WO2004109812A3 - Gehäuse für ein strahlungsemittierendes bauelement, verfahren zu dessen herstellung und strahlungsemittierendes bauelement - Google Patents

Gehäuse für ein strahlungsemittierendes bauelement, verfahren zu dessen herstellung und strahlungsemittierendes bauelement Download PDF

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Publication number
WO2004109812A3
WO2004109812A3 PCT/DE2004/001104 DE2004001104W WO2004109812A3 WO 2004109812 A3 WO2004109812 A3 WO 2004109812A3 DE 2004001104 W DE2004001104 W DE 2004001104W WO 2004109812 A3 WO2004109812 A3 WO 2004109812A3
Authority
WO
WIPO (PCT)
Prior art keywords
radiation
emitting component
housing
production
system carrier
Prior art date
Application number
PCT/DE2004/001104
Other languages
English (en)
French (fr)
Other versions
WO2004109812A2 (de
Inventor
Stefan Groetsch
Patrick Kromotis
Original Assignee
Osram Opto Semiconductors Gmbh
Stefan Groetsch
Patrick Kromotis
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh, Stefan Groetsch, Patrick Kromotis filed Critical Osram Opto Semiconductors Gmbh
Priority to KR1020057022765A priority Critical patent/KR101164249B1/ko
Priority to JP2006508114A priority patent/JP2006526280A/ja
Priority to US10/558,461 priority patent/US7414269B2/en
Priority to EP04738573A priority patent/EP1629538A2/de
Publication of WO2004109812A2 publication Critical patent/WO2004109812A2/de
Publication of WO2004109812A3 publication Critical patent/WO2004109812A3/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K99/00—Subject matter not provided for in other groups of this subclass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Die Erfindung schlägt ein Gehäuse für zumindest zwei strahlungsemittierende Bauelemente, insbesondere LEDs, vor mit einem Systemträger (1) und einer Reflektoranordnung (2), die auf dem Systemträger (1) angeordnet ist, wobei die Reflektoranordnung eine Anzahl an Reflektoren aufweist, die jeweils zur Aufnahme zumindest eines strahlungsemittierenden Bauelements dienen, und die mit einer Haltevorrichtung (4) aneinander befestigt sind.
PCT/DE2004/001104 2003-05-30 2004-05-28 Gehäuse für ein strahlungsemittierendes bauelement, verfahren zu dessen herstellung und strahlungsemittierendes bauelement WO2004109812A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020057022765A KR101164249B1 (ko) 2003-05-30 2004-05-28 광방출소자의 하우징, 상기 광방출소자 하우징의 제조 방법및 광방출소자
JP2006508114A JP2006526280A (ja) 2003-05-30 2004-05-28 放射線を発する構成素子に用いられるハウジング、該ハウジングを製造するための方法および放射線を発する構成素子
US10/558,461 US7414269B2 (en) 2003-05-30 2004-05-28 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
EP04738573A EP1629538A2 (de) 2003-05-30 2004-05-28 Gehäuse für ein strahlungsemittierendes bauelement, verfahren zu dessen herstellung und strahlungsemittierendes bauelement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10324909.5 2003-05-30
DE10324909.5A DE10324909B4 (de) 2003-05-30 2003-05-30 Gehäuse für ein strahlungsemittierendes Bauelement, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement

Publications (2)

Publication Number Publication Date
WO2004109812A2 WO2004109812A2 (de) 2004-12-16
WO2004109812A3 true WO2004109812A3 (de) 2005-02-03

Family

ID=33494792

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/001104 WO2004109812A2 (de) 2003-05-30 2004-05-28 Gehäuse für ein strahlungsemittierendes bauelement, verfahren zu dessen herstellung und strahlungsemittierendes bauelement

Country Status (8)

Country Link
US (1) US7414269B2 (de)
EP (1) EP1629538A2 (de)
JP (1) JP2006526280A (de)
KR (1) KR101164249B1 (de)
CN (1) CN100407455C (de)
DE (1) DE10324909B4 (de)
TW (1) TWI267999B (de)
WO (1) WO2004109812A2 (de)

