WO2006011204A1 - 鉛フリーはんだ合金 - Google Patents
鉛フリーはんだ合金 Download PDFInfo
- Publication number
- WO2006011204A1 WO2006011204A1 PCT/JP2004/010803 JP2004010803W WO2006011204A1 WO 2006011204 A1 WO2006011204 A1 WO 2006011204A1 JP 2004010803 W JP2004010803 W JP 2004010803W WO 2006011204 A1 WO2006011204 A1 WO 2006011204A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- lead
- free solder
- heat cycle
- mass
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Definitions
- the present invention relates to a lead-free solder alloy, particularly a lead-free solder alloy suitable for forming a minute soldering portion such as a solder bump.
- BGA Bit Grid Arrey
- CSP Chip Size Package
- solder bumps are formed in advance on the electrodes, and when mounting on a printed circuit board, the solder bumps are placed on the soldered part of the printed circuit board and then heated by a heating device such as a reflow furnace. Melt the bumps. Then, the solder bumps formed on the BGA etc. will be soldered between the electrodes of the BGA etc. and the soldering part of the printed circuit board.
- wire bonding is performed in which the electrodes on the wafer and the electrodes on the work on which the wafer is mounted are connected with a fine gold wire.
- the connection work is very fast, and a single connection can be made in a short time of less than 0.1 seconds.
- wire bonding can be performed at high speed, it takes time to connect all electrodes in an electronic component with a large number of electrodes, because the gold wire is connected to each electrode. I needed it.
- gold wire is a precious metal, if the material itself is expensive, the power, the number that can be reached
- a DCA (Direct Chip Attachment) method has been adopted in which the electrical connection between the wafer and the work is directly connected to each other without using a gold wire.
- solder bumps are formed in advance on the electrodes of the wafer, and when the wafer is mounted on a workpiece, the solder bumps are placed on the workpiece electrodes and the solder bumps are placed. In this case, conduction is established between the two by melting the cup.
- the DCA method does not use gold wire, so it can be manufactured at a low cost, and the power can be connected to all the electrodes in one operation. Therefore, recently, connection by solder bumps has been widely adopted for connecting electrodes in the DCA system. In this connection by solder bump, even if a large number of electrodes are installed in the center of the work, the work and the electrode of the mounted object are faced to each other and the connection is made with the solder bump. Contacting each other does not happen.
- solder bumps on a BGA or the like or a wafer it is common to use solder balls or solder paste.
- the conventional solder alloy for bump formation is a Pb_Sn solder alloy, and the Pb-Sn solder alloy has been widely used in the solder balls or solder pastes for the solder bumps of the BGA and the wafer as described above.
- This Pb_Sn solder alloy has excellent solderability, so it can perform highly reliable soldering with less occurrence of soldering defects when soldering work and printed circuit boards.
- Lead-free solder is composed of Sn as a main component and Ag, Bi, Cu, Sb, In, Ni, Zn, or the like added thereto as appropriate.
- Conventional strengths Lead-free solders include binary alloys such as Sn-Cu, Sn_Sb, Sn-Bi, Sn_Zn, Sn-Ag, etc. with Sn as the main component, and multi-component lead-free solders with other elements added to the binary alloys. is there.
- Sn-based lead-free solder has inferior solderability compared to conventional Pb-Sn solders, especially binary and multi-element Sn-Cu and Sn-Sb systems.
- Sn-Ag is superior to other binary lead-free solders in terms of solderability, brittleness, aging, etc.
- mopile electronic devices such as mobile phones, notebook computers, digital cameras, and the like
- excellent impact resistance has been demanded in soldered portions where electronic components inside electronic devices are joined.
- mopile electronic devices are often subjected to impacts, and the electronic device at the soldering part is peeled off by this impact, and the function as an electronic device cannot be performed.
- the power you put in your shirt pocket slips out of your pocket when you bend forward, or on a mobile phone with a recent email function, it drops during one-handed operation. .
- solder used in mopile electronic devices has been required to have excellent impact resistance.
