WO2006006730A1 - 平面モータ装置、ステージ装置、露光装置及びデバイスの製造方法 - Google Patents
平面モータ装置、ステージ装置、露光装置及びデバイスの製造方法 Download PDFInfo
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- WO2006006730A1 WO2006006730A1 PCT/JP2005/013339 JP2005013339W WO2006006730A1 WO 2006006730 A1 WO2006006730 A1 WO 2006006730A1 JP 2005013339 W JP2005013339 W JP 2005013339W WO 2006006730 A1 WO2006006730 A1 WO 2006006730A1
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- Prior art keywords
- stage
- motor device
- wst
- planar motor
- moving
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
- H02K1/12—Stationary parts of the magnetic circuit
- H02K1/14—Stator cores with salient poles
- H02K1/146—Stator cores with salient poles consisting of a generally annular yoke with salient poles
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
- H02K2201/18—Machines moving with multiple degrees of freedom
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Definitions
- Planar motor apparatus Planar motor apparatus, stage apparatus, exposure apparatus, and device manufacturing method
- the present invention relates to a planar motor device that two-dimensionally drives a moving unit with respect to a fixed unit, a stage device that includes the planar motor device as a driving unit, and an exposure apparatus that includes the stage device.
- an exposure apparatus is used that transfers a pattern formed in a mask to a substrate such as a glass plate or wafer coated with a photoresist via a projection optical system.
- the substrate is held on the substrate holder by vacuum suction or the like, and the substrate holder is fixed on the substrate table.
- a stage device that positions a substrate by driving a substrate table on which the substrate is placed in a two-dimensional direction without contact.
- This contactless drive step As a drive source of a driving device, for example, a planar motor having a structure in which a variable magnetoresistive drive type linear pulse motor is coupled for two axes is known.
- variable magnetoresistive drive type linear pulse motor includes, for example, a stator composed of a plate-like magnetic body in which uneven teeth are formed at equal intervals in the longitudinal direction, and an uneven protrusion of the stator.
- the substrate stage is required to move at a higher acceleration.
- the thrust In order to increase the thrust, the current flowing through the coil is increased, or the permanent magnet is enlarged and the magnetic flux formed by the permanent magnet What is necessary is just to raise a density.
- the above planar motor if a large current is passed through the coil, the amount of heat generation increases, and mechanical errors due to, for example, expansion of members constituting the substrate stage are generated due to the heat generated from the coil. In particular, the positioning accuracy is deteriorated.
- the weight of the moving part will increase. If the weight of the moving part increases, even if the thrust is increased, the acceleration cannot be increased, and the positioning accuracy of the substrate stage may be deteriorated. Also, When the weight of the moving part increases, in order to increase the acceleration, it is necessary to pass a larger current through the coil, and the efficiency becomes worse. On the other hand, if the permanent magnet is reduced in size, the moving part will be lighter, but the magnetic flux density formed by the permanent magnet will be lower, and it will be necessary to pass a larger amount of current through the coil to obtain the same thrust. Arise.
- the present invention has been made in view of the above circumstances, and is a planar motor device that can move with high acceleration, achieve high positioning accuracy, and can be driven efficiently. It is an object of the present invention to provide a stage apparatus provided with a motor device as drive means, and an exposure apparatus provided with the stage device. Disclosure of the invention
- the planar motor device of the present invention includes a fixed portion (16) that forms a predetermined moving surface, and a moving portion (17) that can move along the moving surface.
- a planar motor device wherein the fixed portion is disposed along the moving surface, each of which includes a plurality of core members (2 2) each including a magnetic body, and a coil (2) magnetically connected to each of the core members ( 2 1), and the moving part includes a magnetic member (2 6) arranged along the moving surface on the side facing the fixed part.
- the magnetic flux generated from each of the coils is guided to the moving surface through the magnetically connected core member, and repels the magnetic flux generated from the magnet provided in the moving part, or Aspirate each other. This repulsive force and suction force generate a thrust in the moving part, and the moving part moves along the moving surface.
- the stage device of the present invention also has a stage (25, 25) on which the object (R, W) is placed.
- a stage device (RST, WST) provided with the above-mentioned planar motor device as a drive means for the stage.
- the exposure apparatus of the present invention further includes a mask stage (RST) that holds a mask (R) and a substrate stage (WS T) that holds a substrate (W), and the pattern formed on the mask is transferred to the substrate.
- the stage can be moved with high acceleration, so that the object can be transported at high speed in a short time.
- FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention.
- FIG. 2 is a top view showing the configuration of the wafer stage W ST.
- FIG. 3 is a top view of the stage unit WST 1 provided on the wafer stage WST.
- FIG. 4 is a cross-sectional view taken along line AA in FIG.
- FIG. 5 is an enlarged view of the core member 22.
- FIG. 6 is a cross-sectional arrow view along the line BB in FIG.
