WO2004089585A2 - Plaque de serrage et procede pour produire une plaque de serrage - Google Patents

Plaque de serrage et procede pour produire une plaque de serrage Download PDF

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Publication number
WO2004089585A2
WO2004089585A2 PCT/EP2004/003730 EP2004003730W WO2004089585A2 WO 2004089585 A2 WO2004089585 A2 WO 2004089585A2 EP 2004003730 W EP2004003730 W EP 2004003730W WO 2004089585 A2 WO2004089585 A2 WO 2004089585A2
Authority
WO
WIPO (PCT)
Prior art keywords
chips
micro
plate
chipboard
chip
Prior art date
Application number
PCT/EP2004/003730
Other languages
German (de)
English (en)
Other versions
WO2004089585A3 (fr
Inventor
Martin Berger
Manfred Riepertinger
Original Assignee
Fritz Egger Gmbh & Co.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fritz Egger Gmbh & Co. filed Critical Fritz Egger Gmbh & Co.
Priority to DE502004009691T priority Critical patent/DE502004009691D1/de
Priority to AT04739079T priority patent/ATE435104T1/de
Priority to EP04739079A priority patent/EP1610933B1/fr
Priority to PL04739079T priority patent/PL1610933T3/pl
Publication of WO2004089585A2 publication Critical patent/WO2004089585A2/fr
Publication of WO2004089585A3 publication Critical patent/WO2004089585A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles

