WO2005008787A1 - 光検出素子 - Google Patents
光検出素子 Download PDFInfo
- Publication number
- WO2005008787A1 WO2005008787A1 PCT/JP2004/010428 JP2004010428W WO2005008787A1 WO 2005008787 A1 WO2005008787 A1 WO 2005008787A1 JP 2004010428 W JP2004010428 W JP 2004010428W WO 2005008787 A1 WO2005008787 A1 WO 2005008787A1
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- WIPO (PCT)
- Prior art keywords
- photodetector
- light
- photoconductive
- present
- field effect
- Prior art date
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- 230000003287 optical effect Effects 0.000 title abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 21
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 21
- 230000008859 change Effects 0.000 claims abstract description 7
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- 238000001514 detection method Methods 0.000 claims description 19
- 239000002071 nanotube Substances 0.000 claims description 17
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
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- 239000002184 metal Substances 0.000 description 7
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
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- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
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- 206010034972 Photosensitivity reaction Diseases 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
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- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
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- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 description 1
- FQWUNUXAOHTLLG-ASDGIDEWSA-N 6-[(3s,6s,9s,12r)-3,6-dibenzyl-2,5,8,11-tetraoxo-1,4,7,10-tetrazabicyclo[10.3.0]pentadecan-9-yl]-n-hydroxyhexanamide Chemical compound C([C@H]1C(=O)N2CCC[C@@H]2C(=O)N[C@H](C(N[C@@H](CC=2C=CC=CC=2)C(=O)N1)=O)CCCCCC(=O)NO)C1=CC=CC=C1 FQWUNUXAOHTLLG-ASDGIDEWSA-N 0.000 description 1
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- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
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- IWBUYGUPYWKAMK-UHFFFAOYSA-N [AlH3].[N] Chemical compound [AlH3].[N] IWBUYGUPYWKAMK-UHFFFAOYSA-N 0.000 description 1
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- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
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- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 1
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum arsenic arsenic Chemical compound 0.000 description 1
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- 239000011230 binding agent Substances 0.000 description 1
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- QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
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- 229910052763 palladium Inorganic materials 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
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- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical compound [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K39/30—Devices controlled by radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- H01L31/02—Details
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- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
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- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
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- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/112—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor
- H01L31/113—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor
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- H10K30/60—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation in which radiation controls flow of current through the devices, e.g. photoresistors
- H10K30/65—Light-sensitive field-effect devices, e.g. phototransistors
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/953—Detector using nanostructure
- Y10S977/954—Of radiant energy
Definitions
- the present invention relates to a photodetecting element combining a photoconductive substance and a carbon nanotube.
- a photodetector converts the energy of light or electromagnetic waves into electrical energy.
- Conventional photodetectors include a photo diode and an avalanche photo diode mainly composed of semiconductors. Smart Phototransistor, Photo M0 SCCD sensor, CMOS sensor, Photomultiplier tube using photoelectric effect, etc.
- the former semiconductor photodetector has two types: a carrier that is generated by light irradiation, that is, an electron or a hole, which is directly or amplified and is extracted as an external current, and a minority capacitor that is generated by light irradiation. ) A number of carriers are stored in a predetermined location and modulated by the directional electric field created by them.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-510 17 06 04
- Non-Patent Document 2 P.G.Co 11 ins, K. Brad 1 ey, H. 1 sh i gam i,
- Non-Patent Document 3 (Non-Patent Document 3) 1. A. e V i tsky, W. B. E u I e r
- the conventional photodetectors described above use n-type semiconductors as conductive layers and storage layers.
- Patent Document 1 and Non-patent Documents 1 and 2 use a carbon nanotube as a detection element. Although this example is used, it is intended to detect gas and not to be used as a light-emitting element (the content disclosed in Non-Patent Document 3 is applied to a carbon nanotube JL pump). This is an example of measuring the light current of a single-pitch nanotube by the obtained light.
- the operating principle is different from that of the present invention described below.
- the Hammond wavelength region is narrow and the sensitivity is low.
- the present invention achieves such a conventional situation
- the first means of the present invention is to generate a carrier inside the cell by irradiating light or electromagnetic waves, for example, a silicon, germanium, or galium.
