CN104275561A - Environment-friendly lead-free soldering-aiding paste - Google Patents
Environment-friendly lead-free soldering-aiding paste Download PDFInfo
- Publication number
- CN104275561A CN104275561A CN201410475538.8A CN201410475538A CN104275561A CN 104275561 A CN104275561 A CN 104275561A CN 201410475538 A CN201410475538 A CN 201410475538A CN 104275561 A CN104275561 A CN 104275561A
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- CN
- China
- Prior art keywords
- parts
- environment
- aiding
- paste
- diethylene glycol
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Abstract
The invention discloses an environment-friendly lead-free soldering-aiding paste. The environment-friendly lead-free soldering-aiding paste is characterized by comprising the following raw materials in parts by weight: 60 to 70 parts of tin, 2 to 3 parts of silver, 0.2 to 0.8 parts of copper, 0.1 to 0.3 parts of magnesium, 2 to 4 parts of dehydrogenated rosin, 0.2 to 0.5 parts of hexadecyl pyridine bromide generation, 2 to 4 parts of sebacic acid, 2 to 3 parts of ethylenediamine, 2 to 4 parts of diethylene glycol monobutyl ether, 3 to 5 parts of ethylene glycol monoethyl ether, 0.2 to 0.8 parts of bis-stearamide, 0.2 to 0.6 parts of BHT (butylated hydroxytoluene) and 0.2 to 0.6 parts of 2,3-dibromo propanol. The environment-friendly lead-free soldering-aiding paste does not contain lead, is high in weldability, low in solid content, and few in residual materials after welding, is not required to be cleaned, and is excellent in performance, the defects of the current flux can be overcome, and the requirement on environment protection is also met by the utilization of the environment-friendly lead-free soldering-aiding paste.
Description
Technical field
The present invention relates to metal solder field, be specifically related to a kind of environment-friendly type lead-free weld-aiding cream.
Background technology
Scaling powder can remove oxide in the process of welding, reduces soldered material surface tension, is widely used in the welding of horological instruments, precise part, medicine equipment, mobile communication, digital product and all kinds of pcb board and BGA tin ball.
Weld-aiding cream appears at the surface mounting technology (SurfaceMountAssembly of 20 century 70s, be called for short SMT), refer to printing, applying solder paste on printed circuit board pad, and Surface Mount Component is placed with accurately scribbles on the pad of solder(ing) paste, according to specific reflux temperature curve heater circuit plate, allow solder(ing) paste melt, between components and parts with printed circuit board, form solder joint after its alloying component cooled and solidified and realize the metallurgical technology be connected.Solder(ing) paste is a kind of Novel welding material arisen at the historic moment along with SMT.Solder(ing) paste is a complicated system, is to be mixed by solder powder, scaling powder and other additive, the creaminess mixture of formation.Solder(ing) paste has certain vigorous degree at normal temperatures, can be bonded at commitment positions by the beginning of electronic devices and components, under welding temperature, along with the volatilization of solvent and portions additive, welded components and parts is formed permanent connection together with printed circuit pad solder.Existing weld-aiding cream also has plumbous grade for heavy metal mostly, and inadequate environmental protection, easily pollutes.Now study a kind of environment-friendly type lead-free weld-aiding cream, environment-friendly high-efficiency, improve the fastness of welding.
Summary of the invention
For the problems referred to above, the invention provides a kind of environment-friendly type lead-free weld-aiding cream, environment friendly and pollution-free, improve the fastness of welding.
In order to solve the problem, technical scheme provided by the invention is:
A kind of environment-friendly type lead-free weld-aiding cream, is characterized in that: comprise following raw material: tin 60-70 part, silver-colored 2-3 part, copper 0.2-0.8 part, magnesium 0.1-0.3 part, dehydrogenated rosin 2-4 part, Cetyl bromo-pyridine 0.2-0.5 part, SA 2-4 part, ethylenediamine 2-3 part, diethylene glycol monobutyl ether 2-4 part, diethylene glycol monohexyl ether 3-5 part, two stearic amide 0.2-0.8 part, BHT0.2-0.6 part, 2,3 one dibromo-propanol 0.2-0.6 parts.
