WO2006016662A1 - 半導体素子マトリクスアレイ、その製造方法及び表示パネル - Google Patents
半導体素子マトリクスアレイ、その製造方法及び表示パネル Download PDFInfo
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- WO2006016662A1 WO2006016662A1 PCT/JP2005/014784 JP2005014784W WO2006016662A1 WO 2006016662 A1 WO2006016662 A1 WO 2006016662A1 JP 2005014784 W JP2005014784 W JP 2005014784W WO 2006016662 A1 WO2006016662 A1 WO 2006016662A1
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- display
- semiconductor
- inspection
- pixel
- display panel
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 89
- 239000011159 matrix material Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000007689 inspection Methods 0.000 claims description 111
- 239000010410 layer Substances 0.000 claims description 73
- 239000010408 film Substances 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 41
- 238000012360 testing method Methods 0.000 claims description 39
- 239000010409 thin film Substances 0.000 claims description 16
- 239000011229 interlayer Substances 0.000 claims description 14
- 238000005224 laser annealing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 238000011156 evaluation Methods 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 2
- 238000006073 displacement reaction Methods 0.000 claims 2
- 238000005401 electroluminescence Methods 0.000 description 48
- 230000007547 defect Effects 0.000 description 15
- 239000003990 capacitor Substances 0.000 description 11
- 238000001514 detection method Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
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- 230000002950 deficient Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 239000007924 injection Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000003870 refractory metal Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
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- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 241000519995 Stachys sylvatica Species 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
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- 229910052720 vanadium Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Definitions
- the present invention relates to a semiconductor element matrix array and a display device that can easily inspect characteristics of semiconductor elements arranged in a matrix.
- a semiconductor element for example, a thin film transistor (hereinafter referred to as “TFT”) is used to control an electroluminescence (EL) element that is a self-luminous element. It is used as a switching element for controlling signal supply to each pixel of a liquid crystal display (hereinafter referred to as “LCD”).
- TFT thin film transistor
- EL electroluminescence
- LCD liquid crystal display
- an active matrix EL display device in which a switch element such as a TFT for individually controlling an EL element is provided in each pixel and the EL element is controlled for each pixel is increasing.
- a plurality of gate lines extend in the row direction on the substrate, a plurality of data lines and power supply lines extend in the column direction, and each pixel has an organic EL element, a selection TFT, and a drive.
- the selection TFT is turned on, the data voltage on the data line is applied to the storage capacitor to charge the storage capacitor, and the drive TFT is turned on by this voltage to turn on the current from the power supply line.
- the organic EL device emits light through the device.
- a polycrystalline silicon film obtained by polycrystallizing an amorphous silicon film by irradiating laser light can be used as an active layer thereof.
- This laser beam (laser beam) is shaped into a strip shape (rectangular shape) extending in the minor axis direction and the major axis direction perpendicular to the minor axis direction by the optical system of the laser annealing apparatus.
- the band-shaped laser light is scanned from one side (one side) to the other side (other side corresponding) of the substrate, and thereby the amorphous silicon film formed on the substrate is scanned.
- Laser light is irradiated.
- the energy at each position in the major axis and minor axis directions of the laser beam The distribution is not always uniform.
- the laser output intensity varies over time.
- the long axis direction of the shaping beam is parallel to the left and right (horizontal scanning) direction of the display panel, stripes appear in the upper and lower (vertical scanning) directions of the display surface, and this is called a vertical stripe display defect.
- Another display defect is striped unevenness that is noticeably observed in the side direction of one irradiated area, particularly in the long axis direction, of the shaped beam due to the intensity variation between each irradiation shot of the laser beam.
- the scanning direction of the laser beam is the vertical scanning direction of the display panel and the super-axis direction of the shaped beam is the horizontal scanning direction of the display panel
- stripes are generated along the horizontal scanning direction of the panel. Therefore, it is called a horizontal stripe display defect.
- the semiconductor element matrix array of the present invention is a semiconductor element matrix array in which a plurality of semiconductor elements are arranged in a matrix, and the semiconductor element is formed by any one of layers constituting the semiconductor element. Two or more of the elements are electrically connected to each other, and a wiring layer electrically connecting the two or more semiconductor elements to each other is provided with at least an electrically connected wiring layer that can be connected to the outside of the array. ing.
- the semiconductor element electrically connected to the wiring layer arranged to be connectable to the outside of the array is a transistor, and the source of the transistor or One of the drains is electrically connected to the wiring layer.
