JP2020143350A - Waste electronic substrate processing method and processing apparatus - Google Patents
Waste electronic substrate processing method and processing apparatus Download PDFInfo
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- JP2020143350A JP2020143350A JP2019041573A JP2019041573A JP2020143350A JP 2020143350 A JP2020143350 A JP 2020143350A JP 2019041573 A JP2019041573 A JP 2019041573A JP 2019041573 A JP2019041573 A JP 2019041573A JP 2020143350 A JP2020143350 A JP 2020143350A
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- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 239000002699 waste material Substances 0.000 title claims abstract description 61
- 238000012545 processing Methods 0.000 title claims abstract description 17
- 238000003672 processing method Methods 0.000 title abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 99
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000010949 copper Substances 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000002245 particle Substances 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 238000007873 sieving Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 18
- 239000011135 tin Substances 0.000 description 39
- 229910052718 tin Inorganic materials 0.000 description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 27
- 239000000463 material Substances 0.000 description 21
- 238000012546 transfer Methods 0.000 description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000003723 Smelting Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Processing Of Solid Wastes (AREA)
- Combined Means For Separation Of Solids (AREA)
- Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
本発明は廃電子基板（以下、廃基板と云う）から銅を含む電子部品等（以下、実装部品と云う）と、スズを含むハンダとを分離して回収することができる廃基板の処理方法に関する。 The present invention is a method for treating a waste substrate capable of separating and recovering an electronic component containing copper (hereinafter referred to as a mounting component) and a solder containing tin from a waste electronic substrate (hereinafter referred to as a waste substrate). Regarding.
電子基板には配線や電子部品に銅が多く含まれており、廃基板からこれらの銅が回収される。近年、廃基板を銅製錬所で処理して銅を回収するケースが増えているが、電子基板には銅と共にハンダに由来するスズが含まれており、スズは銅製錬における忌避元素であるため、製錬所のスズ負担が増大し、各工程における操業トラブルの一因になっている。そのため、廃基板から事前にハンダ由来のスズを分離して銅とスズを別個に処理することが望まれている。 Wiring and electronic components of electronic boards contain a large amount of copper, and these coppers are recovered from waste boards. In recent years, there have been an increasing number of cases where waste substrates are processed at a copper smelter to recover copper, but since electronic substrates contain tin derived from solder as well as copper, tin is a repellent element in copper smelting. , The tin burden on the smelter has increased, which is one of the causes of operational troubles in each process. Therefore, it is desired to separate solder-derived tin from the waste substrate in advance and treat copper and tin separately.
廃基板の処理方法として、以下の技術が従来から知られている。
(イ)廃基板を網板に載置し、加熱下で振動してハンダを溶融し、電子部品を分離し、残留した基板を加熱して炭化する処理方法（特許文献１）。
(ロ)廃基板をフックに吊した状態で加熱し振動を加えてハンダを溶融脱落させる処理方法（特許文献２、特許文献３）。
The following techniques have been conventionally known as methods for treating waste substrates.
(B) A treatment method in which a waste substrate is placed on a net plate, vibrated under heating to melt solder, electronic components are separated, and the remaining substrate is heated and carbonized (Patent Document 1).
(B) A treatment method in which a waste substrate is hung on a hook and heated to apply vibration to melt and drop the solder (
特許文献１の処理方法は、加熱温度が高いので基板が変質し、ハンダの回収が困難になる懸念がある。また、溶融したハンダを振動して落下させる場合、振動数が適切でないとハンダを十分に脱落させることができない。特許文献２と特許文献３の処理方法は、廃基板を吊下げる操作が必要であるため多量処理には不適である。また、脱落する電子部材を分別できないため、銅とスズを分離して回収できないと云う問題がある。
In the treatment method of Patent Document 1, since the heating temperature is high, there is a concern that the substrate is deteriorated and it becomes difficult to recover the solder. Further, when the molten solder is vibrated and dropped, the solder cannot be sufficiently removed unless the frequency is appropriate. The processing methods of
本発明は、従来の処理方法の上記問題を解消したものであり、廃基板から銅を含む実装部品とスズを含むハンダとを容易に分離して回収する処理方法と処理装置を提供する。 The present invention solves the above-mentioned problems of the conventional processing method, and provides a processing method and a processing apparatus for easily separating and recovering a mounting component containing copper and a solder containing tin from a waste substrate.
