WO2007113079A1 - Heat sink and its use as a cooling and screening apparatus - Google Patents

Heat sink and its use as a cooling and screening apparatus Download PDF

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Publication number
WO2007113079A1
WO2007113079A1 PCT/EP2007/052246 EP2007052246W WO2007113079A1 WO 2007113079 A1 WO2007113079 A1 WO 2007113079A1 EP 2007052246 W EP2007052246 W EP 2007052246W WO 2007113079 A1 WO2007113079 A1 WO 2007113079A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
circuit board
printed circuit
material body
components
Prior art date
Application number
PCT/EP2007/052246
Other languages
German (de)
French (fr)
Inventor
Ludger Hinken
Original Assignee
Siemens Home And Office Communication Devices Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Home And Office Communication Devices Gmbh & Co. Kg filed Critical Siemens Home And Office Communication Devices Gmbh & Co. Kg
Publication of WO2007113079A1 publication Critical patent/WO2007113079A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]

Definitions

  • the invention relates to a heat sink according to the preamble of claim 1 and its use according to claim 2.
  • a heat sink which consists of a solid thermally conductive material body with a plurality of cooling fins pointing in a first direction and with a direction pointing in a second direction opposite to the first direction, arranged at the circulation of the material body and the Circulation of the material body interruption ⁇ free circulation bearing surface.
  • a disadvantage of this heat sink is that within the running ⁇ only running surface only a single space within the material body of the heat sink is free, so that with this one heat sink always only a single area with associated components can be cooled and shielded. In the presence of several areas, each with zugehö ⁇ cal components that do not belong together, but which are to shield each other, therefore each heat sink with then correspondingly high costs are necessary.
  • the object of the present invention is therefore, starting from a heat sink of the type mentioned, to improve such a heat sink in the way technically and then to use advantageous in such a way that are reduced by this improved and used heat sink assembly costs and heat sink costs , It should not be consumed more space for the cooling and shielding of components and / or corresponding areas of the printed circuit board, as is actually necessary.
  • the first part of the object is achieved on the basis of adekör ⁇ by the type mentioned in the present invention by a heat sink having the features of the characterizing part of claim 1.
  • the second part of the object is achieved by such a corresponding use of the said cooling ⁇ body, as indicated in claim 2.
  • the inventively technically improved heat sink has a support surface, which is distributed over the entire solid material body over the entire surface plan formed with at least two different locations in the solid material body in worked separate, each accessible from outside of the solid material body cavities.
  • the heat sink on the component side of the printed circuit board By in the body of the heat sink worked into cavities, which are accessible from the outside, it is possible, the heat sink on the component side of the printed circuit board to mon ⁇ animals, where he with his free-machined and externally accessible cavities on to be cooled and / or shielded components and / or corresponding areas of the flat assembly is slipped. In this way, it can not absorb but heat only through its resting on the printed circuit board contact surfaces via its inside walls of the free carved cavities and thus of heat ner Halb the free carved cavities placed components and / or surface areas generated by in ⁇ the pcb is.