- FIG. 7 is a sectional view taken along line C-C in FIG.
- FIG. 8 is a flowchart showing a part of a manufacturing process for manufacturing a liquid crystal display element as a micro device.
- Fig. 9 is a flowchart showing a part of the manufacturing process for manufacturing a semiconductor element as a microphone port device.
- FIG. 10 is a diagram showing an example of a detailed flow of step S 13 in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention.
- An exposure apparatus 10 shown in FIG. 1 is an exposure apparatus for manufacturing semiconductor elements, and is a step for transferring the pattern formed on the reticle sequentially onto the wafer W while moving the reticle R and the wafer W synchronously. It is a de-scanning type reduction projection type exposure apparatus.
- an XYZ orthogonal coordinate system is set in the figure, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system.
- This XYZ orthogonal coordinate system is set so that the X-axis and Z-axis are parallel to the paper surface, and the Y-axis is set to a direction perpendicular to the paper surface.
- the XYZ coordinate system in the figure the XY plane is actually set parallel to the horizontal plane, and the Z axis is set vertically upward. It is assumed that the synchronous movement direction (scanning direction) of the wafer W and reticle R during exposure is set in the Y direction.
- the exposure apparatus 10 includes an illumination optical system I LS, a reticle stage RST that holds a reticle R as a mask, a projection optical system PL, and a wafer W as a substrate in the X direction in the XY plane. And a wafer stage WST as a stage device including stage units WST 1 and WST 2 that move in a two-dimensional direction in the Y direction, and a main controller MCS that controls them.
- the wafer stage WST is a stage unit WS provided with various measuring instruments for measuring the performance of the exposure apparatus 10 in addition to the stage units WST1 and WST2. T 3 (see Figure 2) is also provided. The stage unit WST 3 will be described later.
- the illumination optical system I LS performs the shaping of the exposure light emitted from a light source unit (not shown) (for example, a laser light source such as an ultra-high pressure halogen lamp or an excimer laser) and makes the illuminance distribution uniform, and the rectangular shape on the reticle R ( Irradiate the illumination area I AR with a uniform illuminance.
- the reticle stage RST has a structure in which a stage movable portion 11 is provided on a reticle base (not shown). During exposure, the stage movable portion 11 moves on the reticle base at a predetermined scanning speed along a predetermined scanning direction. Moving.
- a reticle is held on the upper surface of the stage movable unit 11 by, for example, vacuum suction.
- An exposure light passage hole (not shown) is formed below the reticle R of the stage movable portion 11.
- a reflecting mirror 12 is arranged at the end of the stage movable part 11 and the position of the stage movable part 11 is detected by the laser interferometer 13 measuring the position of the reflecting mirror 12. Is done.
- the detection result of the laser interferometer 13 is output to the stage control system SCS.
- the stage control system SCS drives the stage movable unit 11 based on the detection result of the laser interferometer 13 and the control signal from the main controller MCS based on the moving position of the stage movable unit 11.
- a mark (reticle mark) formed on the reticle R is formed above the reticle stage R ST and a reference member for defining a reference position of the wafer stage WST.
- a reticle alignment sensor is provided for observing the reference marks at the same time and measuring their relative positional relationship.
- the projection optical system PL is a reduction optical system whose reduction magnification is x ( ⁇ is, for example, 4 or 5), for example, and is disposed below the reticle stage RST, and the direction of the optical axis ⁇ is set to the ⁇ axis direction.
- a refractive optical system including a plurality of lens elements arranged at predetermined intervals along the optical axis ⁇ direction is used so as to achieve a telecentric optical arrangement.
- An appropriate lens element is selected according to the wavelength of light emitted from the light source unit.
- a reduced image (partial inverted image) of the pattern in the illumination area I AR of the reticle R is conjugated to the illumination area I AR on the wafer W. It is formed in the exposed area I.
- FIG. 2 is a top view showing the configuration of wafer stage WST.
- wafer stage WST is a stage unit supported by levitating with a base member 14 and an air slider described later via a clearance of about several ⁇ above the upper surface of base member 14.
- Stage units WST 1 and ⁇ 3 to 2 are provided to hold and transport wafers ⁇ , and stage unit WST 3 is used to transport various measuring instruments that measure the performance of the exposure apparatus 10 Is provided.
- Various measurements The equipment is attached to the stage unit WST 3.
- Stage units WST 1 to WST 3 are individually driven by drive devices 15 to individually move stage WST 1 to WST 3 in any direction within the XY plane. be able to.
- the position where the stage unit WST 2 is arranged is the loading position of wafer W, and when unloading the wafer W that has been exposed, the unexposed wafer W When loading, either stage WST 1 or WST 2 is placed at this position.
- the position where the stage unit WST 1 is arranged is the exposure position, and one of the stage units WST 1 and WST 2 holding the wafer W to be exposed. One is placed at this position during exposure.
