WO2005036587A3 - Elektronisches bauelement, schaltungsträgeraufbau und elektronikeinheit mit wärmespeicher - Google Patents
Elektronisches bauelement, schaltungsträgeraufbau und elektronikeinheit mit wärmespeicher Download PDFInfo
- Publication number
- WO2005036587A3 WO2005036587A3 PCT/EP2004/052528 EP2004052528W WO2005036587A3 WO 2005036587 A3 WO2005036587 A3 WO 2005036587A3 EP 2004052528 W EP2004052528 W EP 2004052528W WO 2005036587 A3 WO2005036587 A3 WO 2005036587A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic
- component
- electronic component
- carrier assembly
- circuit carrier
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Control Of Electric Motors In General (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10347518.4 | 2003-10-13 | ||
DE10347518A DE10347518A1 (de) | 2003-10-13 | 2003-10-13 | Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005036587A2 WO2005036587A2 (de) | 2005-04-21 |
WO2005036587A3 true WO2005036587A3 (de) | 2009-03-12 |
Family
ID=34428357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/052528 WO2005036587A2 (de) | 2003-10-13 | 2004-10-13 | Elektronisches bauelement, schaltungsträgeraufbau und elektronikeinheit mit wärmespeicher |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10347518A1 (de) |
WO (1) | WO2005036587A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104272453A (zh) * | 2012-04-25 | 2015-01-07 | 高通股份有限公司 | 使用相变材料和散热器对集成电路的热管理 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005034546A1 (de) * | 2005-07-23 | 2007-01-25 | Conti Temic Microelectronic Gmbh | Baugruppe mit Kühlvorrichtung |
DE102005041861B3 (de) * | 2005-09-02 | 2007-04-19 | Siemens Ag | Anordnung zum Temperieren einer Elektronikeinheit |
JP4694514B2 (ja) * | 2007-02-08 | 2011-06-08 | トヨタ自動車株式会社 | 半導体素子の冷却構造 |
DE102008004053A1 (de) * | 2008-01-11 | 2009-07-23 | Airbus Deutschland Gmbh | Spitzenlast-Kühlung von elektronischen Bauteilen durch phasenwechselnde Materialien |
DE102008057963A1 (de) * | 2008-11-19 | 2010-05-27 | Lorenzen, Dirk, Dr. | Strahlungsquelle mit einer Wärmeübertragungsvorrichtung und Verfahren zum Betrieb der Strahlungsquelle |
DE102009042519A1 (de) * | 2009-09-16 | 2011-03-24 | Esw Gmbh | Vorrichtung zur Kühlung von Halbleitern |
DE102010062593A1 (de) | 2010-12-08 | 2012-06-14 | Robert Bosch Gmbh | Ultraschallsensor mit einer Dämpfungseinrichtung und Verwendung desselben |
DE102010062914A1 (de) * | 2010-12-13 | 2012-06-14 | Robert Bosch Gmbh | Halbleiter mit einem Verbindungselement zum Aführen von Wärme und Verfahren |
DE102011075565A1 (de) * | 2011-05-10 | 2012-11-15 | Robert Bosch Gmbh | Schaltungsmodul mit Kühlung durch Phasenwechselmaterial |
DE102013217829A1 (de) * | 2013-09-06 | 2015-03-12 | Siemens Aktiengesellschaft | Integriertes Schaltungssystem mit einer ein Latentwärme-Speichermedium nutzenden Kühlvorrichtung |
DE102014202008A1 (de) * | 2014-02-05 | 2015-08-06 | Robert Bosch Gmbh | Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems |
WO2016150622A1 (en) | 2015-03-24 | 2016-09-29 | Asml Netherlands B.V. | A lithography apparatus and a method of manufacturing a device |
EP3240372A1 (de) | 2016-04-27 | 2017-11-01 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Kapazitiver wärmekomponententräger und verfahren zur herstellung des komponententrägers |
