WO2005036587A3 - Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator - Google Patents

Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator Download PDF

Info

Publication number
WO2005036587A3
WO2005036587A3 PCT/EP2004/052528 EP2004052528W WO2005036587A3 WO 2005036587 A3 WO2005036587 A3 WO 2005036587A3 EP 2004052528 W EP2004052528 W EP 2004052528W WO 2005036587 A3 WO2005036587 A3 WO 2005036587A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic
component
electronic component
carrier assembly
circuit carrier
Prior art date
Application number
PCT/EP2004/052528
Other languages
German (de)
French (fr)
Other versions
WO2005036587A2 (en
Inventor
Stephan Bolz
Michael Decker
Thomas Riepl
Karin Schottenloher
Daniela Wolf
Original Assignee
Siemens Ag
Stephan Bolz
Michael Decker
Thomas Riepl
Karin Schottenloher
Daniela Wolf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Stephan Bolz, Michael Decker, Thomas Riepl, Karin Schottenloher, Daniela Wolf filed Critical Siemens Ag
Publication of WO2005036587A2 publication Critical patent/WO2005036587A2/en
Publication of WO2005036587A3 publication Critical patent/WO2005036587A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Electric Motors In General (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to an electronic component, a circuit carrier assembly and an electronic unit, in particular for use in the field of motor vehicle electronics. The invention also relates to a method for producing elements of this type. The aim of the invention is to provide a simple method for influencing the operating temperature of electronic components, in particular in order to increase the service life of said components. The basic concept of the invention is to intercept temporary fluctuations in operating temperature that occur during the operation of an electronic component using a thermal accumulator in the form of a phase-change material, i.e. to accumulate a temporarily increased or reduced thermal power loss of the component in a reversible manner in the vicinity of said component.
PCT/EP2004/052528 2003-10-13 2004-10-13 Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator WO2005036587A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10347518.4 2003-10-13
DE10347518A DE10347518A1 (en) 2003-10-13 2003-10-13 Electronic component, circuit carrier assembly and electronic unit with heat accumulator

Publications (2)

Publication Number Publication Date
WO2005036587A2 WO2005036587A2 (en) 2005-04-21
WO2005036587A3 true WO2005036587A3 (en) 2009-03-12

Family

ID=34428357

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/052528 WO2005036587A2 (en) 2003-10-13 2004-10-13 Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator

Country Status (2)

Country Link
DE (1) DE10347518A1 (en)
WO (1) WO2005036587A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104272453A (en) * 2012-04-25 2015-01-07 高通股份有限公司 Thermal management of integrated circuits using phase change material and heat spreaders

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005034546A1 (en) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Module with cooling device, has melt-body retained in number of cooling chambers
DE102005041861B3 (en) * 2005-09-02 2007-04-19 Siemens Ag Arrangement for tempering an electronic unit using a latent heat reservoir and a trigger to release stored heat
JP4694514B2 (en) * 2007-02-08 2011-06-08 トヨタ自動車株式会社 Semiconductor device cooling structure
DE102008004053A1 (en) * 2008-01-11 2009-07-23 Airbus Deutschland Gmbh Peak load cooling of electronic components through phase change materials
DE102008057963A1 (en) * 2008-11-19 2010-05-27 Lorenzen, Dirk, Dr. Laser arrangement, particularly radiation source, has laser diode arrangement, heat transmission device and thermo reactive medium, where thermo reactive medium is arranged in heat guiding body
DE102009042519A1 (en) * 2009-09-16 2011-03-24 Esw Gmbh Device for cooling semiconductors
DE102010062593A1 (en) 2010-12-08 2012-06-14 Robert Bosch Gmbh Ultrasonic sensor with a damping device and use thereof
DE102010062914A1 (en) * 2010-12-13 2012-06-14 Robert Bosch Gmbh Semiconductor i.e. power semiconductor, for use in direct current power semiconductor of electronic commutated electromotor of motor car, has ceramic layer comprises pores that are filled with thermal conductive medium e.g. adhesive
DE102011075565A1 (en) * 2011-05-10 2012-11-15 Robert Bosch Gmbh Circuit module with cooling by phase change material
DE102013217829A1 (en) * 2013-09-06 2015-03-12 Siemens Aktiengesellschaft Integrated circuit system with a cooling device using a latent heat storage medium
DE102014202008A1 (en) * 2014-02-05 2015-08-06 Robert Bosch Gmbh Electronic system and method for manufacturing an electronic system
JP6511534B2 (en) 2015-03-24 2019-05-15 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and method of manufacturing a device
EP3240372A1 (en) 2016-04-27 2017-11-01 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Heat capacitive component carrier and method to produce said component carrier
DE102017200524A1 (en) * 2017-01-13 2018-07-19 Siemens Aktiengesellschaft Cooling device with a heat pipe and a latent heat storage, method for producing the same and electronic circuit
DE102023126586A1 (en) 2022-09-30 2024-04-04 Bernd WILDPANNER Semiconductor component

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
WO2000054332A1 (en) * 1999-03-11 2000-09-14 Conexant Systems, Inc Cooling system for pulsed power electronics
US6317321B1 (en) * 1994-11-04 2001-11-13 Compaq Computer Corporation Lap-top enclosure having surface coated with heat-absorbing phase-change material
EP1336992A2 (en) * 2002-02-15 2003-08-20 Delphi Technologies, Inc. Thermally-capacitive phase change encapsulant for electronic devices

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CH546480A (en) * 1972-06-08 1974-02-28 Bbc Brown Boveri & Cie DEVICE FOR THE ABSORPTION OF THERMAL IMPULSES.
JPS59155156A (en) * 1983-02-24 1984-09-04 Toshiba Corp Module of integrated circuit
DE4019091A1 (en) * 1990-06-15 1991-12-19 Battelle Institut E V HEAT DISCHARGE DEVICE FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
US5315154A (en) * 1993-05-14 1994-05-24 Hughes Aircraft Company Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
EP0732743A3 (en) * 1995-03-17 1998-05-13 Texas Instruments Incorporated Heat sinks
US6202739B1 (en) * 1998-11-25 2001-03-20 Motorola, Inc. Apparatus including a heat-dissipating apparatus, and method for forming same
DE19932441A1 (en) * 1999-07-12 2001-01-25 Siemens Ag Device for cooling semiconductor components when load peaks occur
DE10114998A1 (en) * 2000-06-08 2002-02-21 Merck Patent Gmbh Use of PCM in coolers for electronic batteries

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US6317321B1 (en) * 1994-11-04 2001-11-13 Compaq Computer Corporation Lap-top enclosure having surface coated with heat-absorbing phase-change material
WO2000054332A1 (en) * 1999-03-11 2000-09-14 Conexant Systems, Inc Cooling system for pulsed power electronics
EP1336992A2 (en) * 2002-02-15 2003-08-20 Delphi Technologies, Inc. Thermally-capacitive phase change encapsulant for electronic devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104272453A (en) * 2012-04-25 2015-01-07 高通股份有限公司 Thermal management of integrated circuits using phase change material and heat spreaders
CN104272453B (en) * 2012-04-25 2016-05-25 高通股份有限公司 Use phase-change material and the heat management of radiator to integrated circuit

Also Published As

Publication number Publication date
WO2005036587A2 (en) 2005-04-21
DE10347518A1 (en) 2005-05-25

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