WO2005073334A1 - 粘着剤組成物 - Google Patents
粘着剤組成物 Download PDFInfo
- Publication number
- WO2005073334A1 WO2005073334A1 PCT/JP2005/001026 JP2005001026W WO2005073334A1 WO 2005073334 A1 WO2005073334 A1 WO 2005073334A1 JP 2005001026 W JP2005001026 W JP 2005001026W WO 2005073334 A1 WO2005073334 A1 WO 2005073334A1
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- WO
- WIPO (PCT)
- Prior art keywords
- group
- polymer
- adhesive composition
- hydrolyzable silyl
- sensitive adhesive
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
Definitions
- the present invention relates to a pressure-sensitive adhesive composition. More specifically, (A) a hydrolyzable silyl group-containing organic polymer having a number average molecular weight of 15,000 100000 having at least 1.3 hydrolyzable silyl groups per molecule, The present invention relates to a hydrolyzable silyl group-containing polyether polymer having a number average molecular weight of 500 to 15,000 having three hydrolyzable silyl groups, and a pressure-sensitive adhesive composition comprising (C) a tackifier resin as an essential component.
- pressure-sensitive adhesive compositions comprising a curable polymer mixed with a tackifier resin have been well known.
- a pressure-sensitive adhesive composition comprising an oxyalkylene-based polymer containing a hydrolyzable silyl group and a tackifier resin contains no or almost no organic solvent. Since it can be applied without using it, it has been proposed as an adhesive composition that does not adversely affect the environment (for example, see Patent Document 1). However, the above adhesive composition has insufficient adhesive strength, and if a large amount of tackifying resin is added to increase the adhesive strength, the viscosity of the composition becomes extremely high, and it is necessary to use a large amount of solvent. was there
- Patent Document 1 JP-A-59-71377
- Patent Document 2 JP-A-5-59267
- An object of the present invention is to provide a pressure-sensitive adhesive composition that can be applied with little or no solvent and that has excellent pressure-sensitive adhesive properties. Means for solving the problem
- a pressure-sensitive adhesive composition containing the compound can be applied with little or no solvent, and exhibits excellent adhesive strength after curing, leading to the completion of the present invention.
- the pressure-sensitive adhesive composition of the present invention can be applied with little or no organic solvent, and has excellent pressure-sensitive adhesive properties.
- the organic polymer having at least 1.3 hydrolyzable silyl groups in one molecule, which is the component (A) of the present invention, is not particularly limited.
- its main chain skeleton is generally known.
- Organic polymers such as oxyalkylene polymers, alkyl (meth) acrylate polymers, saturated hydrocarbon polymers, and polyester polymers can be used.
- Oxyalkylene polymers are particularly preferred because of their low-temperature properties, flexibility, and good compatibility with other components.Thus, in the following description of polymer (A), oxyalkylene polymers are mainly used as representative examples. Describe what constitutes a chain skeleton.
- the oxyalkylene polymer is a polymer having a repeating unit represented by the following general formula (1).
- R 1 is a divalent alkylene group
- R 1 in the general formula (1) is preferably a linear or branched alkylene group having 1 to 14 carbon atoms, more preferably 4 carbon atoms.
- Specific examples of the repeating unit represented by the general formula (1) include: f, -CH ⁇ , -CH CH ⁇ _, -CH CH (CH) ⁇ _, -CH CH (CH) ⁇ _, -CH
- the main chain skeleton of the oxyalkylene polymer may be composed of only one type of repeating unit, or may be composed of two or more types of repeating units.
- a polymer having -CH CH (CH) ⁇ _ as a main repeating unit is preferable.
- the main chain of the polymer may contain a repeating unit other than an oxyalkylene group.
- the total amount of oxyalkylene units in the polymer is preferably at least 80% by weight, particularly preferably at least 90% by weight.
- the main chain having 0.31.3 hydrolyzable silyl groups in one molecule which is the component (B) of the present invention, has essentially the general formula 1 ⁇ _ ⁇ _ (1 ⁇ is 2 also Ru Similarly der as above for R 1 in the hydrolyzable silyl group-containing organic polymer comprising repeating units represented by the valence alkylene group).
- the polymer of the component (A) and the component (B) may be a linear polymer or a branched polymer, or may be a mixture thereof. However, in order to obtain good peeling properties, it is preferable that 50% by weight or more of the polymer is a linear polymer.