Preferably, described each raw material is: tin 62-68 part, silver-colored 2.2-2.8 part, copper 0.4-0.6 part, magnesium 0.15-0.25 part, dehydrogenated rosin 2.5-3.5 part, Cetyl bromo-pyridine 0.25-0.45 part, SA 2.5-3.5 part, ethylenediamine 2.2-2.8 part, diethylene glycol monobutyl ether 2.5-3.5 part, diethylene glycol monohexyl ether 3.5-4.5 part, two stearic amide 0.4-0.6 part, BHT0.3-0.5 part, 2,3 one dibromo-propanol 0.3-0.5 parts.
Preferably, described each raw material is: 65 parts, tin, silver 2.5 parts, copper 0.5 part, 0.2 part, magnesium, dehydrogenated rosin 3 parts, Cetyl bromo-pyridine 0.35 part, SA 3 parts, ethylenediamine 2.5 parts, diethylene glycol monobutyl ether 3 parts, diethylene glycol monohexyl ether 4 parts, two stearic amide 0.5 part, BHT0.4 part, 2,3 one dibromo-propanols 0.4 part.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Detailed description of the invention
The present invention will be further described below:
Embodiment one:
A kind of environment-friendly type lead-free weld-aiding cream, is characterized in that: comprise following raw material: 60 parts, tin, silver 2 parts, copper 0.2 part, 0.1 part, magnesium, dehydrogenated rosin 2 parts, Cetyl bromo-pyridine 0.2 part, SA 2 parts, ethylenediamine 2 parts, diethylene glycol monobutyl ether 2 parts, diethylene glycol monohexyl ether 3 parts, two stearic amide 0.2 part, BHT0.2 part, 2,3 one dibromo-propanols 0.2 part.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Embodiment two:
A kind of environment-friendly type lead-free weld-aiding cream, is characterized in that: comprise following raw material: 70 parts, tin, silver 3 parts, copper 0.8 part, 0.3 part, magnesium, dehydrogenated rosin 4 parts, Cetyl bromo-pyridine 0.5 part, SA 4 parts, ethylenediamine 3 parts, diethylene glycol monobutyl ether 4 parts, diethylene glycol monohexyl ether 5 parts, two stearic amide 0.8 part, BHT0.6 part, 2,3 one dibromo-propanols 0.6 part.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Embodiment three:
A kind of environment-friendly type lead-free weld-aiding cream, is characterized in that: comprise following raw material: 65 parts, tin, silver 2.5 parts, copper 0.5 part, 0.2 part, magnesium, dehydrogenated rosin 3 parts, Cetyl bromo-pyridine 0.35 part, SA 3 parts, ethylenediamine 2.5 parts, diethylene glycol monobutyl ether 3 parts, diethylene glycol monohexyl ether 4 parts, two stearic amide 0.5 part, BHT0.4 part, 2,3 one dibromo-propanols 0.4 part.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Embodiment four:
A kind of environment-friendly type lead-free weld-aiding cream, is characterized in that: comprise following raw material: 62 parts, tin, silver 2.2 parts, copper 0.4 part, 0.15 part, magnesium, dehydrogenated rosin 2.5 parts, Cetyl bromo-pyridine 0.25 part, SA 2.5 parts, ethylenediamine 2.2 parts, diethylene glycol monobutyl ether 2.5 parts, diethylene glycol monohexyl ether 3.5 parts, two stearic amide 0.4 part, BHT0.3 part, 2,3 one dibromo-propanols 0.3 part.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
Embodiment five:
A kind of environment-friendly type lead-free weld-aiding cream, is characterized in that: comprise following raw material: 68 parts, tin, silver 2.8 parts, copper 0.6 part, 0.25 part, magnesium, dehydrogenated rosin 3.5 parts, Cetyl bromo-pyridine 0.45 part, SA 3.5 parts, ethylenediamine 2.8 parts, diethylene glycol monobutyl ether 3.5 parts, diethylene glycol monohexyl ether 4.5 parts, two stearic amide 0.6 part, BHT0.5 part, 2,3 one dibromo-propanols 0.5 part.