- Lead-free solder alloys tend to be less susceptible to drop impact than Pb-Sn solder alloys.
- As a lead-free solder alloy that is resistant to drop impact there is also a lead-fuji-solder that consists of Ag0.5 5 mass%, CuO.Ol—0.1 mass%, P0.001-0.05 mass%, and the balance Sn. (Japanese Patent Application 2003-000788)
- the invention of the Sn_Ag_Cu_Zn-based lead-free solder alloy includes ones that generate little dross and bridges during flow soldering (Japanese Patent Laid-Open No. 2003-326386), and those that have a high electrode diffusion suppression effect. (JP 2002-185130 A).
- Patent Document 1 Japanese Patent Laid-Open No. 3-050286
- Patent Document 2 Japanese Patent Application No. 2003-000788
- Patent Document 3 Japanese Patent Laid-Open No. 2003-326386
- Patent Document 4 Japanese Patent Laid-Open No. 2002-185130
- the Sn-Ag-Cu lead-free solder alloy having excellent heat cycle resistance was not sufficiently strong in impact resistance, particularly in a soldered portion having a small soldering area.
- recent electronic devices have become high-performance and downsized, and the electronic components incorporated in them have become smaller and more sophisticated. On the contrary, the size of is getting smaller.
- the strength of the solder bumps formed on the electrodes of electronic components that have been reduced in this way is also small.
- the solder in the small lead-free soldering area is weak in impact resistance, the electronic device is subject to a drop-like impact. In addition, the soldered part easily peels off and the function as an electronic device cannot be performed.
- the present invention AgO. L-less than 2.0 wt%, CuO.01- 0.2 mass 0/0, ZnO.005- 0.1 mass 0/0, a lead-free solder alloy and the balance Sn is there.
- Ag has an effect on heat cycle resistance. If the amount of additive is less than 0.1% by mass, the effect of improving heat cycle resistance will not appear, and the effect will be less than 2.0% by mass If it is too much, the impact resistance will be reduced.
- Cu can further improve impact resistance. If the amount of Cu to be added is less than 0.01% by mass, the effect of improving the impact resistance will not appear, and if it is contained more than 0.2% by mass, many voids will be generated in the soldered part.
- Addition of Zn is effective in impact resistance after thermal aging, and if the amount of addition is less than 0.005 mass%, the effect of improving impact resistance does not appear, exceeding 0.1 mass%. When added, the wettability of the solder alloy is significantly reduced and the frequency of void generation increases.
- the Sn-Ag-Cu-Zn-based lead-free solder alloy of the present invention 0.0005 0.1% by mass of at least one selected from Ga, Ge, and P can also be added. These elements are effective in preventing yellowing of lead-free solder. This yellowing is confirmed when a high temperature storage test is performed on electronic parts such as BGA using lead-free solder. This high-temperature storage test is remarkably confirmed when left in a high-temperature atmosphere at a force of S and 125 ° C for different conditions depending on the electronic component manufacturer and the electronic device set manufacturer. If the surface of the solder bump turns yellow in the high temperature storage test, when the solder bump is inspected by image processing, it cannot be accurately inspected, causing an error. Ga, Ge and P are effective in preventing yellowing In order to prevent yellowing, it is necessary to add 0.0005% by mass of at least one of these.
- the Sn-Ag-Cu-Zn-based lead-free solder alloy of the present invention is obtained by adding at least one selected from Ga, Ge, and P to an Ag-Cu-Zn-based lead-free solder and further adding Ni. or Co and may 0.01 0.1 0/0 added to. These elements are effective in the heat cycle resistance of lead-free solder. If the soldered part is very small like BGA, the electronic part may be used repeatedly. If it is exposed to a heat cycle for many years, the soldered part may break down. In the present invention, Sn_Ag_Cu-Zn lead-free solder,
- the present invention is intended to improve impact resistance and heat cycle resistance at a minute soldered portion.