- the molecular weight of the polymer as the component (A) is preferably 15,000 to 100,000 force S, more preferably 20,000 to 50,000 force S, in terms of number average molecular weight.
- the number average molecular weight is less than 15,000, the resulting pressure-sensitive adhesive composition becomes hard, and good pressure-sensitive adhesive properties cannot be obtained. Conversely, if the number average molecular weight exceeds 100,000, the viscosity becomes too high, and the workability is remarkably reduced.
- the number average molecular weight can be measured by various methods, it is generally measured by conversion from terminal group analysis of an oxyalkylene polymer or by gel permeation chromatography (GPC).
- the term “molecular weight” refers to a molecular weight determined by gel permeation chromatography (GPC).
- the molecular weight of the hydrolyzable silyl group-containing organic polymer of the component (B) is preferably from 500 to 15,000, and more preferably from 1500 to 12000.
- the most preferred molecular weight f is 3000-10000.
- the viscosity of the pressure-sensitive adhesive composition is sufficient. May not be lowered.
- the hydrolyzable silyl group-containing organic polymer comprising a repeating unit represented by the formula (1) is hydrolyzed by an appropriate method to a polyether having a hydroxyl group at a terminal and an oxyalkylene polymer known as a polyol. It can be obtained by introducing a reactive silyl group.
- the oxyalkylene polymer serving as the main chain skeleton has at least one hydroxyl group in the presence of a catalyst such as an alkali metal catalyst, a metal porphyrin catalyst, a double metal cyanide complex catalyst, and a phosphazene catalyst. It can be produced by reacting an initiator such as a hydroxy compound with a monoepoxide such as an alkylene oxide. Among them, a particularly preferable production method is a method using a double metal cyanide complex catalyst and a phosphazene catalyst.
- a high-molecular-weight oxyalkylene-based polymer can be easily obtained, and the resulting polymer has a narrow molecular weight distribution, and therefore has a low viscosity instead of a molecular weight and has a problem with hue. Because there is no.
- a relatively low molecular weight oxyalkylene polymer may be used. In such a case, the oxyalkylene polymer produced using an alkali metal catalyst is reacted with a dihalogenated compound to carry out a molecular weight increase reaction. A xyalkylene polymer may be obtained.
- the number of functional groups of the hydroxy conjugate used as the initiator of the ring-opening polymerization of the monoepoxide is preferably 2 or more.
- propylene glycol, glycerin, and pentaerythritol, PPG, PPT (polyoxypropylene triol) is added to the initiator of the ring-opening polymerization of the monoepoxide.
- polyether used as the initiator include polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxyhexylene, polyoxytetramethylene, and copolymers thereof.
- the polyether is polyoxypropylene diol and polyoxypropylene diol. Riol, acrylyl-terminated polyoxypropylene, methallyl-terminated polyoxypropylene, and the like.
- the hydrolyzable silyl group referred to in the present invention is a silicon-containing functional group which can be crosslinked by forming a siloxane bond.
- the silyl group represented by the following general formula (I) is a typical hydrolyzable silyl group.
- the hydrolyzable silyl group is not limited to only this group. Absent.
- R 2 is a substituted or unsubstituted monovalent organic group having 112 to 120 carbon atoms, preferably an alkyl group having 8 or less carbon atoms, a phenyl group or a fluoroalkyl group. Particularly preferred are a methynole group, an ethyl group, a propyl group, a butyl group, a hexyl group, a cyclohexyl group, a phenyl group and the like.
- X is a hydrolyzable group, for example, a halogen atom, an alkoxy group, an alkenyloxy group, an acyloxy group, an amide group, an amino group, an aminooxy group, a ketoximate group, an acid amide group
- the number of carbon atoms of the hydrolyzable group having a carbon atom is preferably 6 or less, and particularly preferably 4 or less.
- Preferred hydrolyzable groups include lower alkoxy groups having 4 or less carbon atoms, in particular, methoxy, ethoxy, propoxy, probe / reoxy and the like. a is 1,
- the method of introducing the silicon group represented by the general formula (I) into the oxyalkylene polymer is not particularly limited, but for example, it can be introduced by the following method.
- a method for introducing an olefin group a compound having both an unsaturated group and a functional group capable of reacting with a hydroxyl group is reacted with a hydroxyl group of an oxyalkylene polymer to form an ether bond, an ester bond, a urethane bond, or a carbonate.
