WO2007077594A1 - Solder remover and method of removing solder - Google Patents

Solder remover and method of removing solder Download PDF

Info

Publication number
WO2007077594A1
WO2007077594A1 PCT/JP2005/024050 JP2005024050W WO2007077594A1 WO 2007077594 A1 WO2007077594 A1 WO 2007077594A1 JP 2005024050 W JP2005024050 W JP 2005024050W WO 2007077594 A1 WO2007077594 A1 WO 2007077594A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
printed circuit
circuit board
types
heating
Prior art date
Application number
PCT/JP2005/024050
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuhito Nakazawa
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to JP2007552818A priority Critical patent/JP4763725B2/en
Priority to PCT/JP2005/024050 priority patent/WO2007077594A1/en
Publication of WO2007077594A1 publication Critical patent/WO2007077594A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/001—Dry processes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B13/00—Obtaining lead
    • C22B13/02—Obtaining lead by dry processes
    • C22B13/025—Recovery from waste materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B25/00—Obtaining tin
    • C22B25/06—Obtaining tin from scrap, especially tin scrap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Definitions

  • the present invention relates to a solder removal apparatus and a solder removal method for removing solder welded to a printed circuit board from the printed circuit board.
  • printed circuit boards are used inside electronic devices and household electrical appliances, and lead solder, tin, lead, bismuth, indium, silver, zinc are used to connect the printed circuit boards to electronic components.
  • Lead-free solder containing copper, antimony, etc. is used.
  • a printed circuit board from which electric power has been removed is suspended, the printed circuit board is heated to a temperature higher than the solidus temperature of the solder, and vibrations of 10 Hz or higher are applied to the printed circuit board.
  • a solder removal method for a printed circuit board is disclosed in which the solder attached to the printed circuit board is removed (see, for example, Patent Document 1). This solder removal method involves removing harmful lead solder deposited on the soldered part of the printed circuit board before disposing of the electronic equipment and household appliances, and then disposing of it in landfills. It is effective in suppressing
  • Patent Document 1 JP-A-10-17948
  • lead-free solders that do not contain lead have been developed and are now being used in various electronic appliances.
  • the use of lead in such places is actually regulated.
  • This lead-free solder uses metal elements such as bismuth, indium, silver, zinc, copper, and antimony, mainly tin. Although its toxicity is lower than that of lead solder, there are problems such as being economically expensive and fearing depletion of resources.
  • an object of the present invention is to provide a solder removal apparatus and a solder removal method effective for environmental protection and resource protection.
  • solder removal apparatus of the present invention that achieves the above-described object provides:
  • a heating device that heats a printed circuit board on which a plurality of types of solders having different melting points are welded at a heating temperature set for each of the plurality of types of solder, and a printed circuit board that is heated by the heating device are vibrated. And a container for collecting the separated solder from the printed circuit board that is vibrated by the vibration device.
  • the desoldering apparatus of the present invention since the printed circuit board is heated at the heating temperature set for each of the plurality of types of solder, the plurality of types of solder can be effectively separated and collected.
  • the container is composed of a plurality of trays for collecting the plurality of types of solder by type! /.
  • solder removal apparatus of the present invention When the solder removal apparatus of the present invention is configured as described above, a plurality of types of solder can be recovered more effectively.
  • the printed circuit board is formed by forming a recording part in which solder information including melting points of the plurality of types of solder is recorded on the printed circuit board, and reads the solder information recorded in the recording part.
  • a temperature setting means for setting the heating temperature of the heating device based on the solder information.
  • the printed circuit board can be heated at the heating temperature for each of a plurality of types of solder based on the information recorded in the recording unit. Various types of solder can be collected efficiently.
  • the printed circuit board is formed by forming a recording unit in which solder information including the composition of the plurality of types of solder is recorded on the printed circuit board. Set each of the above types of solder on a heated printed circuit board. Provided with frequency setting means for reading the solder information recorded in the recording section and setting the frequency of the excitation device based on the read solder information. Is preferred to be.
  • the printed circuit board can be vibrated at the frequency of each of a plurality of types of solder based on the information recorded in the recording unit. Various types of solder can be collected efficiently.
  • the recording unit is preferably a wireless tag (RFID tag) mounted on a printed circuit board.
  • RFID tag wireless tag
  • solder removal apparatus of the present invention When the solder removal apparatus of the present invention is configured as described above, the solder information is easily read, and the solder is collected based on the solder information. Separated collection is possible.
  • the heating device and the vibration device include a plurality of heating units and vibration units corresponding to a plurality of types of solder having different melting points.
  • solder removal apparatus of the present invention When the solder removal apparatus of the present invention is configured as described above, a plurality of types of solder can be efficiently recovered.
  • the plurality of heating units are arranged in order from a heating unit corresponding to a solder having a low melting point.
  • solder removal apparatus of the present invention When the solder removal apparatus of the present invention is configured as described above, a plurality of types of solder can be efficiently recovered.
  • the printed circuit board is provided with transport means for transporting the printed circuit board on a transport path that passes through the plurality of heating units and vibration units.
  • solder removal apparatus of the present invention When the solder removal apparatus of the present invention is configured as described above, a plurality of types of solder can be collected more efficiently.
  • solder removal method of the present invention that achieves the above-described object includes:
  • a printed circuit board on which a plurality of types of solder with different melting points are welded is heated at a heating temperature set for each of the plurality of types of solder, and the frequency set for each of the plurality of types of solder is set on the printed circuit board. And the solder is separated from the printed circuit board. [0024] According to the solder removal method of the present invention, the printed circuit board is heated at the heating temperature set for each of the plurality of types of solder, so that the plurality of types of solder can be effectively separated and collected.
  • solder removal method of the present invention is configured as described above, a plurality of types of solder can be more effectively separated and collected.
  • solder removal method of the present invention is configured as described above, a plurality of types of solder can be separately collected for each type.
  • solder information including the melting points of the plurality of types of solder recorded in advance on the printed circuit board is read, and the printed circuit board is heated at a heating temperature set for each type of solder based on the solder information. Preferred to heat.
  • solder removal method of the present invention is configured as described above, a plurality of types of solder can be collected more efficiently.
  • solder information including the melting points of the plurality of types of solder recorded in advance on the printed circuit board is read, and the printed circuit board is loaded at the frequency set for each solder type based on the solder information.
  • U prefer to vibrate.
  • solder removal method of the present invention is configured as described above, a plurality of types of solder can be collected more efficiently.
  • solder removal apparatus and a solder removal method that can effectively separate and collect a plurality of types of solder and are effective for environmental protection and resource protection.
  • FIG. 1 is a schematic diagram of a solder removal apparatus according to a flow method of a first embodiment of the present invention.
  • FIG. 2 is a diagram showing solder information in the solder removal apparatus of the first embodiment.
  • FIG. 3 is a front sectional view of an electric furnace portion used in the solder removal apparatus of the first embodiment.
  • FIG. 4 is a cross-sectional view taken along line X—X in FIG.
  • FIG. 5 is a flowchart of a solder removal method by a flow method according to the first embodiment.
  • FIG. 6 is a schematic view of a batch-type solder removal apparatus according to a second embodiment of the present invention.
  • FIG. 7 is a flowchart of a batch-type solder removal method according to a second embodiment of the present invention.
  • solder removal method of the present invention a printed circuit board on which a plurality of types of solders having different melting points are welded is heated at a heating temperature set for each of the plurality of types of solder.
  • the solder is separated from the printed circuit board by applying a vibration having a set frequency for each of the plurality of types of solder.
  • the plurality of types of solder are separated in ascending order of melting point.
  • the printed circuit board force is also collected for each type of separated solder. Also, the solder information including the melting points of the plurality of types of solder recorded in advance on the printed circuit board is read. Based on the solder information, the printed circuit board is heated at a heating temperature set for each type of solder.
  • solder information including the melting points of the plurality of types of solder recorded in advance on the printed circuit board is read, and the printed circuit board is loaded at the frequency set for each solder type based on the solder information. Come to vibrate!
  • the above solder information includes a tag in which solder information of solder type and melting temperature used on the printed circuit board is recorded, for example, a wireless IC tag (RFID tag), a label It is possible to control the heating temperature and frequency of the solder removal device by mounting a barcode, two-dimensional code, etc. on the printed circuit board in advance and reading the solder information with a tag reader provided in the solder removal device. it can.
  • RFID tag wireless IC tag
  • FIG. 1 is a schematic diagram of a solder removal apparatus according to the flow method of the first embodiment of the present invention.
  • FIG. 1 shows an outline of a solder removal apparatus 1 by a flow method.
  • This solder removal apparatus 1 includes an electric furnace 11a and an electric furnace 1 lb for heating a printed circuit board 10 on which two kinds of solders having different melting points are welded at a heating temperature set for each of the two kinds of solder.
  • the substrate 14 is transported via the electric furnace 11a and the electric furnace l ib.
  • the conveying means 14 is conveyed on the conveying path 13, and the printed circuit board 10 is heated by the electric furnace 11a and the electric furnace l ib.
  • a receiving tray 15a and a receiving tray 15b for collecting the solder separated from the printed circuit board 10 to which the vibration is applied by the vibrating devices 12a and 12b.
  • solder removal apparatus 1 reads solder information from the wireless IC tag 10b and, based on the solder information, determines the heating temperatures of the electric furnace 11a and the electric furnace l ib.
