägerplatte 13 entfernt werden. E- ventuell hat die aufgrund des Lötvorgangs erzeugte Wärme auch zu einer Lösung der vorläufigen Verbindung zwischen dem Trägerbauteil 13 und den Bauelementen 11 geführt. In jedem Fall ist die Bindung zwischen dem Trägerbauteil 13 und den Bauele- menten 11 von geringerer Festigkeit als die LötverbindungenAccording to FIG. 4, a soldering process has been carried out which has made solder joints 22 from the solder particles 17, which produce a material bond with the contact surfaces 18a and 18b. After the soldering of the components 11 to the circuit carrier 12, the carrier plate 13 can be removed. E-ventually, the heat generated due to the soldering process has also led to a solution of the preliminary connection between the support member 13 and the components 11. In any case, the bond between the carrier component 13 and the components 11 is of lesser strength than the solder joints
22, so dass diese bei einem Ablösen der Trägerplatte 13 nach¬ geben und die Bauelemente 11 daher auf dem Schaltungsträger22, so that they give 13 ¬ at a detachment of the support plate and therefore the components 11 on the circuit carrier
12 verbleiben. 12 remain.

Claims

Patentansprüche claims
1. Verfahren zum Plazieren von elektrisch kontaktierbaren Bauelementen (11) mit ihrer Montageseite (21) auf einem Schaltungsträger (12), wobei die gewünschte Anordnung der Bauelemente durch einen Prozess der Selbstorganisation erzeugt wird, indemA method for placing electrically contactable components (11) with their mounting side (21) on a circuit carrier (12), wherein the desired arrangement of the components is produced by a process of self-organization by
- die Bauelemente (11) zunächst mit ihrer der Montageseite- The components (11) first with their mounting side
(21) abgekehrten Rückseite (20) auf einem Trägerbauteil (13) fixiert werden, wobei hierfür die Rückseiten (20) der Bauelemente (11) und die Oberfläche des Trägerbauteils (13) zuvor mit die Selbstorganisation der Bauelemente (11) auslösenden Oberflächenbereichen versehen wurden,(21) facing away from the back (20) on a support member (13) are fixed, for this purpose, the back sides (20) of the components (11) and the surface of the support member (13) were previously provided with the self-organization of the components (11) triggering surface areas .
- das Trägerbauteil (13) mit den Montageseiten (21) der Bau- elemente (11) gegenüber dem Schaltungsträger (12) ausgerichtet und auf diesen aufgesetzt wird und- The support member (13) with the mounting sides (21) of the components (11) relative to the circuit substrate (12) is aligned and placed on this and
- die Bauelemente (11) auf dem Schaltungsträger (12) befes¬ tigt werden dadurch gekennzeichnet, dass verschiedenartige Bauelemente (11) auf dem Trägerbauteil (13) fixiert werden, wobei eine Eindeutigkeit der Platzierung der Bauelemente (11) auf dem Trägerbauteil (13) dadurch gewähr¬ leistet wird, dass für die Erzeugung der Oberflächenbereiche jeder Art von Bauelementen (11) und der zugehörigen Oberflä- chenbereiche auf dem Trägerbauteil (13) ein Wirkprinzip der Selbstorganisation ausgewählt wird, das selektiv bezüglich der Wirkprinzipien der Selbstorganisation aller anderen Arten von Bauelementen (11) ist.- the components (11) be taken on the circuit carrier (12) buildin ¬ characterized in that various components are fixed to the support member (13) (11), a uniqueness of the placement of the components (11) on the support component (13) characterized legal ¬ will ensure that for the generation of the surface areas of every kind of components (11) and the corresponding surface portions on the support member (13) an active principle of self-organization is selected which selectively with respect to the active principle of self-organization of all the other types of devices (11).
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das Trägerbauteil (13) nach dem Befestigen der Bauele¬ mente (11) auf dem Schaltungsträger (12) von den Bauelementen (11) abgelöst wird. 2. The method according to claim 1, characterized in that the carrier component (13) after fixing the Bauele ¬ elements (11) on the circuit carrier (12) of the components (11) is detached.
3. Verfahren nach einem der voranstehenden Ansprüche, dadurch gekennzeichnet, dass das Befestigen der Bauelemente (11) auf dem Schaltungs- träger (12) durch Löten erfolgt.3. The method according to any one of the preceding claims, characterized in that the fastening of the components (11) on the circuit carrier (12) by soldering takes place.
4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass Lotpartikel (17, 17a) aus einem Lotwerkstoff durch einen weiteren Prozess der Selbstorganisation auf die Kontaktflächen (18a) der Bauelemente (11) aufgetragen werden, bevor das Trägerbauteil (13) auf den Schaltungsträger (12) aufgesetzt wird.4. The method according to claim 3, characterized in that solder particles (17, 17a) are applied from a solder material by a further process of self-assembly on the contact surfaces (18a) of the components (11) before the carrier component (13) on the circuit carrier ( 12) is placed.
