WO2007055433A1 - Method for manufacturing intenna and intenna manufactured by the same - Google Patents

Method for manufacturing intenna and intenna manufactured by the same Download PDF

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Publication number
WO2007055433A1
WO2007055433A1 PCT/KR2005/003859 KR2005003859W WO2007055433A1 WO 2007055433 A1 WO2007055433 A1 WO 2007055433A1 KR 2005003859 W KR2005003859 W KR 2005003859W WO 2007055433 A1 WO2007055433 A1 WO 2007055433A1
Authority
WO
WIPO (PCT)
Prior art keywords
intenna
base
pattern portion
recessed pattern
manufacturing
Prior art date
Application number
PCT/KR2005/003859
Other languages
French (fr)
Inventor
Eung-Soon Chang
Original Assignee
Eung-Soon Chang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050107597A external-priority patent/KR100654230B1/en
Application filed by Eung-Soon Chang filed Critical Eung-Soon Chang
Publication of WO2007055433A1 publication Critical patent/WO2007055433A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/40—Element having extended radiating surface

Definitions

  • the present invention relates to a method for manufacturing an intenna and an structure of the intenna, and more particularly, to a method for manufacturing an intenna, which manufactures the intenna by forming a groove of a desired intenna shape on the surface of synthetic resin material and performing metal plating advantageous for wireless reception along the groove, rather than separately making a metal part of the intenna and assembling them.
  • Background Art
  • an intenna is an embedded antenna as shown in FlG. 1, which refers to a device mounted inside of a wireless application, unlike an antenna mounted outside of a wireless application, and reduces the overall volume of the wireless application to make it slimmer.
  • the intenna is a folded monopole intenna for sending and receiving a radio signal by supplementing a folded monopole antenna mounted on a wireless application.
  • Such intenna is known to drastically improve the quality of sending and receiving a radio signal by decreasing the impedance to a specific resistance level of metal by realizing an intenna pattern consisting of a feeding point structure proceeding upward so as to form a value L and an offset point structure located in parallel at a position adjacent to the feeding point structure to form a value C.
  • the conventional intennas are disadvantageous in that the assembly work is difficult and the error rate is high because an impedance transformer and an amplifier that are used along with the intenna are configured separately and provided at the main body side. Disclosure of Invention Technical Problem
  • an object of the present invention to provide an intenna which is convenient to manufacture, easy to mass produce, cheap and useable for every model and thus has a high compatibility by manufacturing the intenna in such a manner that a base material is formed from synthetic resin material containing a photosensitizer type additive, a recessed pattern portion is formed on the base material along a desired intenna shape by a laser processing technique and the recessed pattern portion is plated with metal capable of functioning as the intenna by a plating technique.
  • a method for manufacturing an intenna in accordance with the present invention comprising the steps of: making a base of a desired shape from synthetic resin material containing a photosensitive additive erasable upon exposure to light; forming a recessed pattern portion of a desired shape as the photosensitive additive is erased by irradiating a laser light on the surface of the base prepared by the base making step; and processing the laser- processed base by an electroless plating technique so that a metal alloy plating layer functioning as an intenna can be deposited on the photosensitive layer-erased recessed pattern portion.
  • the intenna is provided with a metal alloy plating layer which is manufactured by the above manufacturing method and deposited on the recessed pattern portion prepared on the surface of the base of synthetic resin material by a plating technique.
  • the base has an impedance transformer at a position not overlapping with the plating layer formed along the recessed pattern portion.
  • the base has an amplifier at a position not overlapping with the plating layer formed along the recessed pattern portion.
  • FlG. 1 is an exemplary view showing a use state of a conventional intenna
  • FlG. 2 is an exemplary view showing the conventional intenna
  • FlG. 3 is an exemplary view showing an intenna in accordance with the present invention
  • FlG. 4 is a cross sectional view showing a structure of the intenna in accordance with the present invention
  • FlG. 5 is an another exemplary view showing an intenna in accordance with the present invention
  • FlG. 6 is a process chart showing a method for manufacturing the intenna in accordance with the present invention.
  • a manufactured intenna of the present invention comprises a base 10 of synthetic resin material and a plating layer 12 deposited on a recessed pattern portion 11 prepared on the surface of the base by a plating technique.
  • the intenna is manufactured by laser processing the recessed pattern portion 11 on the base 10 of synthetic resin material and then laminating the plating layer 12, rather than making an intenna from a particular metal material and attaching it.
  • Such a structural characteristic enables to form an intenna as far as to the upper surface or side surface of the base 10, and makes it easier to manufacture an intenna even in such a shape to be freely bendable along the profile of the base.
  • the intenna of the present invention has enhanced mass productivity because the step of separately manufacturing and assembling as in a prior art metal intenna is omitted, superior competitiveness because the production cost can be reduced, and improved compatibility since the intenna of the present invention is usable to every cell phones of various types if the shape of the base material is made consistent.
  • the productivity can be improved and the error rate can be decreased.
  • a base making step, a laser processing step, a plating processing step and a finish processing step are sequentially performed, starting from a material preparation step.
  • the aforementioned material preparation step is a process of making a base material.
  • the material to be used in the present invention is a synthetic resin material containing a photosensitive additive erasable upon exposure to light, which is widely used in various fields and available by purchase.
  • the above material can be manufactured in a desired size and shape by an injection molding method as if a conventional synthetic resin material is injection molded.
  • a base 10 having a desired shape is made from synthetic resin material containing a photosensitive additive erasable upon exposure to light.
  • a mounting groove 13 for an impedance transformer 20 and an amplifier 30 may be prepared simultaneously.
  • a recessed pattern portion 11 is formed on the base 10 by the aforementioned laser processing technique.
  • the recessed pattern portion 11 may be designed in various shapes. As an example, it may have the shape as shown in FlG. 2.
  • the shape of the recessed pattern portion 11 thus-designed is computer programmed and stored in a laser irradiator (not shown), and then can be processed by automatically irradiating it on the base 10 designed so as to be continually and automatically fed.
  • the recessed pattern portion 11 may be formed along the designed pattern shape.
  • an alloy plating layer 12 is deposited on the recessed pattern portion 11 by plating the material on which the recessed pattern portion 11 is formed with the electroless plating technique.
  • This electroless plating technique is a method suitable for parts intended for synthetic resin material that electric current cannot pass through, and is a well known technique.
  • the above plating material includes metals such as copper, nickel, gold, etc. that can function enough as an intenna.
  • the impedance transformer 20 and the amplifier 30 are integrally assembled. Next, the parts are finished through a usual finish processing step, a defective unit pickup step and so on. [44]
  • the present invention thus constructed is advantageous in that the intenna is convenient to manufacture, easy to mass produce, cheap and useable to every cell phones of various types and thus has a high compatibility as compared to the prior art method of assembling a separate metal intenna, because the intenna is manufactured in such a manner that a base material is formed from synthetic resin material containing a photosensitizer type additive, a recessed pattern portion is formed on the base material along a desired intenna shape by a laser processing technique and the recessed pattern portion is plated with metal capable of functioning as the intenna by a plating technique.
  • the productivity is improved and the error rate is lowered as the intenna can be made in a module by including an impedance transformer and an amplifier when configuring the intenna by the electroless plating technique.