- a solder bump is a suitable application for this purpose. Even when used for soldering, it is effective in improving impact resistance and heat cycle resistance.
- solder bump formation it is often used as solder balls or solder paste. That is, solder balls are mounted on a substrate such as BGA for BGA, etc., and solder bumps are formed by melting the solder balls. Solder paste is applied to the wafer on the wafer, and the solder paste is melted. By doing so, solder bumps are formed.
- the lead-free solder alloy of the present invention has better impact resistance after bump formation and heat cycle resistance than conventional lead-free solder alloys, it is accidentally dropped during use or transportation of electronic equipment.
- the lead-free solder alloy of the present invention does not turn yellow even when a high-temperature test is performed after the solder bump is formed, so that no error occurs during the image inspection of the solder bump, and the inspection performance is excellent. It is. BEST MODE FOR CARRYING OUT THE INVENTION
- a lead-free solder alloy of the present invention was prepared with the composition shown in Table 1, and a drop impact resistance test, a heat cycle test, and a discoloration test were performed together with the solder alloy of the comparative example.
- the lead-free solder alloy of the present invention and the solder alloy of the comparative example were prepared with the composition shown in Table 2, and the generation of voids was compared.
- Table 1 shows examples of lead-free solder alloys and comparative examples.
- Solder paste is printed on a CSP with a size of 10 x 10 mm and 150 electrodes, and a solder ball with a diameter of 0.3 mm is placed. With what you stored
- Heat cycle A heat cycle is applied to a printed circuit board on which electronic components are mounted, and the number of times until the soldered portion is broken is measured.
- Discoloration test (yellowing): The yellowing of the solder surface after high-temperature heating is visually observed.
- solder balls placed on the CSP are melted in a reflow furnace to form solder bumps.
- solder balls placed on the CSP are melted in a reflow furnace to form solder bumps.
- the lead-free solder alloy of the present invention is excellent in impact resistance and heat cycle resistance after being exposed to thermal aging, and is excellent in that the solder discoloration causes little generation of voids.
- the lead-free solder alloy of the present invention is not limited to mopile devices such as mobile phones, notebook computers, and digital cameras, but also small electronic devices such as remote controllers and printed circuit boards for manual tools that can fall. It can be applied to.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005518101A JP3827322B2 (ja) | 2004-07-29 | 2004-07-29 | 鉛フリーはんだ合金 |
EP04771016A EP1772225A4 (en) | 2004-07-29 | 2004-07-29 | LEAD-FREE SOLDERING ALLOY |
CN2004800409997A CN1905985B (zh) | 2004-07-29 | 2004-07-29 | 无铅焊锡合金 |
US11/578,827 US20070243098A1 (en) | 2004-07-29 | 2004-07-29 | Lead-Free Solder |
PCT/JP2004/010803 WO2006011204A1 (ja) | 2004-07-29 | 2004-07-29 | 鉛フリーはんだ合金 |