- a semiconductor element matrix array on a substrate, an active layer made of a semiconductor film and having a source and a drain, a gate insulating film covering at least the active layer, and the gate A gate electrode formed on the insulating film so as to overlap the active layer; an interlayer insulating film formed so as to cover the gate electrode; and a planarizing insulating film formed on the interlayer insulating film; A semiconductor element including electrodes connected to the source or the drain through contact holes corresponding to the source and the drain on the interlayer insulating film and the planarizing insulating film, and the source or the drain Are connected to the source or drain of another semiconductor element, and a plurality of electrodes are connected to each other.
- the electrodes for connecting the semiconductor elements are provided so as to be connectable to the outside of the matrix array.
- a display panel in which a plurality of pixels are arranged in a matrix in a display pixel region on a substrate, and each of the plurality of pixels includes a display element and a display operation of the display element.
- a pixel circuit for controlling the pixel circuit the pixel circuit including at least one thin film transistor for a pixel, and an active layer and a gate electrode of the thin film transistor for the pixel on the substrate.
- a plurality of built-in inspection elements having a configured layer, wherein at least one inspection wiring is connected to the plurality of inspection elements, and the inspection wiring is connectable to the outside of the panel. Formed on
- the thin film transistor for pixels and the semiconductor active layer of the built-in inspection element are both crystalline semiconductors obtained by crystallizing an amorphous semiconductor film with laser annealing.
- the built-in inspection element is a film and is provided with a plurality of lines parallel to the scanning direction at least in a direction coinciding with the scanning direction of the laser beam of the laser canal.
- a laser of the laser cannel is more than the number of lines of the built-in inspection element provided in a direction intersecting a laser beam scanning direction of the laser cane. There are more lines provided along the beam scanning direction.
- Another aspect of the present invention is a method of manufacturing a semiconductor element matrix array in which a plurality of semiconductor elements are arranged in a matrix, wherein the semiconductor element is formed by any one of the layers constituting the semiconductor element. 2 or more are electrically connected to each other, and at least a wiring layer that is electrically connected to the wiring that electrically connects the two or more semiconductor elements to each other is provided so as to be connected to the outside of the array. Then, a signal obtained in the wiring layer is detected, the characteristics of the semiconductor element are evaluated based on the detected signal, and good / bad judgment of the semiconductor matrix array is executed.
- Another aspect of the present invention is a method for manufacturing a display panel in which a plurality of pixels are arranged in a matrix in a display pixel region on a substrate, and the plurality of pixels in the display pixel region include Each pixel is formed, and at least one pixel thin film transistor for controlling the display operation of a display element formed later is formed, and a plurality of built-in detection elements are formed on the same substrate.
- the plurality of built-in test elements are connected to each other, a test wiring that can be connected to the outside of the panel is formed, and the built-in A signal obtained by the inspection wiring is detected by operating the inspection element, characteristics of the built-in inspection element are evaluated based on the detected signal, and provided to the plurality of pixels based on the evaluation. Whether the pixel thin film transistor is good or bad is executed, and only the display panel judged good is formed with the display element to complete the display panel.
- a display defect in a display element formed using this semiconductor element in a state where the semiconductor element array is completed can be detected in advance. Therefore, it is not necessary to pass the array determined to be defective to the subsequent process, and the subsequent elements may be formed only on the array determined to be non-defective. As a result, the manufacturing efficiency can be improved and the manufacturing cost can be reduced.
- FIG. 1 is a schematic plan view of an organic EL display panel according to an embodiment of the present invention.
- FIG. 2 is an explanatory diagram of a built-in inspection unit according to an embodiment of the present invention.
- FIG. 3 is a plan view showing the vicinity of a display pixel of the organic EL display device according to the embodiment of the present invention.
- 4A is a cross-sectional view taken along line AA in FIG.
- 4B is a cross-sectional view taken along the line CC in FIG. 1 and a cross-sectional view taken along the line BB in FIG.
- FIG. 5 is another layout example of the inspection wiring according to the embodiment of the present invention.
- FIG. 6 is a diagram showing the relationship between the number of installed lines of the built-in test element 120 according to the embodiment of the present invention and laser annealing. Explanation of symbols
- Organic EL element Organic EL element, 61 anode, VD vertical drive circuit, HD horizontal drive circuit, 100 inspection wiring, 101 inspection terminal (external terminal), 110 display pixel area, 120 built-in inspection element, 130 peripheral BIST section.
- a function and configuration for inspecting defects in a state close to the time of use of the semiconductor elements at the stage of forming each semiconductor element On the array.