- a method of bonding such as by bonding, or when polymerizing an alkylene oxide, a reaction such as aryl glycidyl ether is used.
- a method of introducing an olefin group by adding and copolymerizing an epoxy group-containing epoxy conjugate is used.
- R 2 , X and a are the same as above.
- R 3 is a divalent hydrocarbon group having 117 carbon atoms.
- W is an active hydrogen-containing group selected from a hydroxyl group, a carboxyl group, a mercapto group and an amino group (primary or secondary).
- An olefin group is introduced into an oxyalkylene polymer having a functional group into which an olefin group can be introduced, and the olefin group is combined with a W-force S mercapto group represented by the general formula (4).
- a method of reacting an elemental compound is provided.
- the organic polymer having a hydrolyzable silyl group which is the component (ii) of the present invention, preferably contains 1.3 to 5 hydrolyzable silyl groups in one molecule.
- One to three is particularly preferred
- the number of hydrolyzable silyl groups in one molecule of the component (II) of the present invention is preferably 0.3-1.3 (less than), particularly preferably 0.4-1.2 (hereinafter).
- the compound acts as a plasticizer and may not provide good adhesive properties. If the ratio is 1.3 or more, the flexibility of the adhesive composition may be impaired and good adhesive properties may not be obtained.
- the amount of the component (II) is preferably 1 to 200 parts by weight per 100 parts by weight of the component (II) of the present invention. Shig One hundred parts by weight is particularly preferred.
- tackifying resin as the component (C) of the present invention examples include terpene resins, terpene phenol resins, petroleum resins, rosin esters, and the like. They can be used alone or, if necessary, in combination of two or more.
- a preferred blending amount of the component (C) of the present invention is 5150 parts by weight based on 100 parts by weight of the total amount of the components (A) and (B). More preferably, it is 10 120 parts by weight. 30-100 parts by weight is particularly preferred. If the amount is less than 5 parts by weight, the composition may be inferior in adhesiveness.If the amount exceeds 150 parts by weight, the affinity and hydrophilicity of the hydrolyzable silyl group-containing organic polymer for various good adherends can be obtained. And the properties such as chemical stability may be impaired.
- the method for preparing the pressure-sensitive adhesive composition of the present invention is not particularly limited.
- the above-mentioned components are mixed, kneaded using a mixer, roll, kneader, or the like at room temperature or under heating, or a suitable solvent is added.
- Conventional methods such as dissolving and mixing the components using a small amount can be used.
- the pressure-sensitive adhesive composition of the present invention can contain various known curing catalysts, fillers, and various additives.
- curing catalysts can be widely used. Specific examples thereof include titanium compounds such as titanium tetrabutoxide, tetrapropyl titanate, titanium tetraacetyl acetonate, and titanium acetate; dibutyltin dilaurate, dibutyltin maleate, dibutyltin phthalate, dibutyltin diiotate, and dibutyltin diethanolate.
- titanium compounds such as titanium tetrabutoxide, tetrapropyl titanate, titanium tetraacetyl acetonate, and titanium acetate
- dibutyltin dilaurate dibutyltin maleate, dibutyltin phthalate, dibutyltin diiotate, and dibutyltin diethanolate.
- the amount used is preferably about 0.1 to 20 parts by weight based on 100 parts by weight of the total amount of the organic polymer (A) and the organic polymer (B). If the amount of the curing catalyst used is too small, the curing speed may be reduced, and the curing reaction may not proceed sufficiently. On the other hand, if the amount of the curing catalyst used is too large, local heat generation and foaming may occur during curing, and a good cured product may not be obtained.
- R 2 and a are the same as described above.
- Examples of such a silicon compound include, but are not limited to, phenyltrimethoxysilane, phenylmethyldimethoxysilane, phenyldimethylmethoxysilane, diphenyldimethoxysilane, diphenyljetoxysilane, and triphenylmethoxysilane.
- At least one force of R directly bonded to the Si atom in the general formula S, which is an aryl group having 620 carbon atoms Force of curing of the composition This is preferable because the effect of speeding up the reaction is great.
- diphenyldimethoxysilane / diphenylethoxysilane is particularly preferable because it is inexpensive and easily available.