- the stage units WST1 and WST2 can be individually moved in any direction in the XY plane, so that the mouth position and the exposure position can be alternately switched. Further, it may be configured to detect wafer focusing information at the loading position.
- the various measuring devices provided in the stage unit WS T 3 are, for example, an illuminance sensor that measures the illuminance of the exposure light irradiated onto the wafer stage WST via the projection optical system PL, and an illuminance that measures the illuminance unevenness of the exposure light.
- Unevenness sensor aerial image measurement device that measures the aerial image of the optical image projected onto the wafer stage W s T via the projection optical system PL, an aberration measurement device that measures the aberration of the projection optical system PL, and the wafer stage WS T
- Wafer stage WST3 is also provided with a reference member on which reference marks for defining the reference position, reference plane, etc.
- the stage unit WST 3 can move in any direction in the XY plane separately from the stage units WST 1 and WST 2, so that, for example, the projection optical system before starting the exposure processing of the wafer W It is possible to measure the illuminance or illuminance unevenness of the exposure light irradiated on the wafer stage WST by moving it below the PL (one Z direction).
- the driving device 15 includes a fixed portion 16 (embedded) provided on the upper portion of the base member 14 and the bottom portions of the stage units WST 1 to WST 3 (on the base facing surface side). And a moving motor 17 fixed to the flat motor.
- a planar motor device is configured by the moving unit 17, the base member 14, and the driving device 15. In the following description, the driving device 15 will be referred to as a planar motor 15 for convenience.
- Wafer W is fixed on stage units WST 1 and WST2, for example, by vacuum suction.
- a movable mirror 19 that reflects the laser beam from the laser interferometer 18 is fixed to one end of the stage units WST 1 to WST 3, and the stage interferometer WSTl is arranged by the laser interferometer 18 arranged outside.
- the position of ⁇ WST3 in the XY plane is always detected with a resolution of about 0.5 to 1 nm, for example.
- FIG. 1 shows a state in which the laser beam from the laser interferometer 18 is applied to the movable mirror 19 provided on the stage unit WST 1, but the stages WS T 2 and ST 3 are also illustrated. A similar laser interferometer is provided.
- the position information (or speed information) of the stage nuts WST1 to WST3 is sent to the main control unit MCS via the stage control system SCS and this.
- the stage control system SCS the stage unit WST 1 to the stage unit WST 1 to WST 3 through the plane motor 15 based on the position information (or speed information) of the stage unit WST 1 to WST 3 according to the instruction from the main controller MCS. Controls the movement of the WST 3 in the XY plane.
- FIG. 3 is a top view of the stage unit WST 1 provided on the wafer stage WST
- FIG. 4 is a sectional view taken along line AA in FIG.
- stage unit WST 1 will be described as a representative here.
- the first stage 25, which is a part of the stage unit WST 1 has a predetermined distance from the fixed part 16 on the fixed part 16 provided on the upper part of the base member 14. (Several several zm) is supported.
- Fixed portion 16 forming a part of wafer stage WST has coil 21 wound around it, and includes core members 22 arranged at a predetermined pitch in the XY plane.
- This core member 22 is formed of a magnetic material such as low carbon steel equivalent to SS 400 or stainless steel, for example, and includes a head portion 2 2 a and a column portion 2 2 b.
- the head 2 2 a has a rectangular cross-sectional shape in the XY plane, and the cross-sectional shape of the column portion 2 2 b in the XY plane has a circular shape.
- the head 2 2 a and the column 2 2 b are integrated, and the coil 21 is wound around the column 2 2 b.
- the shape of the core member 22 (the XY cross section etc.) is not particularly limited. Further, the head portion 2 2 a and the column portion 2 2 b may be integrally formed, or may be joined after individually manufactured.
- FIG. 5 is an enlarged view of the core member 22.
- the coil 21 is wound around the support portion 2 2 b of the core member 2 2 via the heat insulating material Ti. This is to prevent the positioning errors of the stages WST 1 to WST 3 caused by the heat generated when a current is passed through the coil 21 being transmitted to the core member 22. That is, when heat from the coil 21 is transmitted to the core member 22, the core member 22 expands to cause a positional shift in the XY plane of the core member 22, or expands in the Z direction to be described later. This is because the unevenness of the surface 24 is generated, which causes positioning errors of the stage units WST 1 to WST 3.
- the heat insulating material Ti a resin having excellent heat insulating properties and heat resistance can be used.
- a heat insulating material Ti is provided between the core member 22 and the coil 21 to insulate between the two, but the present invention is not limited to this.
- each of them may be supported in a non-contact state.
- the heat of the coil 21 may be made difficult to be transmitted to the core member 22 by flowing air whose temperature is controlled or a refrigerant described later between the core member 22 and the coil 21. Further, heat may be exhausted using a heat sink or the like.