  • a temperature setting means 18 for setting and a frequency setting means 19 for setting the frequency of the vibration generators 12a and 12b based on the solder information are provided.
  • the electric furnace 11a and the electric furnace lib are equivalent to the heating device referred to in the present invention, and the tray 15a and the tray 15b are equivalent to the container referred to in the present invention.
  • the wireless IC tag 10b described above corresponds to the recording unit referred to in the present invention.
  • Solder information such as the type, melting temperature, melting time, and frequency of solder used for each component mounted on the printed circuit board 10 is recorded in the wireless IC tag 10b.
  • FIG. 2 is a diagram showing an example of solder information in the solder removal apparatus of the first embodiment.
  • the wireless IC tag 10b formed on the printed circuit board 10 (see FIG. 1) processed by the desoldering apparatus of the present embodiment records the solder information as shown in FIG. .
  • the printed circuit board 10 has six types of components, including component A force and component F.
  • component A uses Sn-58Bi solder.
  • the melting temperature is 139 ° C
  • the melting time is 60 seconds
  • the frequency should be 10Hz
  • Sn-3Ag-0.5Cu solder is used for part B.
  • the temperature must be 217 ° C
  • the melting time must be 180 seconds
  • the frequency should be 50Hz ....
  • Part F uses Sn-58Bi solder, and its melting temperature is 139 ° C.
  • the melting time is 60 seconds, and it is recorded that the frequency should be 10Hz.
  • This solder information is read by the temperature setting means 18 of the solder removal apparatus 1 (see FIG. 1), and the temperature setting means 18 and the frequency setting means 19 are based on this solder information and the electric furnace 1 la and The heating conditions and vibration conditions for the electric furnace 1 lb are set.
  • FIG. 3 is a front cross-sectional view of an electric furnace portion used in the solder removal apparatus of the first embodiment
  • FIG. 4 is a cross-sectional view taken along line X—X in FIG.
  • this electric furnace 11 is a vertically long box-shaped body 111 made of a heat-resistant material, with an opening 113 at the top and open to the top at both sides. An inlet 114 and an outlet 115 are formed.
  • the opening 113 is an interval through which the hook 112 for suspending the printed circuit board 10 (see FIG. 1) can easily pass, and the inlet 114 and the outlet 115 are at an interval through which the hook 112 and the printed circuit board 10 can pass.
  • the inside of the main body 111 is composed of a preheating zone 116 and a main heating zone 117, and heating members 118 are vertically installed on both sides.
  • the heating member 118 is disposed in a state where the heating wire 119 of the sheath meanders and the porous metal plate 120 coated with ceramics is in contact with the heating wire 119.
  • ceramics emits far-infrared rays that can uniformly heat the object to be heated, and the porous metal plate has a large surface area so that it emits a large amount of heat and heats the object to be heated efficiently. Can do.
  • a tray 121 for receiving the falling solder is installed below the main heating zone 117.
  • a transfer device 122 is installed above the main body 111.
  • the conveying device 122 includes a rail 123 having an opening at the bottom and an endless chain 124 force that slides in the rail.
  • the chain 124 is rotated on the outside of the main body 111 by a driving device (not shown) so as to travel above the main body 111 again.
  • Chain 124 at regular intervals, precisely heated Hooks 112 are attached via attachment plates 125 at intervals of the distance between the centers of the zones 117.
  • the hook 112 holds the printed circuit board 10 with a pair of clamping plates having a strong panel force.
  • the chain 124 performs tact feed that travels the distance between the preheating zone 116 and the main heating zone 117 and stops the force for a certain period of time. That is, when the hook 112 stops at the center of the preheating zone 116, the hook 112 in front of the traveling direction (arrow A direction) stops at the center of the main heating zone 117! /.
  • a vibration device 125 is installed at a position directly above the mounting plate 125 above the approximate center of the main heating zone 117.
  • the vibration device 125 moves up and down as shown by an arrow B, and comes into contact with the mounting plate 125 when the force is applied to the lowest point.
  • FIG. 5 is a flowchart of the solder removal method according to the flow method of the first embodiment.
  • step S11 First, at the time of solder mounting of the printed circuit board 10, information such as the composition and melting point of lead-free solder used for the printed circuit board is input to the wireless IC tag (step S11).
  • step S 12 the printed circuit board is also taken out of the discarded electrical product force and mounted on the conveying means 14 of the solder removal apparatus 1 (see FIG. 1) in a suspended state (step S 12).
  • the printed circuit board 10 is transported along the transport path 13 by the transport means 14 of the solder removal apparatus 1.
  • the temperature setting unit 18 and the frequency setting unit 19 are used to place the printed circuit board 10 on the printed circuit board 10.
  • the frequency setting unit 19 sets the frequency of the printed circuit board 10 in each of the electric furnaces 11a and ib to 10 Hz (step S13).
  • the temperature setting unit 18 sets the heating temperature of the printed circuit board 10 in the electric furnaces 11a and ib based on the solder information in order of decreasing melting points of the two types of solder (step S14).
  • this frequency is suitably 10Hz ⁇ : LOOHz.
  • This frequency setting is performed by reading solder information from a tag on the printed circuit board 10. For example, in the case of solder having a low melting point, the frequency force is set, and in the case of solder having a high melting point, the frequency is set large. In this embodiment, the frequency in both the electric furnace 11a and the electric furnace l ib is set to 10 Hz. Next, the printed circuit board 10 is transported into the electric furnace 11 a while being vibrated at a vibration frequency of 10 Hz in a state where it is suspended from the transport means 14 of the solder removal apparatus 1.
  • both the front and back sides of the printed board 10 are heated for 1 to 10 minutes at a melting point of 139 ° C or higher of Sn-58Bi solder (step S15).
  • the Sn-58Bi solder on the printed circuit board 10 is melted and dropped and collected on the tray 15a (step S16).
  • the printed circuit board 10 is transferred into an electric furnace l ib and heated at a melting point of Sn-3Ag-0.5Cu solder of 217 ° C or higher for 1 to 10 minutes (step S17).
  • step S17 the melting point of Sn-3Ag-0.5Cu solder of 217 ° C or higher for 1 to 10 minutes.
  • step S19 the electronic component on the printed circuit board is collected and discarded from the printed circuit board from which the two types of solder are melted and removed.
  • FIG. 6 is a schematic view of a batch-type solder removal apparatus according to the second embodiment of the present invention.
  • FIG. 6 shows an outline of a solder removal apparatus 2 by a notch method.
  • This solder removal apparatus 2 suspends an electric furnace 21 that heats a printed circuit board 10 on which two types of solder having different melting points are welded at a heating temperature set for each of the above two types of solder, and the printed circuit board 10.
  • the conveyance means 24 that conveys the electric furnace 21 through the electric passage 21 twice, the vibration device 22 that vibrates the printed circuit board 10 heated by the electric furnace 21, and the vibration device
  • the solder information is read from the receiving tray 25 that collects the solder separated from the printed circuit board 10 that has been vibrated by 22 and the wireless IC tag 10b formed on the printed circuit board 10, and the heating temperature of the electric furnace 21 is based on the solder information.
  • Temperature setting means 18 for setting the frequency, and frequency setting means 19 for setting the frequency of the vibration device 22 based on the solder information.
  • the electric furnace 21 corresponds to the heating device referred to in the present invention, and the receiving device described above.
  • the dish 25 corresponds to a container according to the present invention.
  • the wireless IC tag 10b includes two types of solder having different melting points, namely Sn.
  • FIG. 7 is a flowchart of the solder removal method by the notch method according to the second embodiment of the present invention.
  • step S21 information such as the composition and melting point of lead-free solder used for the printed circuit board is input to the wireless IC tag.
  • step S22 the discarded electric product force
  • the printed circuit board is taken out and mounted in a suspended state on the conveying means 24 of the solder removal apparatus 2 (see FIG. 6) (step S22).
  • the printed circuit board 10 is transported along the transport path 23 by the transport means 24 of the solder removal apparatus 2.
  • the temperature setting unit 18 and the frequency setting unit 19 are used to place the printed circuit board 10 on the printed circuit board 10.
  • the frequency setting unit 19 sets the frequency of the printed circuit board 10 in the electric furnace 21 to 10 Hz in both the first process and the second process (step S23).
  • the solder information of the present embodiment will be described as being similar to that shown in the first embodiment.
  • the temperature setting unit 18 sets the heating temperature of the printed circuit board 10 in the electric furnace 21 based on the solder information in order from the lowest melting point of the two types of solder (step S24).
  • the printed circuit board 10 is transported into the electric furnace 21 while being vibrated at a vibration frequency of 10 Hz while being suspended from the transport means 24 of the solder removal apparatus 2.
  • Sn-58Bi is heated at a solder melting point of 139 ° C or higher for 1 to 10 minutes (step S25).
  • the Sn-58Bi solder on the printed circuit board 10 is melted and dropped and collected in the tray 25 (step S26).
  • the heating temperature of the printed circuit board 10 in the electric furnace 21 is changed to a higher melting point of 217 ° C. or higher of the melting points of the two types of solder (step S27).
  • the printed circuit board 10 is again conveyed into the electric furnace 21 and heated to a melting point of Sn—3Ag—0.5Cu solder of 217 ° C. or higher (step S28).
  • the Sn-3A gO.5Cu solder on the printed circuit board 10 is melted and dropped and collected in the tray 25 (step S29).
  • step S30 the electronic component on the printed circuit board is collected and discarded from the printed circuit board from which the two types of solder are melted and removed.
  • solder removal apparatus 2 of the second embodiment two types of solder having different melting points are obtained by repeating the solder removal process by the electric furnace 21 and the vibration apparatus 22 twice. That is, Sn-58Bi solder and Sn-3Ag-0.5Cu solder can be collected separately.
  • solder removal apparatus and the solder removal method of the present invention it is possible to efficiently remove solder in a short period of time with a printed circuit board with many types of solder that has been difficult to weld. can do. Furthermore, since the solder deposited on the printed circuit board can be collected for each composition, the collected solder can be reused as a resource.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Processing Of Solid Wastes (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A solder remover and a method of removing solder that are effective in the protection of environment and resources. A solder remover comprises electric furnaces (11a, 11b) for heating a printed board (10) on which two kinds of solders having different melting points are welded at heating temperatures respectively set for the two solders, vibration exciters (12a, 12b) for giving vibration to the printed board (10) heated by the electric furnaces (11a, 11b), and containers (15a, 15b) for collecting the solders separated from the printed board (10) vibrated by the vibration exciters (12a, 12b).