- an active matrix EL display panel that uses a semiconductor element as a TFT for each pixel as a semiconductor element matrix array and drives an EL element by this TFT is taken as an example. Functions built in the array for defect inspection The configuration will be described.
- FIG. 1 is a schematic plan view of an EL panel according to this embodiment, particularly an organic EL panel using an organic compound as a light emitting material.
- FIG. 2 is a schematic circuit diagram of the panel of FIG. 1
- FIG. 3 is a schematic plan view of one pixel of the organic EL display panel.
- a display pixel region 110 in which a plurality of pixels are arranged in a matrix in the row and column directions is provided on an insulating substrate 1 such as glass at a position surrounded by a dotted line in the drawing.
- a vertical driving circuit (V driver) VD arranged in the vertical direction (vertical scanning direction) in the figure and a horizontal driving circuit arranged in the horizontal direction (horizontal scanning direction) in the figure.
- H Dryino H
- each pixel is provided with a selection TFT 30, a driving TFT 40, and an organic EL element 60 (actually, a storage capacitor or the like that holds a signal corresponding to display data for a certain period is formed.
- the selection TFT 30 has a gate 11 connected to a gate signal line (gate line) 51 formed in the row direction of the matrix, and is output to a corresponding row (gate line) of the matrix from the vertical drive circuit VD. It operates by applying a signal.
- the drain 13d of this selection TFT 30 is connected to a drain signal line (data line) 52 formed in the column direction of the matrix, and the horizontal drive circuit HD force is also selected as a video signal output to each column.
- the drive TFT 40 has its gate 41 connected to the source 13 s of the selection TFT 30 and one electrode of the storage capacitor Cs. For this reason, a voltage corresponding to the video signal supplied from the data line 52 via the selection TFT 30 is applied to the gate 41 of the driving TFT 40 via the selection TFT 30, and the driving TFT 40 is supplied from the power line 53 connected to the EL driving power source. Then, a current corresponding to the applied voltage is supplied to the organic EL element 60, and the organic EL element 60 emits light with a luminance corresponding to the supplied current.
- FIG. 4A shows a cross-sectional view along the line AA in FIG. 3
- FIG. 4B shows a cross-sectional view along the line C-C in FIG.
- a display pixel is formed in a region surrounded by the gate signal line 51 and the drain signal line 52.
- a selection TFT 30 is provided in the vicinity of the intersection of both signal lines.
- the source 13s of the TFT 30 also serves as a capacitor electrode 55 that forms a capacitance with a storage capacitor electrode line 54 to be described later, and the gate 41 of the driving TFT 40. It is connected to the.
- the source 43s of the driving TFT is connected to the anode 61 of the organic EL element 60, and the other drain 43d is connected to a driving power supply line 53 which is a current source supplied to the organic EL element 60.
- a storage capacitor electrode line 54 is arranged near the selection TFT 30 in parallel with the gate signal line 51.
- the storage capacitor electrode line 54 is also made of chrome isotropic, and the storage capacitor electrode line 54 has a storage capacitor connected to the source 13 s of the selection TFT 30 with the gate insulating film 12 interposed therebetween. Configure and store charge. This holding capacitor is provided to hold a voltage (data voltage corresponding to the video signal) applied to the gate electrode 41 of the driving TFT 40 for a certain period.
- the panel used in the organic EL display device is formed on a substrate 10 such as an insulating substrate such as glass or synthetic resin, a conductive substrate, or a semiconductor plate. It is formed by stacking elements in order. However, when a conductive substrate or semiconductor substrate is used as the substrate 10, SiO or SiN is formed on the substrate 10.
- a substrate 10 such as an insulating substrate such as glass or synthetic resin, a conductive substrate, or a semiconductor plate. It is formed by stacking elements in order.
- SiO or SiN is formed on the substrate 10.
- TFT and organic EL element are formed on it.
- an active layer 13 made of a p-Si film, and a gate insulating film 12 on which an SiO film and an SiN film are stacked in this order.
- Chromium (Cr) Chromium
- a gate signal line 51 also serving as a gate electrode 11 made of a refractory metal such as molybdenum (Mo) is sequentially laminated.
- a contact hole formed corresponding to the drain 13d of the active layer 13 so as to penetrate the interlayer insulating film 15 and the gate insulating film 12 is filled with a metal such as A1, and a drain electrode 16 is provided. .
- the drain electrode 16 is also used as the data signal line 52 having A1 force (see FIG. 3).