- the core member 2 2 is arranged on the base member 14 so that the tip of the head 2 2 a is substantially included on one surface. At this time, the support member 2 2 b of the core member 2 2 is magnetically connected to the base member 14.
- a separator 23 made of a non-magnetic material is provided between the heads 2 2 a of the core member 2 2.
- the separator 23 is made of, for example, SUS or ceramics, and prevents the magnetic circuit from being formed between the adjacent core members 22. Further, it is provided to prevent the displacement of the head 2 2 a of the core member 2 2.
- the separator 23 can be constituted by, for example, a single plate-like member provided with a plurality of openings into which the respective heads 22a of the plurality of core members 22 are fitted.
- the present invention is not limited to this, and it may be divided into a plurality of members. Since the height position of the upper part of the separator 2 3 is set to be the same as the height position of the head part 2 2 a of the core member 2 2, the upper surface (moving surface) of the fixed part 16 becomes almost flat.
- the separator 2 3 is provided between the heads 2 2 a of the core member 2 2, and the vertical direction is sandwiched between the base member 1 4 and the head 2 2 a of the core member 2 2 and the separator 2 3. A space will be formed. By introducing the refrigerant into this space, the coil 21 can be cooled.
- the refrigerant is a liquid having good electrical insulation, and for example, water (pure water) or an organic solvent such as alcohol, ether, HFE (hydro-fluoro-ether) or fluorinate can be used.
- the refrigerant is adjusted so as to maintain a predetermined temperature by a circulation device (not shown), and is supplied to the space.
- the head portion 2 2 a of the core member 2 2 and the separator 2 3 constitute a wall surface forming a part of the refrigerant flow path.
- an appropriate waterproofing treatment or the like is performed on the head 2 2 a of the core member 2 2 and the separator 2 3 or the like.
- a guide member 24 is provided on the upper surface of the fixed portion 16.
- the guide member 24 4 serves as a guide plate for moving the stage units WST 1 to WST 3 in the XY plane, and is made of a non-magnetic material. Since the thickness of the guide member 24 is as thin as several hundred ⁇ , a magnetic material may be used when a nonmagnetic material cannot be used.
- This guide member 24 is made of, for example, alumina ( ⁇ 1 2 ⁇ 3 ) which is a flat It is formed by spraying the upper surface of the fixed portion 16 and spraying it on the metal surface with high-pressure gas. Further, the guide member 24 may be formed of other ceramics, or SUS or the like may be used.
- the coil 21 provided in the fixed portion 16 is supplied with a three-phase alternating current composed of a U phase, a V phase, and a W phase.
- a three-phase alternating current composed of a U phase, a V phase, and a W phase.
- the stage units WST 1 to WST 3 are moved in a desired direction at a desired speed. be able to.
- FIG. 6 is a sectional view taken along the line BB in FIG.
- the heads 2 2 a of the core member 2 2 having a rectangular cross-sectional shape are arranged in a matrix in the XY plane, and a separator 2 3 is provided between the heads 2 2 a. ing.
- each phase of the three-phase alternating current marked on the coil 21 wound around each core member 22 is shown in association with the head 2 2 a of the core member 2 2. Referring to FIG. 6, it can be seen that the phases of U phase, V phase, and W phase (including the phase of V phase, V phase, and phase) are regularly arranged in the plane. .
- the moving part 17 forming a part of the wafer stage WST includes a first stage 25, a permanent magnet 26, an air pad 27, a second stage 28, a horizontal drive mechanism 29, and a vertical drive mechanism. It is composed of 30.
- Permanent magnets 2 6 and air pads 2 7 are regularly arranged on the bottom surface of the first stage 25.
- Permanent magnets 27 can be rare earth magnets such as neodymium iron cobalt magnets, aluminum 'nickel' connort (alnico) magnets, ferrite magnets, samarium 'cobalt magnets, or neodymium' iron 'boron magnets. It is.
- FIG. 7 is a sectional view taken along the line CC in FIG.
- the permanent magnets 26 are arranged at predetermined intervals in the surface so that adjacent magnets have different poles. With this arrangement, an alternating magnetic field is formed in both the X direction and the ⁇ direction.
- An air pad 27 is provided between the permanent magnets 26. This The pad 27 is adapted to support the moving part 17 with respect to the fixed part 16 with a clearance of several microns, for example, by blowing air toward the guide member 24. Acts as part of an air bearing. Further, a pressurized bearing that applies a pressurized pressure by a vacuum or the like may be used.
- the second stage 28 is supported on the first stage 25 by the vertical drive mechanism 30.
- the vertical drive mechanism 30 includes support mechanisms 30 a, 30 b, and 30 c (see FIG. 3) including, for example, a voice coil motor (VCM), and the support mechanisms 30 a, 30 b, 30 c supports three different points of the second stage 28.