  • shielding function with respect to components and / or surface areas of the printed circuit board placed inside the free-machining cavities, so that shields provided specifically for the shield, for example consisting of shielding frames and shielding covers, can be dispensed with.
  • shields provided specifically for the shield for example consisting of shielding frames and shielding covers
  • a shielding lid was used can now be dispensed with a aufwändi ⁇ conditions, especially manual lid process during assembly. Shielding frame and shielding cover are replaced by the heat sink.
  • FIG. 1 shows a first plan view of the component side of a printed circuit board according to the prior art
  • Figure 2 is a second plan view of the component side of a
  • FIG 3 is a front view of a printed circuit board according to one of the figures 1 or 2
  • Figure 4 is a three-dimensional view in an inclined position ei ⁇ ner printed circuit board assembly with a mounted according to ⁇ inventive heat sink, and
  • Figure 5 is a bottom view of a heat sink according to the invention.
  • FIG 1 shows a printed circuit board 1 on which on the component side areas with shielding components and / or shielding pure surface areas (not shown in detail in Figure 1) are surrounded with a shield 2, which still no shielding cover 3 (FIG 2) sets up ⁇ is.
  • the printed circuit board 1 according to one of the FIGS. 1 or 2 can be seen from the side, so that the shielding frame 2 and its shielding cover 3 can be seen on its upper side.
  • a conventional heat sink 4 is mounted, which accomplishes the cooling of the placed on the Obersei ⁇ te of the printed circuit board components from the bottom of the printed circuit board.
  • test points must be provided on the upper side of the printed circuit board 1 between the touch-sensitive components and the components covered by the shielding. To use the test points, the shielding are therefore previously to ent ⁇ distant.
  • FIG. 4 shows a printed circuit board 5 on which a heat sink 6 according to the invention is mounted.
  • the heat sink 6 is solid and therefore as such egg ⁇ nen thermally conductive material body is with a variety of in a first direction facing cooling ribs 7 and with a pointing in a second direction opposite to the first direction, arranged at the circulation of the material body and the circulation of the material body without interruption circumferential bearing surface.
  • this Auflageflä ⁇ che is not limited to the circulation of the heat sink 6 and the heat-conducting material body but the support surface over the entire solid material body distributed over the entire surface plan formed with at least two different locations in the solid material body worked into separate, each of cavities accessible outside the massive body of material 8.
  • the heat sink 6 is placed over the components placed on the component side of the printed circuit board 5 components and fastened with screws (not shown in detail in Figure 4) from the bottom of the printed circuit board 5 forth on the printed circuit board 5.
  • the heat sink 6 can be placed over the placed on the component side of the printed circuit board 5 components, the heat sink 6, as already indicated, at the corre sponding ⁇ places accessible from below, in his massive body freely machined cavities 8, within which the said and relevant components of the printed circuit board 6 find a place for cooling and / or shielding.
  • the heat sink 6 used in FIG. 4 is seen from below and shown alone.
  • the freely accessible cavities 8 accessible from below can be seen.
  • points 9 can be seen, via which the heat sink 6 is attached from the underside of that printed circuit board on which the heat sink 6 is mounted, on the relevant printed circuit board.
  • Plane surfaces 10 of the heat sink 6 close the shield with respect to the printed circuit board 5 ( Figure 4), on which the heat sink is mounted. At the same time, they serve or can NEN, to absorb heat to a good degree of the circuit board 5 ( Figure 4) itself.