本発明は以下の構成を有する廃基板の処理方法と処理装置に関する。
〔１〕網板に載置した廃基板を加熱下で振動して溶融したハンダと実装部品を水槽に落下させ、落下した実装部品と冷却したハンダ粒をさらに篩分けして、篩上の実装部品と篩下のハンダ粒に分離することによって、実装部品に含まれる銅とハンダに含まれるスズとを分離することを特徴とする廃基板の処理方法。
〔２〕廃基板を２３０℃〜２７０℃に加熱してハンダを溶融し、振動数２０Hz〜５０Hzおよび振幅１mm以上で網板を振動して溶融したハンダと実装部品を水槽に落下させる上記[１]に記載する廃基板の処理方法。
〔３〕目開き１５mm〜２５mmの網板を用いて廃基板を該網板上に残し、水槽に落下した実装部品とハンダ粒を分別槽に導き、該分別槽の目開き２mm〜７mmの篩で、篩上に実装部品を残し、篩下にハンダ粒を落下させて、実装部品とハンダ粒を分離する上記[１]または上記[２]に記載する廃基板の処理方法。
〔４〕廃基板を載置する網板、該廃基板を加熱してハンダを溶融する加熱手段、上記網板を振動して実装部品と溶融したハンダを落下させる振動手段、落下した実装部品とハンダを受け入れる水槽、冷却したハンダ粒と実装部品を分別する篩手段を備えることを特徴とする廃基板の処理装置。
〔５〕加振機に支持された筐体を備え、該筐体の上面には網板が設けられており、該筐体の底部には水槽が設けられており、上記網板の上方にはヒータが設けられており、上記網板に載置された廃基板が該ヒータによって加熱されてハンダが溶融され、さらに上記加振機によって筐体が振動されて実装部品と溶融したハンダが水槽に落下され、さらに水槽の落下物を受け入れる分別槽が設けられており、該分別槽には篩が設置されており、篩上に落下物の実装部品が残り、篩下にハンダ粒が落下して分離される上記[４]に記載する廃基板の処理装置。
The present invention relates to a waste substrate processing method and processing apparatus having the following configurations.
[1] The waste substrate placed on the net plate is vibrated under heating to drop the molten solder and the mounted parts into a water tank, and the dropped mounted parts and the cooled solder particles are further sieved and mounted on the sieve. A method for treating a waste substrate, which comprises separating copper contained in a mounting component and tin contained in solder by separating the component and solder particles under a sieve.
[2] The waste substrate is heated to 230 ° C. to 270 ° C. to melt the solder, and the net plate is vibrated at a frequency of 20 Hz to 50 Hz and an amplitude of 1 mm or more to drop the melted solder and mounting components into the water tank. ] The waste substrate processing method described in.
[3] Using a mesh plate with a mesh size of 15 mm to 25 mm, the waste substrate is left on the mesh plate, and the mounting parts and solder grains that have fallen into the water tank are guided to the sorting tank, and a sieve with a mesh size of 2 mm to 7 mm in the sorting tank. The method for treating a waste substrate according to the above [1] or [2], wherein the mounted component is left on the sieve and the solder particles are dropped under the sieve to separate the mounted component and the solder particles.
[4] A net plate on which the waste substrate is placed, a heating means for heating the waste substrate to melt the solder, a vibrating means for vibrating the net plate to drop the mounted component and the molten solder, and a dropped mounting component. A waste substrate processing device characterized by being provided with a water tank for receiving solder and a sieving means for separating cooled solder particles and mounting components.