- a carrier for example, a silicon, germanium, or galium.
- a photoconductive material, and a force-bonded carbon nanotube provided in correspondence with the photoconductive material, and are exposed to light or magnetic waves. It is characterized in that the generated carrier is detected by a change in the five conductions of the self-powered bon nanotube.
- the light-recording 1E conductive material includes, for example, silicon, germanium-aluminum arsenide, and cinnamonium-aluminum arsenide. It is characterized by having a single-layer or multi-layer structure made of a plurality of types of photoconductive materials having photoconductivity in the area of different waves VZ selected from different types such as aluminum phosphor and aluminum phosphorus.
- the third means of the present invention is as follows. It is characterized in that a film made of a photoconductive substance is formed.
- a fourth means of the present invention is a method according to the first to third means, wherein a transparent or translucent insulating layer such as, for example, silicon oxide is provided between the photoconductive substance and the carbon nanotube. It is characterized by being formed
- the fifth means of the present invention is characterized in that in the first to fourth keys, the photodetector has a field effect transmissive structure or a single electron transmissive structure. is there
- the sixth means of the present invention is the fifth means, wherein the field effect transistor structure has a gate electrode below the WJ photoconductive material. It is characterized by having a popped structure
- the electric field effect transistor structure has a structure in which a gate electrode is provided at an upper part of a five-point nanotube with five gate electrodes. It is characterized by this
- the electric field effect transistor comprises:
- the ninth means of the present invention is based on the first to eighth means.
- the electrodes have electrodes that are in contact with both ends of the pon nanotubes, and the electrodes are arranged in a comb shape so as to face each other, and a large number of the pon-nanotubes are connected in parallel between the electrodes. Is characterized by
- a tenth means of the present invention is the first to ninth means, wherein a condensing lens is disposed on a side to which the light or the magnetic wave is irradiated. ).
- the present invention has a structure as described above, has a simple structure, can be manufactured by a simple method, and provides a photodetector having high sensitivity in a wide wavelength range.
- FIG. 1 is a diagram for explaining a light detection principle of a light detection element according to an embodiment of the present invention.
- FIG. 2 is a perspective view of the photodetector according to the first embodiment of the present invention.
- FIG. 3 is a cross-sectional view of the photodetector.
- FIG. 4 is a cross-sectional view of the photodetector according to the second embodiment of the present invention.
- FIG. 5 is a cross-sectional view of the photodetector according to the third embodiment of the present invention.
- FIG. 7 is a cross-sectional view of the photodetector according to the fourth embodiment.
- FIG. 7 is a perspective view of the photodetector according to the fifth embodiment of the present invention. It is a figure showing an example of a sensitivity characteristic.
- FIG. 9 is a diagram illustrating an example of a temperature sensitivity characteristic of the photodetector according to the embodiment of the present invention.
- FIG. 10 is a diagram showing an example of a gate voltage characteristic of the photodetector according to the embodiment of the present invention.
- FIG. 11 is a plan view HI of the photodetector according to the sixth embodiment of the present invention.
- FIG. 12 is a sectional view of a photodetection device according to a seventh embodiment of the present invention.
- FIG. 13 is a cross-sectional view of the light detection device according to the eighth embodiment of the present invention.
- FIG. 14 is a cross-sectional view of a photodetector device according to a ninth embodiment of the present invention.
- FIG. 15 is a schematic configuration diagram of an optical signal processing circuit using a detection element according to the embodiment of the present invention.
- FIG. 16 is a schematic configuration diagram showing an example in which a photodetector according to an embodiment of the present invention is used for a image sensor.
- FIG. 1 is a diagram for explaining the light detection principle of the photodetector according to the embodiment of the present invention.
- a pontoon tube 2 shines on the photoconductive substance 1 in the vicinity of the photoconductive substance 1 or is irradiated with a magnetic wave 3, as shown in FIG.
- the carrier 4 is generated in the photoconductive material 1 and this carrier 4 emits a bundled wire 5C (see FIG. 3 (c)).
- the presence or intensity of light or magnetic wave 3 irradiating photoconductive substance 1 that affects conduction can be detected as a change in the electrical conduction of carbon nanotube 2.
- FIGS. 2 and 3 are views for explaining the first embodiment of the present invention.