Beneficial effect of the present invention is: the present invention is not leaded, and solderability is good, and solids content is low, and postwelding residue is few, need not clean.Function admirable of the present invention, and the shortcoming that can overcome existing scaling powder, it uses the requirement also more meeting environmental protection.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (3)
1. an environment-friendly type lead-free weld-aiding cream, is characterized in that: comprise following raw material: tin 60-70 part, silver-colored 2-3 part, copper 0.2-0.8 part, magnesium 0.1-0.3 part, dehydrogenated rosin 2-4 part, Cetyl bromo-pyridine 0.2-0.5 part, SA 2-4 part, ethylenediamine 2-3 part, diethylene glycol monobutyl ether 2-4 part, diethylene glycol monohexyl ether 3-5 part, two stearic amide 0.2-0.8 part, BHT0.2-0.6 part, 2,3 one dibromo-propanol 0.2-0.6 parts.
2. environment-friendly type lead-free weld-aiding cream according to claim 1, it is characterized in that: described each raw material is: tin 62-68 part, silver 2.2-2.8 part, copper 0.4-0.6 part, magnesium 0.15-0.25 part, dehydrogenated rosin 2.5-3.5 part, Cetyl bromo-pyridine 0.25-0.45 part, SA 2.5-3.5 part, ethylenediamine 2.2-2.8 part, diethylene glycol monobutyl ether 2.5-3.5 part, diethylene glycol monohexyl ether 3.5-4.5 part, two stearic amide 0.4-0.6 part, BHT0.3-0.5 part, 2,3 one dibromo-propanol 0.3-0.5 parts.
3. environment-friendly type lead-free weld-aiding cream according to claim 1 and 2, is characterized in that: described each raw material is: 65 parts, tin, silver 2.5 parts, copper 0.5 part, 0.2 part, magnesium, dehydrogenated rosin 3 parts, Cetyl bromo-pyridine 0.35 part, SA 3 parts, ethylenediamine 2.5 parts, diethylene glycol monobutyl ether 3 parts, diethylene glycol monohexyl ether 4 parts, two stearic amide 0.5 part, BHT0.4 part, 2,3 one dibromo-propanols 0.4 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410475538.8A CN104275561A (en) | 2014-09-17 | 2014-09-17 | Environment-friendly lead-free soldering-aiding paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410475538.8A CN104275561A (en) | 2014-09-17 | 2014-09-17 | Environment-friendly lead-free soldering-aiding paste |
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| Publication Number | Publication Date |
|---|---|
| CN104275561A true CN104275561A (en) | 2015-01-14 |
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|---|---|---|---|
| CN201410475538.8A Pending CN104275561A (en) | 2014-09-17 | 2014-09-17 | Environment-friendly lead-free soldering-aiding paste |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007023288A2 (en) * | 2005-08-24 | 2007-03-01 | Fry's Metals Inc. | Solder alloy |
| CN101143407A (en) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | Soldering paste and its preparation method |
| CN101462209A (en) * | 2009-01-16 | 2009-06-24 | 深圳市唯特偶化工开发实业有限公司 | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste |
| CN102000927A (en) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | Lead-free soldering paste |
| CN103302421A (en) * | 2013-06-24 | 2013-09-18 | 无锡市彩云机械设备有限公司 | No-clean soldering flux and tinol thereof |
-
2014
- 2014-09-17 CN CN201410475538.8A patent/CN104275561A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007023288A2 (en) * | 2005-08-24 | 2007-03-01 | Fry's Metals Inc. | Solder alloy |
| CN101143407A (en) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | Soldering paste and its preparation method |
| CN101462209A (en) * | 2009-01-16 | 2009-06-24 | 深圳市唯特偶化工开发实业有限公司 | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste |
| CN102000927A (en) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | Lead-free soldering paste |
| CN103302421A (en) * | 2013-06-24 | 2013-09-18 | 无锡市彩云机械设备有限公司 | No-clean soldering flux and tinol thereof |
Non-Patent Citations (1)
| Title |
|---|
| 陈工: "无铅焊锡助焊膏配方分析", 《HTTP://WWW.HECHUANCHEM.COM/PRODUCTVIEW.ASP?ID=90》 * |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150114 |
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| RJ01 | Rejection of invention patent application after publication |