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JP4761848B2 (ja) * 2005-06-22 2011-08-31 株式会社東芝 半導体発光装置
JP2009530798A (ja) 2006-01-05 2009-08-27 イルミテックス， インコーポレイテッド Ｌｅｄから光を導くための独立した光学デバイス
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP5956937B2 (ja) * 2006-02-03 2016-07-27 日立化成株式会社 光半導体素子搭載用パッケージ基板の製造方法
JP4300223B2 (ja) * 2006-06-30 2009-07-22 株式会社 日立ディスプレイズ 照明装置および照明装置を用いた表示装置
JP2010506402A (ja) 2006-10-02 2010-02-25 イルミテックス， インコーポレイテッド Ｌｅｄのシステムおよび方法
DE102007001706A1 (de) 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
KR100862531B1 (ko) * 2007-03-12 2008-10-09 삼성전기주식회사 멀티 캐비티 발광다이오드 패키지
JP2011512037A (ja) 2008-02-08 2011-04-14 イルミテックス， インコーポレイテッド エミッタ層成形のためのシステムおよび方法
GB2462411B (en) * 2008-07-30 2013-05-22 Photonstar Led Ltd Tunable colour led module
TW201034256A (en) * 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
US8084777B2 (en) * 2009-03-24 2011-12-27 Bridgelux, Inc. Light emitting diode source with protective barrier
SG175267A1 (en) * 2009-05-04 2011-11-28 Procter & Gamble Wearable article with highly extensible fastening member having stress distribution features
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
CA2777781A1 (en) * 2009-10-15 2011-04-21 The Procter & Gamble Company Wearable article with extensible fastening member having stress distribution features and/or fastening combination performance characteristics, and method of testing and selectingfastening combination performance characteristics
US8157412B2 (en) * 2009-12-01 2012-04-17 Shin Zu Shing Co., Ltd. Light emitting diode substrate assembly
DE102012220977A1 (de) * 2012-11-16 2014-05-22 Osram Gmbh Reflektoranordnung
US10016320B2 (en) 2013-01-11 2018-07-10 The Procter & Gamble Company Wearable article with extensible fastening member having stress distribution features and/or fastening combination performance characteristics, and method of testing and selecting fastening combination performance characteristics
KR102098153B1 (ko) * 2013-07-15 2020-04-08 엘지이노텍 주식회사 발광소자 모듈
US9976710B2 (en) 2013-10-30 2018-05-22 Lilibrand Llc Flexible strip lighting apparatus and methods
JP6265055B2 (ja) * 2014-01-14 2018-01-24 ソニー株式会社 発光装置、表示装置および照明装置
WO2015172794A1 (en) * 2014-05-13 2015-11-19 Coelux Srl Light source and sunlight imitating lighting system
WO2017156189A1 (en) 2016-03-08 2017-09-14 Lilibrand Llc Lighting system with lens assembly
WO2018140727A1 (en) 2017-01-27 2018-08-02 Lilibrand Llc Lighting systems with high color rendering index and uniform planar illumination
US20180328552A1 (en) 2017-03-09 2018-11-15 Lilibrand Llc Fixtures and lighting accessories for lighting devices
US11041609B2 (en) 2018-05-01 2021-06-22 Ecosense Lighting Inc. Lighting systems and devices with central silicone module
US11353200B2 (en) 2018-12-17 2022-06-07 Korrus, Inc. Strip lighting system for direct input of high voltage driving power
DE102022205568A1 (de) 2022-06-01 2023-12-07 Continental Automotive Technologies GmbH Anzeigevorrichtung und Fortbewegungsmittel

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3148843A1 (de) * 1981-12-10 1983-06-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrfach-leuchtdiodenanordnung
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US5084804A (en) * 1988-10-21 1992-01-28 Telefunken Electronic Gmbh Wide-area lamp
WO2002017405A1 (de) * 2000-08-23 2002-02-28 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zu dessen herstellung, modul und vorrichtung mit einem solchen modul
EP1187226A1 (de) * 2000-09-01 2002-03-13 Citizen Electronics Co., Ltd. Oberflächenmontierbares LED und Herstellungsverfahren
US20020084462A1 (en) * 2000-09-29 2002-07-04 Shingo Tamai Light emission device
WO2003019677A2 (de) * 2001-08-21 2003-03-06 Osram Opto Semiconductors Gmbh Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement

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Publication number Priority date Publication date Assignee Title
DE3148843A1 (de) * 1981-12-10 1983-06-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrfach-leuchtdiodenanordnung
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US5084804A (en) * 1988-10-21 1992-01-28 Telefunken Electronic Gmbh Wide-area lamp
WO2002017405A1 (de) * 2000-08-23 2002-02-28 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zu dessen herstellung, modul und vorrichtung mit einem solchen modul
EP1187226A1 (de) * 2000-09-01 2002-03-13 Citizen Electronics Co., Ltd. Oberflächenmontierbares LED und Herstellungsverfahren
US20020084462A1 (en) * 2000-09-29 2002-07-04 Shingo Tamai Light emission device
WO2003019677A2 (de) * 2001-08-21 2003-03-06 Osram Opto Semiconductors Gmbh Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement

Also Published As

Publication number Publication date
DE10324909A1 (de) 2005-01-05
DE10324909B4 (de) 2017-09-07
EP1629538A2 (de) 2006-03-01
CN1799149A (zh) 2006-07-05
CN100407455C (zh) 2008-07-30
TWI267999B (en) 2006-12-01
TW200427114A (en) 2004-12-01
KR101164249B1 (ko) 2012-07-09
US7414269B2 (en) 2008-08-19
WO2004109812A2 (de) 2004-12-16
US20070069227A1 (en) 2007-03-29
JP2006526280A (ja) 2006-11-16
KR20060020645A (ko) 2006-03-06

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