5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass die Prozesse der Selbstorganisation für die Bauelemente5. The method according to claim 4, characterized in that the processes of self-organization for the components
(11) und für die Lotpartikel (17, 17a) in einem Arbeitsgang durchgeführt werden.(11) and for the solder particles (17, 17a) are carried out in one operation.
6. Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass Lotpartikel (17, 17a) aus einem Lotwerkstoff durch einen weiteren Prozess der Selbstorganisation auf für die Bauele- mente (11) vorgesehenen Kontaktflächen (18b) des Schaltungs¬ trägers (12) aufgetragen werden, bevor das Trägerbauteil (13) auf den Schaltungsträger (12) aufgesetzt wird.6. The method according to claim 3, characterized in that are applied that solder particles (17, 17a) made of a solder material by a further process of self-organization for Bauelemente (11) provided in contact surfaces (18b) of the circuit ¬ carrier (12), before the carrier component (13) is placed on the circuit carrier (12).
7. Verfahren nach einem der Ansprüche 4 bis 6, dadurch gekennzeichnet, dass mit dem weiteren Prozess der Selbstorganisation eine Mo- nolage von Lotpartikeln (17, 17a) auf die Kontaktflächen (18b) aufgebracht wird. 7. The method according to any one of claims 4 to 6, characterized in that with the further process of self-organization a mono- location of solder particles (17, 17a) is applied to the contact surfaces (18b).
8. Verfahren nach Anspruch 7, dadurch gekennzeichnet, dass die Lotpartikel (17, 17a) eine im Wesentlichen gleichmä¬ ßige Größe aufweisen.8. The method according to claim 7, characterized in that the solder particles (17, 17a) have a substantially gleichmä ¬ lar size.
9. Montagesystem für die Herstellung von mit Bauelementen (11) bestückten Schaltungsträgern (12), bestehend aus9. Mounting system for the production of components (11) equipped circuit carriers (12), consisting of
- einem auf die zu bestückenden Schaltungsträger (12) ange- passten Trägerbauteil (13) für die zu bestückenden Bauele- mente (11) unda carrier component (13) adapted to the circuit carrier (12) to be assembled for the components (11) to be assembled and
- den zu bestückenden Bauelementen (11), wobei die von der Montageseite abgekehrten Rückseiten (20) der Bauelemente (11) und die Oberfläche des Trägerbauteils (13) mit Oberflächenbereichen versehen sind, die eine selbst organisierte Anordnung der Bauelemente auf dem Trägerbauteil unter Berücksichtigung der erforderlichen Bestückung des Schaltungsträgers erlauben, dadurch gekennzeichnet, dass verschiedenartige Bauelemente (11) für die Fixierung auf dem Trägerbauteil (13) vorgesehen sind, wobei eine Eindeutigkeit der Platzierung der Bauelemente (11) auf dem Trägerbauteil (13) dadurch gewährleistet ist, dass für die Oberflächenbe¬ reiche jeder Art von Bauelementen und die zugehörigen Oberflächenbereiche auf dem Trägerbauteil ein Wirkprinzip der Selbstorganisation vorgesehen ist, das selektiv bezüglich der Wirkprinzipien der Selbstorganisation aller anderen Arten von Bauelementen (11) ist. - The components to be equipped (11), wherein the remote from the mounting side backs (20) of the components (11) and the surface of the support member (13) are provided with surface areas, a self-organized arrangement of the components on the support member, taking into account allow the required mounting of the circuit substrate, characterized in that various components (11) are provided for fixing on the support member (13), wherein a uniqueness of the placement of the components (11) on the support member (13) is ensured by the fact that for the Oberflächenbe ¬ rich each type of components and the associated surface areas on the support member an operating principle of self-organization is provided, which is selective with respect to the principles of action of the self-organization of all other types of components (11).
PCT/EP2007/052803 2006-03-31 2007-03-23 Method for positioning components with which electrical contact can be made on a circuit carrier, and mounting system suitable for carrying out this method WO2007113139A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007800118444A CN101416301B (en) 2006-03-31 2007-03-23 Method for placing electrical contact elements on a circuit carrier and mounting system suitable for carrying out the method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006016275.7 2006-03-31
DE102006016275A DE102006016275B4 (en) 2006-03-31 2006-03-31 Method for placing electrically contactable components on a circuit carrier