Abstract

A method for manufacturing an intenna and a structure of the intenna are disclosed. The method for manufacturing an intenna comprises: a base making step of making a base of a desired shape from synthetic resin material containing a photosensitive additive erasable upon exposure to light; a laser processing step of forming a recessed pattern portion of a desired shape as the photosensitive additive is erased by irradiating a laser light on the surface of the based prepared by the base making step; and a plating processing step of processing the laser-processed base by an electroless plating technique so that a metal alloy plating layer functioning as an intenna can be deposited on the photosensitive layer-erased recessed pattern portion.

Description

Description
METHOD FOR MANUFACTURING INTENNA AND INTENNA MANUFACTURED BY THE SAME
Technical Field
[1] The present invention relates to a method for manufacturing an intenna and an structure of the intenna, and more particularly, to a method for manufacturing an intenna, which manufactures the intenna by forming a groove of a desired intenna shape on the surface of synthetic resin material and performing metal plating advantageous for wireless reception along the groove, rather than separately making a metal part of the intenna and assembling them. Background Art
[2] In general, an intenna is an embedded antenna as shown in FlG. 1, which refers to a device mounted inside of a wireless application, unlike an antenna mounted outside of a wireless application, and reduces the overall volume of the wireless application to make it slimmer.
[3] That is, the intenna is a folded monopole intenna for sending and receiving a radio signal by supplementing a folded monopole antenna mounted on a wireless application.
[4] Such intenna is known to drastically improve the quality of sending and receiving a radio signal by decreasing the impedance to a specific resistance level of metal by realizing an intenna pattern consisting of a feeding point structure proceeding upward so as to form a value L and an offset point structure located in parallel at a position adjacent to the feeding point structure to form a value C.
[5] However, conventional intennas have rarely developed for use in mounting on slim shape-oriented wireless applications, such as cell phones, especially, almost nothing has been developed for use in CDMA frequency type or PCS frequency type, which have been recognized as an obstacle to the trend toward development of small size- oriented cell phones.
[6] Recently, those made slim according to the aforementioned small-size cell phones have been developed as shown in FlG. 2, but they are disadvantageous in that the productivity is low and the price is high.
[7] Moreover, the conventional intennas are disadvantageous in that the assembly work is difficult and the error rate is high because an impedance transformer and an amplifier that are used along with the intenna are configured separately and provided at the main body side. Disclosure of Invention Technical Problem
[8] Accordingly, it is an object of the present invention to provide an intenna which is convenient to manufacture, easy to mass produce, cheap and useable for every model and thus has a high compatibility by manufacturing the intenna in such a manner that a base material is formed from synthetic resin material containing a photosensitizer type additive, a recessed pattern portion is formed on the base material along a desired intenna shape by a laser processing technique and the recessed pattern portion is plated with metal capable of functioning as the intenna by a plating technique.
[9] It is another object of the present invention to make an intenna in a module by including an impedance transformer and an amplifier when configuring the intenna by the electroless plating technique as set forth. Technical Solution
[10] To achieve the above object, there is provided a method for manufacturing an intenna in accordance with the present invention, comprising the steps of: making a base of a desired shape from synthetic resin material containing a photosensitive additive erasable upon exposure to light; forming a recessed pattern portion of a desired shape as the photosensitive additive is erased by irradiating a laser light on the surface of the base prepared by the base making step; and processing the laser- processed base by an electroless plating technique so that a metal alloy plating layer functioning as an intenna can be deposited on the photosensitive layer-erased recessed pattern portion.
[11] Preferably, the intenna is provided with a metal alloy plating layer which is manufactured by the above manufacturing method and deposited on the recessed pattern portion prepared on the surface of the base of synthetic resin material by a plating technique.
[12] Preferably, the base has an impedance transformer at a position not overlapping with the plating layer formed along the recessed pattern portion.
[13] Preferably, the base has an amplifier at a position not overlapping with the plating layer formed along the recessed pattern portion.
[14]
Brief Description of the Drawings
[15] These and other features, aspects, and advantages of preferred embodiments of the present invention will be more fully described in the following detailed description, taken accompanying drawings. In the drawings:
[16] FlG. 1 is an exemplary view showing a use state of a conventional intenna;
[17] FlG. 2 is an exemplary view showing the conventional intenna;
[18] FlG. 3 is an exemplary view showing an intenna in accordance with the present invention; [19] FlG. 4 is a cross sectional view showing a structure of the intenna in accordance with the present invention; [20] FlG. 5 is an another exemplary view showing an intenna in accordance with the present invention; and [21] FlG. 6 is a process chart showing a method for manufacturing the intenna in accordance with the present invention.