Abstract

The invention proposes a heat sink (6) which is used for cooling and screening components and/or corresponding regions of a flat assembly. A heat sink (6) of this type has hollow spaces (8) which are accessible from the outside formed in its body. In the mounted state, the heat sink (6) is placed over components and/or flat regions, which are to be cooled and/or screened, of a flat assembly (5) by means of its hollow spaces (8), wherein the heat sink (6) simultaneously performs a screening function and a cooling function.

Description

Beschreibung description
KÜHLKÖRPER UND DESSEN VERWENDUNG ALS KÜHL- UND ABSCHIRMVORRICHTUNGCOOLING BODY AND ITS USE AS A COOLING AND SHIELDING DEVICE
Die Erfindung betrifft einen Kühlkörper gemäß dem Oberbegriff des Anspruchs 1 und dessen Verwendung gemäß Anspruch 2.The invention relates to a heat sink according to the preamble of claim 1 and its use according to claim 2.
Es gibt Flachbaugruppen, die Bereiche haben, die abgeschirmt werden müssen, und die Bauelemente und/oder Bereiche haben, die gekühlt werden müssen.There are printed circuit boards that have areas that need to be shielded and that have components and / or areas that need to be cooled.
Zur Kühlung der zu kühlenden Bauelemente und/oder der entsprechenden Bereiche der Flachbaugruppe ist bekannt, Kühlkör¬ per zu verwenden, die auf der der Bauelementeseite gegenüber- liegenden Seite der Flachbaugruppe montiert werden. Für die Abschirmung von Bauteilen und/oder Bereichen auf der Bauteileseite ist bekannt, auf der Bauteileseite Abschirmrahmen zu verwenden, die um die abzuschirmenden Bauelemente und/oder entsprechenden Bereiche der Flachbaugruppe herum platziert werden, und denen Abschirmdeckel zur vollständigen Abschirmung besagter Elemente und/oder Stellen auf der Flachbaugruppe aufgepresst werden.To cool the components to be cooled and / or the corresponding areas of the printed circuit board is known to use Kühlkör ¬ per, which are mounted on the component side of the opposite side of the printed circuit board. For the shielding of components and / or areas on the component side is known to use on the component side shroud, which are placed around the shielded components and / or corresponding areas of the printed circuit board, and which shield cover for complete shielding of said elements and / or bodies be pressed onto the printed circuit board.
Die vorgenannte Methode der Abschirmung von Bauelementen be- ziehungsweise entsprechender Bereiche der Flachbaugruppe und der Kühlung von Bauelementen und/oder entsprechender Bereiche der Flachbaugruppe ist Montage aufwändig, Kosten intensiv und benötigt mehr Raum, als tatsächlich unbedingt notwendig ist.The aforementioned method of shielding components or corresponding areas of the printed circuit board and the cooling of components and / or corresponding areas of the printed circuit board assembly is complex, expensive and requires more space than is actually necessary.
Aus dem Dokument US 6 577 504 Bl ist ein Kühlkörper bekannt, der aus einem massiven wärmeleitenden Materialkörper besteht mit einer Vielzahl von in eine erste Richtung zeigenden Kühlrippen und mit einer in eine zweite Richtung entgegengesetzt zur ersten Richtung zeigenden, am Umlauf des Materialkörpers angeordneten und den Umlauf des Materialkörpers unterbre¬ chungsfrei umlaufenden Auflagefläche. Nachteilig bei diesem Kühlkörper ist, dass innerhalb der um¬ laufenden Auflagefläche nur ein einziger Raum innerhalb des Materialkörpers des Kühlkörpers frei gearbeitet ist, so dass mit diesem einen Kühlkörper immer auch nur ein einziger Be- reich mit zugehörigen Bauteilen gekühlt und geschirmt werden kann. Bei Vorhandensein mehrerer Bereiche mit jeweils zugehö¬ rigen Bauteilen, die nicht zusammengehören, die aber gegenseitig zu schirmen sind, sind daher jeweilige Kühlkörper mit dann entsprechend hohen Kosten notwendig.From the document US Pat. No. 6,577,504 B1, a heat sink is known, which consists of a solid thermally conductive material body with a plurality of cooling fins pointing in a first direction and with a direction pointing in a second direction opposite to the first direction, arranged at the circulation of the material body and the Circulation of the material body interruption ¬ free circulation bearing surface. A disadvantage of this heat sink is that within the running ¬ only running surface only a single space within the material body of the heat sink is free, so that with this one heat sink always only a single area with associated components can be cooled and shielded. In the presence of several areas, each with zugehö ¬ cal components that do not belong together, but which are to shield each other, therefore each heat sink with then correspondingly high costs are necessary.