Publications (1)

Publication Number Publication Date
WO2007113139A1 true WO2007113139A1 (en) 2007-10-11

Family

ID=38180479

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/052803 WO2007113139A1 (en) 2006-03-31 2007-03-23 Method for positioning components with which electrical contact can be made on a circuit carrier, and mounting system suitable for carrying out this method

Country Status (3)

Country Link
CN (1) CN101416301B (en)
DE (1) DE102006016275B4 (en)
WO (1) WO2007113139A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009050426B3 (en) * 2009-10-22 2011-03-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for aligned application of silicon chips with switching structures on e.g. wafer substrate, involves fixing aligned components on substrate by electrostatic force by applying electrical holding voltage above metallization surfaces
DE102021206898A1 (en) 2021-06-30 2023-01-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Arrangement and method for producing a semiconductor arrangement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040142575A1 (en) * 2002-07-25 2004-07-22 Brewer Peter D. Large area printing method for integrating device and circuit components
US20050064696A1 (en) * 2003-09-19 2005-03-24 Larson Charles E. Methods relating to forming interconnects and resulting assemblies
WO2005091354A1 (en) * 2004-03-22 2005-09-29 Tamura Corporation Solder composition and method of bump formation therewith
WO2006030674A1 (en) * 2004-09-15 2006-03-23 Matsushita Electric Industrial Co., Ltd. Flip chip mounting method and flip chip mounting element

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6569382B1 (en) * 1991-11-07 2003-05-27 Nanogen, Inc. Methods apparatus for the electronic, homogeneous assembly and fabrication of devices
US6089853A (en) * 1997-12-24 2000-07-18 International Business Machines Corporation Patterning device for patterning a substrate with patterning cavities fed by service cavities
DE102004058201A1 (en) * 2004-12-02 2006-06-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for transfer of especially electrical construction elements onto surface entails electrostatic charging of photoconductor layer on chargeable carrier to create charge structure for transfer of individual construction elements