Description

はんだ除去装置、はんだ除去方法  Desoldering device and desoldering method
技術分野  Technical field
[0001] 本発明は、プリント基板に溶着しているはんだをプリント基板から除去するはんだ除 去装置およびはんだ除去方法に関する。  The present invention relates to a solder removal apparatus and a solder removal method for removing solder welded to a printed circuit board from the printed circuit board.
背景技術  Background art
[0002] 一般に電子機器や家電製品には、内部にプリント基板が使用されており、そのプリ ント基板と電子部品との接続には、鉛はんだや、スズ、鉛、ビスマス、インジウム、銀、 亜鉛、銅、アンチモンなどを含有する鉛フリーはんだが用いられている。これらの電 子機器'家電製品は、古くなつたり故障したりしたときには廃棄処分されることとなるが 、プリント基板については、細かく破砕された後に、埋立処理されるのが一般的であ る。  [0002] Generally, printed circuit boards are used inside electronic devices and household electrical appliances, and lead solder, tin, lead, bismuth, indium, silver, zinc are used to connect the printed circuit boards to electronic components. Lead-free solder containing copper, antimony, etc. is used. These electronic appliances and household electrical appliances are disposed of when they become old or break down, but printed boards are generally crushed and then landfilled.
[0003] しかし、昨今、環境保護の見地から埋立処理による土壌汚染の懸念が増大し、特 に、鉛を代表とする有害金属が埋立地に廃棄された場合の有害金属元素の土壌へ の溶出が問題となっている。  [0003] However, recently, from the viewpoint of environmental protection, there is an increasing concern about soil contamination due to landfill treatment, and in particular, leaching of toxic metal elements into soil when toxic metals such as lead are disposed of in landfills. Is a problem.
[0004] このような背景において、例えば、電気製品力 取り外したプリント基板を吊設し、 該プリント基板をはんだの固相線温度以上に加熱し、プリント基板に 10Hz以上の振 動を与えて該プリント基板に付着していたはんだを除去するというプリント基板のはん だ除去方法が開示されている (例えば、特許文献 1参照)。このはんだ除去方法は、 電子機器'家電製品を廃棄処分する前に、プリント基板のはんだ付け部分に溶着し ている有害な鉛はんだを除去した後、埋立処分するというものであり、鉛による土壌 汚染の抑制に有効である。  [0004] In such a background, for example, a printed circuit board from which electric power has been removed is suspended, the printed circuit board is heated to a temperature higher than the solidus temperature of the solder, and vibrations of 10 Hz or higher are applied to the printed circuit board. A solder removal method for a printed circuit board is disclosed in which the solder attached to the printed circuit board is removed (see, for example, Patent Document 1). This solder removal method involves removing harmful lead solder deposited on the soldered part of the printed circuit board before disposing of the electronic equipment and household appliances, and then disposing of it in landfills. It is effective in suppressing
特許文献 1 :特開平 10— 17948号公報  Patent Document 1: JP-A-10-17948
[0005] しかし、近年、鉛の有害性に鑑み、鉛を含有しな 、鉛フリーはんだが開発され、様 々な電子機器'家電製品で使用されるようになりつつあり、欧州等では電子機器等に おける鉛の使用が実際に規制される運びとなっている。この鉛フリーはんだにはスズ を中心として、ビスマス、インジウム、銀、亜鉛、銅、アンチモン等の金属元素が用い られており、有害性は鉛はんだよりは低いものの経済的に高価であることや資源の枯 渴が懸念される等の問題がある。 [0005] However, in recent years, in view of the harmfulness of lead, lead-free solders that do not contain lead have been developed and are now being used in various electronic appliances. The use of lead in such places is actually regulated. This lead-free solder uses metal elements such as bismuth, indium, silver, zinc, copper, and antimony, mainly tin. Although its toxicity is lower than that of lead solder, there are problems such as being economically expensive and fearing depletion of resources.
[0006] 本発明は、上記事情に鑑み、環境保護および資源保護に有効なはんだ除去装置 およびはんだ除去方法を提供することを目的とする。  In view of the above circumstances, an object of the present invention is to provide a solder removal apparatus and a solder removal method effective for environmental protection and resource protection.
発明の開示  Disclosure of the invention
[0007] 上記目的を達成する本発明のはんだ除去装置は、  [0007] The solder removal apparatus of the present invention that achieves the above-described object provides:
互いに融点の異なる複数種類のはんだが溶着されているプリント基板を、上記複数 種類のはんだごとに設定した加熱温度で加熱する加熱装置と、該加熱装置により加 熱された状態のプリント基板に振動を与える加振装置と、該加振装置により振動が与 えられたプリント基板カゝら分離されたはんだを回収する容器とを備えたことを特徴とす る。  A heating device that heats a printed circuit board on which a plurality of types of solders having different melting points are welded at a heating temperature set for each of the plurality of types of solder, and a printed circuit board that is heated by the heating device are vibrated. And a container for collecting the separated solder from the printed circuit board that is vibrated by the vibration device.
[0008] 本発明のはんだ除去装置によれば、複数種類のはんだごとに設定した加熱温度で プリント基板を加熱するので複数種類のはんだを効果的に分別回収することができる  [0008] According to the desoldering apparatus of the present invention, since the printed circuit board is heated at the heating temperature set for each of the plurality of types of solder, the plurality of types of solder can be effectively separated and collected.
[0009] ここで、上記容器は、上記複数種類のはんだを種類別に回収するための複数の受 け皿からなるものであることが好まし！/、。 [0009] Here, it is preferable that the container is composed of a plurality of trays for collecting the plurality of types of solder by type! /.
[0010] 本発明のはんだ除去装置を上記のように構成した場合は、複数種類のはんだをよ り効果的に回収することができる。 [0010] When the solder removal apparatus of the present invention is configured as described above, a plurality of types of solder can be recovered more effectively.
[0011] また、上記プリント基板は、該プリント基板に上記複数種類のはんだの融点を含む はんだ情報が記録された記録部が形成されたものであり、上記記録部に記録された はんだ情報を読み取り、該はんだ情報に基づき上記加熱装置の加熱温度を設定す る温度設定手段を備えたものであることが好まし 、。  [0011] Further, the printed circuit board is formed by forming a recording part in which solder information including melting points of the plurality of types of solder is recorded on the printed circuit board, and reads the solder information recorded in the recording part. Preferably, it is provided with a temperature setting means for setting the heating temperature of the heating device based on the solder information.
[0012] 本発明のはんだ除去装置を上記のように構成した場合は、記録部に記録されたは んだ情報に基づき複数種類のはんだごとの加熱温度でプリント基板を加熱すること ができるので複数種類のはんだを効率よく回収するすることができる。  [0012] When the solder removal apparatus of the present invention is configured as described above, the printed circuit board can be heated at the heating temperature for each of a plurality of types of solder based on the information recorded in the recording unit. Various types of solder can be collected efficiently.
[0013] また、上記プリント基板は、該プリント基板に上記複数種類のはんだの組成を含む はんだ情報が記録された記録部が形成されたものであり、上記加振装置が、上記カロ 熱装置により加熱された状態のプリント基板に、上記複数種類のはんだごとに設定し た振動数の振動を与えるものであって、上記記録部に記録されたはんだ情報を読み 取り、読み取つたはんだ情報に基づき上記加振装置の振動数を設定する振動数設 定手段を備えたものであることが好まし 、。 [0013] In addition, the printed circuit board is formed by forming a recording unit in which solder information including the composition of the plurality of types of solder is recorded on the printed circuit board. Set each of the above types of solder on a heated printed circuit board. Provided with frequency setting means for reading the solder information recorded in the recording section and setting the frequency of the excitation device based on the read solder information. Is preferred to be.
[0014] 本発明のはんだ除去装置を上記のように構成した場合は、記録部に記録されたは んだ情報に基づき複数種類のはんだごとの振動数でプリント基板を振動させることが できるので複数種類のはんだを効率よく回収するすることができる。 [0014] When the solder removal apparatus of the present invention is configured as described above, the printed circuit board can be vibrated at the frequency of each of a plurality of types of solder based on the information recorded in the recording unit. Various types of solder can be collected efficiently.
[0015] また、上記記録部が、プリント基板に実装された無線タグ (RFIDタグ)であることが 好ましい。 [0015] The recording unit is preferably a wireless tag (RFID tag) mounted on a printed circuit board.