Aufgabe der vorliegenden Erfindung ist es daher, ausgehend von einem Kühlkörper der eingangs genannten Art, einen solchen Kühlkörper in der Weise technisch zu verbessern und dann in einer solchen Weise vorteilhaft zu verwenden, dass durch diesen verbesserten und verwendeten Kühlkörper der Montageaufwand und die Kühlkörperkosten verringert sind. Dabei soll nicht mehr Raum für die Kühlung und Abschirmung von Bauelementen und/oder entsprechender Bereiche der Flachbaugruppe verbraucht sein, als tatsächlich notwendig ist.The object of the present invention is therefore, starting from a heat sink of the type mentioned, to improve such a heat sink in the way technically and then to use advantageous in such a way that are reduced by this improved and used heat sink assembly costs and heat sink costs , It should not be consumed more space for the cooling and shielding of components and / or corresponding areas of the printed circuit board, as is actually necessary.
Der erste Teil der Aufgabe wird ausgehend von einem Kühlkör¬ per der eingangs genannten Art erfindungsgemäß durch einen Kühlkörper gelöst, der die Merkmale des kennzeichnenden Teils des Anspruchs 1 aufweist. Der zweite Teil der Aufgabe wird durch eine solche entsprechende Verwendung des besagten Kühl¬ körpers gelöst, wie sie im Anspruch 2 angegeben ist.The first part of the object is achieved on the basis of a Kühlkör ¬ by the type mentioned in the present invention by a heat sink having the features of the characterizing part of claim 1. The second part of the object is achieved by such a corresponding use of the said cooling ¬ body, as indicated in claim 2.
Der erfindungsgemäß technisch verbesserte Kühlkörper weist eine Auflagefläche auf, die über den gesamten massiven Mate- rialkörper verteilt vollflächig plan ausgebildet ist mit an mindestens zwei verschiedenen Stellen in den massiven Materialkörper hinein gearbeiteten separaten, jeweils von außerhalb des massiven Materialkörpers zugänglichen Hohlräumen.The inventively technically improved heat sink has a support surface, which is distributed over the entire solid material body over the entire surface plan formed with at least two different locations in the solid material body in worked separate, each accessible from outside of the solid material body cavities.
Bezüglich der Verwendung ist der so technisch verbesserte Kühlkörper als Abschirmung und Kühlung für mehrere separat abzuschirmende Bauelemente und/oder entsprechender Bereiche einer Flachbaugruppe verwendet, das heißt, es ist hierfür insgesamt nur ein einziger Kühlkörper mit den Kosten für einen einzigen Kühlkörper verwendet.Regarding the use of the so technically improved heat sink is used as shielding and cooling for several separately shielded components and / or corresponding areas of a printed circuit board, that is, it is for this purpose Overall, only a single heatsink with the cost of a single heatsink used.
Durch die in den Körper des Kühlkörpers hinein gearbeiteten Hohlräume, die von außen zugänglich sind, ist es möglich, den Kühlkörper auf der Bauteileseite der Flachbaugruppe zu mon¬ tieren, wobei er mit seinen frei gearbeiteten und von außen zugänglichen Hohlräumen über zu kühlende und/oder abzuschirmende Bauelemente und/oder entsprechende Bereiche der Flach- baugruppe gestülpt ist. Auf diese Weise kann er nicht nur ü- ber seine auf der Flachbaugruppe aufliegenden Auflageflächen Wärme aufnehmen sondern auch über seine Innenwandungen der frei gearbeiteten Hohlräume und damit von Wärme, die von in¬ nerhalb der frei gearbeiteten Hohlräume platzierten Bauteilen und/oder Flächenbereichen der Flachbaugruppe erzeugt ist.By in the body of the heat sink worked into cavities, which are accessible from the outside, it is possible, the heat sink on the component side of the printed circuit board to mon ¬ animals, where he with his free-machined and externally accessible cavities on to be cooled and / or shielded components and / or corresponding areas of the flat assembly is slipped. In this way, it can not absorb but heat only through its resting on the printed circuit board contact surfaces via its inside walls of the free carved cavities and thus of heat nerhalb the free carved cavities placed components and / or surface areas generated by in ¬ the pcb is.
