WO2005029555A3 - Nanostructure augmentation of surfaces for enhanced thermal transfer - Google Patents

Nanostructure augmentation of surfaces for enhanced thermal transfer Download PDF

Info

Publication number
WO2005029555A3
WO2005029555A3 PCT/US2004/030734 US2004030734W WO2005029555A3 WO 2005029555 A3 WO2005029555 A3 WO 2005029555A3 US 2004030734 W US2004030734 W US 2004030734W WO 2005029555 A3 WO2005029555 A3 WO 2005029555A3
Authority
WO
WIPO (PCT)
Prior art keywords
nanostructure
augmentation
thermal transfer
nanostructures
enhanced thermal
Prior art date
Application number
PCT/US2004/030734
Other languages
French (fr)
Other versions
WO2005029555A2 (en
Inventor
Ju-Hyung Lee
Nasreen G Chopra
Original Assignee
Koila Inc
Ju-Hyung Lee
Nasreen G Chopra
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koila Inc, Ju-Hyung Lee, Nasreen G Chopra filed Critical Koila Inc
Publication of WO2005029555A2 publication Critical patent/WO2005029555A2/en
Publication of WO2005029555A3 publication Critical patent/WO2005029555A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032Packages or encapsulation
    • B81B7/0077Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0081Thermal properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites

Abstract

Nanostructures augment heat-exchange surfaces of various devices or structures. In some embodiments, the nanostructures are arranged such that air or other cooling fluid can flow between the nanostructures. In other embodiments, the nanostructures are arranged densely to provide good contact between the augmented device or structure and another device or structure.
PCT/US2004/030734 2003-09-16 2004-09-16 Nanostructure augmentation of surfaces for enhanced thermal transfer WO2005029555A2 (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US50361303P 2003-09-16 2003-09-16
US50361203P 2003-09-16 2003-09-16
US50359103P 2003-09-16 2003-09-16
US60/503,613 2003-09-16
US60/503,591 2003-09-16
US60/503,612 2003-09-16
US53224403P 2003-12-23 2003-12-23
US60/532,244 2003-12-23
US54470904P 2004-02-13 2004-02-13
US60/544,709 2004-02-13
US56018004P 2004-04-06 2004-04-06
US60/560,180 2004-04-06

Publications (2)

Publication Number Publication Date
WO2005029555A2 WO2005029555A2 (en) 2005-03-31
WO2005029555A3 true WO2005029555A3 (en) 2005-07-07

Family

ID=34382307

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2004/030416 WO2005028549A2 (en) 2003-09-16 2004-09-16 Nano-composite materials for thermal management applications
PCT/US2004/030734 WO2005029555A2 (en) 2003-09-16 2004-09-16 Nanostructure augmentation of surfaces for enhanced thermal transfer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2004/030416 WO2005028549A2 (en) 2003-09-16 2004-09-16 Nano-composite materials for thermal management applications

Country Status (2)