[0016] 本発明のはんだ除去装置を上記のように構成した場合は、はんだ情報を容易に読 み取り、はんだ情報に基づいて、はんだの回収を行うため、複数種類のはんだをより 効果的に分別回収することができる。  [0016] When the solder removal apparatus of the present invention is configured as described above, the solder information is easily read, and the solder is collected based on the solder information. Separated collection is possible.
[0017] また、上記加熱装置および加振装置は、互いに融点の異なる複数種類のはんだに 対応する複数の加熱ユニットおよび加振ユニットからなるものであることが好ましい。 [0017] Further, it is preferable that the heating device and the vibration device include a plurality of heating units and vibration units corresponding to a plurality of types of solder having different melting points.
[0018] 本発明のはんだ除去装置を上記のように構成した場合は、複数種類のはんだを効 率よく回収することができる。 [0018] When the solder removal apparatus of the present invention is configured as described above, a plurality of types of solder can be efficiently recovered.
[0019] また、上記加熱装置は、上記複数の加熱ユニットが、融点の低いはんだに対応する 加熱ユニットから順に配列されたものであることが好ましい。 [0019] Further, in the heating device, it is preferable that the plurality of heating units are arranged in order from a heating unit corresponding to a solder having a low melting point.
[0020] 本発明のはんだ除去装置を上記のように構成した場合は、複数種類のはんだを一 層効率よく回収することができる。  [0020] When the solder removal apparatus of the present invention is configured as described above, a plurality of types of solder can be efficiently recovered.
[0021] また、プリント基板を上記複数の加熱ユニットおよび加振ユニットを経由する搬送路 上を搬送する搬送手段を備えたものであることが好ま U、。 [0021] It is also preferable that the printed circuit board is provided with transport means for transporting the printed circuit board on a transport path that passes through the plurality of heating units and vibration units.
[0022] 本発明のはんだ除去装置を上記のように構成した場合は、複数種類のはんだをさ らに効率よく回収することができる。 [0022] When the solder removal apparatus of the present invention is configured as described above, a plurality of types of solder can be collected more efficiently.
[0023] また、上記目的を達成する本発明のはんだ除去方法は、 [0023] Further, the solder removal method of the present invention that achieves the above-described object includes:
互いに融点の異なる複数種類のはんだが溶着されているプリント基板を、上記複数 種類のはんだそれぞれについて設定した加熱温度で加熱するとともに、該プリント基 板に、上記複数種類のはんだそれぞれについて設定した振動数の振動を与えて該 プリント基板からはんだを分離することを特徴とする。 [0024] 本発明のはんだ除去方法によれば、複数種類のはんだごとに設定した加熱温度で プリント基板を加熱するので複数種類のはんだを効果的に分別回収することができる A printed circuit board on which a plurality of types of solder with different melting points are welded is heated at a heating temperature set for each of the plurality of types of solder, and the frequency set for each of the plurality of types of solder is set on the printed circuit board. And the solder is separated from the printed circuit board. [0024] According to the solder removal method of the present invention, the printed circuit board is heated at the heating temperature set for each of the plurality of types of solder, so that the plurality of types of solder can be effectively separated and collected.
[0025] ここで、上記複数種類のはんだを融点の低い順に分離することが好ましい。 Here, it is preferable to separate the plurality of types of solder in ascending order of melting point.
[0026] 本発明のはんだ除去方法を上記のように構成した場合は、複数種類のはんだをよ り効果的に分別回収することができる。 [0026] When the solder removal method of the present invention is configured as described above, a plurality of types of solder can be more effectively separated and collected.
[0027] また、上記プリント基板力も分離されたはんだを種類別に回収することが好ましい。 [0027] Further, it is preferable to collect the solder separated from the printed circuit board force by type.
[0028] 本発明のはんだ除去方法を上記のように構成した場合は、複数種類のはんだを種 類別に分別回収することができる。 [0028] When the solder removal method of the present invention is configured as described above, a plurality of types of solder can be separately collected for each type.
[0029] また、上記プリント基板に予め記録された、上記複数種類のはんだの融点を含むは んだ情報を読み取り、該はんだ情報に基づき、はんだの種類ごとに設定した加熱温 度で該プリント基板を加熱することが好ま 、。 [0029] Further, the solder information including the melting points of the plurality of types of solder recorded in advance on the printed circuit board is read, and the printed circuit board is heated at a heating temperature set for each type of solder based on the solder information. Preferred to heat.
[0030] 本発明のはんだ除去方法を上記のように構成した場合は、複数種類のはんだをよ り効率よく回収することができる。 [0030] When the solder removal method of the present invention is configured as described above, a plurality of types of solder can be collected more efficiently.
[0031] また、上記プリント基板に予め記録された、上記複数種類のはんだの融点を含むは んだ情報を読み取り、該はんだ情報に基づき、はんだの種類ごとに設定した振動数 で該プリント基板を振動させることが好ま U、。 [0031] Further, the solder information including the melting points of the plurality of types of solder recorded in advance on the printed circuit board is read, and the printed circuit board is loaded at the frequency set for each solder type based on the solder information. U, prefer to vibrate.
[0032] 本発明のはんだ除去方法を上記のように構成した場合は、複数種類のはんだをよ り効率よく回収することができる。 [0032] When the solder removal method of the present invention is configured as described above, a plurality of types of solder can be collected more efficiently.
[0033] 本発明によれば、複数種類のはんだを効果的に分別回収することのできる、環境 保護および資源保護に有効なはんだ除去装置およびはんだ除去方法を実現するこ とがでさる。 [0033] According to the present invention, it is possible to realize a solder removal apparatus and a solder removal method that can effectively separate and collect a plurality of types of solder and are effective for environmental protection and resource protection.
図面の簡単な説明  Brief Description of Drawings
[0034] [図 1]本発明の第 1の実施形態の流れ方式によるはんだ除去装置の概要図である。  [0034] FIG. 1 is a schematic diagram of a solder removal apparatus according to a flow method of a first embodiment of the present invention.
[図 2]第 1の実施形態のはんだ除去装置におけるはんだ情報を示す図である。  FIG. 2 is a diagram showing solder information in the solder removal apparatus of the first embodiment.
[図 3]第 1の実施形態のはんだ除去装置に用いられる電気炉部分の正面断面図であ る。  FIG. 3 is a front sectional view of an electric furnace portion used in the solder removal apparatus of the first embodiment.
[図 4]図 3の X— X線で切断した断面図である。 [図 5]第 1の実施形態の流れ方式によるはんだ除去方法の流れ図である。 4 is a cross-sectional view taken along line X—X in FIG. FIG. 5 is a flowchart of a solder removal method by a flow method according to the first embodiment.
[図 6]本発明の第 2の実施形態のバッチ方式によるはんだ除去装置の概要図である。  FIG. 6 is a schematic view of a batch-type solder removal apparatus according to a second embodiment of the present invention.
[図 7]本発明の第 2の実施形態のバッチ方式によるはんだ除去方法の流れ図である。 発明を実施するための最良の形態  FIG. 7 is a flowchart of a batch-type solder removal method according to a second embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
[0035] 以下、図を参照して本発明の実施の形態を説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0036] 本発明のはんだ除去方法は、互いに融点の異なる複数種類のはんだが溶着され ているプリント基板を、上記複数種類のはんだそれぞれについて設定した加熱温度 で加熱するとともに、該プリント基板に、上記複数種類のはんだそれぞれについて設 定した振動数の振動を与えて該プリント基板からはんだを分離するものである。  [0036] In the solder removal method of the present invention, a printed circuit board on which a plurality of types of solders having different melting points are welded is heated at a heating temperature set for each of the plurality of types of solder. The solder is separated from the printed circuit board by applying a vibration having a set frequency for each of the plurality of types of solder.
[0037] 以下に説明する第 1の実施形態では、流れ方式によるはんだ除去装置を用いたは んだ除去方法について説明する。  [0037] In the first embodiment described below, a solder removal method using a flow type solder removal apparatus will be described.
[0038] この第 1の実施形態では、上記複数種類のはんだを融点の低い順に分離するよう に構成されている。  [0038] In the first embodiment, the plurality of types of solder are separated in ascending order of melting point.