- the compounding amount thereof is preferably about 0.01 to 20 parts by weight with respect to 100 parts by weight of the total of the polymer (A) and the polymer (B). 1-10 parts by weight is more preferred. If the amount of the silicon compound falls below this range, the effect of accelerating the curing reaction may be reduced. On the other hand, if the amount of the silicon compound exceeds this range, the hardness and tensile strength of the cured product may decrease.
- a silane coupling agent, a reaction product of the silane coupling agent, or a compound other than the silane coupling agent can be added to the composition of the present invention as an adhesion-imparting agent.
- the silane coupling agent include: isocyanate propyl trimethoxy silane, y- isocyanate propyl triethoxy silane, ⁇ -isocyanate propyl methyl methoxy silane, ⁇ -isocyanate propyl methyl dimethoxy silane Silanes containing an isocyanate group such as ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropylmethyldimethoxysilane, ⁇ -aminopropylmethylethoxysilane, ⁇ - (2-aminoethyl) Aminopropyltrimethoxysilane, ⁇ - (2-aminoethyl)
- silane coupling agent such as amino-modified silyl polymer, silyl ani amino polymer, unsaturated amino silane complex, phenylamino long-chain alkyl silane, amino silyl ani silicone, silylated polyester and the like can also be used as the silane coupling agent.
- the silane coupling agent is usually used in an amount of 0.1 to 20 parts by weight based on 100 parts by weight of the total amount of the polymer ( ⁇ ) and the polymer ( ⁇ ). Is used. In particular, the range of 0.5 to 10 parts by weight is preferable.
- the basic production method is a method in which the pressure-sensitive adhesive composition is applied to a support and thermosetted, and is not limited to the following examples.
- the pressure-sensitive adhesive composition of the present invention is applied on a support with a coater, and is cured by heating to obtain a sticky product.
- a support films, papers, all kinds of cloths, metal foils and the like made of synthetic resin or denatured natural product can be used.
- Specific examples of the support include polyethylene, polypropylene, polyimide, polycarbonate, polyvinyl chloride, polyester, polyurethane, cellophane, impregnated paper, coated paper, woodfree paper, kraft paper, cloth, acetate cloth, nonwoven fabric, glass cloth, Forces including metal foils are not limited to these. Each of these may be used alone, or at least two or more thereof may be used in a laminated form.
- a release paper coated with a release agent of a silicone type, an olefin type, a fluorine type, or the like can be used. From the viewpoints of cost and release property, use of release agents based on olefin or solvent-free silicone preferable.
- the method of heat curing is not particularly limited.
- the temperature varies depending on the type of the polymer to be used, the compound to be added, and the like, but is usually preferably in the range of 50 ° C to 180 ° C.
- the curing time varies depending on the polymer used, the compound to be added, the reaction temperature, etc., but is usually within a range of 0.1 minute to 24 hours, preferably 1 minute to 10 hours, and more preferably 1 minute to 1 hour. is there.
- the pressure-sensitive adhesive composition of the present invention can be used for various types of pressure-sensitive adhesive products for general office use, paper wrapping, PP film bonding, re-peeling, general packaging, electricity, and fixing.
- An adhesive product using the adhesive composition of the present invention includes an adhesive tape for packaging, an office adhesive tape, a coating masking tape, an electrical insulating adhesive tape, a binding adhesive tape, a protective adhesive tape, and an identification tape.
- a drug in making the above adhesive product, a drug, an electromagnetic wave absorbing material, a light absorbing agent, a foaming component, and the like can be added in accordance with these uses.
- composition of the present invention will be specifically described by way of examples, but the present invention is not limited to only these examples.
- the terminal hydroxyl group of ACTCO-NORE P-23 (manufactured by Mitsui Takeda Co., Ltd., polyoxypropylene glycol) was metaloxylated. Further, after reacting with Shii-Dariaryl to introduce an unsaturated group into the terminal, 0.5 equivalent of methyldimethoxysilane is reacted with the terminal group, and GPC measurement (polystyrene conversion) having a methyldimethoxysilyl group at the terminal is carried out. A polymer (B_2) having an average molecular weight of 4000 was obtained. The viscosity of (B_2) (23 ° C: B-type viscometer) was 0.6 Pa's.
