WO2006061081A3 - Electrochemical deposition of tantalum and/or copper in ionic liquids - Google Patents

Electrochemical deposition of tantalum and/or copper in ionic liquids Download PDF

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Publication number
WO2006061081A3
WO2006061081A3 PCT/EP2005/012180 EP2005012180W WO2006061081A3 WO 2006061081 A3 WO2006061081 A3 WO 2006061081A3 EP 2005012180 W EP2005012180 W EP 2005012180W WO 2006061081 A3 WO2006061081 A3 WO 2006061081A3
Authority
WO
WIPO (PCT)
Prior art keywords
tantalum
copper
electrochemical deposition
hydroxyalkyl
ionic liquids
Prior art date
Application number
PCT/EP2005/012180
Other languages
German (de)
French (fr)
Other versions
WO2006061081A2 (en
Inventor
Urs Welz-Biermann
Frank Endres
El Abedin Sherif Zein
Original Assignee
Merck Patent Gmbh
Urs Welz-Biermann
Frank Endres
El Abedin Sherif Zein
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh, Urs Welz-Biermann, Frank Endres, El Abedin Sherif Zein filed Critical Merck Patent Gmbh
Priority to EP05813986A priority Critical patent/EP1831433A2/en
Priority to JP2007544757A priority patent/JP2008523242A/en
Priority to CA002590080A priority patent/CA2590080A1/en
Priority to US11/721,277 priority patent/US20090242414A1/en
Publication of WO2006061081A2 publication Critical patent/WO2006061081A2/en
Publication of WO2006061081A3 publication Critical patent/WO2006061081A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Abstract

The invention relates to a method for electrochemical deposition of tantalum and/or copper on a substrate in an ionic liquid, containing at least one tetraalkylammonium-, tetraalkylphosphonium-, 1,1-dialkylpyrrolidinium-, 1-hydroxyalkyl-1-alkylpyrrolidinium-, 1-hydroxyalkyl-3-alkylimidazolium- or bis(1-hydroxyalkyl)imidazolium cation, whereby the alkyl groups or the alkylene chains of the 1-hydroxyalkyl groups can independently have 1 to 10 C atoms.
PCT/EP2005/012180 2004-12-10 2005-11-15 Electrochemical deposition of tantalum and/or copper in ionic liquids WO2006061081A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP05813986A EP1831433A2 (en) 2004-12-10 2005-11-15 Electrochemical deposition of tantalum and/or copper in ionic liquids
JP2007544757A JP2008523242A (en) 2004-12-10 2005-11-15 Electrochemical deposition of tantalum and / or copper in ionic liquids
CA002590080A CA2590080A1 (en) 2004-12-10 2005-11-15 Electrochemical deposition of tantalum and/or copper in ionic liquids
US11/721,277 US20090242414A1 (en) 2004-12-10 2005-11-15 Electronchemical deposition of tantalum and/or copper in ionic liquids

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004059520A DE102004059520A1 (en) 2004-12-10 2004-12-10 Electrochemical deposition of tantalum and / or copper in ionic liquids
DE102004059520.8 2004-12-10

Publications (2)

Publication Number Publication Date
WO2006061081A2 WO2006061081A2 (en) 2006-06-15
WO2006061081A3 true WO2006061081A3 (en) 2007-08-02

Family

ID=35976745

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/012180 WO2006061081A2 (en) 2004-12-10 2005-11-15 Electrochemical deposition of tantalum and/or copper in ionic liquids

Country Status (10)

Country Link
US (1) US20090242414A1 (en)
EP (1) EP1831433A2 (en)
JP (1) JP2008523242A (en)
KR (1) KR20070085936A (en)
CN (1) CN101076617A (en)
CA (1) CA2590080A1 (en)
DE (1) DE102004059520A1 (en)
RU (1) RU2007125776A (en)
TW (1) TW200626755A (en)
WO (1) WO2006061081A2 (en)

