WO2006049776A3 - Ink-jet printing of coupling agents for trace or circuit deposition templating - Google Patents
Ink-jet printing of coupling agents for trace or circuit deposition templating Download PDFInfo
- Publication number
- WO2006049776A3 WO2006049776A3 PCT/US2005/035282 US2005035282W WO2006049776A3 WO 2006049776 A3 WO2006049776 A3 WO 2006049776A3 US 2005035282 W US2005035282 W US 2005035282W WO 2006049776 A3 WO2006049776 A3 WO 2006049776A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coupling agent
- trace
- ink
- substrate
- circuit deposition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/976,461 US20060093732A1 (en) | 2004-10-29 | 2004-10-29 | Ink-jet printing of coupling agents for trace or circuit deposition templating |
US10/976,461 | 2004-10-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006049776A2 WO2006049776A2 (en) | 2006-05-11 |
WO2006049776A3 true WO2006049776A3 (en) | 2006-07-13 |
Family
ID=36216821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/035282 WO2006049776A2 (en) | 2004-10-29 | 2005-09-28 | Ink-jet printing of coupling agents for trace or circuit deposition templating |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060093732A1 (en) |
TW (1) | TW200621912A (en) |
WO (1) | WO2006049776A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8052269B2 (en) | 2007-01-30 | 2011-11-08 | Hewlett-Packard Development Company, L.P. | Jettable inks with reduced frothing |
US20100233361A1 (en) * | 2009-03-12 | 2010-09-16 | Xerox Corporation | Metal nanoparticle composition with improved adhesion |
GB201113919D0 (en) * | 2011-08-12 | 2011-09-28 | Intrinsiq Materials Ltd | High resolution printing |
WO2016022035A1 (en) * | 2014-08-06 | 2016-02-11 | Nokia Technologies Oy | Apparatus comprising a self-assembled layer and method of surface modification |
US11152294B2 (en) | 2018-04-09 | 2021-10-19 | Corning Incorporated | Hermetic metallized via with improved reliability |
US11786974B2 (en) * | 2018-05-03 | 2023-10-17 | Hamilton Sundstrand Corporation | Additive manufacturing of electronics having bulk properties |
JP6620277B1 (en) * | 2018-08-07 | 2019-12-18 | 株式会社豊光社 | Method for producing plated glass substrate |
WO2020068436A1 (en) * | 2018-09-24 | 2020-04-02 | Corning Incorporated | Methods for increasing adhesion between metallic films and glass surfaces and articles made therefrom |
JP7223868B2 (en) | 2019-02-14 | 2023-02-16 | オルボテック リミテッド | Method and apparatus for preparing PCB products with high density conductors |
CN113474311B (en) | 2019-02-21 | 2023-12-29 | 康宁股份有限公司 | Glass or glass ceramic article with copper-metallized through-holes and process for making same |
DE102019219615A1 (en) | 2019-12-13 | 2021-06-17 | Heraeus Deutschland GmbH & Co. KG | Manufacturing process for precious metal electrodes |
US20220278244A1 (en) * | 2021-02-26 | 2022-09-01 | Brite Hellas Ae | Photovoltaic glass pane and method of producing a photovoltaic glass pane |
US20230096301A1 (en) * | 2021-09-29 | 2023-03-30 | Catlam, Llc. | Circuit Board Traces in Channels using Electroless and Electroplated Depositions |
Citations (9)
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JP2000204479A (en) * | 1999-01-14 | 2000-07-25 | Ritsumeikan | Formation of three-dimensional device structure |
US20010012869A1 (en) * | 1998-10-22 | 2001-08-09 | Motoo Fukushima | Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method |
WO2002093991A1 (en) * | 2001-05-15 | 2002-11-21 | International Business Machines Corporation | Method for electroless deposition and patterning of a metal on a substrate |
US20030132121A1 (en) * | 2001-11-29 | 2003-07-17 | International Business Machines Corporation | Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization |
JP2003209341A (en) * | 2002-01-16 | 2003-07-25 | Ulvac Japan Ltd | Method for forming conductive pattern on insulation board |
WO2003072851A1 (en) * | 2002-02-28 | 2003-09-04 | Zeon Corporation | Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board |
US20030199162A1 (en) * | 2000-03-31 | 2003-10-23 | Seiko Epson Corporation | System and methods for fabrication of a thin pattern |
WO2004005413A1 (en) * | 2002-07-03 | 2004-01-15 | Nanopowders Industries Ltd. | Low sintering temperatures conductive nano-inks and a method for producing the same |
WO2004068389A2 (en) * | 2003-01-28 | 2004-08-12 | Conductive Inkjet Technology Limited | Method of forming a conductive metal region on a substrate |
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2004
- 2004-10-29 US US10/976,461 patent/US20060093732A1/en not_active Abandoned
-
2005
- 2005-09-28 WO PCT/US2005/035282 patent/WO2006049776A2/en active Application Filing
- 2005-09-29 TW TW094134074A patent/TW200621912A/en unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US20010012869A1 (en) * | 1998-10-22 | 2001-08-09 | Motoo Fukushima | Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method |
JP2000204479A (en) * | 1999-01-14 | 2000-07-25 | Ritsumeikan | Formation of three-dimensional device structure |
US20030199162A1 (en) * | 2000-03-31 | 2003-10-23 | Seiko Epson Corporation | System and methods for fabrication of a thin pattern |
WO2002093991A1 (en) * | 2001-05-15 | 2002-11-21 | International Business Machines Corporation | Method for electroless deposition and patterning of a metal on a substrate |
US20030132121A1 (en) * | 2001-11-29 | 2003-07-17 | International Business Machines Corporation | Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization |
JP2003209341A (en) * | 2002-01-16 | 2003-07-25 | Ulvac Japan Ltd | Method for forming conductive pattern on insulation board |
WO2003072851A1 (en) * | 2002-02-28 | 2003-09-04 | Zeon Corporation | Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board |
US20050153059A1 (en) * | 2002-02-28 | 2005-07-14 | Yasuhiro Wakizaka | Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board |
WO2004005413A1 (en) * | 2002-07-03 | 2004-01-15 | Nanopowders Industries Ltd. | Low sintering temperatures conductive nano-inks and a method for producing the same |
WO2004068389A2 (en) * | 2003-01-28 | 2004-08-12 | Conductive Inkjet Technology Limited | Method of forming a conductive metal region on a substrate |
Non-Patent Citations (2)
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PATENT ABSTRACTS OF JAPAN vol. 2000, no. 10 17 November 2000 (2000-11-17) * |
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 11 5 November 2003 (2003-11-05) * |
Also Published As
Publication number | Publication date |
---|---|
WO2006049776A2 (en) | 2006-05-11 |
TW200621912A (en) | 2006-07-01 |
US20060093732A1 (en) | 2006-05-04 |
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