- the support mechanisms 30 a, 30 b, and 30 c are configured to be extendable and contractible in the Z direction.
- the second stage 28 is moved to the Z direction. Rotation of the second stage 28 around the X axis by driving the support mechanisms 30a, 30b, 30c independently, or by driving with different expansion / contraction amounts, respectively.
- the rotation around the Y axis can be controlled.
- the horizontal drive mechanism 29 is provided with drive mechanisms 29 a, 29 b, 29 c (see FIG. 3) including, for example, a voice coil motor (VCM), etc., and these drive mechanisms 29 a, 29 b, 29 c This controls the position of the second stage 28 in the XY plane and the rotation around the Z axis.
- the Y-direction position of the second stage 28 can be varied by driving the drive mechanisms 29a and 29b with the same expansion / contraction amount
- the second mechanism 28c can be driven by driving the drive mechanism 29c.
- the position of the stage 28 in the X direction can be varied, and the rotation of the second stage 28 about the Z axis can be varied by driving the drive mechanisms 29a and 29b with different expansion / contraction amounts.
- the first stage 25 driven by the flat motor 17 described above is a coarse movement stage
- the second stage 28 driven by the horizontal drive mechanism 29 is a fine movement stage.
- the horizontal drive mechanism 29 and the vertical drive mechanism 30 adjust the position of the second stage 28 in the XY plane and the position in the Z direction under the control of the stage control system SCS.
- stage unit WST 1 When the stage unit WST 1 having the above-described configuration is moved, a driving method similar to a known rear air motor that is driven by three-phase alternating current can be used. Tsuma When the stage unit WST 1 is composed of a linear motor configured to be movable in the X direction and a linear motor configured to be movable in the Y direction, the stage unit WST 1 is moved in the X direction.
- the Y direction It is sufficient to apply a three-phase alternating current similar to that of a linear motor configured to be movable in the Y direction to each coil 21 arranged in the.
- a three-phase alternating current similar to that of a linear motor configured to be movable in the Y direction to each coil 21 arranged in the.
- the core member 22 wound around the coil 21 functions as an electromagnet.
- An attractive force and a repulsive force act between the magnetic force (magnetic flux) generated from the electromagnet and the permanent magnet 26 arranged on the stage unit WST (moving part 17). Such an action occurs between each core member 22 and the permanent magnet 26, and the stage unit WST can be moved to a desired position by controlling the three-phase alternating current.
- the core member 22 is arranged in the XY plane so that the front end portion of the head portion 22a is substantially included in the fixed portion 16, and the coil 21 is wound around the core member 22. Because of the rotated configuration, the magnetic flux generated by passing a current through the coil 21 can be effectively guided to the bottom surface of the stage unit WST 1 with little loss. For this reason, the permanent magnet 26 on the bottom surface of the first stage 25 provided in the stage unit WST 1 can be thinned, and the stage unit WST 1 can be reduced in weight.
- the magnetic flux generated from the permanent magnet 26 is weakened by making the permanent magnet 26 thinner, the magnetic flux generated from the coil 21 by the core member 22 can be guided to the bottom surface of the stage unit WST 1 with little loss. Therefore, the thrust is not reduced.
- the stage WST 1 is reduced in weight without causing a reduction in thrust, so that the stage unit WST 1 can be accelerated at a high acceleration and the positioning accuracy can be improved.
- the heat generated by passing an electric current through the coil 21 is removed by the refrigerant introduced into the space sandwiched between the base member 14 and the head portion 22a of the core member 22 and the separator 23 in the vertical direction. can do.
- the coil 21 is connected to the core member 2 via the heat insulating material T i 2 to prevent the deterioration of positioning accuracy caused by expansion or deformation of the core member 2 2 by the heat from the coil 2 1 being transmitted to the core member 2 2. it can. From the above, in this embodiment, the stage unit WST 1 can be driven efficiently. The above-described effects can be obtained for the stage units WST 2 and WST 3 as well.
- the exposure apparatus 10 of the present embodiment includes an air pump 40 for supplying pressurized air to the air pad 27 shown in FIG.
- Air pump 40 and stage units WST 1 and WST 2 are connected via tubes 4 1 and 4 2, respectively. Air from air pump 40 is connected to stage unit WST 1 via tube 4 1. At the same time, it is supplied to the stage unit WST 2 through the tube 42.
- a cooling device 4 3 for cooling the coil 21 shown in FIG. 4 is provided. This cooling device 4 3 is connected to the base member 14 by a refrigerant supply pipe 4 4 and a refrigerant discharge pipe 4 5. It is connected.
- the refrigerant from the cooling device 4 3 is supplied to the base member 14 (the portion where the coil 2 1 in the fixed portion 16 is provided) via the refrigerant supply pipe 4 4, and is supplied via the base member 14. Is recovered by the cooling device 43 through the refrigerant discharge pipe 45.