- FIG. 2 is a perspective view of the photodetector.
- FIG. 3 is a cross-sectional view of the photodetector. Then, a pontotube 2 is formed on the photoconductive substance 1 via an insulating layer 6, and the force is applied to the bon nanotube 2. Open electrode 7 7 to apply pressure equivalent to M
- a photoconductive silicon substrate (photoconductive material) is used.
- Photoconductive substance 1 is used for chemical phase growth equipment (CVD equipment) such as metal vapor deposition equipment (MBE equipment) and metal vapor phase epitaxy equipment (M0CVD).
- CVD equipment chemical phase growth equipment
- MBE equipment metal vapor deposition equipment
- M0CVD metal vapor phase epitaxy equipment
- the photoconductive substance 1 that can be made by crystal growth using y can be P or semi-insulating even if n ⁇ y
- the insulating layer 6 is made of a transparent or translucent material. Then, as shown in FIG. 3, the key 4 generated by irradiating the photoconductive material 1 with light or a magnetic wave 3 through the insulating layer 6 through O is contained in the photoconductive material 1. If it exists, it is not always necessary to flow into the force-pong nanotube2. The light can be incident from the bottom or side of the photodetector.
- FIG. 4 is a cross-sectional view of a photodetector for illustrating a second embodiment of the present invention.
- a plurality of types of photoconductive materials having photoconductivity in different wavelength ranges are shown. If a multilayer structure 8 of a to 1 e is adopted, a photodetector having sensitivity over the entire photosensitivity wavelength in of each photoconductive substance 1 is manufactured. be able to.
- An example of the photosensitivity wavelength range of the photoconductive material 1 is as follows. Silicon (Si): 200 1100 nm, Germanium (Ge): 500-1500 nm, Gallium arsenide (GaAs): 200 0 nm, indium gallium arsenide (InGaAs): 65 0 to 2900 nm, indium arsenide (InAs): 130 000 nm
- AIAs aluminum arsenic
- AIGAAs aluminum arsenic arsenic
- InAAIAs indium aluminum arsenide
- GaAsP gallium arsenide phosphorus
- Rum Arsenic phosphorus (1 nGaAsP) indium antimony (1 nSb)
- mercury (millimeter) mercury HgCdTe
- PbSe lead selenium
- PbS lead sulfur
- CdSe cadmium selenium
- Cdsulfate Cds
- GAN gallium nitrogen
- indium gallium nitrogen indium gallium nitrogen
- the sensitivity wavelength varies depending on the combination (composition ratio) of the various optical IE conductive substances 1.
- the appropriate film thickness of each layer is from several nanometers to several micrometer. The larger the film thickness, the larger the volume of the sensitive region, but if the film is too thick, it takes time to form the film.
- aluminum gallium arsenide (1 nGaAs) film, gallium arsenide (GaAS) film, aluminum-aluminum arsenide (A1As) The shells are layered in the order of the membrane. However, it is not always necessary to arrange them in this way. ⁇ Necessary / light hL, response characteristics, and characteristics of individual materials! It should be noted that the order of the layers to be formed, the thickness of the layers, and the number of the layers may be appropriately determined.
- the multilayer structure 8 is used.However, a plurality of types of photoconductive materials 1 having photoconductivity in different wavelength ranges are appropriately mixed according to the required light response characteristics and the characteristics of each material. It is possible to manufacture a photodetector having a single-layer structure having sensitivity over the entire photosensitivity wavelength range of each photoconductive substance 1.
- the photodetector according to the present invention has a very simple configuration, it does not have to be a carrier generated by irradiation of light or electromagnetic waves.
- the bundle n3 ⁇ 4N emitted from the filter has a structure that affects the i-conduction of carbon nano-naps installed through the insulating layer, the irradiation of light or electromagnetic waves is detected with high accuracy. You can do it.
- FIG. 5 is a cross-sectional view of a photodetector for illustrating a third embodiment of the present invention. 0
- a gate electrode is provided below photoconductive material 1.
- Pole 9 is provided to create a field effect transmissive structure
- FIG. 6 is a cross-sectional view of a photodetector for illustrating a fourth embodiment of the present invention.