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EP1983079A1 (en) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Barrier layer and method for making the same
ATE493523T1 (en) * 2007-08-02 2011-01-15 Akzo Nobel Nv METHOD FOR ELECTRODEPOSITION OF METALS USING IONIC LIQUIDS USING AN ADDITIVE
GB0715258D0 (en) * 2007-08-06 2007-09-12 Univ Leuven Kath Deposition from ionic liquids
EP2080972A1 (en) 2008-01-08 2009-07-22 L'AIR LIQUIDE, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Combined burner and lance apparatus for electric arc furnaces
CN102066304A (en) * 2008-06-17 2011-05-18 威斯康星校友研究基金会 Chemical transformation of lignocellulosic biomass into fuels and chemicals
DE102008030988B4 (en) * 2008-06-27 2010-04-01 Siemens Aktiengesellschaft Component having a layer incorporating carbon nanotubes (CNTs) and methods of making same
DE102008031003B4 (en) 2008-06-30 2010-04-15 Siemens Aktiengesellschaft A method of producing a CNT-containing layer of an ionic liquid
CN102498122B (en) * 2009-07-01 2016-08-03 威斯康星校友研究基金会 Biomass by hydrolyzation
DE102009043594B4 (en) 2009-09-25 2013-05-16 Siemens Aktiengesellschaft Process for the electrochemical coating and incorporation of particles into the layer
DE102009060937A1 (en) 2009-12-22 2011-06-30 Siemens Aktiengesellschaft, 80333 Process for electrochemical coating
CN101828958B (en) * 2010-05-19 2011-12-28 瞿东滨 Protruded bone integrated setting nail
CN102912384B (en) * 2012-10-31 2015-03-04 南京工业大学 Method for preparing porous copper powder by electrodepositing Cu-Al-Mg-Li alloy
DE102013202254A1 (en) 2013-02-12 2014-08-14 Siemens Aktiengesellschaft Process for the production of high energy magnets
US20140262800A1 (en) * 2013-03-12 2014-09-18 Taiwan Semiconductor Manufacturing Company, Ltd. Electroplating Chemical Leveler
WO2014160144A1 (en) * 2013-03-13 2014-10-02 Fluidic, Inc. Synergistic additives for electrochemical cells with electrodeposited fuel
US10006141B2 (en) * 2013-06-20 2018-06-26 Baker Hughes, A Ge Company, Llc Method to produce metal matrix nanocomposite
WO2015157441A1 (en) * 2014-04-09 2015-10-15 Nulwala Hunaid B Ionic liquid solvent for electroplating process
CN104141151A (en) * 2014-08-06 2014-11-12 哈尔滨工业大学 Method for forming metal simple substance through ionic liquid in electrolytic deposition mode
US10669635B2 (en) 2014-09-18 2020-06-02 Baker Hughes, A Ge Company, Llc Methods of coating substrates with composite coatings of diamond nanoparticles and metal
CA2959118A1 (en) * 2014-10-01 2016-04-07 Halliburton Energy Services, Inc. Polymerizable ionic liquids for use in subterranean formation operations
US9873827B2 (en) 2014-10-21 2018-01-23 Baker Hughes Incorporated Methods of recovering hydrocarbons using suspensions for enhanced hydrocarbon recovery
US10167392B2 (en) 2014-10-31 2019-01-01 Baker Hughes Incorporated Compositions of coated diamond nanoparticles, methods of forming coated diamond nanoparticles, and methods of forming coatings
JP6413751B2 (en) * 2014-12-22 2018-10-31 日清紡ホールディングス株式会社 Plating solution
US10155899B2 (en) 2015-06-19 2018-12-18 Baker Hughes Incorporated Methods of forming suspensions and methods for recovery of hydrocarbon material from subterranean formations
CN105463532A (en) * 2015-12-29 2016-04-06 沈阳师范大学 Novel electroplating liquid for ferronickel plating
CN105780069A (en) * 2015-12-29 2016-07-20 沈阳师范大学 Chloride 1-hexyl-3-methyl glyoxaline/ferric chloride system electroplating solution
US9834850B1 (en) 2016-08-08 2017-12-05 Seagate Technology Llc Method of forming one or more metal and/or metal alloy layers in processes for making transducers in sliders, and related sliders
US11424484B2 (en) 2019-01-24 2022-08-23 Octet Scientific, Inc. Zinc battery electrolyte additive
CN111826691B (en) * 2020-08-21 2021-09-21 东北大学 Method for preparing zinc-tantalum alloy by using solvated ionic liquid