Gleichzeitig führt er eine Abschirmfunktion bezüglich von innerhalb der frei gearbeiteten Hohlräume platzierten Bauteilen und/oder Flächenbereichen der Flachbaugruppe aus, so dass auf eigens für die Abschirmung vorgesehene Abschirmungen bei- spielsweise bestehend aus Abschirmrahmen und Abschirmdeckel verzichtet werden kann. Gerade wenn vorher ein Abschirmdeckel eingesetzt war kann jetzt bei der Montage auf einen aufwändi¬ gen, insbesondere manuellen Deckelprozess verzichtet werden. Abschirmrahmen und Abschirmdeckel sind durch den Kühlköper ersetzt.At the same time, it carries out a shielding function with respect to components and / or surface areas of the printed circuit board placed inside the free-machining cavities, so that shields provided specifically for the shield, for example consisting of shielding frames and shielding covers, can be dispensed with. Especially if previously a shielding lid was used can now be dispensed with a aufwändi ¬ conditions, especially manual lid process during assembly. Shielding frame and shielding cover are replaced by the heat sink.
Weitere Vorteile sind, dass unterschiedlich große Abschirmbe¬ reiche ohne Erhöhung der Typenvielfalt von Kühlkörpern mög¬ lich ist, dass auf der Rückseite der Leiterplatte Prüfpunkte wieder realisierbar sind und dass die Aufbauhöhe der betref¬ fenden Flachbaugruppe nicht erhöht, in der Regel sogar ver¬ kleinert ist.Further advantages are that different sized Abschirmbe ¬ rich without increasing the variety of types of heat sinks pos ¬ lich that on the back of the circuit board inspection points are again feasible and that the height of the relevant ¬ concern PCB does not increase, usually ver ¬ kleinert is.
Nachfolgend wird ein Ausführungsbeispiel der Erfindung anhand einer Zeichnung näher erläutert: Darin zeigen:An exemplary embodiment of the invention will be explained in more detail below with reference to a drawing, in which:
Figur 1 eine erste Draufsicht auf die Bauteileseite einer Flachbaugruppe gemäß dem Stand der Technik, Figur 2 eine zweite Draufsicht auf die Bauteileseite einerFIG. 1 shows a first plan view of the component side of a printed circuit board according to the prior art, Figure 2 is a second plan view of the component side of a
Flachbaugruppe gemäß der Figur 1, Figur 3 eine Vorderansicht einer Flachbaugruppe gemäß einer der Figuren 1 oder 2, Figur 4 eine dreidimensionale Ansicht in Schrägstellung ei¬ ner Flachbaugruppe mit einem montierten erfindungs¬ gemäßen Kühlköper, und3 is a front view of a printed circuit board according to one of the figures 1 or 2, Figure 4 is a three-dimensional view in an inclined position ei ¬ ner printed circuit board assembly with a mounted according to ¬ inventive heat sink, and
Figur 5 eine Unteransicht eines erfindungsgemäßen Kühlkörpers .Figure 5 is a bottom view of a heat sink according to the invention.
In der Figur 1 ist eine Flachbaugruppe 1 dargestellt, auf der auf der Bauteileseite Bereiche mit abzuschirmenden Bauteilen und/oder abzuschirmenden reinen Flächenbereichen (in der Figur 1 nicht näher dargestellt) mit einem Abschirmrahmen 2 um- geben sind, denen noch kein Abschirmdeckel 3 (Figur 2) aufge¬ setzt ist.1 shows a printed circuit board 1 on which on the component side areas with shielding components and / or shielding pure surface areas (not shown in detail in Figure 1) are surrounded with a shield 2, which still no shielding cover 3 (FIG 2) sets up ¬ is.
In der Figur 2 ist die in der Figur 1 beschriebene Flachbau¬ gruppe 1 zu sehen, auf deren Abschirmrahmen 2 jetzt Abschirm- deckel 3 aufgesetzt sind.In the figure 2, the flat ¬ described in Figure 1 is group 1 to see their shrouds 2 now shielding lid are fitted. 3
In der Figur 3 ist die Flachbaugruppe 1 gemäß einer der Figu¬ ren 1 oder 2 von der Seite her zu sehen, so dass auf deren Oberseite die Abschirmrahmen 2 und deren Abschirmdeckel 3 zu erkennen sind. Auf der Unterseite der Flachbaugruppe 1 ist ein herkömmlicher Kühlkörper 4 montiert, der von der Unterseite der Flachbaugruppe her die Kühlung der auf der Obersei¬ te der Flachbaugruppe platzierten Bauteile bewerkstelligt. Prüfpunkte müssen hierbei auf der Oberseite der Flachbaugrup- pe 1 zwischen den berührungsempfindlichen und von der Abschirmung verdeckten Bauteilen vorgesehen sein. Zur Benützung der Prüfpunkte sind die Abschirmdeckel daher vorher zu ent¬ fernen .In FIG. 3, the printed circuit board 1 according to one of the FIGS. 1 or 2 can be seen from the side, so that the shielding frame 2 and its shielding cover 3 can be seen on its upper side. On the underside of the printed circuit board 1, a conventional heat sink 4 is mounted, which accomplishes the cooling of the placed on the Obersei ¬ te of the printed circuit board components from the bottom of the printed circuit board. In this case, test points must be provided on the upper side of the printed circuit board 1 between the touch-sensitive components and the components covered by the shielding. To use the test points, the shielding are therefore previously to ent ¬ distant.
