WO2005036587A3 - Elektronisches bauelement, schaltungsträgeraufbau und elektronikeinheit mit wärmespeicher - Google Patents

Elektronisches bauelement, schaltungsträgeraufbau und elektronikeinheit mit wärmespeicher Download PDF

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Publication number
WO2005036587A3
WO2005036587A3 PCT/EP2004/052528 EP2004052528W WO2005036587A3 WO 2005036587 A3 WO2005036587 A3 WO 2005036587A3 EP 2004052528 W EP2004052528 W EP 2004052528W WO 2005036587 A3 WO2005036587 A3 WO 2005036587A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic
component
electronic component
carrier assembly
circuit carrier
Prior art date
Application number
PCT/EP2004/052528
Other languages
English (en)
French (fr)
Other versions
WO2005036587A2 (de
Inventor
Stephan Bolz
Michael Decker
Thomas Riepl
Karin Schottenloher
Daniela Wolf
Original Assignee
Siemens Ag
Stephan Bolz
Michael Decker
Thomas Riepl
Karin Schottenloher
Daniela Wolf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Stephan Bolz, Michael Decker, Thomas Riepl, Karin Schottenloher, Daniela Wolf filed Critical Siemens Ag
Publication of WO2005036587A2 publication Critical patent/WO2005036587A2/de
Publication of WO2005036587A3 publication Critical patent/WO2005036587A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Electric Motors In General (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Die vorliegende Erfindung betrifft ein elektronisches Bauelement, einen Schaltungsträgeraufbau sowie eine Elektronikeinheit, insbesondere zur Verwendung im Bereich der Kraftfahrzeugelektronik. Ferner betrifft die Erfindung ein Verfahren zur Herstellung solcher Vorrichtungen. Es ist daher eine Aufgabe der Erfindung, einen Weg aufzuzeigen, um die Betriebstemperatur von elektronischen Bauelementen in einfacher Weise beeinflussen zu können, insbesondere zur Verlängerung der Bauelementlebensdauer. Die Grundidee der Erfindung besteht darin, zeitweise im Betrieb eines elektronischen Bauelements auftretende Betriebstemperaturänderungen durch einen 'thermischen Speicher' in Form eines Phasenänderungsmaterials abzufangen, d. h. eine zeitweise erhöhte oder verringerte thermische Verlustleistung des Bauelements reversibel in der Umgebung dieses Bauelements zu speichern.
PCT/EP2004/052528 2003-10-13 2004-10-13 Elektronisches bauelement, schaltungsträgeraufbau und elektronikeinheit mit wärmespeicher WO2005036587A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10347518.4 2003-10-13
DE10347518A DE10347518A1 (de) 2003-10-13 2003-10-13 Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher

Publications (2)

Publication Number Publication Date
WO2005036587A2 WO2005036587A2 (de) 2005-04-21
WO2005036587A3 true WO2005036587A3 (de) 2009-03-12

Family

ID=34428357

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/052528 WO2005036587A2 (de) 2003-10-13 2004-10-13 Elektronisches bauelement, schaltungsträgeraufbau und elektronikeinheit mit wärmespeicher

Country Status (2)

Country Link
DE (1) DE10347518A1 (de)
WO (1) WO2005036587A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104272453A (zh) * 2012-04-25 2015-01-07 高通股份有限公司 使用相变材料和散热器对集成电路的热管理

