WO2006038543A3 - 発光装置及びそれを用いた照明器具または液晶表示装置 - Google Patents

発光装置及びそれを用いた照明器具または液晶表示装置 Download PDF

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Publication number
WO2006038543A3
WO2006038543A3 PCT/JP2005/018083 JP2005018083W WO2006038543A3 WO 2006038543 A3 WO2006038543 A3 WO 2006038543A3 JP 2005018083 W JP2005018083 W JP 2005018083W WO 2006038543 A3 WO2006038543 A3 WO 2006038543A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
liquid crystal
crystal display
lighting equipment
Prior art date
Application number
PCT/JP2005/018083
Other languages
English (en)
French (fr)
Other versions
WO2006038543A2 (ja
WO2006038543A1 (ja
Inventor
Keiichi Yano
Original Assignee
Toshiba Kk
Toshiba Materials Co Ltd
Keiichi Yano
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk, Toshiba Materials Co Ltd, Keiichi Yano filed Critical Toshiba Kk
Priority to EP05788119A priority Critical patent/EP1806789B1/en
Priority to US11/576,533 priority patent/US7812360B2/en
Priority to JP2006539258A priority patent/JP4960099B2/ja
Priority to CN200580033649.2A priority patent/CN101036238B/zh
Publication of WO2006038543A2 publication Critical patent/WO2006038543A2/ja
Publication of WO2006038543A1 publication Critical patent/WO2006038543A1/ja
Publication of WO2006038543A3 publication Critical patent/WO2006038543A3/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

　窒化アルミニウムから成る同時焼成基板１３の表面に少なくとも１個の発光素子１５がフリップチップ法により実装された発光装置１１であり、上記発光素子１５からの発光を正面方向に反射する傾斜面１４を有するリフレクター１６が、上記発光素子１５の周囲を取り囲むように窒化アルミニウム基板１３表面に接合されていることを特徴とする発光装置１１である。上記構成に係る発光装置によれば、製造工程が簡素であり、また放熱性が優れ、より大きな電流を流すことができ、発光効率が高く輝度を大幅に増加させることが可能な発光装置が提供できる。
PCT/JP2005/018083 2004-10-04 2005-09-30 発光装置及びそれを用いた照明器具または液晶表示装置 WO2006038543A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP05788119A EP1806789B1 (en) 2004-10-04 2005-09-30 Lighting apparatus comprising light emitting diodes and liquid crystal display comprising the lighting apparatus
US11/576,533 US7812360B2 (en) 2004-10-04 2005-09-30 Light emitting device, lighting equipment or liquid crystal display device using such light emitting device
JP2006539258A JP4960099B2 (ja) 2004-10-04 2005-09-30 発光装置及びそれを用いた照明器具または液晶表示装置
CN200580033649.2A CN101036238B (zh) 2004-10-04 2005-09-30 发光设备、使用所述发光设备的照明设备和液晶显示装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-291608 2004-10-04
JP2004291608 2004-10-04

Publications (3)

Publication Number Publication Date
WO2006038543A2 WO2006038543A2 (ja) 2006-04-13
WO2006038543A1 WO2006038543A1 (ja) 2006-04-13
WO2006038543A3 true WO2006038543A3 (ja) 2006-05-26

Family

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012779A (ja) * 1996-06-21 1998-01-16 Toshiba Corp 半導体実装構造
JP2002353515A (ja) * 2001-05-24 2002-12-06 Samsung Electro Mech Co Ltd 発光ダイオード及びこれを用いた発光装置とその製造方法
JP2003192442A (ja) * 2001-12-26 2003-07-09 Toshiba Corp 窒化アルミニウム基板、薄膜付き窒化アルミニウム基板およびこれからなるレーザー発光素子用サブマウント材
JP2004087796A (ja) * 2002-08-27 2004-03-18 Matsushita Electric Works Ltd Ｌｅｄチップ取付部材の製造方法及びそのｌｅｄチップ取付部材を用いたｌｅｄ実装基板
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
JP2005150408A (ja) * 2003-11-17 2005-06-09 Sumitomo Electric Ind Ltd 発光素子搭載用パッケージおよび光源装置
JP2005210042A (ja) * 2003-09-11 2005-08-04 Kyocera Corp 発光装置および照明装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012779A (ja) * 1996-06-21 1998-01-16 Toshiba Corp 半導体実装構造
JP2002353515A (ja) * 2001-05-24 2002-12-06 Samsung Electro Mech Co Ltd 発光ダイオード及びこれを用いた発光装置とその製造方法
JP2003192442A (ja) * 2001-12-26 2003-07-09 Toshiba Corp 窒化アルミニウム基板、薄膜付き窒化アルミニウム基板およびこれからなるレーザー発光素子用サブマウント材
JP2004087796A (ja) * 2002-08-27 2004-03-18 Matsushita Electric Works Ltd Ｌｅｄチップ取付部材の製造方法及びそのｌｅｄチップ取付部材を用いたｌｅｄ実装基板
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
JP2005210042A (ja) * 2003-09-11 2005-08-04 Kyocera Corp 発光装置および照明装置
JP2005150408A (ja) * 2003-11-17 2005-06-09 Sumitomo Electric Ind Ltd 発光素子搭載用パッケージおよび光源装置

Also Published As

Publication number Publication date
US20070247855A1 (en) 2007-10-25
TW200616265A (en) 2006-05-16
EP1806789A2 (en) 2007-07-11
JPWO2006038543A1 (ja) 2008-05-15
CN101036238A (zh) 2007-09-12
US7812360B2 (en) 2010-10-12
JP4960099B2 (ja) 2012-06-27
EP1806789B1 (en) 2012-05-09
CN101036238B (zh) 2014-01-08
KR20070089784A (ko) 2007-09-03
KR100867970B1 (ko) 2008-11-11
TWI295860B (ja) 2008-04-11
EP1806789A4 (en) 2009-09-02
WO2006038543A2 (ja) 2006-04-13

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