In der Figur 4 ist eine Flachbaugruppe 5 zu sehen, auf der ein erfindungsgemäßer Kühlkörper 6 montiert ist. Der Kühlkörper 6 ist massiv ausgebildet und stellt daher als solches ei¬ nen wärmeleitenden Materialkörper dar mit einer Vielzahl von in eine erste Richtung zeigenden Kühlrippen 7 und mit einer in eine zweite Richtung entgegengesetzt zur ersten Richtung zeigenden, am Umlauf des Materialkörpers angeordneten und den Umlauf des Materialkörpers unterbrechungsfrei umlaufenden Auflagefläche. Gemäß der Erfindung ist aber diese Auflageflä¬ che nicht auf den Umlauf des Kühlkörpers 6 beziehungsweise des wärmeleitenden Materialkörpers beschränkt sondern ist die Auflagefläche über den gesamten massiven Materialkörper verteilt vollflächig plan ausgebildet mit an mindestens zwei verschiedenen Stellen in den massiven Materialkörper hinein gearbeiteten separaten, jeweils von außerhalb des massiven Materialkörpers zugänglichen Hohlräumen 8.FIG. 4 shows a printed circuit board 5 on which a heat sink 6 according to the invention is mounted. The heat sink 6 is solid and therefore as such egg ¬ nen thermally conductive material body is with a variety of in a first direction facing cooling ribs 7 and with a pointing in a second direction opposite to the first direction, arranged at the circulation of the material body and the circulation of the material body without interruption circumferential bearing surface. According to the invention, however, this Auflageflä ¬ che is not limited to the circulation of the heat sink 6 and the heat-conducting material body but the support surface over the entire solid material body distributed over the entire surface plan formed with at least two different locations in the solid material body worked into separate, each of cavities accessible outside the massive body of material 8.
Der Kühlkörper 6 ist über die auf der Bauteileseite der Flachbaugruppe 5 platzierten Bauteile gestülpt und mit Schrauben (in der Figur 4 nicht näher dargestellt) von der Unterseite der Flachbaugruppe 5 her auf der Flachbaugruppe 5 befestigt .The heat sink 6 is placed over the components placed on the component side of the printed circuit board 5 components and fastened with screws (not shown in detail in Figure 4) from the bottom of the printed circuit board 5 forth on the printed circuit board 5.
Damit der Kühlkörper 6 über die auf der Bauteileseite der Flachbaugruppe 5 platzierten Bauteile gestülpt werden kann, weist der Kühlkörper 6, wie schon angedeutet, an den entspre¬ chenden Stellen von unten zugängliche, in seinem massiven Körper frei gearbeitete Hohlräume 8 auf, innerhalb denen die besagten und betreffenden Bauteile der Flachbaugruppe 6 für eine Kühlung und/oder Abschirmung Platz finden.Thus, the heat sink 6 can be placed over the placed on the component side of the printed circuit board 5 components, the heat sink 6, as already indicated, at the corre sponding ¬ places accessible from below, in his massive body freely machined cavities 8, within which the said and relevant components of the printed circuit board 6 find a place for cooling and / or shielding.
In der Figur 5 ist der in der Figur 4 verwendete Kühlkörper 6 von unten gesehen und alleine dargestellt gezeigt. Dabei sind insbesondere die von unten zugänglichen, frei gearbeiteten Hohlräume 8 zu sehen. Daneben sind Stellen 9 zu sehen, über die der Kühlkörper 6 von der Unterseite derjenigen Flachbaugruppe her, auf der der Kühlkörper 6 montiert ist, auf der betreffenden Flachbaugruppe befestigt ist. Plane Flächen 10 des Kühlkörpers 6 schließen die Abschirmung gegenüber der Flachbaugruppe 5 (Figur 4) ab, auf der der Kühlkörper montiert ist. Gleichzeitig dienen sie dazu oder können dazu die- nen, in einem guten Maß Wärme von der Leiterplatte 5 (Figur 4) selbst aufzunehmen. In FIG. 5, the heat sink 6 used in FIG. 4 is seen from below and shown alone. In particular, the freely accessible cavities 8 accessible from below can be seen. In addition, points 9 can be seen, via which the heat sink 6 is attached from the underside of that printed circuit board on which the heat sink 6 is mounted, on the relevant printed circuit board. Plane surfaces 10 of the heat sink 6 close the shield with respect to the printed circuit board 5 (Figure 4), on which the heat sink is mounted. At the same time, they serve or can NEN, to absorb heat to a good degree of the circuit board 5 (Figure 4) itself.