- Polyoxypropylene glycol with GPC measurement (polystyrene equivalent) number average molecular weight of 31,000 is produced by polymerizing propylene oxide using lactocol P-23 as an initiator and zinc hexacyanocobaltate glyme complex. Then, the terminal hydroxyl group was methanoloxylated. After further reacting with acrylyl chloride to introduce unsaturated groups at all terminals, methyldimethoxysilane is reacted with 0.75 equivalents to the unsaturated groups to obtain a polymer having a methyldimethoxysilyl group at the terminal (A-1). ).
- the viscosity of (A-1) (23 ° C: B-type viscometer) is 46.8 Pa's.
- Polyoxypropylene glycol having a number average molecular weight of 26,000 as measured by GPC is produced by polymerizing propylene oxide using lactocol P-23 as an initiator and a zinc hexacyanocobaltate glyme complex. Then, ⁇ -isocyanatopyrupitrimethoxysilane (Nippon Tunicer Co., Ltd., 5187) was reacted at 0.85 equivalents with respect to all terminal groups to obtain a polymer having a trimethoxysilyl group at the terminal ( ⁇ -2). Got. The viscosity of ( ⁇ -2) (23 ° C: B-type viscometer) was 48.5 Pa's.
- Polyoxypropylene glycol having a number average molecular weight of 10800 by GPC measurement is produced by polymerizing propylene oxide using lactocol P-23 as an initiator and a zinc hexacyanocobaltate glyme complex. Then, the terminal hydroxyl group was methanoloxylated. After further reacting with acrylyl chloride to introduce unsaturated groups at all terminals, 0.75 equivalents of rudimethoxysilane was reacted with the unsaturated group to obtain a polymer (A-3) having a methyldimethoxysilyl group at a terminal. The viscosity of (A-3) (23 ° C: B-type viscometer) was 3D at 5.9 Pas.
- Actol P-23 30 parts by weight of Actol P-23 was mixed with 100 parts by weight of the polymer (A-1) to obtain a polymer mixture (D-4).
- 100 parts by weight of the polymer mixture (D-4) was mixed with 50 parts by weight of YS polystar S145 (terpene phenol resin, manufactured by Yasuhara Chemical Co., Ltd.) to obtain an adhesive composition (E-4).
- the viscosity (23 ° C .: B-type viscometer) of the pressure-sensitive adhesive composition (E-4) was 279.5 Pa ′s.
- This mixture was applied on a 38 ⁇ m-thick polyester film so as to have a width of 8 cm and a thickness of 75 ⁇ m, and was cured by heating at 130 ° C for 3 minutes to obtain an adhesive film. .
- An adhesive finolem was obtained in the same manner as in Example 1 except that (E-2) was used instead of the adhesive composition (E-1).
- An adhesive finolem was obtained in the same manner as in Example 1 except that (E-3) was used instead of the adhesive composition (E-1).
- An adhesive finolem was obtained in the same manner as in Example 1 except that (E-4) was used instead of the adhesive composition (E-1).
- An adhesive finolem was obtained in the same manner as in Example 1 except that (E-6) was used instead of the adhesive composition (E-1).
- the pressure-sensitive adhesive composition of the present invention is that force s indicating the and excellent adhesion and low viscosity Help.