Country Link
TW (2) TW200516100A (en)
WO (2) WO2005028549A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US8062554B2 (en) * 2005-02-04 2011-11-22 Raytheon Company System and methods of dispersion of nanostructures in composite materials
US9771264B2 (en) 2005-10-25 2017-09-26 Massachusetts Institute Of Technology Controlled-orientation films and nanocomposites including nanotubes or other nanostructures
DE102006010232A1 (en) 2006-03-02 2007-09-06 Schunk Kohlenstofftechnik Gmbh Method for producing a heat sink and heat sink
CN100437013C (en) * 2006-03-07 2008-11-26 天津大学 Heating tube with nanometer coating on internal surface and evaporator
US8337979B2 (en) 2006-05-19 2012-12-25 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
EP2441884A1 (en) 2006-05-19 2012-04-18 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
KR100818273B1 (en) 2006-09-04 2008-04-01 삼성전자주식회사 Method of reducing temperature difference between a pair of substrates and fluid reaction device using the same
US8220530B2 (en) 2006-10-17 2012-07-17 Purdue Research Foundation Electrothermal interface material enhancer
JP5201367B2 (en) * 2007-03-23 2013-06-05 帝人株式会社 Thermosetting resin composite composition, resin molded body and method for producing the same
US8636972B1 (en) 2007-07-31 2014-01-28 Raytheon Company Making a nanomaterial composite
GB0715990D0 (en) * 2007-08-16 2007-09-26 Airbus Uk Ltd Method and apparatus for manufacturing a component from a composite material
US8919428B2 (en) 2007-10-17 2014-12-30 Purdue Research Foundation Methods for attaching carbon nanotubes to a carbon substrate
US8541058B2 (en) 2009-03-06 2013-09-24 Timothy S. Fisher Palladium thiolate bonding of carbon nanotubes
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US8541933B2 (en) * 2010-01-12 2013-09-24 GE Lighting Solutions, LLC Transparent thermally conductive polymer composites for light source thermal management
FR2958407B1 (en) * 2010-04-02 2012-12-28 Snecma PROCESS FOR ANALYZING A PLURALITY OF FERROMAGNETIC PARTICLES
US8668356B2 (en) * 2010-04-02 2014-03-11 GE Lighting Solutions, LLC Lightweight heat sinks and LED lamps employing same
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
US9484283B2 (en) 2013-01-04 2016-11-01 Toyota Motor Engineering & Manufacturing North America Inc. Modular jet impingement cooling apparatuses with exchangeable jet plates
US9460985B2 (en) 2013-01-04 2016-10-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses having a jet orifice surface with alternating vapor guide channels
JP6373284B2 (en) 2013-02-28 2018-08-15 エヌ12 テクノロジーズ, インク.N12 Technologies, Inc. Nano-structured film cartridge-based dispensing
US8981556B2 (en) 2013-03-19 2015-03-17 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having non-uniform jet orifice sizes
US9247679B2 (en) 2013-05-24 2016-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement coolers and power electronics modules comprising the same
US9803938B2 (en) 2013-07-05 2017-10-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies having porous three dimensional surfaces
US9257365B2 (en) 2013-07-05 2016-02-09 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies and power electronics modules having multiple-porosity structures
CN105086912B (en) * 2015-09-06 2017-07-04 安徽工业大学 A kind of stronitum stannate nanometer rods composite electron encapsulating material
EP3398907A4 (en) * 2015-12-28 2019-08-14 Hitachi Zosen Corporation Carbon nanotube composite material and method for producing carbon nanotube composite material
CN109311239A (en) 2016-05-31 2019-02-05 麻省理工学院 Composite article including non-linear elongated nanostructure is with and related methods
US20190085138A1 (en) 2017-09-15 2019-03-21 Massachusetts Institute Of Technology Low-defect fabrication of composite materials
US11031657B2 (en) 2017-11-28 2021-06-08 Massachusetts Institute Of Technology Separators comprising elongated nanostructures and associated devices and methods, including devices and methods for energy storage and/or use
CN111891399B (en) * 2020-06-18 2023-06-20 北京遥感设备研究所 Become multi-functional integrated structure of high-strength high heat conduction of branch aluminum alloy

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5946930A (en) * 1997-03-26 1999-09-07 Anthony; Michael M. Self-cooling beverage and food container using fullerene nanotubes
US5965267A (en) * 1995-02-17 1999-10-12 Arizona Board Of Regents On Behalf Of The University Of Arizona Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxide and the nanoencapsulates and nanotubes formed thereby
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US20030116503A1 (en) * 2001-12-21 2003-06-26 Yong Wang Carbon nanotube-containing structures, methods of making, and processes using same
KR20030062116A (en) * 2002-01-16 2003-07-23 삼성에스디아이 주식회사 Heat radiator structure and manufacturing method therof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10113587A1 (en) * 2001-03-20 2002-10-02 Morphochem Ag Process for the preparation of substituted pyrroles
US6965513B2 (en) * 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965267A (en) * 1995-02-17 1999-10-12 Arizona Board Of Regents On Behalf Of The University Of Arizona Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxide and the nanoencapsulates and nanotubes formed thereby
US5946930A (en) * 1997-03-26 1999-09-07 Anthony; Michael M. Self-cooling beverage and food container using fullerene nanotubes
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US20030116503A1 (en) * 2001-12-21 2003-06-26 Yong Wang Carbon nanotube-containing structures, methods of making, and processes using same
KR20030062116A (en) * 2002-01-16 2003-07-23 삼성에스디아이 주식회사 Heat radiator structure and manufacturing method therof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies

Also Published As

Publication number Publication date
TW200519346A (en) 2005-06-16
WO2005028549A3 (en) 2005-08-18
WO2005029555A2 (en) 2005-03-31
TW200516100A (en) 2005-05-16
WO2005028549A2 (en) 2005-03-31

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