- the drive power line 53 which is the drive power supply for the organic EL element, is also disposed using the A1 layer formed at the same time.
- a planarizing insulating film 17 made of, for example, an insulating organic resin and flattening the upper surface is formed so as to cover the entire surface of the substrate including them. Yes.
- FIG. 4B a driving TFT 40 that is a TFT for driving an organic EL element will be described with reference to FIG. 4B.
- the same components as those shown in FIG. 4A described above are basically denoted by the same reference numerals.
- a gate electrode 41 made of a refractory metal is sequentially formed.
- a channel 43c is formed in a region covered with the gate electrode 41 with the gate insulating film 12 interposed therebetween.
- Impurities here, p-conductivity type impurities such as boron
- a SiO film, a SiN film, and a SiO film are laminated in this order so as to cover the entire surface on the gate insulating film 12 and the gate electrode 41.
- An interlayer insulating film 15 is formed. Further, a drive power supply line 53 filled with a metal such as A1 and connected to the drive power supply is arranged in the contact hole provided corresponding to the drain 43d through the interlayer insulating film 15 and the gate insulating film 12. Yes. Further, a flat insulating film 17 is formed so as to cover the entire surface of the substrate. On the flat insulating layer 17, there is a transparent electrode made of ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), that is, an anode 61 of an organic EL element. Is formed. The anode 61 is patterned into individual patterns for each pixel.
- ITO Indium Tin Oxide
- IZO Indium Zinc Oxide
- a contact hole is formed in the flat insulating film 17 at a position corresponding to the source 43s, and the source 43s and the anode 61 of the organic EL element are connected in this contact hole.
- a flat insulating film 18 is further formed on the periphery of the anode 61 so as to cover the edge portion. The flat insulating film 18 prevents a short-circuit between a corner portion around the anode 61 and the cathode 65 laminated on the anode 61 with a light emitting element layer interposed therebetween. Further, in the opening of the flat insulating film 18, the anode 61 and the light emitting element layer including the light emitting layer are in direct contact with each other to define the light emitting region of the organic EL element.
- the organic EL element 60 has a laminated structure in which a light emitting element layer is formed between an anode 61 made of a transparent electrode such as ITO and a cathode 65 made of a metal electrode such as A1.
- the light emitting element layer may have a single layer structure or a multilayer structure of two or more layers depending on the material used, for example, to inject holes from the anode 61, which is a hole injection electrode, into the light emitting layer from the anode 61 side.
- a hole injection layer (not shown) using CFx, etc., a hole transport layer 62 using NPB, etc., a light emitting layer 63 in which a light emitting material is mixed as a dopant in a host material such as NPB, etc., an electron comprising Alq, etc.
- the transport layer 64, lithium fluoride alloy, and other forces are also available, and it has an electron injection layer that injects electrons from the cathode into the light emitting layer.
- the organic EL element In the organic EL element, holes injected from the anode and electrons injected from the cathode are recombined inside the light emitting layer, and excitons are generated by exciting organic molecules forming the light emitting layer. Light is emitted from the light emitting layer in the process of radiation deactivation of the excitons, and this light is emitted from the transparent anode through the transparent insulating substrate to emit light.
- the organic EL element 60 has the anode 61 connected to the driving TFT 40 of each pixel, and is controlled by a circuit element of one pixel, here, a selection TFT, a driving TFT, etc.
- the element 60 emits light under the control of the pixel circuit, so that light emission display for each pixel is performed.
- each pixel circuit is provided in the peripheral region of the display pixel region 110 (region indicated by a dotted line in FIG. 1) where a large number of display pixel circuits are formed.
- a horizontal drive circuit HD and a vertical drive circuit VD are formed as peripheral drive circuits for driving the drive.
- the present embodiment has a built-in inspection wiring 100 that can be used when inspecting TFT characteristic variations.
- the inspection wiring 100 is formed in a hatched area. That is, it extends along the vertical drive circuit VD and the horizontal drive circuit HD, and is formed between each drive circuit VD, HD and the display pixel region 110, and is connected to the inspection terminal 101. .
- the inspection wiring 100 is simply formed around the drive circuit, and as shown in FIG. 4B, the built-in inspection element 120 having the same structure as the TFT in the display pixel region is provided. It is connected. Note that the inspection wiring 100 extends in the normal direction of the paper in FIG. 4B.
- the built-in inspection element 120 may be a TFT element provided exclusively for inspection, or when the panel performs a normal display operation as a display device (completed body), a drive circuit or a pixel circuit A TFT that can operate as a part of may be used.