[0039] また、上記プリント基板力も分離されたはんだを種類別に回収するようになっている また、上記プリント基板に予め記録された、上記複数種類のはんだの融点を含むは んだ情報を読み取り、該はんだ情報に基づき、はんだの種類ごとに設定した加熱温 度で該プリント基板を加熱するようになっている。  [0039] The printed circuit board force is also collected for each type of separated solder. Also, the solder information including the melting points of the plurality of types of solder recorded in advance on the printed circuit board is read. Based on the solder information, the printed circuit board is heated at a heating temperature set for each type of solder.
[0040] また、上記プリント基板に予め記録された、上記複数種類のはんだの融点を含むは んだ情報を読み取り、該はんだ情報に基づき、はんだの種類ごとに設定した振動数 で該プリント基板を振動させるようになって!/、る。 [0040] Further, the solder information including the melting points of the plurality of types of solder recorded in advance on the printed circuit board is read, and the printed circuit board is loaded at the frequency set for each solder type based on the solder information. Come to vibrate!
[0041] 上記のはんだ情報は、プリント基板の作成時に、そのプリント基板に用いられるはん だの種類や溶融温度のはんだ情報が記録されたタグ、例えば、無線 ICタグ (RFIDタ グ）、ラベル、バーコード、二次元コード等を予めプリント基板に実装しておき、はんだ 除去装置に備えられたタグ読取り装置で上記はんだ情報を読み取ることによりはんだ 除去装置の加熱温度や振動数を制御することができる。 [0041] The above solder information includes a tag in which solder information of solder type and melting temperature used on the printed circuit board is recorded, for example, a wireless IC tag (RFID tag), a label It is possible to control the heating temperature and frequency of the solder removal device by mounting a barcode, two-dimensional code, etc. on the printed circuit board in advance and reading the solder information with a tag reader provided in the solder removal device. it can.
[0042] 図 1は、本発明の第 1の実施形態の流れ方式によるはんだ除去装置の概要図であ る。 [0043] 図 1には、流れ方式によるはんだ除去装置 1の概要が示されている。このはんだ除 去装置 1は、互いに融点の異なる 2種類のはんだが溶着されているプリント基板 10を 上記 2種類のはんだごとに設定した加熱温度で加熱する電気炉 11aおよび電気炉 1 lbと、プリント基板 10を、吊り下げた状態で電気炉 11aおよび電気炉 l ibを経由する 搬送路 13上を搬送する搬送手段 14と、電気炉 11aおよび電気炉 l ibにより加熱さ れた状態のプリント基板 10に振動を与える加振装置 12a, 12bと、加振装置 12a, 12 bにより振動が与えられたプリント基板 10からそれぞれ分離されたはんだを回収する 受け皿 15aおよび受け皿 15bとを備えている。 FIG. 1 is a schematic diagram of a solder removal apparatus according to the flow method of the first embodiment of the present invention. FIG. 1 shows an outline of a solder removal apparatus 1 by a flow method. This solder removal apparatus 1 includes an electric furnace 11a and an electric furnace 1 lb for heating a printed circuit board 10 on which two kinds of solders having different melting points are welded at a heating temperature set for each of the two kinds of solder. In the suspended state, the substrate 14 is transported via the electric furnace 11a and the electric furnace l ib. The conveying means 14 is conveyed on the conveying path 13, and the printed circuit board 10 is heated by the electric furnace 11a and the electric furnace l ib. And a receiving tray 15a and a receiving tray 15b for collecting the solder separated from the printed circuit board 10 to which the vibration is applied by the vibrating devices 12a and 12b.
[0044] この実施形態では、プリント基板 10上に各種のデバイス 10aのほかに、複数種類の はんだの融点を含むはんだ情報が記録された無線 ICタグ 10bが形成されたプリント 基板 10を処理する例が示されており、このはんだ除去装置 1は、上記各構成要素の ほかに、上記無線 ICタグ 10bからはんだ情報を読み取り、該はんだ情報に基づき電 気炉 11aおよび電気炉 l ibの加熱温度を設定する温度設定手段 18と、該はんだ情 報に基づき加振装置 12a, 12bの振動数を設定する振動数設定手段 19とが備えら れている。  In this embodiment, in addition to various devices 10a on the printed circuit board 10, an example of processing the printed circuit board 10 on which the wireless IC tag 10b in which solder information including melting points of a plurality of types of solder is recorded is formed. In addition to the above components, the solder removal apparatus 1 reads solder information from the wireless IC tag 10b and, based on the solder information, determines the heating temperatures of the electric furnace 11a and the electric furnace l ib. A temperature setting means 18 for setting and a frequency setting means 19 for setting the frequency of the vibration generators 12a and 12b based on the solder information are provided.
[0045] 上記の電気炉 11aおよび電気炉 l ibは、本発明にいう加熱装置に相当するもので あり、また、上記の受け皿 15aおよび受け皿 15bは、本発明にいう容器に相当するも のであり、また、上記の無線 ICタグ 10bは、本発明にいう記録部に相当するものであ る。  [0045] The electric furnace 11a and the electric furnace lib are equivalent to the heating device referred to in the present invention, and the tray 15a and the tray 15b are equivalent to the container referred to in the present invention. The wireless IC tag 10b described above corresponds to the recording unit referred to in the present invention.
[0046] 上記の無線 ICタグ 10bには、プリント基板 10に実装されている各部品に使用され ているはんだの種類、溶融温度、溶融時間、振動数などのはんだ情報が記録されて いる。  [0046] Solder information such as the type, melting temperature, melting time, and frequency of solder used for each component mounted on the printed circuit board 10 is recorded in the wireless IC tag 10b.
[0047] 図 2は、第 1の実施形態のはんだ除去装置におけるはんだ情報の一例を示す図で ある。  FIG. 2 is a diagram showing an example of solder information in the solder removal apparatus of the first embodiment.
[0048] 本実施形態のはんだ除去装置で処理されるプリント基板 10 (図 1参照）上に形成さ れた無線 ICタグ 10bには、図 2に示すような内容のはんだ情報が記録されている。す なわち、上記プリント基板 10には、図 2に示すように、部品 A力も部品 Fまでの 6種類 の部品が実装されており、例えば、部品 Aには、 Sn— 58Biはんだ使用されており、 その溶融温度は 139°C、溶融時間は 60秒必要であり、振動数は 10Hzを選択すべき こと、また、部品 Bには、 Sn— 3Ag— 0. 5Cuはんだが使用されており、その溶融温 度は 217°C、溶融時間は 180秒必要であり、振動数は 50Hzを選択すべきこと、…部 品 Fには、 Sn— 58Biはんだ使用されており、その溶融温度は 139°C、溶融時間は 6 0秒必要であり、振動数は 10Hzを選択すべきことなどが記録されて 、る。 [0048] The wireless IC tag 10b formed on the printed circuit board 10 (see FIG. 1) processed by the desoldering apparatus of the present embodiment records the solder information as shown in FIG. . In other words, as shown in Figure 2, the printed circuit board 10 has six types of components, including component A force and component F. For example, component A uses Sn-58Bi solder. , The melting temperature is 139 ° C, the melting time is 60 seconds, the frequency should be 10Hz, and Sn-3Ag-0.5Cu solder is used for part B. The temperature must be 217 ° C, the melting time must be 180 seconds, and the frequency should be 50Hz .... Part F uses Sn-58Bi solder, and its melting temperature is 139 ° C. The melting time is 60 seconds, and it is recorded that the frequency should be 10Hz.
[0049] このはんだ情報は、はんだ除去装置 1 (図 1参照）の温度設定手段 18によって読み 取られ、温度設定手段 18および振動数設定手段 19は、このはんだ情報に基づき電 気炉 1 laおよび電気炉 1 lbの加熱条件および振動条件の設定を行うようになって 、 る。 This solder information is read by the temperature setting means 18 of the solder removal apparatus 1 (see FIG. 1), and the temperature setting means 18 and the frequency setting means 19 are based on this solder information and the electric furnace 1 la and The heating conditions and vibration conditions for the electric furnace 1 lb are set.
[0050] 図 3は、第 1の実施形態のはんだ除去装置に用いられる電気炉部分の正面断面図 、図 4は図 3の X— X線で切断した断面図である。  FIG. 3 is a front cross-sectional view of an electric furnace portion used in the solder removal apparatus of the first embodiment, and FIG. 4 is a cross-sectional view taken along line X—X in FIG.
[0051] 図 3および図 4に示すように、この電気炉 11は、本体 111が耐熱材料からできた縦 長の箱状体のものであり、上部に開口 113、そして両側部に上部まで開放した入口 1 14と出口 115が形成されている。開口 113はプリント基板 10 (図 1参照）を吊設する フック 112が容易に通過できる間隔となっており、入口 114と出口 115はフック 112お よびプリント基板 10が通過できる間隔となっている。  [0051] As shown in Fig. 3 and Fig. 4, this electric furnace 11 is a vertically long box-shaped body 111 made of a heat-resistant material, with an opening 113 at the top and open to the top at both sides. An inlet 114 and an outlet 115 are formed. The opening 113 is an interval through which the hook 112 for suspending the printed circuit board 10 (see FIG. 1) can easily pass, and the inlet 114 and the outlet 115 are at an interval through which the hook 112 and the printed circuit board 10 can pass.