Best Mode for Carrying Out the Invention [22] Hereinafter, the construction and operation of the present invention will be described in detail with reference to the accompanying drawings. [23] FlG. 3 is an exemplary view showing an intenna in accordance with the present invention. FlG. 4 is a cross sectional view showing a structure of the intenna in accordance with the present invention. [24] First, as shown in the drawings, a manufactured intenna of the present invention comprises a base 10 of synthetic resin material and a plating layer 12 deposited on a recessed pattern portion 11 prepared on the surface of the base by a plating technique. [25] According to a method of the present invention, the intenna is manufactured by laser processing the recessed pattern portion 11 on the base 10 of synthetic resin material and then laminating the plating layer 12, rather than making an intenna from a particular metal material and attaching it. [26] Such a structural characteristic enables to form an intenna as far as to the upper surface or side surface of the base 10, and makes it easier to manufacture an intenna even in such a shape to be freely bendable along the profile of the base. [27] It is preferable to prepare and use a signal connection portion S and a ground connection portion G as the intenna on the plating layer 12. [28] Moreover, the intenna of the present invention has enhanced mass productivity because the step of separately manufacturing and assembling as in a prior art metal intenna is omitted, superior competitiveness because the production cost can be reduced, and improved compatibility since the intenna of the present invention is usable to every cell phones of various types if the shape of the base material is made consistent. [29] In particular, in a case where the intenna is made in a module by preparing a mounting groove 13 at a certain part of the base 10 and an impedance transformer 20 and an amplifier 30 at the mounting groove 13, the productivity can be improved and the error rate can be decreased.
[30] Next, the manufacturing method of the present invention will be described.
[31] First, in the present invention, as shown in FlG. 5, a base making step, a laser processing step, a plating processing step and a finish processing step are sequentially performed, starting from a material preparation step. [32] The aforementioned material preparation step is a process of making a base material. The material to be used in the present invention is a synthetic resin material containing a photosensitive additive erasable upon exposure to light, which is widely used in various fields and available by purchase. [33] The above material can be manufactured in a desired size and shape by an injection molding method as if a conventional synthetic resin material is injection molded. [34] That is, a base 10 having a desired shape is made from synthetic resin material containing a photosensitive additive erasable upon exposure to light. [35] At this point, a mounting groove 13 for an impedance transformer 20 and an amplifier 30 may be prepared simultaneously. [36] Next, a recessed pattern portion 11 is formed on the base 10 by the aforementioned laser processing technique. [37] The recessed pattern portion 11 may be designed in various shapes. As an example, it may have the shape as shown in FlG. 2. [38] The shape of the recessed pattern portion 11 thus-designed is computer programmed and stored in a laser irradiator (not shown), and then can be processed by automatically irradiating it on the base 10 designed so as to be continually and automatically fed. [39] Because the photosensitive additive part contained in the synthetic resin material is erased by the laser irradiation, the recessed pattern portion 11 may be formed along the designed pattern shape. [40] Next, an alloy plating layer 12 is deposited on the recessed pattern portion 11 by plating the material on which the recessed pattern portion 11 is formed with the electroless plating technique. [41] This electroless plating technique is a method suitable for parts intended for synthetic resin material that electric current cannot pass through, and is a well known technique. [42] Further, the above plating material includes metals such as copper, nickel, gold, etc. that can function enough as an intenna. [43] After the plating process, the impedance transformer 20 and the amplifier 30 are integrally assembled. Next, the parts are finished through a usual finish processing step, a defective unit pickup step and so on. [44]
Industrial Applicability [45] The present invention thus constructed is advantageous in that the intenna is convenient to manufacture, easy to mass produce, cheap and useable to every cell phones of various types and thus has a high compatibility as compared to the prior art method of assembling a separate metal intenna, because the intenna is manufactured in such a manner that a base material is formed from synthetic resin material containing a photosensitizer type additive, a recessed pattern portion is formed on the base material along a desired intenna shape by a laser processing technique and the recessed pattern portion is plated with metal capable of functioning as the intenna by a plating technique.
[46] In particular, the productivity is improved and the error rate is lowered as the intenna can be made in a module by including an impedance transformer and an amplifier when configuring the intenna by the electroless plating technique.
[47] Although the present invention has been described in connection with the exemplary embodiments illustrated in the drawings, it is only illustrative. It will be understood by those skilled in the art that various modifications and equivalents can be made to the present invention. Therefore, the true technical scope of the present invention should be defined by the appended claims.
[48]