- the built-in inspection element 120 may have at least a TFT for controlling an EL element as a display element in the pixel circuit at the time of inspection, in particular, a TFT structure having the same structure as the driving TFT 40 and performing the same operation.
- the inspection wiring 100 is a so-called dummy wiring that does not contribute to display control during normal operation.
- the built-in test element 120 has the same structure as the driving TFT of the display pixel and does not contribute to display as a display pixel circuit, as shown in FIGS. 2 and 4B. It is composed.
- the first row is a dummy pixel row that is the built-in test element 120 according to the present embodiment, and is not displayed.
- the display pixel area 110 From the second line is the display pixel area 110, which is actually selected and supplied with a data signal corresponding to the corresponding video signal for display.
- the connection structure between the dummy pixel row and the inspection wiring 100 is shown in the portion denoted by the peripheral BIST portion 130 in FIG. 4B.
- the dummy pixel which is the built-in test element 120 is displayed
- Each pixel circuit in the pixel region 110 has the same structure except that an EL element connected to the pixel TFT is not formed on the pixel TFT. For example, as shown in FIG. Pixels having the same number of columns as the region 110 are formed side by side.
- the same conductive layer as the pixel electrode 61 (EL element anode) 61 for each pixel is provided for each pixel.
- a dummy pixel circuit provided in the row direction in FIG.
- the inspection wiring 100 that connects (130r) to each other is configured. As described above, the inspection wiring 100 is connected to a plurality of dummy pixels and extends to one inspection terminal 101.
- the inspection method of the TFT array is as follows. First, in this example, an inspection circuit is connected to the inspection terminal 101 of the TFT array substrate in which the pixel electrode (anode) 61 is formed as a TFT array substrate on which no EL element is formed. Also, the H driver HD and V driver VD are operated to output a selection signal to the first dummy pixel row (130r), and the dummy selection TFT 30d of each dummy pixel is turned on. Is output to the data signal line 52, and a voltage signal corresponding to the inspection data is applied to the gate electrode (reference numeral 41 in FIG. 4B) of the dummy drive TFT 40d via the dummy selection TFT 30d.
- the dummy drive TFT 40d operates in accordance with this, depending on the voltage of the inspection signal applied to the gate electrode 41 from the drive current source (see reference numeral 53 in FIG. 3) connected to the drain (or source) of the dummy drive TFT 40d.
- Current is passed through the inspection wiring 100 connected to the source (or drain). Therefore, by measuring the voltage obtained at the inspection terminal 101 at this time, it is possible to detect the amount of current actually flown by the TFT in the corresponding dummy pixel circuit by converting it into voltage data.
- inspection signals voltage signals that enable the dummy drive TFT 40d to operate
- the test result for the dummy pixel circuit corresponding to the voltage signal power obtained in step 3 is obtained, and the test data (current characteristic data) can be obtained for each dummy pixel.
- the first pixel column of the force matrix showing only the dummy pixel circuit provided in the row direction is similarly set as a dummy pixel circuit, and each pixel circuit in this column is inspected.
- the pixels in the column direction can be similarly inspected by connecting them with the wiring 100 and pulling them out to the inspection terminals 101. That is, a selection signal is sequentially output to the gate signal line 51 of each row, and an inspection signal is output to the data signal line 52 of the first column, so that the dummy pixel columns are sequentially arranged for each row.
- the characteristics of each dummy pixel in the column direction can be measured.
- the inspection wiring 100 can be commonly connected to all the dummy pixel circuits in the column direction and the row direction. This is because if each dummy pixel is driven in turn and a corresponding inspection signal is supplied to the dummy pixel each time, the inspection result power for each dummy pixel in the column direction and the row direction can be obtained at the inspection terminal 101 in order.
- the inspection wiring 100 can be connected to all the pixels with a single inspection wiring 110, even if this built-in inspection unit 130 is provided on the panel substrate, the reduction of the display pixel region 110 due to this can be suppressed to a minimum. it can.
- the inspection wiring 100 is not limited to the configuration provided along the driver on two sides of the substrate 10 as shown in FIG. 1, but the remaining two sides of the display pixel region 110, that is, the third side or the fourth side. It may be further formed on the side.
- FIG. 5 is a conceptual diagram in the case where common inspection wirings 100 are provided on the four sides (left and right and upper and lower sides) of the display pixel region 110. In this case, a built-in inspection element 120 is provided corresponding to the inspection wiring 100 on each side. However, for example, in the examples of FIGS. 1 and 5, on the lower side of the panel, there are many external connection terminals, common wiring for driving power supply wiring, common contact for cathode of EL element, etc.