- the field effect transistor is made with a gate electrode 9
- FIG. 7 is a perspective view of a photodetector for explaining a fifth embodiment of the present invention.
- a gate electrode is formed on the insulating layer 6 of the present embodiment in the vicinity of the power nanotube 2.
- the field effect structure is a lantern structure.
- y ⁇ H1 It is possible to measure a single fan with 13 ⁇ 4 sensitivity by lowering the current.
- the photoconductive substance may be located under the power nanotube, but may be located on the top. If the method of formation by coating is adopted, it is easy to fabricate a photodetector. If a photoconductive substance is dissolved in a resin or the like and applied, the production of a photodetector can be more easily performed.
- the above-mentioned resin functions as a binder, and for example, a transparent resin such as an acrylic resin or an epoxy resin is suitable. Also, the sensitivity can be improved by coloring the layer of the photoconductive material 1. It is possible to provide a color filter that limits the wavelength range.
- FIG. 8 is a diagram showing an example of the wavelength sensitivity characteristics of the photodetector according to the first embodiment (see FIGS. 2 and 3) in a room.
- silicon oxide as the insulating layer 6
- a carbon nanotube 2 was formed on the insulating layer 6, and the two electrodes 7, 7 formed on both the carbon nanotube 2 were formed.
- M Pressure in this embodiment, a drain pressure of 2 V
- the light sensitivity obtained from the change in the current flowing through the pressure-sensitive nanotube 2 is changed by the light emitted to the photoconductive material 1. Shown for different wavelengths
- the photosensitivity wavelength shown in this figure is that of a silicon V-con, with a light intensity of 15 A / W near the wavelength of 600 nm, which is the same as that of the conventional silicon Z1.
- Fig. 9 is a graph showing an example of the characteristic of the photodetector with a very high optical sensitivity of about 20 times.
- the measurement conditions at this time are as follows. Using a light with a skin length of 600 ⁇ m, the light intensity was measured at each time. As shown in the figure, by adjusting the measurement temperature of the photodetector ud element, high light sensitivity can be obtained, and the measurement Lim degree can be adjusted to the section H of 1725250K. And due to light
- FIGS. 2 and 3 the other structures are the same, and in the structure in which only the force-ponnane tube 2 is not manufactured, not only 3 ⁇ 41E is not seen, but also ⁇ the light-detecting element. No action
- a gate electrode is formed in the vicinity of a carbon nanotube to form a field effect transistor structure, so that a photoconductive substance or
- the sensitivity of the photodetector can be adjusted by controlling the number of elements in the probe and adjusting the lane current and photocurrent.
- FIG. 10 shows the ⁇ f ⁇ of the photodetector having the field effect transmissive structure when the gate voltage was changed.
- FIG. 1 is a characteristic diagram showing a change in the lane current and the photocurrent in FIG. 1.
- the gate voltage of the photodetector having the field effect transistor structure is adjusted. Therefore, it is possible to obtain a high intensity of the photocurrent, and it is possible to increase the sensitivity. Since the photodetectors of the present invention can be easily connected in a plurality of rows or in parallel, the output can be further increased.
- FIG. 11 illustrates the sixth embodiment of the fifth embodiment.
- this embodiment which is a plan view of a photodetecting element for performing the operation, the two comb-shaped poles 7 and 7 are placed ⁇ on the insulating layer 6 so as to face each other, and a force is applied between the electrodes 77. Many Nanotubes 2 are connected in parallel. With this arrangement, the output of the photodetector can be made larger.
- FIG. 12 is a cross-sectional view of a light detection device for describing a seventh embodiment m of the present invention.
- This embodiment shows a more specific structure OH using the light detection element of the above embodiment.
- the light detection element is attached and fixed on the stage 11.
- the stage 11 has a plurality of lead electrodes ⁇ 2 a C for connecting to an external circuit.
- the cap 17 is covered with a cap 17 for maintenance, and the lower part of the cap 17 is welded or adhered to the stage 11.