Claims

Patentansprüche claims
1. Kühlkörper, bestehend aus einem massiven wärmeleitenden Materialkörper mit einer Vielzahl von in eine erste Richtung zeigenden Kühlrippen und mit einer in eine zweite Richtung entgegengesetzt zur ersten Richtung zeigenden, am Umlauf des Materialkörpers angeordneten und den Umlauf des Materialkör¬ pers unterbrechungsfrei umlaufenden Auflagefläche, da¬ durch gekennzeichnet , dass die Auflagefläche über den gesamten massiven Materialkörper verteilt vollflächig plan ausgebildet ist mit an mindestens zwei verschiedenen Stellen in den massiven Materialkörper hinein gearbeiteten separaten, jeweils von außerhalb des massiven Materialkörpers zugänglichen Hohlräumen (8).1. Heatsink, consisting of a solid heat-conductive material body having a plurality of facing in a first direction fins and with a pointing in a second direction opposite to the first direction, arranged on the circulation of the material body and the circulation of Materialkör ¬ pers uninterrupted circulating support surface, there ¬ characterized in that the support surface is distributed over the entire solid material body over the entire surface plan is formed with at least two different locations in the solid material body in worked separate, each accessible from outside of the solid material body cavities (8).
2. Verwendung eines Kühlkörpers nach Anspruch 1 gleichzeitig als ein Kühlkörper (6) nach herkömmlicher Art und als Abschirmung für abzuschirmende Bauelemente oder entsprechender Bereiche einer Flachbaugruppe (5) . 2. Use of a heat sink according to claim 1 at the same time as a heat sink (6) according to conventional manner and as a shield for shielding components or corresponding areas of a printed circuit board assembly (5).
PCT/EP2007/052246 2006-03-31 2007-03-09 Heat sink and its use as a cooling and screening apparatus WO2007113079A1 (en)

Applications Claiming Priority (2)

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DE102006015047 2006-03-31
DE102006015047.3 2006-03-31

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6328054A (en) * 1986-07-22 1988-02-05 Fujitsu Ltd Heat dissipation structure of highly integrated parts
US5548481A (en) * 1993-04-05 1996-08-20 Ford Motor Company Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population
JP2000165283A (en) * 1998-11-27 2000-06-16 Kokusai Electric Co Ltd Radio unit for base station
DE10043014A1 (en) * 1999-09-03 2001-04-12 Schneider Clauss Gmbh & Co Kg Heat sink for electronic elements has base with vertical pillars in which air flows around pillars
US6577504B1 (en) * 2000-08-30 2003-06-10 Intel Corporation Integrated heat sink for different size components with EMI suppression features
JP2003218564A (en) * 2002-01-25 2003-07-31 Shimada Phys & Chem Ind Co Ltd Parts case and method of manufacturing the same
US20030193794A1 (en) * 2002-04-10 2003-10-16 Bradley Reis Board-level EMI shield with enhanced thermal dissipation
US20050141211A1 (en) * 2003-12-30 2005-06-30 Yi-Jen Chen Electronic apparatus and shielding module thereof
US20070035929A1 (en) * 2005-08-12 2007-02-15 Hon Hai Precision Industry Co., Ltd. Heat sink with emi shielding walls

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6328054A (en) * 1986-07-22 1988-02-05 Fujitsu Ltd Heat dissipation structure of highly integrated parts
US5548481A (en) * 1993-04-05 1996-08-20 Ford Motor Company Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population
JP2000165283A (en) * 1998-11-27 2000-06-16 Kokusai Electric Co Ltd Radio unit for base station
DE10043014A1 (en) * 1999-09-03 2001-04-12 Schneider Clauss Gmbh & Co Kg Heat sink for electronic elements has base with vertical pillars in which air flows around pillars
US6577504B1 (en) * 2000-08-30 2003-06-10 Intel Corporation Integrated heat sink for different size components with EMI suppression features
JP2003218564A (en) * 2002-01-25 2003-07-31 Shimada Phys & Chem Ind Co Ltd Parts case and method of manufacturing the same
US20030193794A1 (en) * 2002-04-10 2003-10-16 Bradley Reis Board-level EMI shield with enhanced thermal dissipation
US20050141211A1 (en) * 2003-12-30 2005-06-30 Yi-Jen Chen Electronic apparatus and shielding module thereof
US20070035929A1 (en) * 2005-08-12 2007-02-15 Hon Hai Precision Industry Co., Ltd. Heat sink with emi shielding walls

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