WO2006133956A3 - Removal of thin structured polymer layers by means of atmospheric plasma - Google Patents

Removal of thin structured polymer layers by means of atmospheric plasma Download PDF

Info

Publication number
WO2006133956A3
WO2006133956A3 PCT/EP2006/005801 EP2006005801W WO2006133956A3 WO 2006133956 A3 WO2006133956 A3 WO 2006133956A3 EP 2006005801 W EP2006005801 W EP 2006005801W WO 2006133956 A3 WO2006133956 A3 WO 2006133956A3
Authority
WO
WIPO (PCT)
Prior art keywords
removal
polymer layers
atmospheric plasma
structured polymer
thin structured
Prior art date
Application number
PCT/EP2006/005801
Other languages
German (de)
French (fr)
Other versions
WO2006133956A2 (en
Inventor
Markus Gabriel
Sven Hansen
Hans-Georg Kapitza
Original Assignee
Suss Microtec Lithography Gmbh
Markus Gabriel
Sven Hansen
Hans-Georg Kapitza
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh, Markus Gabriel, Sven Hansen, Hans-Georg Kapitza filed Critical Suss Microtec Lithography Gmbh
Publication of WO2006133956A2 publication Critical patent/WO2006133956A2/en
Publication of WO2006133956A3 publication Critical patent/WO2006133956A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Drying Of Semiconductors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention relates to methods for forming a structure in a resist layer that is applied to a substrate by means of an imprint lithography process. According to said methods, the layer that remains in the valleys of the structure after stamping and curing the resist layer is removed under the effect of plasma at atmospheric pressure.
PCT/EP2006/005801 2005-06-16 2006-06-16 Removal of thin structured polymer layers by means of atmospheric plasma WO2006133956A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102005027948 2005-06-16
DE102005027948.1 2005-06-16
DE102005045331.7 2005-09-22
DE102005045331A DE102005045331A1 (en) 2005-06-16 2005-09-22 Removal of thin structured polymer layers by atmospheric plasma

Publications (2)

Publication Number Publication Date
WO2006133956A2 WO2006133956A2 (en) 2006-12-21
WO2006133956A3 true WO2006133956A3 (en) 2007-07-26

Family

ID=37309350

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/005801 WO2006133956A2 (en) 2005-06-16 2006-06-16 Removal of thin structured polymer layers by means of atmospheric plasma

Country Status (2)

Country Link
DE (1) DE102005045331A1 (en)
WO (1) WO2006133956A2 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560777A (en) * 1992-11-09 1996-10-01 Goldstar Co., Ltd. Apparatus for making a semiconductor
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
WO2000054107A1 (en) * 1999-03-11 2000-09-14 Board Of Regents, The University Of Texas System Step and flash imprint lithography
WO2003030252A2 (en) * 2001-09-28 2003-04-10 Hrl Laboratories, Llc Process for producing interconnects
WO2003087935A2 (en) * 2002-04-17 2003-10-23 Clariant Gmbh Nanoimprint resist
US20040266073A1 (en) * 2003-02-06 2004-12-30 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device and display device
US20050011752A1 (en) * 2003-02-05 2005-01-20 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for wiring
US20050100830A1 (en) * 2003-10-27 2005-05-12 Molecular Imprints, Inc. Methods for fabricating patterned features utilizing imprint lithography
EP1594002A2 (en) * 2004-01-16 2005-11-09 Lg Electronics Inc. Method for manufacturing large area stamp for nanoimprint lithography

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560777A (en) * 1992-11-09 1996-10-01 Goldstar Co., Ltd. Apparatus for making a semiconductor
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
WO2000054107A1 (en) * 1999-03-11 2000-09-14 Board Of Regents, The University Of Texas System Step and flash imprint lithography
WO2003030252A2 (en) * 2001-09-28 2003-04-10 Hrl Laboratories, Llc Process for producing interconnects
WO2003087935A2 (en) * 2002-04-17 2003-10-23 Clariant Gmbh Nanoimprint resist
US20050011752A1 (en) * 2003-02-05 2005-01-20 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for wiring
US20040266073A1 (en) * 2003-02-06 2004-12-30 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device and display device
US20050100830A1 (en) * 2003-10-27 2005-05-12 Molecular Imprints, Inc. Methods for fabricating patterned features utilizing imprint lithography
EP1594002A2 (en) * 2004-01-16 2005-11-09 Lg Electronics Inc. Method for manufacturing large area stamp for nanoimprint lithography

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JOHNSON S C ET AL: "Advances in step and flash imprint lithography", PROCEEDINGS OF THE SPIE, SPIE, BELLINGHAM, VA, US, vol. 5037, 25 February 2003 (2003-02-25), pages 197 - 202, XP002314656, ISSN: 0277-786X *
LE N V ET AL: "Selective dry etch process for step and flash imprint lithography", MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, vol. 78-79, March 2005 (2005-03-01), pages 464 - 473, XP004803664, ISSN: 0167-9317 *

Also Published As

Publication number Publication date
DE102005045331A1 (en) 2006-12-28
WO2006133956A2 (en) 2006-12-21

Similar Documents

Publication Publication Date Title
WO2008146869A3 (en) Pattern forming method, pattern or mold formed thereby
WO2009004560A3 (en) A method for forming a patterned layer on a substrate
EP1785770A3 (en) Stamp for micro/nano imprint lithography using diamond-like carbon and method of fabricating the same
WO2009154571A8 (en) A method of making an imprint on a polymer structure
TW200834245A (en) Method for manufacturing semiconductor device with four-layered laminate
WO2009147602A3 (en) Silicone rubber material for soft lithography
WO2010047769A8 (en) Reduction of stress during template separation from substrate
WO2008099795A3 (en) Imprint method and imprint apparatus
WO2008066562A3 (en) Imprint lithography method and system
TW200633791A (en) Method for fabricating nano-adhesive
WO2012027050A3 (en) Mask for near-field lithography and fabrication the same
WO2006057745A3 (en) Direct imprinting of etch barriers using step and flash imprint lithography
WO2009020193A3 (en) Imprint method and processing method of substrate
DE602006007089D1 (en) Imprint lithography method, apparatus therefor, and method of manufacturing a semiconductor chip
WO2005121892A3 (en) Apparatus, system and method to vary dimensions of a substrate during nano-scale manufacturing
WO2008068701A3 (en) Method and apparatus for applying a sheet to a substrate
ATE544093T1 (en) IMPRINT METHOD FOR PRODUCING A RELIEF LAYER AND ITS USE AS AN ETCHING MASK
WO2010047788A3 (en) Imprint lithography system and method
WO2008105531A1 (en) Pellicle frame apparatus, mask, exposure method, exposure apparatus and device manufacturing method
WO2008017472A3 (en) Method for the production of a porous, ceramic surface layer
WO2011094317A3 (en) Micro-conformal templates for nanoimprint lithography
WO2010078343A3 (en) Resist feature and removable spacer pitch doubling patterning method for pillar structures
WO2009002644A8 (en) Methods of making hierarchical articles
TW200700208A (en) Method for fabricating soft mold
WO2008121186A3 (en) System and method for depositing thin layers on non-planar substrates by stamping

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06754406

Country of ref document: EP

Kind code of ref document: A2