- the inspection wiring 100 provided on a plurality of sides can be a single common wiring. That is, the built-in test elements 120 provided on each of the plurality of sides are all connected to the test terminal 101 by the single test wiring 100.
- the inspection wiring 100 is arranged at least in the vertical scanning direction and the horizontal scanning direction of the substrate.
- the dummy pixels lined up in these directions that is, the current capability of pixel circuits formed in substantially the same conditions as the dummy pixels and arranged in a matrix in the vertical and horizontal scanning directions in the display pixel region 110 are measured. If possible.
- the inspection wiring 100 is formed at the same time as the anode 61 of the organic EL element, and uses the same ITO film as the anode.
- the present invention is not limited to this, and it is possible to use a layer (conductive film) formed at the same time as the TFT is formed. That is, for example, a refractory metal is used as the inspection wiring 100, and the metal wiring formed simultaneously with the gate electrode 41 (31) and the gate signal line 51 of the TFT, the data signal line 52, and the power supply wiring 53 simultaneously.
- the formed metal wiring can be employed.
- a metal layer formed at the same time as the gate signal line 51 is used, a low resistance wiring can be obtained, and this wiring layer is provided between the driving power supply wiring 53 for supplying current to the dummy driving TFT 40 and an interlayer insulation. Even when the film 15 is formed and the power supply wiring 53 and the inspection wiring 100 cross in the wiring routing layout, it is possible to cross the wiring without needing to take special insulation means.
- the inspection wiring 100 and the built-in inspection element 120 are both arranged inside the panel from the drive circuits HD and VD and at the periphery of the panel outside the display pixel region 110. ing.
- the inspection wiring 100 is formed simultaneously with the anode 61 of the EL element 60.
- the EL element 60 is not formed on the wiring 100, and does not contribute to the actual display.
- the built-in inspection element 120 (dummy pixel circuit) is formed only for one row and one column outside the display pixel region 110 and is connected by one inspection wiring 100. is doing.
- a plurality of rows or a plurality of columns may be provided. By providing multiple rows and multiple columns, the inspection data can be averaged. Therefore, not only local defects can be detected, but also the TFT characteristics variations in the row and column directions due to non-uniformity of laser annealing. It is possible to accurately grasp the tendency, that is, to increase the inspection accuracy.
- FIG. 6 shows another example of the number of built-in test elements 120 installed.
- FIG. 6 shows the scanning direction of the laser beam with respect to the panel when the polycrystalline silicon film used as the active layer of TFT is used to obtain an amorphous silicon force.
- This laser annealing is performed by, for example, shaping pulse laser light (excimer laser light) into a rectangular shape and irradiating the amorphous silicon film with a laser beam while shifting the irradiation position in a predetermined direction.
- the scanning direction of the laser beam coincides with the vertical scanning direction in the TFT array display.
- the major axis direction of the laser beam shaped into a rectangle is set parallel to the display horizontal scanning direction
- the minor axis direction is set parallel to the beam scanning direction and the display vertical scanning direction.
- the columns (in this case, rows) of the built-in test elements 120 arranged in a line or strip along the long axis direction of the shaped beam of laser light may be one column, but the built-in test elements arranged in the beam scanning direction.
- the 120 columns are preferably a plurality of columns. In other words, it is preferable that the number of columns of the built-in inspection elements 120 in the beam scanning direction is larger than the number of columns (here, the number of rows) of the built-in inspection elements 120 in the major axis direction of the shaped beam.
- a plurality of rows are arranged along this scanning direction. It is preferable to provide the built-in test element 120 of the above.
- two rows of internal inspection elements 120 are provided along the long axis direction of the shaped beam, and three rows of internal inspection elements 120 are arranged in the scanning direction of the laser beam.
- the ratio may be 1 row to 2 columns, or 3 or 4 columns may be provided.
- the horizontal scanning direction of the display panel coincides with the scanning direction of the laser beam and the long axis direction of the laser beam shaping beam coincides with the vertical scanning direction of the panel
- the horizontal scanning is performed.
- At least a plurality of rows of the built-in test elements 120 provided along the direction are provided (set to be larger than the number of columns of the built-in test elements 120 provided along the vertical scanning direction).
- the built-in test elements 120 provided in a plurality of rows are pulled out to the test terminals 101 by connecting at least each row to the common test wiring 100.