[5] A housing supported by a vibrating machine is provided, a net plate is provided on the upper surface of the housing, and a water tank is provided on the bottom of the housing, which is above the net plate. Is provided with a heater, the waste substrate placed on the net plate is heated by the heater to melt the solder, and the housing is vibrated by the vibration exciter to vibrate the mounted parts and the melted solder in the water tank. There is a sorting tank that receives the dropped objects in the water tank, and a sieve is installed in the sorting tank. The mounted parts of the falling objects remain on the sieve, and the solder particles fall under the sieve. The waste substrate processing apparatus according to the above [4].
〔具体的な説明〕
以下、本発明を具体的に説明する。
廃基板の処理方法
本発明の処理方法は、網板に載置した廃基板を加熱下で振動して溶融したハンダと実装部品を水槽に落下させ、落下した実装部品と冷却したハンダ粒をさらに篩分けして、篩上の実装部品と篩下のハンダ粒に分離することによって、実施部品に含まれる銅とハンダに含まれるスズとを分離することを特徴とする廃基板の処理方法である。
[Specific explanation]
Hereinafter, the present invention will be specifically described.
Disposal method of waste substrate <br /> In the treatment method of the present invention, the waste substrate placed on the net plate is vibrated under heating, and the molten solder and mounting parts are dropped into a water tank and cooled with the dropped mounting parts. A waste substrate characterized by separating copper contained in an implementation component and tin contained in solder by further sieving the solder grains and separating them into mounting parts on the sieve and solder grains under the sieve. It is a processing method.
廃基板は、破砕・切断した電子基板あるいは破砕・切断しない電子基板の何れでもよい。廃基板を載せる網板は、実装部品と溶融したハンダが落下して廃基板が残るように、目開１５mm〜２５mmの網板が好ましい。網板に載せた廃基板をハンダの融点以上に加熱してハンダを溶融させる。具体的には、例えば２３０℃〜２７０℃に加熱してハンダを溶融すると良い。 The waste substrate may be either a crushed / cut electronic substrate or an electronic substrate that is not crushed / cut. The net plate on which the waste substrate is placed is preferably a net plate having a mesh size of 15 mm to 25 mm so that the mounted parts and the molten solder fall and the waste substrate remains. The waste substrate placed on the net plate is heated above the melting point of the solder to melt the solder. Specifically, for example, it is preferable to heat the solder to 230 ° C. to 270 ° C. to melt the solder.
この加熱下で網板を振動して溶融したハンダと実装部品を水槽に落下させる。溶融したハンダが落下しやすいように、振動数２０Hz〜５０Hzおよび振幅１mm以上で網板を振動すると良い。振動数が２０Hzより小さいと溶融したハンダが網板に付着して落下し難い。また振幅が大きいほどハンダが落下しやすく、１mm以上の振幅であれば良い。ハンダが溶融することによって実装部品が基板から離脱し易くなる。 Under this heating, the net plate is vibrated to drop the molten solder and mounting parts into the water tank. It is preferable to vibrate the net plate at a frequency of 20 Hz to 50 Hz and an amplitude of 1 mm or more so that the molten solder can easily fall. If the frequency is less than 20 Hz, the molten solder will adhere to the net plate and will not easily fall. Further, the larger the amplitude, the easier it is for the solder to fall, and the amplitude may be 1 mm or more. The melting of the solder makes it easier for the mounted components to separate from the board.
熔融したハンダと実装部品を水槽に落下させる。溶融したハンダは該水槽に落下して冷却し、ハンダ粒になる。該水槽の実装部品とハンダ粒を分別槽に導き、該分別槽の篩で実装部品とハンダ粒を分離する。実装部品は概ね７mm以上の大きさであり、一方、ハンダ粒は概ね２mm未満のものが多いので、上記分別槽に目開き２mm〜７mmの篩を設け、篩上に実装部品を残し、篩下にハンダ粒を落下させて、実装部品とハンダ粒を分離すると良い。 Drop the molten solder and mounting components into the water tank. The molten solder falls into the water tank and is cooled to become solder particles. The mounting parts and solder grains of the water tank are guided to the sorting tank, and the mounting parts and the solder grains are separated by the sieve of the sorting tank. Since the mounted parts are generally 7 mm or more in size, while the solder grains are often less than 2 mm, a sieve having a mesh size of 2 mm to 7 mm is provided in the sorting tank, and the mounted parts are left on the sieve and under the sieve. It is advisable to drop the solder particles on the sieve to separate the mounted parts and the solder particles.