- a coolant such as water is supplied to the space between which the upper and lower sides are sandwiched between the guide member 24 and the base 14 and in which the coil 21, the core member 22, and the separator 23 are disposed. Can be configured to.
- the exposure apparatus 10 includes an off-axis type wafer sensor for measuring the position information of the alignment mark formed on the wafer W.
- a TTL (through-the-lens) type alignment sensor that measures the positional information of alignment marks formed on the wafer W via the projection optical system PL is provided.
- slit-shaped detection light is irradiated to wafer W from an oblique direction, and the reflected light is measured to detect the position and orientation (rotation around the X and Y axes) of wafer W in the Z direction.
- an autofocus mechanism and a photo-leveling mechanism are provided that correct the position and orientation of the wafer W in the Z direction and align the surface of the wafer W with the image plane of the projection optical system PL. ing.
- the configuration of the planar motor device, the stage device, and the exposure apparatus according to the embodiment of the present invention has been described above. Next, the operation during exposure will be briefly described.
- exposure processing is performed after measuring the performance of the exposure equipment using various measuring instruments provided in the stage unit WST 3.
- main controller MCS for example, retracts both stage units WST 1 and WST 2 from the exposure position, and places stage unit WST 3 in the exposure position instead.
- the reticle loader pattern reticle
- the main controller MCS sets the optical characteristics of the illumination optical system ILS (number of aperture stops, illumination conditions, etc.), emits exposure light from a light source unit (not shown), reticle R and projection optics.
- the illuminance and illuminance unevenness of the exposure light irradiated onto the stage unit WST 3 via the system PL are measured using the illuminance sensor and the illuminance unevenness sensor, respectively.
- the residual aberration of the projection optical system PL is measured using an aberration measuring device.
- the main controller MCS uses the obtained measurement results to adjust the optical characteristics of the illumination optical system ILS and to use one or more lens elements provided in the projection optical system PL.
- the main controller MCS first controls the reticle loader (not shown) to unload the reticle held on the reticle stage RST, and also uses the first reticle used in the exposure process. Load R onto reticle stage RST.
- the main controller MCS Move the unit WST 3 by a predetermined amount and place it below the wafer alignment sensor. Place the reference mark on the reference member within the measurement field of the wafer alignment sensor and use the wafer alignment sensor as a reference. Measure the position information of the mark.
- the baseline amount is obtained from the measurement result of the reticle alignment sensor and the measurement result of the wafer alignment sensor.
- the main controller MCS retracts the stage unit WST3 from the exposure position and, for example, places the stageunit WST1 in the opening position. Then, the stage unit W ST 1 holding the wafer W at the head of the lot is placed below the wafer alignment sensor, and the position of several alignment marks (about 3 to 9) on the wafer W is measured. Then, based on the measurement result, the main controller MCS performs EGA (enhanced global alignment) operation to determine the regularity of the arrangement of all shot areas set on the wafer W.
- EGA calculation refers to position information of marks (alignment marks) formed on each of a part of typical (3 to 9) shot areas set in advance on the wafer W. And a calculation method that determines the regularity of the arrangement of all shot areas set on the wafer W by a statistical method based on the design information.
- the main controller MCS obtains coordinate values obtained by correcting the coordinate values of the obtained shot areas by the above-described baseline amount. If the stage unit WST1 is driven using the corrected coordinate value, each shot area on the wafer W can be aligned with the exposure area IA of the projection optical system PL. Since the exposure apparatus 10 of the present embodiment is a step-and-scan exposure apparatus, when exposing a shot area, the reticle stage RST and stage unit WST 1 are accelerated, and each is predetermined. The main controller MCS emits exposure light from the illumination optical system ILS to illuminate the reticle R, and the pattern image of the reticle R is projected onto the wafer W via the projection optical system PL. Project above.
- a partial pattern image of the reticle R is projected onto the exposure area IA, and the reticle R moves in the X direction (or + X direction) at a velocity V with respect to the projection optical system PL.
- the wafer W moves in the + X direction (or one X direction) at a speed j3 ⁇ V (/ 3 is the projection magnification).
- the main controller MCS moves the stage unit WST 1 to the stepping position to move the next shot area to the scan start position, and so on in the step 'and scan method.
- the exposure process for each shot area is sequentially performed.
- a so-called moving magnet type wafer stage WST in which 26 is provided and the fixed part 16 is provided with the coil 21, is described as an example.
- the present invention can also be applied to a so-called moving coil type wafer stage in which a coil is provided in the moving part of the stage unit and a permanent magnet is provided in the fixed part.
- the present invention is applied to the wafer stage WST.
- the present invention can also be applied to the reticle stage RST, and can also be applied to both the reticle stage RST and the wafer stage WST. It is.