TW093137797A TWI275648B (en) | 2004-07-29 | 2004-12-07 | Lead-free solder alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/010803 WO2006011204A1 (ja) | 2004-07-29 | 2004-07-29 | 鉛フリーはんだ合金 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006011204A1 true WO2006011204A1 (ja) | 2006-02-02 |
Family
ID=35785963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/010803 WO2006011204A1 (ja) | 2004-07-29 | 2004-07-29 | 鉛フリーはんだ合金 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070243098A1 (ja) |
EP (1) | EP1772225A4 (ja) |
JP (1) | JP3827322B2 (ja) |
CN (1) | CN1905985B (ja) |
TW (1) | TWI275648B (ja) |
WO (1) | WO2006011204A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009078299A (ja) * | 2007-09-07 | 2009-04-16 | Hitachi Metals Ltd | 耐落下衝撃性に優れたはんだ合金、およびそれを用いたはんだボール、ならびにはんだ接合部 |
WO2009051240A1 (ja) * | 2007-10-17 | 2009-04-23 | Ishikawa Metal, Co., Ltd. | 鉛フリーはんだ |
WO2012023440A1 (ja) * | 2010-08-18 | 2012-02-23 | 新日鉄マテリアルズ株式会社 | 半導体実装用半田ボール及び電子部材 |
CN102806429A (zh) * | 2011-05-30 | 2012-12-05 | 日立电线株式会社 | 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件 |
JP2017159314A (ja) * | 2016-03-08 | 2017-09-14 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
US11999001B2 (en) | 2012-12-03 | 2024-06-04 | Adeia Semiconductor Technologies Llc | Advanced device assembly structures and methods |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7750475B2 (en) * | 2003-10-07 | 2010-07-06 | Senju Metal Industry Co., Ltd. | Lead-free solder ball |
WO2006129713A1 (ja) | 2005-06-03 | 2006-12-07 | Senju Metal Industry Co., Ltd. | 鉛フリーはんだ合金 |
TWI465312B (zh) * | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Cu濃度及Ni濃度之調整方法 |
TWI394846B (zh) * | 2008-09-22 | 2013-05-01 | 無鉛含銀焊錫廢渣資源再生之方法 | |
JP4554713B2 (ja) * | 2009-01-27 | 2010-09-29 | 株式会社日本フィラーメタルズ | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 |
CN101791748A (zh) * | 2010-04-07 | 2010-08-04 | 上海交通大学 | 抑制固态界面反应的Sn-Ag-Cu-Zn-Ge无铅钎料及其制备方法 |
US20110281256A1 (en) | 2010-05-17 | 2011-11-17 | Michael Glenn Davis | Systems and Methods of Detecting and Demonstrating Hair Damage Via Evaluation of Protein Fragments |
CN102554489A (zh) * | 2011-12-28 | 2012-07-11 | 宁波圣之岛焊锡材料有限公司 | 一种低松香无卤素无铅焊锡膏及其制备方法 |
CN103732349B (zh) * | 2012-08-08 | 2015-11-25 | 千住金属工业株式会社 | 高温无铅焊料合金 |
CN102848100B (zh) * | 2012-10-10 | 2015-03-25 | 南京航空航天大学 | 含Nd、Ga的低银Sn-Ag-Cu无铅钎料 |
CN103243234B (zh) * | 2013-04-27 | 2015-08-26 | 深圳市同方电子新材料有限公司 | 一种电子封装软钎焊用系列低银无铅钎料及其制备方法 |
CN109014652A (zh) * | 2018-09-26 | 2018-12-18 | 深圳市安臣焊锡制品有限公司 | 一种环保型焊锡材料及其制备工艺 |
CN111673312B (zh) * | 2020-05-29 | 2022-02-22 | 西安理工大学 | 一种电子封装用Sn-Ag-Cu系无铅焊料及其制备方法 |
CN114769936B (zh) * | 2022-04-25 | 2023-09-26 | 深圳市兴鸿泰锡业有限公司 | 一种波峰焊锡条及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002239780A (ja) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
JP2003326386A (ja) * | 2002-05-13 | 2003-11-18 | Matsushita Electric Ind Co Ltd | 無鉛はんだ合金 |
JP2003334688A (ja) * | 2002-05-20 | 2003-11-25 | Hitachi Metals Ltd | はんだ合金およびはんだボール |
JP2004141910A (ja) * | 2002-10-23 | 2004-05-20 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2004214468A (ja) * | 2003-01-07 | 2004-07-29 | Senju Metal Ind Co Ltd | リードレス部品および鉛フリーはんだ |
Family Cites Families (4)
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JP3753168B2 (ja) * | 1999-08-20 | 2006-03-08 | 千住金属工業株式会社 | 微小チップ部品接合用ソルダペースト |