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040142575A1 (en) * 2002-07-25 2004-07-22 Brewer Peter D. Large area printing method for integrating device and circuit components
US20050064696A1 (en) * 2003-09-19 2005-03-24 Larson Charles E. Methods relating to forming interconnects and resulting assemblies
WO2005091354A1 (en) * 2004-03-22 2005-09-29 Tamura Corporation Solder composition and method of bump formation therewith
EP1729334A1 (en) * 2004-03-22 2006-12-06 Tamura Corporation Solder composition and method of bump formation therewith
WO2006030674A1 (en) * 2004-09-15 2006-03-23 Matsushita Electric Industrial Co., Ltd. Flip chip mounting method and flip chip mounting element
EP1796156A1 (en) * 2004-09-15 2007-06-13 Matsushita Electric Industrial Co., Ltd. Flip chip mounting method and flip chip mounting element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009050426B3 (en) * 2009-10-22 2011-03-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for aligned application of silicon chips with switching structures on e.g. wafer substrate, involves fixing aligned components on substrate by electrostatic force by applying electrical holding voltage above metallization surfaces
DE102021206898A1 (en) 2021-06-30 2023-01-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Arrangement and method for producing a semiconductor arrangement
DE102021206898B4 (en) 2021-06-30 2023-02-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Device and method for producing a semiconductor device

Also Published As

Publication number Publication date
DE102006016275A1 (en) 2007-10-18
CN101416301A (en) 2009-04-22
DE102006016275B4 (en) 2013-12-19
CN101416301B (en) 2011-12-14

Similar Documents

Publication Publication Date Title
DE69533336T2 (en) TEST CARD AND ITS APPLICATION
DE102008045735B4 (en) Stacked semiconductor chips
EP0328161A2 (en) Process for producing a metallic body having a multiplanar microstructure
DE69731208T2 (en) METHOD FOR PRODUCING AN INTEGRATED SWITCHING ARRANGEMENT
WO2005115072A2 (en) Support with solder globule elements and a method for assembly of substrates with globule contacts
DE102009050426B3 (en) Method for aligned application of silicon chips with switching structures on e.g. wafer substrate, involves fixing aligned components on substrate by electrostatic force by applying electrical holding voltage above metallization surfaces
EP1240529A2 (en) Method for producing micromechanical structures
EP1508166A2 (en) Electronic component comprising external surface contacts and a method for producing the same
DE10325559B3 (en) Method and device for producing a system with a component applied to a predetermined location on a surface of a substrate
WO1998039230A1 (en) Method for producing and magazining micro components, magazine and assembly method for micro components
DE19581457C1 (en) Handling procedure and handling tool e.g. for equipping circuit boards with micro-sized components
WO2007113139A1 (en) Method for positioning components with which electrical contact can be made on a circuit carrier, and mounting system suitable for carrying out this method
WO2022012903A1 (en) Connecting element, method for producing a connecting element, arrangement comprising a connecting element and two components connected by means thereof as well as method for connecting two components by means of a connecting element
EP0836540B1 (en) Process for manufacturing mould inserts
WO2006007819A1 (en) Substrate with strip conductors and production of strip conductors on substrates for semiconductor components
WO2008040307A2 (en) Method for producing an arrangement of optoelectronic components, and arrangement of optoelectronic components
DE102008027115A1 (en) Contact structure, electronic component with a contact structure and method for its production
DE102013109879A1 (en) Joining methods, material or phase transformation methods, securing methods, joining means and security system using reactive material systems
DE102006016276B3 (en) Method for applying solder particles on to contact surfaces for forming electrical connection, involves taking solder particles through self-organization process on contact surfaces
DE19823876B4 (en) Component loaded with different connections (biochip) and method for its production
EP1711044B1 (en) Method of transferring electrical components onto a surface
WO2020229013A1 (en) Multi-chip carrier structure
EP1464080B1 (en) Method for production of a bonding device
DE10105872A1 (en) Arrangement used in the manufacture of matrix displays comprises a substrate having a recess, and a chip provided in the recess with a layer formed on the peripheral surface of the recess and/or chip
DE102011104843B4 (en) Micromirror component with linear bending spring and method for its production

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07727277

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 200780011844.4

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07727277

Country of ref document: EP

Kind code of ref document: A1