- the inspection wirings 100 provided in a plurality of rows are located near the terminal end of the previous row drawn to the inspection terminal 101 (the end of the display pixel region 110). In the vicinity of each other, a method of connecting them to each other and pulling them out to the inspection terminal 101 as a single wiring is preferable. Even when the built-in test elements 120 are provided in a plurality of columns or a plurality of rows (or both), the characteristic detection method of each element 120 is the same as in the case of one column and one row.
- the inspection wiring 100 is commonly connected to a plurality of columns of built-in test elements 120, it corresponds to the total current flowing through the plurality of columns of built-in test elements 120 belonging to the same row.
- a method of detecting a voltage signal can be adopted, and the average value of the characteristics of a plurality of columns can be inspected in a short time.
- the detection accuracy improves as the number of columns and rows of the built-in test elements 120 increases.
- the force required to reduce the area of the pixel display region 110 on the panel substrate due to the provision of a plurality of these. Incurs an increase in size. Therefore, suppression of reduction in display area (prevention of panel enlargement) It is preferable to provide the minimum number of built-in test elements 120 for realizing the necessary detection accuracy while achieving the above.
- the plurality of built-in inspection elements 120 provided along the laser beam scanning direction are provided as adjacent as possible to each column. It is preferable from the viewpoint of improving inspection accuracy. If they are arranged adjacent to each other, the element manufacturing conditions, and in particular the laser annealing conditions, can be approximated between adjacent elements 120, and it is not necessary to consider the factors of characteristic fluctuations due to differences in manufacturing conditions, etc. This is because the significance of testing is increased.
- the intensity variation in the major axis direction of the shaped beam of laser light has area characteristics based on the dimensions of the laser optical system, etc., and continuity due to the use of the same optical system. This is easier than the variation in the scanning direction. Furthermore, the characteristic variation of each element is actually detected by the built-in test elements 120 that are actually arranged along the long axis direction of the shaped beam of the laser beam, and the built-in test elements 120 in a plurality of column directions are connected. It is easy to correct the detection signals respectively obtained in V and in the beam long axis direction.
- the number of the built-in test elements 120 arranged is not limited to the case where the test wiring 100 has the same layer force as the anode, and even when other TFT configuration conductive layers are used, It is preferable to reduce the number while achieving high detection accuracy so as not to increase the size of the display or reduce the display area.
- the circuit configuration of the display pixel has been shown to be a configuration of two types of element circuits, that is, a selection TFT and a driving TFT.
- the present invention is not limited thereto.
- it may have a structure with a correction circuit TFT that corrects the threshold voltage of the driving TFT to make the display more uniform, and is used to detect the non-uniformity of the driving TFT remaining after the threshold voltage correction.
- the same effect can be obtained.
- the present invention is not limited to inputting a voltage signal as in the present invention called voltage driving, but is also applied to detection when a current signal called current driving is input and a driving TFT is controlled through a driving circuit.
- the form can be adapted.
- a dummy area is provided in a part of the pixel, and the elements and wirings are provided there. And arrange thus, it is possible to inspect not only the periphery but also the display area. In that case, point defects such as horizontal stripes and vertical stripes only in a wide area, or defects in the area of several pixels (the brighter ones are called “white spots” and the darker ones are called “dim dots”). ) Can be detected, and the effect of inspection is further improved.
- connection wiring overlaps the drain signal line 52 and the gate signal line 51, which are existing wirings, thereby forming a parasitic capacitance between the wirings.
- Parasitic capacitance causes signal propagation distortion (signal delay) and degrades display quality such as crosstalk.
- the S / N may be reduced due to the parasitic capacitance when performing high-speed processing such as shortening the test time. In that case, measures can be taken by reducing the parasitic capacitance by reducing the line width of the connection wiring on other wiring.
- the corresponding video signal data may be set to a potential at which the dummy drive TFT 40d is completely turned off. For example, by setting the potential of the inspection terminal 101 to the same potential as that of the drive power supply line 53, the potential may be set such that a current hardly flows to the dummy drive TFT 40d.