US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
CN1230567C (zh) * | 2003-07-02 | 2005-12-07 | 中国科学院金属研究所 | 一种抗液态表面氧化的工业纯锡及其应用 |
-
2004
- 2004-07-29 EP EP04771016A patent/EP1772225A4/en not_active Withdrawn
- 2004-07-29 JP JP2005518101A patent/JP3827322B2/ja not_active Expired - Lifetime
- 2004-07-29 CN CN2004800409997A patent/CN1905985B/zh not_active Expired - Lifetime
- 2004-07-29 US US11/578,827 patent/US20070243098A1/en not_active Abandoned
- 2004-07-29 WO PCT/JP2004/010803 patent/WO2006011204A1/ja active Application Filing
- 2004-12-07 TW TW093137797A patent/TWI275648B/zh active
Patent Citations (5)
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JP2002239780A (ja) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
JP2003326386A (ja) * | 2002-05-13 | 2003-11-18 | Matsushita Electric Ind Co Ltd | 無鉛はんだ合金 |
JP2003334688A (ja) * | 2002-05-20 | 2003-11-25 | Hitachi Metals Ltd | はんだ合金およびはんだボール |
JP2004141910A (ja) * | 2002-10-23 | 2004-05-20 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2004214468A (ja) * | 2003-01-07 | 2004-07-29 | Senju Metal Ind Co Ltd | リードレス部品および鉛フリーはんだ |
Non-Patent Citations (1)
Title |
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See also references of EP1772225A4 * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009078299A (ja) * | 2007-09-07 | 2009-04-16 | Hitachi Metals Ltd | 耐落下衝撃性に優れたはんだ合金、およびそれを用いたはんだボール、ならびにはんだ接合部 |
WO2009051240A1 (ja) * | 2007-10-17 | 2009-04-23 | Ishikawa Metal, Co., Ltd. | 鉛フリーはんだ |
JPWO2009051240A1 (ja) * | 2007-10-17 | 2011-03-03 | 石川金属株式会社 | 鉛フリーはんだ |
US9024442B2 (en) | 2010-08-18 | 2015-05-05 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder ball for semiconductor packaging and electronic member using the same |
CN102666002A (zh) * | 2010-08-18 | 2012-09-12 | 新日铁高新材料株式会社 | 半导体安装用钎料球和电子部件 |
JP5413926B2 (ja) * | 2010-08-18 | 2014-02-12 | 新日鉄住金マテリアルズ株式会社 | 半導体実装用半田ボール及び電子部材 |
CN102666002B (zh) * | 2010-08-18 | 2014-09-10 | 新日铁住金高新材料株式会社 | 半导体安装用钎料球和电子部件 |
WO2012023440A1 (ja) * | 2010-08-18 | 2012-02-23 | 新日鉄マテリアルズ株式会社 | 半導体実装用半田ボール及び電子部材 |
CN102806429A (zh) * | 2011-05-30 | 2012-12-05 | 日立电线株式会社 | 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件 |
JP2012245554A (ja) * | 2011-05-30 | 2012-12-13 | Hitachi Cable Ltd | Pbフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品 |
CN102806429B (zh) * | 2011-05-30 | 2016-01-20 | 日立金属株式会社 | 无Pb焊料、焊料被覆导体以及使用该无Pb焊料的电气部件 |
US11999001B2 (en) | 2012-12-03 | 2024-06-04 | Adeia Semiconductor Technologies Llc | Advanced device assembly structures and methods |
JP2017159314A (ja) * | 2016-03-08 | 2017-09-14 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
US10773345B2 (en) | 2016-03-08 | 2020-09-15 | Senju Metal Industry Co., Ltd. | Solder alloy, solder ball, chip solder, solder paste, and solder joint |
Also Published As
Publication number | Publication date |
---|---|
TWI275648B (en) | 2007-03-11 |
CN1905985A (zh) | 2007-01-31 |
EP1772225A1 (en) | 2007-04-11 |
JP3827322B2 (ja) | 2006-09-27 |
CN1905985B (zh) | 2010-12-08 |
US20070243098A1 (en) | 2007-10-18 |
JPWO2006011204A1 (ja) | 2010-01-21 |
EP1772225A4 (en) | 2009-07-29 |
TW200604349A (en) | 2006-02-01 |
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