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- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
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Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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AT05709366T ATE557056T1 (de) | 2004-01-30 | 2005-01-26 | Haftklebstoffzusammensetzung |
US10/586,858 US8129479B2 (en) | 2004-01-30 | 2005-01-26 | Pressure sensitive adhesive composition |
JP2005517466A JP4745828B2 (ja) | 2004-01-30 | 2005-01-26 | 粘着剤組成物 |
CN2005800029634A CN1910249B (zh) | 2004-01-30 | 2005-01-26 | 粘合剂组合物 |
CA002554745A CA2554745A1 (en) | 2004-01-30 | 2005-01-26 | Pressure sensitive adhesive composition |
EP05709366A EP1715016B1 (en) | 2004-01-30 | 2005-01-26 | Pressure sensitive adhesive composition |
CN200580023430.4A CN1984832A (zh) | 2005-01-26 | 2005-06-02 | 电梯装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004024173 | 2004-01-30 | ||
JP2004-024173 | 2004-01-30 |
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WO2005073334A1 true WO2005073334A1 (ja) | 2005-08-11 |
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PCT/JP2005/001026 WO2005073334A1 (ja) | 2004-01-30 | 2005-01-26 | 粘着剤組成物 |
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US (1) | US8129479B2 (ja) |
EP (1) | EP1715016B1 (ja) |
JP (1) | JP4745828B2 (ja) |
CN (1) | CN1910249B (ja) |
AT (1) | ATE557056T1 (ja) |
CA (1) | CA2554745A1 (ja) |
WO (1) | WO2005073334A1 (ja) |
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WO2008123552A1 (ja) | 2007-04-03 | 2008-10-16 | Asahi Glass Company, Limited | 粘着体、粘着シートおよびその用途 |
WO2010013653A1 (ja) | 2008-07-28 | 2010-02-04 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
WO2010026995A1 (ja) | 2008-09-05 | 2010-03-11 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
WO2010038715A1 (ja) * | 2008-09-30 | 2010-04-08 | コニシ株式会社 | 粘着テープ又はシートの製造方法 |
WO2010041667A1 (ja) * | 2008-10-08 | 2010-04-15 | 旭硝子株式会社 | 粘着積層体 |
JP2011127004A (ja) * | 2009-12-18 | 2011-06-30 | Cemedine Co Ltd | 複数のポリオキシアルキレン系重合体を用いるスピーカー組立用接着剤 |
WO2011132749A1 (ja) | 2010-04-23 | 2011-10-27 | 旭硝子株式会社 | 粘着積層体および表面保護シート |
CN110087696A (zh) * | 2016-10-28 | 2019-08-02 | 博斯蒂克股份公司 | 用于粘合具有低表面能的基材的自粘组合物 |
JP2019524902A (ja) * | 2016-06-28 | 2019-09-05 | ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG | オルガニルオキシシラン末端ポリマーをベースとする架橋性材料 |
JP7486511B2 (ja) | 2019-02-28 | 2024-05-17 | カネカ アメリカズ ホールディング,インコーポレイティド | 湿気硬化性接着剤組成物 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5187973B2 (ja) * | 2009-04-30 | 2013-04-24 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルムおよび画像表示装置 |
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JP5912833B2 (ja) * | 2011-05-26 | 2016-04-27 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着剤層付光学フィルムおよび画像表示装置 |
EP2682444A1 (en) * | 2012-07-06 | 2014-01-08 | Bostik SA | Use of an adhesive composition to provide a bonding in a wet environment |
CN105612134A (zh) * | 2013-10-02 | 2016-05-25 | 巴斯夫欧洲公司 | 聚(氧化烯)氧基-和/或聚(氧化烯)氨基烷基三烷氧基硅烷作为分散剂的用途 |
FR3058153B1 (fr) * | 2016-10-28 | 2018-11-16 | Bostik Sa | Composition auto-adhesive pour le collage de substrats de basse energie de surface |
EP4051748A4 (en) * | 2019-10-31 | 2023-08-16 | Dow Silicones Corporation | SILICIONE-BASED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND METHODS OF PREPARING AND USING IT |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5971377A (ja) | 1982-10-15 | 1984-04-23 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS6035069A (ja) * | 1984-04-26 | 1985-02-22 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS61116327A (ja) * | 1984-11-12 | 1986-06-03 | Sekisui Fine Chem Kk | 液晶素子の製造方法 |