- the light source unit provided in the exposure apparatus is not limited to excimer lasers such as K r F excimer laser (2 48 nm) and Ar F excimer laser (193 nm), but is emitted from an ultra-high pressure mercury lamp.
- charged particle beams such as X-rays and electron beams
- the exposure apparatus of the present invention is an exposure apparatus that is used for manufacturing a semiconductor element to transfer a device pattern onto a semiconductor substrate, and an exposure apparatus that is used for manufacturing a liquid crystal display element to transfer a circuit pattern onto a glass plate.
- the present invention can also be applied to an exposure apparatus used for manufacturing an imaging device such as a CCD, or an exposure apparatus that is used for manufacturing a thin film magnetic head and transferring a device pattern onto a ceramic wafer.
- FIG. 8 is a flowchart showing a part of a manufacturing process for manufacturing a liquid crystal display element as a micro device. In the pattern forming step S 1 in FIG.
- a so-called photolithography step is performed in which the mask pattern is transferred and exposed onto the wafer W using the exposure apparatus of the present embodiment.
- a predetermined pattern including a large number of electrodes and the like is formed on the wafer W.
- the exposed wafer W is subjected to various processes such as a development process, an etching process, and a peeling process, whereby a predetermined pattern is formed on the wafer W, and the process proceeds to the next color filter forming process S2. .
- a large number of sets of three dots corresponding to R (R ed), G (G reen), and B (B 1 ue) are arranged in a matrix or R, G, B
- a color filter is formed by arranging a set of three stripe filters in the horizontal scanning line direction.
- a cell assembling step S3 is performed.
- a liquid crystal panel liquid crystal cell
- the wafer W having the predetermined pattern obtained in the pattern forming step S 1 and the color filter obtained in the color filter forming step S 2. Assemble.
- liquid crystal is injected between the wafer W having the predetermined pattern obtained in the pattern formation step S 1 and the color filter obtained in the color filter formation step S 2.
- Manufactures panels liquid crystal cells.
- components such as an electric circuit and a backlight for performing the display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete the liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, a liquid crystal display element having an extremely fine pattern can be obtained with high throughput.
- FIG. 9 is a flowchart showing a part of a manufacturing process for manufacturing a semiconductor device as a micro device.
- step ⁇ ⁇ ⁇ design step
- step S 1 1 mask manufacturing step
- step S 1 2 wafer manufacturing step
- a wafer is manufactured using a material such as silicon.
- step S 1 3 wafer processing step
- step S 14 device assembly step
- step S 14 device assembly step
- step S 14 includes processes such as a dicing process, a punching process, and a packaging process (chip encapsulation) as necessary.
- step S 1 5 inspection step
- the micro device manufactured in step S 1 4 undergoes inspections such as an operation confirmation test and a durability test. After these steps, the microdevice is completed and shipped.
- FIG. 10 is a diagram showing an example of a detailed flow of step S 13 in FIG.
- step S 2 1 the wafer surface is oxidized.
- step S 22 C V D step
- an insulating film is formed on the wafer surface.
- step S 2 3 electrode formation step
- step S 2 4 ion implantation step
- ions are implanted into the wafer.
- steps S 2 1 to S 24 constitutes a pre-processing step in each stage of the wafer processing, and is selected and executed according to a necessary process in each stage.
- step S 25 resist formation step
- step S 26 exposure process
- step S 27 development process
- step S 28 etching step
- step (2) the unnecessary resist after etching is removed.
- a stage for holding a reticle (mask) using the above-described exposure apparatus in the pattern formation process (step S 1) or the exposure process (step S 26) The stage holding the plate (wafer) is scanned. For this reason, the movement time between the reticle (mask) and the plate (wafer) can be shortened, and the overlay accuracy can be increased, so that a fine device can be produced efficiently with high yield. it can.
- the present invention can also be applied to an exposure apparatus that transfers a pattern from a mother reticle to a glass substrate, a silicon wafer, or the like.
- a transmission type reticle is generally used, and the reticle substrate is quartz glass, fluorine-doped quartz glass, fluorite, magnesium fluoride. , Or crystal is used.
- Proximity X-ray exposure devices and electron beam exposure devices use transmissive masks (stencil masks, membrane masks), and silicon wafers are used as mask substrates. Note that such an exposure apparatus is disclosed in International Publication No. 99/34255, International Publication No. 99-50712, and International Publication No. 99/66370, and Japanese Laid-Open Patent Publication No. 11-194479, Japanese Unexamined Patent Publication No. 2000- Nos. 12453 and 2000-29202. To the extent permitted by national legislation of the designated country (or selected selected country) designated in this international application, the disclosure in the above-mentioned pamphlet and gazette is incorporated herein by reference.
- the exposure apparatus having a plurality of stages has been described as an example.
- the exposure apparatus may include only one stage.