なお、一般に、目開２mm未満の細かい篩を用いると、実装部品の約９５wt％以上が篩上に残り、ハンダ粒の約５０wt％も篩上に残る。また目開７mm超の粗い篩を用いると、ハンダ粒の約９０wt％以上が篩下に落下し、実装部品の約２０wt％も篩下に落下する。一方、目開２mm〜７mmの篩を用いれば、実装部品の約９５wt％以上は篩上に残り、ハンダ粒の約７０wt％以上は篩下に落下するので、実装部品とハンダ粒を上手く分離することができる。 In general, when a fine sieve having a mesh size of less than 2 mm is used, about 95 wt% or more of the mounted parts remain on the sieve, and about 50 wt% of the solder grains also remain on the sieve. Further, when a coarse sieve having a mesh size of more than 7 mm is used, about 90 wt% or more of the solder grains fall under the sieve, and about 20 wt% of the mounted parts also fall under the sieve. On the other hand, if a sieve with a mesh size of 2 mm to 7 mm is used, about 95 wt% or more of the mounted parts remain on the sieve, and about 70 wt% or more of the solder grains fall under the sieve, so that the mounted parts and the solder grains are separated well. be able to.
廃基板の処理装置
本発明の処理装置は、廃基板を載置する網板、該廃基板を加熱してハンダを溶融する加熱手段、上記網板を振動して実装部品と溶融したハンダを落下させる振動手段、落下した実装部品とハンダを受け入れる水槽、冷却したハンダ粒と実装部品を分別する篩手段を備えることを特徴とする廃基板の処理装置である。
Waste board processing device The processing device of the present invention includes a net plate on which the waste substrate is placed, a heating means for heating the waste substrate to melt the solder, and vibrating the net plate to drop the mounted parts and the molten solder. It is a waste substrate processing device provided with a vibrating means for causing the solder to be generated, a water tank for receiving the dropped mounted parts and solder, and a sieve means for separating the cooled solder particles and the mounted parts.
本発明の処理装置の構成例を図１に示す。図示するように、本発明の処理装置は、筐体１１を備えており、筐体１１の上面には網板１２が設けられている。網板１２には廃基板１３が載置される。網板１２は目開１５mm〜２５mmの網板が好ましい。筐体１１の底部には水槽１４が設けられている。水槽１４には室温以下の水が溜まっている。さらに網板１２の上方には廃基板１３を加熱してハンダを溶融するヒータ１５が設けられている。筐体１１は振動手段である加振機１０によって支持されている。加振機１０によって、例えば振動数２０Hz〜５０Hzおよび振幅１mm以上で筐体１１と一体に網板１２が振動される。
A configuration example of the processing apparatus of the present invention is shown in FIG. As shown in the figure, the processing apparatus of the present invention includes a
網板１２に載置された廃基板１３がヒータ１５によって加熱されてハンダが溶融され、さらに加振機１０によって筐体１１と一体に網板１２が振動されて、実装部品と溶融したハンダが水槽１４に落下される。水槽１４に落下したハンダは水中で冷却されてハンダ粒になる。
The
水槽の落下物（実装部品とハンダ粒）を受け入れる分別槽１６が筐体１１の外側に併設されている。分別槽１６には篩１７が設置されており、分別槽１６および篩１７によって篩手段が形成されている。篩１７は目開２mm〜７mmの篩が好ましい。この目開の篩を用いれば、実装部品の大部分が篩上に残り、ハンダ粒の大部分が篩下に落下するので、実装部品とハンダ粒が上手く分離される。
A sorting
本発明の処理方法ないし処理装置は、廃基板を簡単な工程で多量に処理することができる。また、基板に含まれるハンダ由来のスズの大部分を効率よく実装部品から分離することができるので、回収した実装部品を銅製錬所で再利用するときに、スズの負担が少なく、銅製錬工程内のトラブルを低減することができる。さらに、ハンダの大部分を分離して回収できるので、回収したハンダ粒をリサイクル原料として容易に再利用することができる。例えば、電子基板に含まれる銅の約９９wt％以上を回収することができ、スズの約５０wt％を回収することができる。 The processing method or processing apparatus of the present invention can process a large amount of waste substrate in a simple process. In addition, since most of the solder-derived tin contained in the substrate can be efficiently separated from the mounted parts, the burden on tin is small when the collected mounted parts are reused in the copper smelter, and the copper smelting process is performed. It is possible to reduce the troubles inside. Further, since most of the solder can be separated and recovered, the recovered solder grains can be easily reused as a recycling raw material. For example, about 99 wt% or more of copper contained in an electronic substrate can be recovered, and about 50 wt% of tin can be recovered.