DE102017200524A1 (de) * | 2017-01-13 | 2018-07-19 | Siemens Aktiengesellschaft | Kühlvorrichtung mit einem Wärmerohr und einem Latentwärmespeicher, Verfahren zum Herstellen derselben und elektronische Schaltung |
DE102023126586A1 (de) | 2022-09-30 | 2024-04-04 | Bernd WILDPANNER | Halbleiter-Bauelement |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5349237A (en) * | 1992-03-20 | 1994-09-20 | Vlsi Technology, Inc. | Integrated circuit package including a heat pipe |
WO2000054332A1 (en) * | 1999-03-11 | 2000-09-14 | Conexant Systems, Inc | Cooling system for pulsed power electronics |
US6317321B1 (en) * | 1994-11-04 | 2001-11-13 | Compaq Computer Corporation | Lap-top enclosure having surface coated with heat-absorbing phase-change material |
EP1336992A2 (de) * | 2002-02-15 | 2003-08-20 | Delphi Technologies, Inc. | Phasenveränderliche Einkapselung mit thermischer Kapazität für elektronische Anordnungen |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH546480A (de) * | 1972-06-08 | 1974-02-28 | Bbc Brown Boveri & Cie | Einrichtung zur absorption thermischer impulse. |
JPS59155156A (ja) * | 1983-02-24 | 1984-09-04 | Toshiba Corp | Icモジユ−ル |
DE4019091A1 (de) * | 1990-06-15 | 1991-12-19 | Battelle Institut E V | Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung |
US5315154A (en) * | 1993-05-14 | 1994-05-24 | Hughes Aircraft Company | Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition |
US5455458A (en) * | 1993-08-09 | 1995-10-03 | Hughes Aircraft Company | Phase change cooling of semiconductor power modules |
EP0732743A3 (de) * | 1995-03-17 | 1998-05-13 | Texas Instruments Incorporated | Wärmesenken |
US6202739B1 (en) * | 1998-11-25 | 2001-03-20 | Motorola, Inc. | Apparatus including a heat-dissipating apparatus, and method for forming same |
DE19932441A1 (de) * | 1999-07-12 | 2001-01-25 | Siemens Ag | Vorrichtung zur Entwärmung von Halbleiterbauelementen beim Auftreten von Belastungsspitzen |
DE10114998A1 (de) * | 2000-06-08 | 2002-02-21 | Merck Patent Gmbh | Einsatz von PCM in Kühlern für elektronische Batterie |
-
2003
- 2003-10-13 DE DE10347518A patent/DE10347518A1/de not_active Withdrawn
-
2004
- 2004-10-13 WO PCT/EP2004/052528 patent/WO2005036587A2/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5349237A (en) * | 1992-03-20 | 1994-09-20 | Vlsi Technology, Inc. | Integrated circuit package including a heat pipe |
US6317321B1 (en) * | 1994-11-04 | 2001-11-13 | Compaq Computer Corporation | Lap-top enclosure having surface coated with heat-absorbing phase-change material |
WO2000054332A1 (en) * | 1999-03-11 | 2000-09-14 | Conexant Systems, Inc | Cooling system for pulsed power electronics |
EP1336992A2 (de) * | 2002-02-15 | 2003-08-20 | Delphi Technologies, Inc. | Phasenveränderliche Einkapselung mit thermischer Kapazität für elektronische Anordnungen |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104272453A (zh) * | 2012-04-25 | 2015-01-07 | 高通股份有限公司 | 使用相变材料和散热器对集成电路的热管理 |
CN104272453B (zh) * | 2012-04-25 | 2016-05-25 | 高通股份有限公司 | 使用相变材料和散热器对集成电路的热管理 |
Also Published As
Publication number | Publication date |
---|---|
DE10347518A1 (de) | 2005-05-25 |
WO2005036587A2 (de) | 2005-04-21 |
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