JPH02132174A (ja) * | 1988-11-11 | 1990-05-21 | Kanegafuchi Chem Ind Co Ltd | 粘着製品の製法 |
JPH0559267A (ja) | 1991-09-04 | 1993-03-09 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2003105303A (ja) * | 2001-09-28 | 2003-04-09 | Diabond Industry Co Ltd | 湿気硬化形ホットメルト接着剤およびその製造方法 |
JP2004115780A (ja) * | 2002-09-06 | 2004-04-15 | Cemedine Co Ltd | 硬化性組成物 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3561996A (en) * | 1968-05-27 | 1971-02-09 | Rohm & Haas | Method of improving adhesion of vinyl addition polymer aqueous-based composition sealants, etc. |
JPS5974149A (ja) * | 1982-10-20 | 1984-04-26 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物 |
JPS5978223A (ja) * | 1982-10-27 | 1984-05-07 | Kanegafuchi Chem Ind Co Ltd | 重合体の製造方法 |
JPS59168014A (ja) * | 1983-03-15 | 1984-09-21 | Kanegafuchi Chem Ind Co Ltd | 硬化性弾性組成物 |
JPS6160771A (ja) * | 1984-08-31 | 1986-03-28 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS61225205A (ja) * | 1985-03-30 | 1986-10-07 | Kanegafuchi Chem Ind Co Ltd | シリル基含有ビニル系樹脂及び硬化性組成物 |
CA1338943C (en) * | 1987-12-28 | 1997-02-25 | Sadao Yukimoto | Curable composition of oxyalkylene polymer |
DE68914304T2 (de) * | 1988-01-21 | 1994-08-25 | Kanegafuchi Chemical Ind | Härtbare Polymerzusammensetzung. |
ES2070136T3 (es) * | 1988-04-07 | 1995-06-01 | Kanegafuchi Chemical Ind | Material adhesivo sensible a la presion. |
JP2610305B2 (ja) * | 1988-06-10 | 1997-05-14 | 鐘淵化学工業株式会社 | 硬化性組成物 |
US6369187B1 (en) * | 1990-04-09 | 2002-04-09 | Kanegafuchi Chemical Industry Co., Ltd. | Reactive silicon group-containing oxypropylene polymer and method of producing same |
US5331049A (en) * | 1990-06-22 | 1994-07-19 | Exxon Chemical Patents Inc. | Water-curable, hot melt adhesive composition |
US5064896A (en) * | 1990-08-08 | 1991-11-12 | Tanner Chemical Company, Inc. | Adhesive compositions |
JP2995309B2 (ja) * | 1991-09-09 | 1999-12-27 | 鐘淵化学工業株式会社 | 硬化性組成物 |
JPH05302026A (ja) * | 1992-04-28 | 1993-11-16 | Sekisui Chem Co Ltd | 室温硬化性組成物 |
JP3250690B2 (ja) * | 1993-04-12 | 2002-01-28 | 鐘淵化学工業株式会社 | 硬化性組成物 |
JPH07242737A (ja) * | 1994-03-07 | 1995-09-19 | Kanegafuchi Chem Ind Co Ltd | 硬化性樹脂組成物 |
EP0918062B1 (en) * | 1997-04-21 | 2004-02-18 | Asahi Glass Company Ltd. | Room temperature setting compositions |
WO1999005215A1 (fr) * | 1997-07-28 | 1999-02-04 | Kaneka Corporation | Composition adhesive polymerisable |
JP3913859B2 (ja) * | 1997-09-10 | 2007-05-09 | 株式会社カネカ | 硬化性組成物 |
CA2301313A1 (en) * | 1999-03-18 | 2000-09-18 | Yuka Kanamori | Curable composition |
CA2302653A1 (en) * | 1999-03-29 | 2000-09-29 | Hideharu Jyono | Curable composition |
DE60016083T2 (de) * | 1999-05-31 | 2005-11-03 | Kaneka Corp. | Verwendung eines vernetzten Produkts als wärmeempfindliches elastisches Klebemittel |
WO2000075226A1 (fr) * | 1999-06-04 | 2000-12-14 | Kaneka Corporation | Composition durcissable et son procede d'utilisation |
US6642309B2 (en) * | 2001-08-14 | 2003-11-04 | Kaneka Corporation | Curable resin composition |
US6649016B2 (en) * | 2002-03-04 | 2003-11-18 | Dow Global Technologies Inc. | Silane functional adhesive composition and method of bonding a window to a substrate without a primer |
JP4485246B2 (ja) * | 2003-04-23 | 2010-06-16 | 株式会社カネカ | 硬化性組成物 |
-
2005
- 2005-01-26 US US10/586,858 patent/US8129479B2/en not_active Expired - Fee Related
- 2005-01-26 AT AT05709366T patent/ATE557056T1/de active