[0052] 本体 111の内部は予備加熱ゾーン 116と本加熱ゾーン 117とからなっており、両側 に加熱部材 118が縦方向に設置されている。この加熱部材 118は、シースの電熱線 119が蛇行して配設されて 、て、該電熱線 119にセラミックスを被覆した多孔質金属 板 120が接した状態で設置されている。セラミックスは加熱されると被加熱物を内部 まで均一に加熱することのできる遠赤外線を放射し、また多孔質金属板は表面積が 大きいため熱の放出量が多く被加熱物を効率よく加熱することができる。  [0052] The inside of the main body 111 is composed of a preheating zone 116 and a main heating zone 117, and heating members 118 are vertically installed on both sides. The heating member 118 is disposed in a state where the heating wire 119 of the sheath meanders and the porous metal plate 120 coated with ceramics is in contact with the heating wire 119. When heated, ceramics emits far-infrared rays that can uniformly heat the object to be heated, and the porous metal plate has a large surface area so that it emits a large amount of heat and heats the object to be heated efficiently. Can do.
[0053] 本加熱ゾーン 117の下部には、落下してくるはんだを受け取る受け皿 121が設置さ れている。  [0053] Below the main heating zone 117, a tray 121 for receiving the falling solder is installed.
[0054] 本体 111の上方には搬送装置 122が設置されている。搬送装置 122は、下部が開 口となったレール 123と該レール内を摺動する無端のチェーン 124力 構成されてい る。チェーン 124は図示しない駆動装置で本体 111の外側を回動して、再度本体 11 1の上方を走行するようになっている。チェーン 124には一定間隔で、正確には加熱 ゾーン 117の中心間の距離毎の間隔でフック 112が取付板 125を介して取り付けら れている。フック 112は強いパネ力を有する一対の挟持板でプリント基板 10を保持す る。 A transfer device 122 is installed above the main body 111. The conveying device 122 includes a rail 123 having an opening at the bottom and an endless chain 124 force that slides in the rail. The chain 124 is rotated on the outside of the main body 111 by a driving device (not shown) so as to travel above the main body 111 again. Chain 124 at regular intervals, precisely heated Hooks 112 are attached via attachment plates 125 at intervals of the distance between the centers of the zones 117. The hook 112 holds the printed circuit board 10 with a pair of clamping plates having a strong panel force.
[0055] チェーン 124は、予備加熱ゾーン 116と本加熱ゾーン 117との間の距離を走行して 力も一定時間停止するタクト送りを行う。すなわち、フック 112が予備加熱ゾーン 116 の中心で停止したときには、走行方向（矢印 A方向）前方のフック 112は本加熱ゾー ン 117の中心で停止するようになって!/、る。  [0055] The chain 124 performs tact feed that travels the distance between the preheating zone 116 and the main heating zone 117 and stops the force for a certain period of time. That is, when the hook 112 stops at the center of the preheating zone 116, the hook 112 in front of the traveling direction (arrow A direction) stops at the center of the main heating zone 117! /.
[0056] 本加熱ゾーン 117の略中心の上方で、取付板 125の直上となるところには加振装 置 125が設置されている。該加振装置 125は矢印 Bのように上下動し、最下点に下 力 たときには取付板 125に接するようになつている。  [0056] A vibration device 125 is installed at a position directly above the mounting plate 125 above the approximate center of the main heating zone 117. The vibration device 125 moves up and down as shown by an arrow B, and comes into contact with the mounting plate 125 when the force is applied to the lowest point.
[0057] 次に、第 1の実施形態におけるはんだ除去の手順について説明する。  Next, the procedure for removing solder in the first embodiment will be described.
[0058] 図 5は、第 1の実施形態の流れ方式によるはんだ除去方法の流れ図である。  FIG. 5 is a flowchart of the solder removal method according to the flow method of the first embodiment.
[0059] 先ず、プリント基板 10のはんだ実装時に、このプリント基板に使用される鉛フリーは んだの組成および融点などの情報を無線 ICタグに入力する (ステップ S11)。  [0059] First, at the time of solder mounting of the printed circuit board 10, information such as the composition and melting point of lead-free solder used for the printed circuit board is input to the wireless IC tag (step S11).
[0060] 次に、廃棄された電気製品力も上記プリント基板を取り出し、はんだ除去装置 1 (図 1参照）の搬送手段 14に吊り下げた状態で装着する (ステップ S 12)。  Next, the printed circuit board is also taken out of the discarded electrical product force and mounted on the conveying means 14 of the solder removal apparatus 1 (see FIG. 1) in a suspended state (step S 12).
[0061] 次に、はんだ除去装置 1の搬送手段 14によりプリント基板 10を搬送路 13に沿って 搬送し、先ず、温度設定部 18および振動数設定部 19 (図 1参照）によりプリント基板 10上の無線 ICタグ 1 Obに記録されたはんだ情報を読み取る。振動数設定部 19は読 み取られたはんだ情報に基づき電気炉 11a, l ibそれぞれにおけるプリント基板 10 の振動数をともに 10Hzに設定する (ステップ S13)。また、温度設定部 18は上記は んだ情報に基づき電気炉 11a, l ibにおけるプリント基板 10の加熱温度を、上記 2種 類のはんだの融点の低 、順に設定する (ステップ S 14)。  [0061] Next, the printed circuit board 10 is transported along the transport path 13 by the transport means 14 of the solder removal apparatus 1. First, the temperature setting unit 18 and the frequency setting unit 19 (see FIG. 1) are used to place the printed circuit board 10 on the printed circuit board 10. Read the solder information recorded on the wireless IC tag 1 Ob. Based on the read solder information, the frequency setting unit 19 sets the frequency of the printed circuit board 10 in each of the electric furnaces 11a and ib to 10 Hz (step S13). Further, the temperature setting unit 18 sets the heating temperature of the printed circuit board 10 in the electric furnaces 11a and ib based on the solder information in order of decreasing melting points of the two types of solder (step S14).
[0062] この振動数は、鉛フリーはんだの場合、 10Hz〜： LOOHzが適当である。この振動数 の設定はプリント基板 10上のタグからはんだ情報を読み取り、例えば融点の低いは んだでは、振動数力 、さくてもよぐ融点が高いはんだでは振動数を大きく設定する 。なお、この実施形態では、電気炉 11aおよび電気炉 l ibにおける振動数はともに 1 0Hzに設定されている。 [0063] 次に、プリント基板 10をはんだ除去装置 1の搬送手段 14に吊り下げた状態で振動 数： 10Hzの振動を与えながら電気炉 11a内に搬送する。電気炉 11aでは、プリント基 板 10の表裏両面を Sn— 58Biはんだの融点 139°C以上で 1分から 10分間加熱され る（ステップ S15)。これによりプリント基板 10上の Sn—58Biはんだは溶融して受け 皿 15aに落下回収される（ステップ S16)。 [0062] In the case of lead-free solder, this frequency is suitably 10Hz ~: LOOHz. This frequency setting is performed by reading solder information from a tag on the printed circuit board 10. For example, in the case of solder having a low melting point, the frequency force is set, and in the case of solder having a high melting point, the frequency is set large. In this embodiment, the frequency in both the electric furnace 11a and the electric furnace l ib is set to 10 Hz. Next, the printed circuit board 10 is transported into the electric furnace 11 a while being vibrated at a vibration frequency of 10 Hz in a state where it is suspended from the transport means 14 of the solder removal apparatus 1. In the electric furnace 11a, both the front and back sides of the printed board 10 are heated for 1 to 10 minutes at a melting point of 139 ° C or higher of Sn-58Bi solder (step S15). As a result, the Sn-58Bi solder on the printed circuit board 10 is melted and dropped and collected on the tray 15a (step S16).
[0064] 続いてプリント基板 10は電気炉 l ib内に搬送され、 Sn—3Ag— 0. 5Cuはんだの 融点 217°C以上で 1分から 10分間加熱される (ステップ S17)。これによりプリント基 板 10上の Sn— 3Ag— 0. 5Cuはんだは溶融して受け皿 15bに落下回収される (ステ ップ S18)。  [0064] Subsequently, the printed circuit board 10 is transferred into an electric furnace l ib and heated at a melting point of Sn-3Ag-0.5Cu solder of 217 ° C or higher for 1 to 10 minutes (step S17). As a result, the Sn-3Ag-0.5Cu solder on the printed board 10 is melted and dropped and collected on the tray 15b (step S18).
[0065] 次に、 2種類のはんだが溶融除去されたプリント基板から、該プリント基板上の電子 部品の回収'廃棄が行われる (ステップ S19)。  Next, the electronic component on the printed circuit board is collected and discarded from the printed circuit board from which the two types of solder are melted and removed (step S19).
[0066] こうして、 2種類のはんだを融点の低い順に、すなわち融点 139°Cの Sn—58Biは んだを先に、融点 217°Cの Sn—3Ag—0. 5Cuはんだを後に分離することにより、 2 種類のはんだを別々に回収することができる。 [0066] Thus, by separating the two types of solder in ascending order of melting point, that is, Sn-58Bi solder with a melting point of 139 ° C first, Sn-3Ag-0.5Cu solder with a melting point of 217 ° C was separated later. The two types of solder can be collected separately.
[0067] 次に、第 2の実施形態について説明する。 [0067] Next, a second embodiment will be described.