- an exposure apparatus including an exposure stage that can move while holding a substrate to be processed such as a wafer and a measurement stage that includes various measurement members and sensors has been described as an example.
- Such an exposure apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 11-1135400. To the extent permitted by the national laws of the designated country (or selected selected country) designated in this international application, the disclosure in the above publication is incorporated and made a part of this description.
- a light transmissive mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive substrate, or a predetermined reflective pattern light reflective type on a light reflective substrate.
- a predetermined light-shielding pattern or phase pattern / dimming pattern
- a predetermined reflective pattern light reflective type on a light reflective substrate.
- an electronic mask which is a kind of optical system
- Such an electronic mask is disclosed, for example, in US Pat. No. 6,7778,2557.
- the present invention can be applied to an exposure apparatus that exposes a substrate with interference fringes generated by interference of a plurality of light beams, which is called two-beam interference exposure.
- an exposure method and exposure apparatus are disclosed in, for example, International Publication No. 0 1/3 5 1 6 8 pamphlet. To the extent permitted by national laws and regulations of the designated country (or selected country of choice) designated in this international application, the disclosure in the above pamphlet will be incorporated into the description.
- the present invention can also be applied to an immersion exposure apparatus that performs exposure by filling the space between the projection optical system PL and the substrate (wafer) W with a liquid.
- an immersion exposure apparatus For example, as a method for locally filling the space between the projection optical system 30 and the substrate W with a liquid, the one disclosed in International Publication No. 2 0 0 4/0 5 3 9 5 8 pamphlet is known. Yes. To the extent permitted by national legislation in the designated country (or selected selected country) designated in this international application, the disclosure in the above-mentioned pamphlet will be used as a part of this description.
- the present invention also provides a liquid immersion exposure apparatus that moves a stage holding a substrate (wafer) W to be exposed in a liquid tank, a liquid tank having a predetermined depth on the stage, and a substrate W placed therein.
- the present invention can also be applied to a holding immersion exposure apparatus.
- an immersion exposure apparatus that moves a stage holding a substrate to be exposed in a liquid tank, see, for example, Japanese Patent Application Laid-Open No. 6-1 2 4 8 7 3 with a predetermined depth on the stage.
- For an immersion exposure apparatus that forms a liquid tank and holds a substrate in the liquid tank see, for example, Japanese Patent Application Laid-Open No. 10-3030 3 14 and US Pat. No. 5, 8 2 5, 0 4 3 Each of which is disclosed.
- national laws and regulations of designated designations (or selected selected countries) designated in this international application the disclosure in the above-mentioned publications or US patents is incorporated as part of this description.
- the present invention is not limited to the configuration in which the optical path space on the exit side of the terminal optical member of the projection optical system 30 is filled with liquid (pure water) and the substrate (wafer) W is exposed. / 0 1 9 1 2
- the optical path space on the incident side of the terminal optical member of the projection optical system may be filled with liquid (pure water).
- reaction force generated by the movement of the wafer stage WST is not transmitted to the projection optical system PL, as described in Japanese Patent Laid-Open No. 8-166640 (USP 5,528, 118). It may be mechanically released to the floor (ground) using a frame member. Also, the reaction force generated by the movement of the reticle stage RST is described in Japanese Patent Application Laid-Open No. 8-3300 / 224 (US S / N08 / 416, 558) so as not to be transmitted to the projection optical system PL. As described, it may be mechanically released to the floor (ground) using a frame member.
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Abstract
Description
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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EP05766499.7A EP1788694A4 (en) | 2004-07-15 | 2005-07-13 | EQUIPMENT FOR PLANAR MOTOR, STAGE EQUIPMENT, EXPOSURE EQUIPMENT AND METHOD OF MANUFACTURING THE DEVICE |
JP2006529258A JPWO2006006730A1 (ja) | 2004-07-15 | 2005-07-13 | 平面モータ装置、ステージ装置、露光装置及びデバイスの製造方法 |
US11/632,401 US20080012511A1 (en) | 2004-07-15 | 2005-07-13 | Planar Motor Device, Stage Device, Exposure Device and Device Manufacturing Method |
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JP2004208574 | 2004-07-15 | ||
JP2004-208574 | 2004-07-15 |
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PCT/JP2005/013339 WO2006006730A1 (ja) | 2004-07-15 | 2005-07-13 | 平面モータ装置、ステージ装置、露光装置及びデバイスの製造方法 |
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US (1) | US20080012511A1 (ja) |
EP (1) | EP1788694A4 (ja) |
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WO (1) | WO2006006730A1 (ja) |
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Also Published As
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JPWO2006006730A1 (ja) | 2008-05-01 |
US20080012511A1 (en) | 2008-01-17 |
EP1788694A1 (en) | 2007-05-23 |
EP1788694A4 (en) | 2014-07-02 |
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