- 2005-01-26 CA CA002554745A patent/CA2554745A1/en not_active Abandoned
- 2005-01-26 JP JP2005517466A patent/JP4745828B2/ja active Active
- 2005-01-26 EP EP05709366A patent/EP1715016B1/en active Active
- 2005-01-26 CN CN2005800029634A patent/CN1910249B/zh not_active Expired - Fee Related
- 2005-01-26 WO PCT/JP2005/001026 patent/WO2005073334A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5971377A (ja) | 1982-10-15 | 1984-04-23 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS6035069A (ja) * | 1984-04-26 | 1985-02-22 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS61116327A (ja) * | 1984-11-12 | 1986-06-03 | Sekisui Fine Chem Kk | 液晶素子の製造方法 |
JPH02132174A (ja) * | 1988-11-11 | 1990-05-21 | Kanegafuchi Chem Ind Co Ltd | 粘着製品の製法 |
JPH0559267A (ja) | 1991-09-04 | 1993-03-09 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2003105303A (ja) * | 2001-09-28 | 2003-04-09 | Diabond Industry Co Ltd | 湿気硬化形ホットメルト接着剤およびその製造方法 |
JP2004115780A (ja) * | 2002-09-06 | 2004-04-15 | Cemedine Co Ltd | 硬化性組成物 |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5040995B2 (ja) * | 2007-04-03 | 2012-10-03 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
JPWO2008123552A1 (ja) * | 2007-04-03 | 2010-07-15 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
WO2008123552A1 (ja) | 2007-04-03 | 2008-10-16 | Asahi Glass Company, Limited | 粘着体、粘着シートおよびその用途 |
WO2010013653A1 (ja) | 2008-07-28 | 2010-02-04 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
WO2010026995A1 (ja) | 2008-09-05 | 2010-03-11 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
US8648162B2 (en) | 2008-09-05 | 2014-02-11 | Asahi Glass Company, Limited | Adherence substance, pressure sensitive adhesive sheet and its use |
JP5284362B2 (ja) * | 2008-09-30 | 2013-09-11 | コニシ株式会社 | 粘着テープ又はシートの製造方法 |
WO2010038715A1 (ja) * | 2008-09-30 | 2010-04-08 | コニシ株式会社 | 粘着テープ又はシートの製造方法 |
JPWO2010038715A1 (ja) * | 2008-09-30 | 2012-03-01 | コニシ株式会社 | 粘着テープ又はシートの製造方法 |
US8197896B2 (en) | 2008-09-30 | 2012-06-12 | Konishi Co., Ltd. | Method for producing a pressure-sensitive adhesive tape or sheet |
JP5594142B2 (ja) * | 2008-10-08 | 2014-09-24 | 旭硝子株式会社 | 粘着積層体 |
WO2010041667A1 (ja) * | 2008-10-08 | 2010-04-15 | 旭硝子株式会社 | 粘着積層体 |
JP2011127004A (ja) * | 2009-12-18 | 2011-06-30 | Cemedine Co Ltd | 複数のポリオキシアルキレン系重合体を用いるスピーカー組立用接着剤 |
WO2011132749A1 (ja) | 2010-04-23 | 2011-10-27 | 旭硝子株式会社 | 粘着積層体および表面保護シート |
JP2019524902A (ja) * | 2016-06-28 | 2019-09-05 | ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG | オルガニルオキシシラン末端ポリマーをベースとする架橋性材料 |
US11492518B2 (en) | 2016-10-28 | 2022-11-08 | Bostik Sa | Self-adhesive composition for the bonding of substrates with low surface energy |
CN110087696A (zh) * | 2016-10-28 | 2019-08-02 | 博斯蒂克股份公司 | 用于粘合具有低表面能的基材的自粘组合物 |
JP2019536859A (ja) * | 2016-10-28 | 2019-12-19 | ボスティク エス.アー. | 低表面エネルギーを有する基材の結合のための接着剤組成物 |
CN110087696B (zh) * | 2016-10-28 | 2023-04-14 | 博斯蒂克股份公司 | 用于粘合具有低表面能的基材的自粘组合物 |
JP7486511B2 (ja) | 2019-02-28 | 2024-05-17 | カネカ アメリカズ ホールディング,インコーポレイティド | 湿気硬化性接着剤組成物 |
Also Published As
Publication number | Publication date |
---|---|
EP1715016A1 (en) | 2006-10-25 |
ATE557056T1 (de) | 2012-05-15 |
EP1715016A4 (en) | 2009-05-27 |
US8129479B2 (en) | 2012-03-06 |
CA2554745A1 (en) | 2005-08-11 |
US20070123662A1 (en) | 2007-05-31 |
JPWO2005073334A1 (ja) | 2007-09-13 |
EP1715016B1 (en) | 2012-05-09 |
JP4745828B2 (ja) | 2011-08-10 |
CN1910249A (zh) | 2007-02-07 |
CN1910249B (zh) | 2011-06-15 |
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