本発明の処理方法の実施例を以下に示す。実施例において、温度はＫ熱電対で測温した。振動数および加速度はＪＩＳ準拠の振動試験機で制御した。残留基板および落下物の組成は各々化学法で定量した。銅とスズの移行率は次式[１][２]に従って求めた。
[銅移行率(％)]＝(各分離物のCu含有量)/(全分離物のCu含有量合計)×100 ・・・[１]
[スズ移行率(％)]＝(各分離物のSn含有量)/(全分離物のSn含有量合計)×100 ・・・[２]
Examples of the processing method of the present invention are shown below. In the examples, the temperature was measured with a K thermocouple. The frequency and acceleration were controlled by a JIS compliant vibration tester. The composition of the residual substrate and the falling material was quantified by a chemical method. The transfer rate of copper and tin was calculated according to the following equations [1] and [2].
[Copper migration rate (%)] = (Cu content of each separated product) / (Total Cu content of all separated products) × 100 ・ ・ ・ [1]
[Tin transfer rate (%)] = (Sn content of each separated product) / (Total Sn content of all separated products) × 100 ・ ・ ・ [2]
〔実施例〕
廃基板を約５０mm×５０mmの試験片に切断し、マッフル炉で１７０℃〜２７０℃に１０分間加熱した。その後、加熱した廃基板を目開き約２０mmの網板に載せ、ハロゲンヒーターで保温しながら、１分間、振動数１０Hz〜３００Hzで振動した。廃基板から分離したものは、網板の下方に設置した室温の水を入れた水槽内に落下させて水冷した。
その後、水槽内の落下物を冷却後に回収し、目開１mm〜１０mmの篩で分級し、篩上と篩下に分別して回収した。
網板上の残留基板、水槽への落下物、篩上と篩下の回収物について、スズと銅の移行率を調べた。この結果を図２、図３、図４、図５に示す。図２は加熱温度と落下物のスズ移行率との関係を示すグラフ、図３は振動数と落下物のスズ移行率との関係を示すグラフ、図４は分級の篩目開と篩下回収物へのスズ移行率の関係を示すグラフ、図５は目開３mmの篩で分級したときの篩上回収物と篩下回収物、および残留基板に含まれる、各金属（金、銀、銅、スズ）の分布率を示すグラフである。なお、スズはハンダの成分であるので、スズの移行率によってハンダの落下状態を把握することができる。銅は実装部品に由来するので、銅の移行率によって実装部品の落下状態を把握することができる。
〔Example〕
The waste substrate was cut into test pieces of about 50 mm × 50 mm and heated to 170 ° C. to 270 ° C. for 10 minutes in a muffle furnace. Then, the heated waste substrate was placed on a net plate having an opening of about 20 mm, and vibrated at a frequency of 10 Hz to 300 Hz for 1 minute while keeping the heat with a halogen heater. The material separated from the waste substrate was dropped into a water tank containing room temperature water installed below the net plate and cooled by water.