- the U-light is generated by the force to bring the space between the cap 17 attached to 15 and the stage 11 into a true state (decompressed state), or by applying an inert gas such as raw gas or argon gas. Increases the durability and stabilizes the sensing element
- a photodetector having a gate 9 at the bottom and a gate 9 is used, and the gate electrode 9 is fixed to a metal stem 11 by a conductive layer 10. Since the U electrode 12c is directly fixed to the stage 11, the gate electrode 9 is connected to the conductive electrode 10 and the metal electrode 11 via the metal stem 11. 1 2 c
- 11-poles 12a and 12b are a-insulated by insulator 13
- FIG. 13 is a sectional view of a light detection device for illustrating an eighth embodiment of the present invention.
- a part or the whole of a? 15 described above is constituted by a lens body 18.
- the convex part of lens body 18 is Or on both sides.
- FIG. 14 is a cross-sectional view of a light detection device for illustrating a ninth embodiment of the present invention.
- the light detection element on the stage 11 is sealed with a transparent synthetic resin. If the lens body 18 is used as if the shape of the lens body 18 is the same as that of the lens body 18, the light sensitivity can be increased by collecting a large amount of light 3 by the light receiving section of the photodetector. By encapsulating the detection element with synthetic resin, the durability of the light detection element can be increased and the stability can be improved.
- the plurality of photodetectors of the present invention can be easily connected in series or in parallel, they can be used as a first-order or two-dimensional or three-dimensional sensor.
- a light-emitting element 21 such as a light-emitting diode and a power supply 22 are connected to the light-detecting element ⁇ 9 of the present invention via a conductive wire 20 as shown in FIG. It is also possible to directly drive the light-emitting element 21 without connecting an amplifier just by connecting it.
- the two-dimensional optical amplification s # or the optical amplifier s # as shown in Fig. 16 can be used as a night vision camera.
- a main amplifier or optical memo U it can also be applied to an optical signal processing circuit for analog or digital circuits.
- Image sensor 26 is a display that is connected to image sensor 25 (photodetector element 19) by conductor 20.
- a photodetector that responds to light of any wavelength or an electromagnetic wave can be configured.
- a photodetector having an arbitrary multiplication factor can be configured.
- the force nanotube was formed in the plane.
- the shape of the force tube is not necessarily linear, but may be curved, for example, wavy or spiral.
- the power bonder knob was formed on silicon via silicon oxide.
- single element such as silicon germanium, gallium arsenide, and silicon arsenide were formed.
- a similar device can be manufactured even with a semiconductor of
- Multi-structures need not be installed horizontally, but may be installed vertically. Also, it is not always necessary to have a layered structure. If it is a multi-layered structure, it may be a three-dimensional structure it.
- the insulating layer 6 is not always necessary, but removing the insulating layer 6 has an effect of reducing dark current. ⁇ id real
- silicon oxide is used as the insulating layer.
- silicon oxide transparent or translucent glass or resin
- the present invention is based on, for example, a power supply, a photodetection element, and an optical switching element array--next rupture, a one-dimensional or three-dimensional image sensor, and a precision measurement device using the same.
- Position detection elements such as plastic and photo interactive devices in combination with cameras, night vision, cameras, and light-emitting elements can be applied to various technical fields such as optical amplifier 55 for optical arithmetic circuits Is
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Abstract
Description
Claims
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US10/564,936 US7750285B2 (en) | 2003-07-18 | 2004-07-15 | Optical sensor including photoconductive material and carbon nanotube |
JP2005511902A JP4296252B2 (ja) | 2003-07-18 | 2004-07-15 | 光検出素子 |
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JP2007043150A (ja) * | 2005-07-29 | 2007-02-15 | Interuniv Micro Electronica Centrum Vzw | 細長いナノ構造体を有する波長センシティブ検出器 |
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GB2437768A (en) * | 2006-05-03 | 2007-11-07 | Seiko Epson Corp | Photosensing TFT |
US9210304B2 (en) | 2012-03-16 | 2015-12-08 | Empire Technology Development Llc | Low light adaptive imaging device |
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US11757055B2 (en) | 2018-06-26 | 2023-09-12 | Mitsubishi Electric Corporation | Electromagnetic wave detector, and electromagnetic wave detector array |
Also Published As
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US7750285B2 (en) | 2010-07-06 |
JPWO2005008787A1 (ja) | 2006-11-09 |
US20070108484A1 (en) | 2007-05-17 |
JP4296252B2 (ja) | 2009-07-15 |
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