[0068] 図 6は、本発明の第 2の実施形態のバッチ方式によるはんだ除去装置の概要図で ある。  FIG. 6 is a schematic view of a batch-type solder removal apparatus according to the second embodiment of the present invention.
[0069] 図 6には、ノ ツチ方式によるはんだ除去装置 2の概要が示されている。このはんだ 除去装置 2は、互いに融点の異なる 2種類のはんだが溶着されているプリント基板 10 を、上記 2種類のはんだごとに設定した加熱温度で加熱する電気炉 21と、プリント基 板 10を吊り下げた状態で電気炉 21を 2回経由させる搬送路 23上を搬送する搬送手 段 24と、電気炉 21により加熱された状態のプリント基板 10に振動を与える加振装置 22と、加振装置 22により振動が与えられたプリント基板 10から分離されたはんだを 回収する受け皿 25と、プリント基板 10に形成された無線 ICタグ 10bからはんだ情報 を読み取り、該はんだ情報に基づき電気炉 21の加熱温度を設定する温度設定手段 18と、該はんだ情報に基づき加振装置 22の振動数を設定する振動数設定手段 19 とを備えている。  [0069] FIG. 6 shows an outline of a solder removal apparatus 2 by a notch method. This solder removal apparatus 2 suspends an electric furnace 21 that heats a printed circuit board 10 on which two types of solder having different melting points are welded at a heating temperature set for each of the above two types of solder, and the printed circuit board 10. In the lowered state, the conveyance means 24 that conveys the electric furnace 21 through the electric passage 21 twice, the vibration device 22 that vibrates the printed circuit board 10 heated by the electric furnace 21, and the vibration device The solder information is read from the receiving tray 25 that collects the solder separated from the printed circuit board 10 that has been vibrated by 22 and the wireless IC tag 10b formed on the printed circuit board 10, and the heating temperature of the electric furnace 21 is based on the solder information. Temperature setting means 18 for setting the frequency, and frequency setting means 19 for setting the frequency of the vibration device 22 based on the solder information.
[0070] 上記の電気炉 21は、本発明にいう加熱装置に相当するものであり、また、上記の受 け皿 25は、本発明に 、う容器に相当するものである。 [0070] The electric furnace 21 corresponds to the heating device referred to in the present invention, and the receiving device described above. The dish 25 corresponds to a container according to the present invention.
[0071] また、上記無線 ICタグ 10bには、互いに融点の異なる 2種類のはんだ、すなわち Sn [0071] Further, the wireless IC tag 10b includes two types of solder having different melting points, namely Sn.
58Biはんだおよび Sn— 3Ag— 0. 5Cuはんだが用いられていること、およびこれ ら 2種類のはんだの融点はそれぞれ 139°Cおよび 217°Cであること、また、これらの はんだの組成力も振動数として 10Hz〜： LOOHzを選択すべきことなどのはんだ情報 が記録されている。  58Bi solder and Sn-3Ag-0.5Cu solder are used, and the melting points of these two types of solder are 139 ° C and 217 ° C, respectively. As 10Hz ~: Solder information such as selecting LOOHz is recorded.
[0072] 次に、第 2の実施形態におけるはんだ除去の手順について説明する。  [0072] Next, a procedure for removing solder in the second embodiment will be described.
[0073] 図 7は、本発明の第 2の実施形態のノ ツチ方式によるはんだ除去方法の流れ図で ある。 FIG. 7 is a flowchart of the solder removal method by the notch method according to the second embodiment of the present invention.
[0074] 先ず、プリント基板 10のはんだ実装時に、このプリント基板に使用される鉛フリーは んだの組成および融点などの情報を無線 ICタグに入力する (ステップ S21)。  First, at the time of solder mounting of the printed circuit board 10, information such as the composition and melting point of lead-free solder used for the printed circuit board is input to the wireless IC tag (step S21).
[0075] 次に、廃棄された電気製品力 上記プリント基板を取り出し、はんだ除去装置 2 (図 6参照）の搬送手段 24に吊り下げた状態で装着する (ステップ S22)。  Next, the discarded electric product force The printed circuit board is taken out and mounted in a suspended state on the conveying means 24 of the solder removal apparatus 2 (see FIG. 6) (step S22).
[0076] 次に、はんだ除去装置 2の搬送手段 24によりプリント基板 10を搬送路 23に沿って 搬送し、先ず、温度設定部 18および振動数設定部 19 (図 1参照）によりプリント基板 10上の無線 ICタグ 1 Obに記録されたはんだ情報を読み取る。振動数設定部 19は読 み取られたはんだ情報に基づき電気炉 21におけるプリント基板 10の振動数を第 1回 目の処理時および第 2回目の処理時ともに 10Hzに設定する (ステップ S23)。ここで 、本実施例のはんだ情報は、実施例 1で示したものと同様のものとして説明する。ま た、温度設定部 18は上記はんだ情報に基づき電気炉 21におけるプリント基板 10の 加熱温度を、上記 2種類のはんだの融点の低い順に設定する (ステップ S24)。  [0076] Next, the printed circuit board 10 is transported along the transport path 23 by the transport means 24 of the solder removal apparatus 2. First, the temperature setting unit 18 and the frequency setting unit 19 (see FIG. 1) are used to place the printed circuit board 10 on the printed circuit board 10. Read the solder information recorded on the wireless IC tag 1 Ob. Based on the read solder information, the frequency setting unit 19 sets the frequency of the printed circuit board 10 in the electric furnace 21 to 10 Hz in both the first process and the second process (step S23). Here, the solder information of the present embodiment will be described as being similar to that shown in the first embodiment. Further, the temperature setting unit 18 sets the heating temperature of the printed circuit board 10 in the electric furnace 21 based on the solder information in order from the lowest melting point of the two types of solder (step S24).
[0077] 次に、プリント基板 10をはんだ除去装置 2の搬送手段 24に吊り下げた状態で振動 数： 10Hzの振動を与えながら電気炉 21内に搬送する。電気炉 21では Sn— 58Biは んだの融点 139°C以上で表裏両面を 1分から 10分間加熱される (ステップ S25)。こ れによりプリント基板 10上の Sn—58Biはんだは溶融して受け皿 25に落下回収され る（ステップ S 26)。  Next, the printed circuit board 10 is transported into the electric furnace 21 while being vibrated at a vibration frequency of 10 Hz while being suspended from the transport means 24 of the solder removal apparatus 2. In the electric furnace 21, Sn-58Bi is heated at a solder melting point of 139 ° C or higher for 1 to 10 minutes (step S25). As a result, the Sn-58Bi solder on the printed circuit board 10 is melted and dropped and collected in the tray 25 (step S26).
[0078] 次に、上記はんだ情報に基づき電気炉 21におけるプリント基板 10の加熱温度を 2 種類のはんだの融点のうち高い方の融点 217°C以上に変更する (ステップ S27)。 [0079] 次に、プリント基板 10を再び電気炉 21内に搬送し、 Sn— 3Ag— 0. 5Cuはんだの 融点 217°C以上に加熱する（ステップ S28)。これによりプリント基板 10上の Sn—3A g-O. 5Cuはんだは溶融して受け皿 25に落下回収される（ステップ S29)。 Next, based on the solder information, the heating temperature of the printed circuit board 10 in the electric furnace 21 is changed to a higher melting point of 217 ° C. or higher of the melting points of the two types of solder (step S27). Next, the printed circuit board 10 is again conveyed into the electric furnace 21 and heated to a melting point of Sn—3Ag—0.5Cu solder of 217 ° C. or higher (step S28). As a result, the Sn-3A gO.5Cu solder on the printed circuit board 10 is melted and dropped and collected in the tray 25 (step S29).
[0080] 次に、 2種類のはんだが溶融除去されたプリント基板から、該プリント基板上の電子 部品の回収'廃棄が行われる (ステップ S30)。  Next, the electronic component on the printed circuit board is collected and discarded from the printed circuit board from which the two types of solder are melted and removed (step S30).
[0081] このように、第 2の実施形態のはんだ除去装置 2では、電気炉 21および加振装置 2 2によるはんだ除去処理を 2回繰り返すことにより、互いに融点の異なる 2種類のはん だ、すなわち Sn—58Biはんだおよび Sn—3Ag— 0. 5Cuはんだを別々に回収する ことができる。  As described above, in the solder removal apparatus 2 of the second embodiment, two types of solder having different melting points are obtained by repeating the solder removal process by the electric furnace 21 and the vibration apparatus 22 twice. That is, Sn-58Bi solder and Sn-3Ag-0.5Cu solder can be collected separately.
[0082] 以上説明したように、本発明のはんだ除去装置、はんだ除去方法により、これまで 困難であった多種類のはんだが溶着されているプリント基板力ものはんだ除去を短 時間で効率的に実施することができる。さらに、プリント基板に溶着されているはんだ を組成ごとに回収できることから、回収されたはんだを資源として再利用することが可 能となる。  [0082] As described above, with the solder removal apparatus and the solder removal method of the present invention, it is possible to efficiently remove solder in a short period of time with a printed circuit board with many types of solder that has been difficult to weld. can do. Furthermore, since the solder deposited on the printed circuit board can be collected for each composition, the collected solder can be reused as a resource.