Then, the fallen matter in the water tank was collected after cooling, classified by a sieve having a mesh size of 1 mm to 10 mm, and separated and collected on the sieve and under the sieve.
The transfer rate of tin and copper was investigated for the residual substrate on the net plate, the fallen material to the water tank, and the recovered material on and under the sieve. The results are shown in FIGS. 2, 3, 4, and 5. FIG. 2 is a graph showing the relationship between the heating temperature and the tin transfer rate of the falling object, FIG. 3 is a graph showing the relationship between the frequency and the tin transfer rate of the falling object, and FIG. 4 is the sieving of the classification and the recovery under the sieve. A graph showing the relationship between the tin transfer rate to a substance, FIG. 5 shows the recoverable material on the sieve and the recovered material under the sieve when classified with a sieve having a mesh size of 3 mm, and each metal (gold, silver, copper) contained in the residual substrate. , Tin) is a graph showing the distribution rate. Since tin is a component of solder, the falling state of solder can be grasped from the transfer rate of tin. Since copper is derived from the mounted component, the falling state of the mounted component can be grasped from the copper migration rate.
図２および図３に示すように、温度２３０℃〜２７０℃に加熱して、振動数２０Hz〜５０Hzで振動すれば、ハンダ種にかかわらず、ハンダの約５０wt％前後を落下物として回収できる。このうち２５０℃に加熱して２０Hzで振動したときの落下物へのスズの移行率が最も高く、ハンダが最も多く落下している。これは振動数２０Hzのときに廃基板が網板の上で適度に跳ねて網板と衝突して廃基板に衝撃が加わり、熔融状態のスズが良く落下するためであると考えられる。一方、温度が２７０℃以上になると基板が変形・変質してハンダの落下が妨げられるので、落下物へのスズの移行率が低くなる。 As shown in FIGS. 2 and 3, if the product is heated to a temperature of 230 ° C. to 270 ° C. and vibrates at a frequency of 20 Hz to 50 Hz, about 50 wt% of the solder can be recovered as a fallen object regardless of the type of solder. Of these, when heated to 250 ° C. and vibrated at 20 Hz, the transfer rate of tin to falling objects is the highest, and the most solder is dropped. It is considered that this is because the waste substrate appropriately bounces on the net plate at a frequency of 20 Hz and collides with the net plate, an impact is applied to the waste substrate, and the molten tin falls well. On the other hand, when the temperature becomes 270 ° C. or higher, the substrate is deformed and denatured to prevent the solder from falling, so that the transfer rate of tin to the falling object becomes low.
廃基板の加熱振動では、実装部品の一部も落下物になることが多々ある。しかし、図４に示すように、水槽から回収した落下物を目開２mm〜７mmの篩で分級すれば、篩下回収物への銅の移行率は殆ど零であり、約９５wt％以上の銅が実装部品に含まれて篩上に残る。一方、上記目開の範囲では、ハンダ粒の大部分が篩下に落下してスズの約７０wt％以上が篩下回収物に移行するので、銅とスズを分離して回収することができる。このうち、目開３mmの篩を用いれば、スズの約９０wt％以上を篩下回収物に移行させることができ、実装部品は殆ど落下せず、篩下回収物への銅の移行率は１wt％以下であるので、スズと銅を精度よく分離することができる。 Due to the heating vibration of the waste substrate, some of the mounted parts often become falling objects. However, as shown in FIG. 4, when the fallen material collected from the water tank is classified by a sieve having a mesh size of 2 mm to 7 mm, the transfer rate of copper to the collected material under the sieve is almost zero, and about 95 wt% or more of copper is used. Is contained in the mounted component and remains on the sieve. On the other hand, in the above-mentioned range of opening, most of the solder grains fall under the sieve and about 70 wt% or more of tin is transferred to the recovered product under the sieve, so that copper and tin can be recovered separately. Of these, if a sieve with a mesh opening of 3 mm is used, about 90 wt% or more of tin can be transferred to the subsieved material, the mounted parts hardly fall, and the transfer rate of copper to the subsieved material is 1 wt. Since it is less than%, tin and copper can be separated accurately.