Citations (4)

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Publication number Priority date Publication date Assignee Title
US4624753A (en) * 1985-06-05 1986-11-25 Mcmanis Iii George E Method for electrodeposition of metals
WO2001013379A1 (en) * 1999-08-18 2001-02-22 British Nuclear Fuels Plc Process for separating metals
JP2001279486A (en) * 2000-03-30 2001-10-10 Japan Science & Technology Corp Method for plating tantalum
US6552843B1 (en) * 2002-01-31 2003-04-22 Innovative Technology Licensing Llc Reversible electrodeposition device with ionic liquid electrolyte

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TW200526587A (en) * 2003-09-05 2005-08-16 Univ Alabama Ionic liquids containing secondary hydroxyl-groups and a method for their preparation

Patent Citations (5)

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US4624753A (en) * 1985-06-05 1986-11-25 Mcmanis Iii George E Method for electrodeposition of metals
WO2001013379A1 (en) * 1999-08-18 2001-02-22 British Nuclear Fuels Plc Process for separating metals
JP2001279486A (en) * 2000-03-30 2001-10-10 Japan Science & Technology Corp Method for plating tantalum
US6936155B1 (en) * 2000-03-30 2005-08-30 Japan Science And Technology Agency Method for electroplating of tantalum
US6552843B1 (en) * 2002-01-31 2003-04-22 Innovative Technology Licensing Llc Reversible electrodeposition device with ionic liquid electrolyte

Non-Patent Citations (5)

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Title
FORSYTH S ET AL: "N-methyl-N-alkylpyrrolidinium tetrafluoroborate salts: ionic solvents and solid electrolytes", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 46, no. 10-11, 15 March 2001 (2001-03-15), pages 1753 - 1757, XP004231593, ISSN: 0013-4686 *
MURASE K ET AL: "Electrochemical behaviour of copper in trimethyl-n-hexylammonium bis((trifluoromethyl)sulfonyl)amide, an ammonium imide-type room temperature molten salt", JOURNAL OF APPLIED ELECTROCHEMISTRY, SPRINGER, DORDRECHT, NL, vol. 31, 2001, pages 1089 - 1094, XP002383238, ISSN: 0021-891X *
S. ZEIN EL ABEDIN, H. K. FARAG, E. M. MOUSTAFA, U. WELZ-BIERMANN, F. ENDRES: "Electroreduction of tantalum fluoride in a room temperature ionic liquid at variable temperatures", PHYS. CHEM. CHEM. PHYS., no. 7, 27 April 2005 (2005-04-27), pages 2333 - 2339, XP002435793 *
S. ZEIN EL ABEDIN, U. WELZ-BIERMANN, F. ENDRES: "A study of the electrodeposition of tantalum on NiTi alloy in an ionic liquid and corrosion behaviour of the coated alloy", ELECTROCHEMISTRY COMMNUICATIONS, no. 7, 8 August 2005 (2005-08-08), pages 941 - 946, XP002435792 *
SUN J ET AL: "A new family of ionic liquids based on the 1-alkyl-2-methyl pyrrolinium cation", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 48, no. 12, 30 May 2003 (2003-05-30), pages 1707 - 1711, XP004422987, ISSN: 0013-4686 *

Also Published As

Publication number Publication date
CA2590080A1 (en) 2006-06-15
KR20070085936A (en) 2007-08-27
TW200626755A (en) 2006-08-01
US20090242414A1 (en) 2009-10-01
RU2007125776A (en) 2009-01-20
WO2006061081A2 (en) 2006-06-15
EP1831433A2 (en) 2007-09-12
CN101076617A (en) 2007-11-21
JP2008523242A (en) 2008-07-03
DE102004059520A1 (en) 2006-06-14

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