Claims

請求の範囲 The scope of the claims
[1] 互いに融点の異なる複数種類のはんだが溶着されているプリント基板を、前記複数 種類のはんだごとに設定した加熱温度で加熱する加熱装置と、該加熱装置により加 熱された状態のプリント基板に振動を与える加振装置と、該加振装置により振動が与 えられたプリント基板カゝら分離されたはんだを回収する容器とを備えたことを特徴とす るはんだ除去装置。  [1] A heating device that heats a printed circuit board on which a plurality of types of solder having different melting points are welded at a heating temperature set for each of the plurality of types of solder, and a printed circuit board that is heated by the heating device And a container for collecting the separated solder from the printed circuit board that is vibrated by the vibration device.
[2] 前記容器は、前記複数種類のはんだを種類別に回収するための複数の受け皿か らなることを特徴とする請求項 1記載のはんだ除去装置。  [2] The solder removal apparatus according to [1], wherein the container includes a plurality of trays for collecting the plurality of types of solders by type.
[3] 前記プリント基板は、該プリント基板に前記複数種類のはんだの融点を含むはんだ 情報が記録された記録部が形成されたものであり、 [3] The printed circuit board has a recording part on which solder information including melting points of the plurality of types of solder is recorded on the printed circuit board.
前記記録部に記録されたはんだ情報を読み取り、該はんだ情報に基づき前記加熱 装置の加熱温度を設定する温度設定手段を備えたことを特徴とする請求項 1記載の はんだ除去装置。  The solder removal apparatus according to claim 1, further comprising a temperature setting unit that reads solder information recorded in the recording unit and sets a heating temperature of the heating apparatus based on the solder information.
[4] 前記プリント基板は、該プリント基板に前記複数種類のはんだの組成を含むはんだ 情報が記録された記録部が形成されたものであり、  [4] The printed circuit board is formed by forming a recording part on which solder information including the composition of the plurality of types of solder is recorded on the printed circuit board,
前記加振装置が、前記加熱装置により加熱された状態のプリント基板に、前記複数 種類のはんだごとに設定した振動数の振動を与えるものであって、  The vibration device applies vibrations at a frequency set for each of the plurality of types of solder to the printed circuit board heated by the heating device,
前記記録部に記録されたはんだ情報を読み取り、読み取つたはんだ情報に基づき 前記加振装置の振動数を設定する振動数設定手段を備えたことを特徴とする請求 項 1記載のはんだ除去装置。  The solder removal apparatus according to claim 1, further comprising a frequency setting unit that reads the solder information recorded in the recording unit and sets the frequency of the vibration exciter based on the read solder information.
[5] 前記記録部が、プリント基板に実装された無線タグであることを特徴とする請求項 1 記載のはんだ除去装置。 5. The solder removal apparatus according to claim 1, wherein the recording unit is a wireless tag mounted on a printed circuit board.
[6] 前記加熱装置および加振装置は、互いに融点の異なる複数種類のはんだに対応 する複数の加熱ユニットおよび加振ユニットからなるものであることを特徴とする請求 項 1記載のはんだ除去装置。 6. The solder removal apparatus according to claim 1, wherein the heating device and the vibration device comprise a plurality of heating units and vibration units corresponding to a plurality of types of solder having different melting points.
[7] 前記加熱装置は、前記複数の加熱ユニットが、
Figure imgf000014_0001
、はんだに対応する加熱 ユニットから順に配列されたものであることを特徴とする請求項 6記載のはんだ除去 装置。 [7] The heating device includes the plurality of heating units.
Figure imgf000014_0001
The solder removal apparatus according to claim 6, wherein the solder removal apparatuses are arranged in order from a heating unit corresponding to solder.
[8] プリント基板を前記複数の加熱ユニットおよび加振ユニットを経由する搬送路上を搬 送する搬送手段を備えたことを特徴とする請求項 6記載のはんだ除去装置。 8. The solder removal apparatus according to claim 6, further comprising transport means for transporting the printed circuit board on a transport path that passes through the plurality of heating units and vibration units.
[9] 互いに融点の異なる複数種類のはんだが溶着されているプリント基板を、前記複数 種類のはんだそれぞれについて設定した加熱温度で加熱するとともに、該プリント基 板に、前記複数種類のはんだそれぞれについて設定した振動数の振動を与えて該 プリント基板力 はんだを分離することを特徴とするはんだ除去方法。  [9] A printed circuit board on which a plurality of types of solder with different melting points are welded is heated at a heating temperature set for each of the plurality of types of solder, and is set for each of the plurality of types of solder on the printed circuit board. A method for removing solder, characterized in that the printed circuit board solder is separated by applying vibrations at a specified frequency.
[10] 前記複数種類のはんだを融点の低い順に分離することを特徴とする請求項 9記載 のはんだ除去方法。  10. The solder removal method according to claim 9, wherein the plurality of types of solder are separated in ascending order of melting point.
[11] 前記プリント基板力 分離されたはんだを種類別に回収することを特徴とする請求 項 9記載のはんだ除去方法。  11. The solder removal method according to claim 9, wherein the separated solder is collected by type.
[12] 前記プリント基板に予め記録された、前記複数種類のはんだの融点を含むはんだ 情報を読み取り、該はんだ情報に基づき、はんだの種類ごとに設定した加熱温度で 該プリント基板を加熱することを特徴とする請求項 9記載のはんだ除去方法。  [12] Reading solder information including melting points of the plurality of types of solder recorded in advance on the printed circuit board, and heating the printed circuit board at a heating temperature set for each type of solder based on the solder information. 10. The solder removal method according to claim 9, wherein
[13] 前記プリント基板に予め記録された、前記複数種類のはんだの融点を含むはんだ 情報を読み取り、該はんだ情報に基づき、はんだの種類ごとに設定した振動数で該 プリント基板を振動させることを特徴とする請求項 9記載のはんだ除去方法。  [13] Reading solder information including melting points of the plurality of types of solder recorded in advance on the printed circuit board, and vibrating the printed circuit board at a frequency set for each type of solder based on the solder information. 10. The solder removal method according to claim 9, wherein
PCT/JP2005/024050 2005-12-28 2005-12-28 Solder remover and method of removing solder WO2007077594A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007552818A JP4763725B2 (en) 2005-12-28 2005-12-28 Desoldering device and desoldering method
PCT/JP2005/024050 WO2007077594A1 (en) 2005-12-28 2005-12-28 Solder remover and method of removing solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/024050 WO2007077594A1 (en) 2005-12-28 2005-12-28 Solder remover and method of removing solder

Publications (1)

Publication Number Publication Date
WO2007077594A1 true WO2007077594A1 (en) 2007-07-12

Family

ID=38227961

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/024050 WO2007077594A1 (en) 2005-12-28 2005-12-28 Solder remover and method of removing solder

Country Status (2)

Country Link
JP (1) JP4763725B2 (en)
WO (1) WO2007077594A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103071662A (en) * 2012-12-14 2013-05-01 清华大学 Environmentally friendly method for rapidly disassembling waste circuit board through applying [BMIm]BF4
EP2668834A1 (en) * 2011-01-30 2013-12-04 Koninklijke Philips N.V. Printed circuit board assembly
CN103495783A (en) * 2013-09-18 2014-01-08 清华大学 Disassembly device for reusable surface-mounted components of waste circuit board
JP2014529500A (en) * 2011-12-15 2014-11-13 アドバンスドテクノロジーマテリアルズ，インコーポレイテッド Apparatus and method for stripping solder metal during recycling of waste electrical and electronic equipment
WO2015113272A1 (en) * 2014-01-29 2015-08-06 Li Tong (H.K.) Telecom Company Limited System and method for extracting electronic components
WO2018139465A1 (en) * 2017-01-30 2018-08-02 株式会社アステック入江 Electronic component separation device and electronic component separation method
US11884992B2 (en) * 2016-02-08 2024-01-30 Newsouth Innovations Pty Limited Method, apparatus and system for processing a composite waste source

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129548A (en) * 2009-12-15 2011-06-30 Ricoh Microelectronics Co Ltd Jet stream type soldering apparatus
KR101743364B1 (en) * 2015-11-18 2017-06-05 이철호 Waste resources separate collection apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1017948A (en) * 1996-06-27 1998-01-20 Senju Metal Ind Co Ltd Method for removing solder of printed circuit board and device for removing solder
JP2000269614A (en) * 1999-01-11 2000-09-29 Matsushita Electric Ind Co Ltd Component mount circuit form and recycling method for electrical apparatus containing the same
JP2001203447A (en) * 2000-01-18 2001-07-27 Minolta Co Ltd Holding member holding component, printed board mounting article and component-discriminating method thereof
JP2002368409A (en) * 2001-06-07 2002-12-20 Ricoh Co Ltd Component re-working method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1017948A (en) * 1996-06-27 1998-01-20 Senju Metal Ind Co Ltd Method for removing solder of printed circuit board and device for removing solder
JP2000269614A (en) * 1999-01-11 2000-09-29 Matsushita Electric Ind Co Ltd Component mount circuit form and recycling method for electrical apparatus containing the same
JP2001203447A (en) * 2000-01-18 2001-07-27 Minolta Co Ltd Holding member holding component, printed board mounting article and component-discriminating method thereof
JP2002368409A (en) * 2001-06-07 2002-12-20 Ricoh Co Ltd Component re-working method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2668834A1 (en) * 2011-01-30 2013-12-04 Koninklijke Philips N.V. Printed circuit board assembly
US9113584B2 (en) 2011-01-30 2015-08-18 Koninklijke Philips N.V. Printed circuit board assembly
JP2014529500A (en) * 2011-12-15 2014-11-13 アドバンスドテクノロジーマテリアルズ，インコーポレイテッド Apparatus and method for stripping solder metal during recycling of waste electrical and electronic equipment
CN103071662A (en) * 2012-12-14 2013-05-01 清华大学 Environmentally friendly method for rapidly disassembling waste circuit board through applying [BMIm]BF4
CN103495783A (en) * 2013-09-18 2014-01-08 清华大学 Disassembly device for reusable surface-mounted components of waste circuit board
WO2015113272A1 (en) * 2014-01-29 2015-08-06 Li Tong (H.K.) Telecom Company Limited System and method for extracting electronic components
CN104968463A (en) * 2014-01-29 2015-10-07 俐通（香港）有限公司 System and method for extracting electronic components
US11884992B2 (en) * 2016-02-08 2024-01-30 Newsouth Innovations Pty Limited Method, apparatus and system for processing a composite waste source
WO2018139465A1 (en) * 2017-01-30 2018-08-02 株式会社アステック入江 Electronic component separation device and electronic component separation method
JP2018125355A (en) * 2017-01-30 2018-08-09 株式会社アステック入江 Electronic component separating device and electronic component separating method

Also Published As

Publication number Publication date
JPWO2007077594A1 (en) 2009-06-04
JP4763725B2 (en) 2011-08-31

Similar Documents

Publication Publication Date Title
JP4763725B2 (en) Desoldering device and desoldering method
US20140251876A1 (en) Method and apparatus for components removal
KR101230869B1 (en) Apparatus for recovering valuable metal and part from printed circuit board and method thereof
JP3493167B2 (en) Vibrating conveyor and method for conveying silicon debris
US5758817A (en) Apparatus and process for removing surface mounted components from printed wiring assemblies
JP7076338B2 (en) Method for removing linear objects, method for removing linear objects, and method for disposing of scraps of electronic and electrical equipment parts
CN101014227A (en) Method and equipment for disassembling circuit board using contacted impact
TW501388B (en) Solder recovering method and solder recovering apparatus
Kopacek Intelligent disassembly of components from printed circuit boards to enable re-use and more efficient recovery of critical metals
JP2013230437A (en) Method for processing printed circuit board
JP2022093662A (en) Method for removing wire-form object
JP5040780B2 (en) Electronic component separation and collection method and electronic component separation and collection device
US20200037479A1 (en) Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
WO2018139465A1 (en) Electronic component separation device and electronic component separation method
JP5352312B2 (en) Disassembling method for electric equipment and disassembling apparatus for electric equipment
US5927591A (en) Salvage method and apparatus for recovering microelectronic components from printed circuit boards
JPH1017948A (en) Method for removing solder of printed circuit board and device for removing solder
JP2012138397A (en) Method and device for separating electronic components of printed circuit board
JP2755225B2 (en) Separation and disassembly of printed wiring boards with components
JPH1134058A (en) Waste disposal device
JP2020143350A (en) Waste electronic substrate processing method and processing apparatus
JPH11314084A (en) Method and apparatus for treating circuit substrate
JP2000156562A (en) Processor and method
JP2018123356A (en) Metal recovery method
CN104972191A (en) Transmission heating equipment

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2007552818

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 05822781

Country of ref document: EP

Kind code of ref document: A1