上記加熱振動処理後の残留基板および分級処理後の篩上回収物と篩下回収物に含まれる金、銀、銅、およびスズの分布率を図５に示す。図示するように、金のほぼ全量と銀の約９５wt％は残留基板に含まれている。銅については、約７０wt％が残留基板に含まれており、篩上回収物に約２９wt％含まれ、篩下回収物に含まれる銅は約１wt％未満である。一方、スズの約４５wt％は篩下回収物（ハンダ粒）に含まれ、約５５wt％は残留基板に含まれているが、篩上回収物（主に実装部品）に含まれるスズは約１wt％程度であり、ハンダ粒と実装部品に分離回収することによって、スズ混入量が極めて少ない銅含有実装部品を回収することができる。 FIG. 5 shows the distribution rates of gold, silver, copper, and tin contained in the residual substrate after the heat vibration treatment and the collected material on the sieve and the collected material under the sieve after the classification treatment. As shown, almost all of the gold and about 95 wt% of silver are contained in the residual substrate. About 70 wt% of copper is contained in the residual substrate, about 29 wt% is contained in the collected material on the sieve, and about 1 wt% of copper is contained in the collected material under the sieve. On the other hand, about 45 wt% of tin is contained in the collected material under the sieve (solder grains), and about 55 wt% is contained in the residual substrate, but about 1 wt% of tin contained in the collected material on the sieve (mainly mounted parts) is contained. By separating and recovering the solder particles and the mounting component, the copper-containing mounting component having an extremely small amount of tin mixed can be recovered.
１０−加振機、１１−筐体、１２−網板、１３−廃基板、１４−水槽、１５−ヒーター、１６−分別槽、１７−篩、１８−篩上回収物(実装部品)、１９−篩下回収物(ハンダ粒)。
10-vibrator, 11-housing, 12-net board, 13-waste substrate, 14-water tank, 15-heater, 16-separation tank, 17-sieve, 18-soldering material (mounting parts), 19 -Recovered material under the sieve (solder grains).
Claims (5)
A housing supported by a vibrating machine is provided, a net plate is provided on the upper surface of the housing, a cooling tank is provided on the bottom of the housing, and a heater is provided above the net plate. Is provided, the waste electronic board placed on the net plate is heated by the heater to melt the solder, and the housing is vibrated by the vibration exciter to vibrate the mounted parts and the melted solder in the cooling tank. There is a sorting tank that receives the dropped objects in the cooling tank, and a sieve is installed in the sorting tank. The mounted parts of the falling objects remain on the sieve, and the solder particles fall under the sieve. The waste electronic substrate processing apparatus according to claim 4, wherein the waste electronic substrate is separated.
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| JPH10107426A (en) * | 1996-09-26 | 1998-04-24 | Matsushita Electric Ind Co Ltd | Method and device for processing printed wiring board |
| JP2013230437A (en) * | 2012-04-27 | 2013-11-14 | Astec Irie Co Ltd | Method for processing printed circuit board |
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| JPH10107426A (en) * | 1996-09-26 | 1998-04-24 | Matsushita Electric Ind Co Ltd | Method and device for processing printed wiring board |
| JP2013230437A (en) * | 2012-04-27 | 2013-11-14 | Astec Irie Co Ltd | Method for processing printed circuit board |
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| CN113909263A (en) * | 2021-11-12 | 2022-01-11 | 江苏荣麒循环科技有限公司 | Energy-saving and environment-friendly efficient recovery processing device for waste LED chips |
| CN113909263B (en) * | 2021-11-12 | 2022-10-28 | 江苏荣麒循环科技有限公司 | Energy-concerving and environment-protective high-efficient recovery processing device with useless LED chip |
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