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005034546A1 (de) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Baugruppe mit Kühlvorrichtung
DE102005041861B3 (de) * 2005-09-02 2007-04-19 Siemens Ag Anordnung zum Temperieren einer Elektronikeinheit
JP4694514B2 (ja) * 2007-02-08 2011-06-08 トヨタ自動車株式会社 半導体素子の冷却構造
DE102008004053A1 (de) * 2008-01-11 2009-07-23 Airbus Deutschland Gmbh Spitzenlast-Kühlung von elektronischen Bauteilen durch phasenwechselnde Materialien
DE102008057963A1 (de) * 2008-11-19 2010-05-27 Lorenzen, Dirk, Dr. Strahlungsquelle mit einer Wärmeübertragungsvorrichtung und Verfahren zum Betrieb der Strahlungsquelle
DE102009042519A1 (de) * 2009-09-16 2011-03-24 Esw Gmbh Vorrichtung zur Kühlung von Halbleitern
DE102010062593A1 (de) 2010-12-08 2012-06-14 Robert Bosch Gmbh Ultraschallsensor mit einer Dämpfungseinrichtung und Verwendung desselben
DE102010062914A1 (de) * 2010-12-13 2012-06-14 Robert Bosch Gmbh Halbleiter mit einem Verbindungselement zum Aführen von Wärme und Verfahren
DE102011075565A1 (de) * 2011-05-10 2012-11-15 Robert Bosch Gmbh Schaltungsmodul mit Kühlung durch Phasenwechselmaterial
DE102013217829A1 (de) * 2013-09-06 2015-03-12 Siemens Aktiengesellschaft Integriertes Schaltungssystem mit einer ein Latentwärme-Speichermedium nutzenden Kühlvorrichtung
DE102014202008A1 (de) * 2014-02-05 2015-08-06 Robert Bosch Gmbh Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems
WO2016150622A1 (en) 2015-03-24 2016-09-29 Asml Netherlands B.V. A lithography apparatus and a method of manufacturing a device
EP3240372A1 (de) 2016-04-27 2017-11-01 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Kapazitiver wärmekomponententräger und verfahren zur herstellung des komponententrägers
DE102017200524A1 (de) * 2017-01-13 2018-07-19 Siemens Aktiengesellschaft Kühlvorrichtung mit einem Wärmerohr und einem Latentwärmespeicher, Verfahren zum Herstellen derselben und elektronische Schaltung
DE102023126586A1 (de) 2022-09-30 2024-04-04 Bernd WILDPANNER Halbleiter-Bauelement

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US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
WO2000054332A1 (en) * 1999-03-11 2000-09-14 Conexant Systems, Inc Cooling system for pulsed power electronics
US6317321B1 (en) * 1994-11-04 2001-11-13 Compaq Computer Corporation Lap-top enclosure having surface coated with heat-absorbing phase-change material
EP1336992A2 (de) * 2002-02-15 2003-08-20 Delphi Technologies, Inc. Phasenveränderliche Einkapselung mit thermischer Kapazität für elektronische Anordnungen

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CH546480A (de) * 1972-06-08 1974-02-28 Bbc Brown Boveri & Cie Einrichtung zur absorption thermischer impulse.
JPS59155156A (ja) * 1983-02-24 1984-09-04 Toshiba Corp Ｉｃモジユ−ル
DE4019091A1 (de) * 1990-06-15 1991-12-19 Battelle Institut E V Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung
US5315154A (en) * 1993-05-14 1994-05-24 Hughes Aircraft Company Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
EP0732743A3 (de) * 1995-03-17 1998-05-13 Texas Instruments Incorporated Wärmesenken
US6202739B1 (en) * 1998-11-25 2001-03-20 Motorola, Inc. Apparatus including a heat-dissipating apparatus, and method for forming same
DE19932441A1 (de) * 1999-07-12 2001-01-25 Siemens Ag Vorrichtung zur Entwärmung von Halbleiterbauelementen beim Auftreten von Belastungsspitzen
DE10114998A1 (de) * 2000-06-08 2002-02-21 Merck Patent Gmbh Einsatz von PCM in Kühlern für elektronische Batterie

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US6317321B1 (en) * 1994-11-04 2001-11-13 Compaq Computer Corporation Lap-top enclosure having surface coated with heat-absorbing phase-change material
WO2000054332A1 (en) * 1999-03-11 2000-09-14 Conexant Systems, Inc Cooling system for pulsed power electronics
EP1336992A2 (de) * 2002-02-15 2003-08-20 Delphi Technologies, Inc. Phasenveränderliche Einkapselung mit thermischer Kapazität für elektronische Anordnungen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104272453A (zh) * 2012-04-25 2015-01-07 高通股份有限公司 使用相变材料和散热器对集成电路的热管理
CN104272453B (zh) * 2012-04-25 2016-05-25 高通股份有限公司 使用相变材料和散热器对集成电路的热管理

Also Published As

Publication number Publication date
DE10347518A1 (de) 2005-05-25
WO2005036587A2 (de) 2005-04-21

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