Claims

Claims
[1] A method for manufacturing an intenna, comprising the steps of: making a base of a desired shape from synthetic resin material containing a photosensitive additive erasable upon exposure to light; forming a recessed pattern portion of a desired shape as the photosensitive additive is erased by irradiating a laser light on the surface of the based prepared by the base making step; and processing the laser-processed base by an electroless plating technique so that a metal alloy plating layer functioning as an intenna can be deposited on the photosensitive layer-erased recessed pattern portion.
[2] An intenna including a metal alloy plating layer which is manufactured by the manufacturing method of claim 1 and deposited on the recessed pattern portion prepared on the surface of the base of synthetic resin material by a plating technique.
[3] The intenna of claim 1, wherein the base is provided with an impedance transformer at a position not overlapping with the plating layer formed along the recessed pattern portion.
[4] The intenna of claim 1, wherein the base is provided with an amplifier at a position not overlapping with the plating layer formed along the recessed pattern portion.
PCT/KR2005/003859 2005-11-10 2005-11-15 Method for manufacturing intenna and intenna manufactured by the same WO2007055433A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2005-0107597 2005-11-10
KR1020050107597A KR100654230B1 (en) 2005-11-01 2005-11-10 Intenna and the producing method for intenna

Publications (1)

Publication Number Publication Date
WO2007055433A1 true WO2007055433A1 (en) 2007-05-18

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Country Status (1)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167330A (en) * 1991-12-13 1993-07-02 Matsushita Electric Works Ltd Manufacture of antenna for mobile object communication
US6400323B2 (en) * 2000-06-23 2002-06-04 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
US20030024103A1 (en) * 2001-08-03 2003-02-06 Seiko Epson Corporation Method and apparatus for making devices
KR20040003514A (en) * 2002-07-03 2004-01-13 미창테크 주식회사 A method for making a laminated pattern antenna

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167330A (en) * 1991-12-13 1993-07-02 Matsushita Electric Works Ltd Manufacture of antenna for mobile object communication
US6400323B2 (en) * 2000-06-23 2002-06-04 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
US20030024103A1 (en) * 2001-08-03 2003-02-06 Seiko Epson Corporation Method and apparatus for making devices
KR20040003514A (en) * 2002-07-03 2004-01-13 미창테크 주식회사 A method for making a laminated pattern antenna

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