- the inspection readout terminal 101 can share a cathode voltage input terminal (panel completed body) of an unnecessary EL element in the TFT array (EL not formed state). This eliminates the need for a dedicated terminal for inspection and enables a narrow frame by reducing the number of terminals.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2006531746A JPWO2006016662A1 (ja) | 2004-08-11 | 2005-08-11 | 半導体素子マトリクスアレイ、その製造方法及び表示パネル |
KR1020077003177A KR20070032808A (ko) | 2004-08-11 | 2005-08-11 | 반도체 소자 매트릭스 어레이, 그 제조 방법 및 표시 패널 |
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JP2004-234578 | 2004-08-11 | ||
JP2004234578 | 2004-08-11 |
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WO2006016662A1 true WO2006016662A1 (ja) | 2006-02-16 |
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PCT/JP2005/014784 WO2006016662A1 (ja) | 2004-08-11 | 2005-08-11 | 半導体素子マトリクスアレイ、その製造方法及び表示パネル |
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JP (1) | JPWO2006016662A1 (ja) |
KR (1) | KR20070032808A (ja) |
TW (1) | TWI269448B (ja) |
WO (1) | WO2006016662A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007234679A (ja) * | 2006-02-27 | 2007-09-13 | Hitachi Displays Ltd | 有機el表示装置 |
JP2007235106A (ja) * | 2006-01-31 | 2007-09-13 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
EP2058697A1 (en) * | 2006-08-31 | 2009-05-13 | Sharp Kabushiki Kaisha | Display panel, and display device having the panel |
JP2011187408A (ja) * | 2010-03-11 | 2011-09-22 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置及びその製造方法 |
JP2015129941A (ja) * | 2014-01-08 | 2015-07-16 | アップル インコーポレイテッド | 金属引き回し抵抗を減少したディスプレイ回路 |
CN106206619A (zh) * | 2016-08-31 | 2016-12-07 | 厦门天马微电子有限公司 | 阵列基板及其驱动方法和显示装置 |
CN109375439A (zh) * | 2018-12-20 | 2019-02-22 | 武汉华星光电技术有限公司 | 阵列基板及显示面板 |
Families Citing this family (3)
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WO2011099343A1 (en) | 2010-02-12 | 2011-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
KR102078994B1 (ko) * | 2013-10-14 | 2020-02-19 | 엘지디스플레이 주식회사 | 액정표시장치 및 이의 검사방법 |
KR102569929B1 (ko) * | 2018-07-02 | 2023-08-24 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
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- 2005-08-11 WO PCT/JP2005/014784 patent/WO2006016662A1/ja active Application Filing
- 2005-08-11 JP JP2006531746A patent/JPWO2006016662A1/ja active Pending
- 2005-08-11 TW TW094127261A patent/TWI269448B/zh not_active IP Right Cessation
- 2005-08-11 KR KR1020077003177A patent/KR20070032808A/ko not_active Application Discontinuation
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JPH1165487A (ja) * | 1997-08-21 | 1999-03-05 | Seiko Epson Corp | アクティブマトリクス型表示装置 |
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JP2007235106A (ja) * | 2006-01-31 | 2007-09-13 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
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EP2058697A1 (en) * | 2006-08-31 | 2009-05-13 | Sharp Kabushiki Kaisha | Display panel, and display device having the panel |
EP2058697A4 (en) * | 2006-08-31 | 2010-09-22 | Sharp Kk | DISPLAY PANEL AND DISPLAY DEVICE COMPRISING SAID PANEL |
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JP2015129941A (ja) * | 2014-01-08 | 2015-07-16 | アップル インコーポレイテッド | 金属引き回し抵抗を減少したディスプレイ回路 |
JP2017107595A (ja) * | 2014-01-08 | 2017-06-15 | アップル インコーポレイテッド | 金属引き回し抵抗を減少したディスプレイ回路 |
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KR101837343B1 (ko) * | 2014-01-08 | 2018-03-09 | 애플 인크. | 금속 라우팅 저항이 감소된 디스플레이 회로 |
CN106206619A (zh) * | 2016-08-31 | 2016-12-07 | 厦门天马微电子有限公司 | 阵列基板及其驱动方法和显示装置 |
CN106206619B (zh) * | 2016-08-31 | 2019-10-11 | 厦门天马微电子有限公司 | 阵列基板及其驱动方法和显示装置 |
CN109375439A (zh) * | 2018-12-20 | 2019-02-22 | 武汉华星光电技术有限公司 | 阵列基板及显示面板 |
US11037961B2 (en) | 2018-12-20 | 2021-06-15 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Array substrate and display panel |
Also Published As
Publication number | Publication date |
---|---|
TWI269448B (en) | 2006-12-21 |
TW200614516A (en) | 2006-05-01 |
KR20070032808A (ko) | 2007-03-22 |
JPWO2006016662A1 (ja) | 2008-05-01 |
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