Definitions

  • the present invention relates to a method for producing a plate at least partially from micro-chip material and to a plate which has been produced by the method.
  • Table 1 shows the diameters of the chips, the values of the table being understood to mean that, for example, 95.8% by weight of the screening material passes through a sieve with a mesh size of 2.0 mm or 8.4% by mass in the sieve mesh region from 1.4 to 2.0 mm.
  • diameter is to be understood in the indication of a sieve fraction that the diameter in each case indicates the smallest diameter in a cross section in any direction of the particle or chip. Because in a screening, the particles to be sieved are moved so that elongated particles are also erected and come along the longitudinal extent through the sieve.
  • the shavings are mixed separately into cover layers and middle layer in mixers with binder, hardener, wax emulsion and optionally additives and fed to the spreading machine, which forms a multi-layered chip cake mirroring the center of the board.
  • the chip cake consisting of lower cover layer, a middle layer and an upper cover layer (three-layer or multilayer boards). But a multi-layered structure can also be completely missing, then one speaks of single-layer plates.
  • a stable chipboard is pressed under the action of pressure and temperature, by curing the binder, which can meet the requirements of the European standard EN 312-3, shown in Table 2.
  • the fibers leave the refiner together with water and steam via a pressure pipeline, the so-called blowpipe - also called blow-line.
  • blowpipe - also called blow-line.
  • this tube there are several leads for supplying binder, hardener, emulsion and other additives.
  • the fiber-binder mixture thus obtained is transferred to the dryer - usually a tubular electric dryer in which the fibers are dried by the action of convective heat to a final moisture content of 8 to 15%.
  • the result is binder-provided wood fibers from which a fiber cake is subsequently formed.
  • a stable plate medium-density fiberboard MDF or high-density fiberboard HDF
  • the panels comply with the requirements of European standard EN 622, Part 5, which defines the properties of MDF and whose values are shown in Table 4.
  • a fiberboard, in contrast to a chipboard, is distinguished by a very homogeneous density distribution over the plate thickness and over a very homogeneous surface.
  • an MDF board can be painted with conventional painting techniques without pretreatment, just like a chipboard.
  • the reason for this is on the one hand the high isotropy of the MDF surface, which is ensured by the fineness and / or fiberiness of the wood, and on the other hand by the homogeneous suction behavior of the surface.
  • fiberboard Another disadvantage in the production of fiberboard is that the fibers are not pourable Good and thus are expensive to handle.
  • the conventional mixers used for particle board production can not be used for gluing the fibers.
  • the fibers are very flexible due to their elongated rod-like shape with small thickness and have the so-called Curl bin. As a result, juxtaposed fibers entangle and matt easily, which makes pouring or sieving impossible for fractionation.
  • a disadvantage of the fiberboard is that due to the high process temperatures, the color of the fibers and thus of the finished fiberboard is dark is.
  • the dark color complicates a FarbbeSchichtung, for example, by painting, if a light color, for example. White, to be achieved as the surface color.
  • the present invention is therefore based on the technical problem of specifying a method for producing a chipboard and a chipboard itself, wherein the chipboard has properties of an MDF board without the use of expensive MDF manufacturing process.
  • the process according to the invention for producing a plate of cellulosic particles has the following steps:
  • cellulosic material is mechanically machined and then the chips are dried.
  • the chips are at least partially mechanically mikrozerspant and micro-chips are glued.
  • the plate is made at least partially from the Mikrospanmaterial.
  • the wood is not defibred in the moist state after thermal digestion as is usual for MDF, but is micro-machined in the dried state.
  • the plate according to the invention consists of a cellulosic material with a proportion of cellulosic chips and a proportion of binders.
  • Microplated material is provided within at least one plate layer, the chips having a proportion of micro-chips with a diameter of less than 1.0 mm, which is at least 75%, in particular at least 80% and preferably at least 90% of the chips.
  • a further preferred embodiment of the invention even includes a proportion of greater than 95% chips with a diameter of less than 1.0 mm. It is also possible to produce a plate containing over 98% of micro-chips smaller than 1 mm in diameter.
  • the plate according to the invention thus differs from the prior art, which is larger in the at least one layer, the proportion of micro-chips than conventional chipboard. It generally applies that the properties of the chipboard are better, the greater the proportion of chips under a diameter of less than 1 mm.
  • the chips have a proportion of micro-chips with a diameter of less than 0.6 mm, the at least 50%, in particular at least 65% and preferably at least 80% or even at least 85% of the chips.
  • the proportion of small chips, so the micro-chips compared to the prior art is so high that the properties of such micro-chipboard are similar to the properties of MDF boards.
  • the properties of the micro-chipboard are the better, the greater the proportion of smaller micro-chips.
  • the plate may preferably be made entirely of the microspot mat material so as to give a homogeneous distribution of the micropipes within the plate.
  • the plate has a middle layer, which consists of a conventional chip material, while the two outer layers consist of the micro-chip material. This ensures that the cheaper material of the chipboard is used in the middle, while the more expensive material of the micro-chips is used at the bottom and the top, in particular to be able to exploit the improved surface properties can.
  • the inventive method is then designed accordingly, wherein only a part of the plate is made from the micro-chip cake.
  • micro-chip material wood parts are machined in analogy to the chipboard production and on a residual moisture of 2 - 5%, in particular 4 - dried 4.5%. Subsequently, the dry fiber is carried out in a fiber mill, which is for example by means of special V-groove strips and baskets in a position to produce fibers from the chips.
  • the particles produced in the dry fiber are called micro-chips, which can also be derived from the properties of the micro-chips described below.
  • a first distinguishing feature compared to fibers is that the micro-chips represent a pourable and pourable good. In contrast to the fibers for a production of a fiberboard so the micro-chips can be fractionated by a sieving.
  • microspheric mixture thus obtained has the following exemplary microspan size distribution which has been obtained by sieve analysis with screens of corresponding mesh size.
  • Table 5 shows the measurement results for the diameter of the micro-chips over several samples. The result is a diameter distribution which is close to the diameter distribution for fibers shown in Table 3. Further measurement results are explained in more detail in the examples discussed below.
  • micro-chips are subsequently glued, and due to the nature of the micro-chips, conventional mixers used in the chipboard industry can be used. This occurs in contrast to the fiber plate technology (blow-line gluing) by the low processing temperature no damage to the binder, which is reflected in a lower binder requirement.
  • a proportion of binder based on the dry weight of the microprecipitants, of at least 12%, preferably 15-25%, is emphasized.
  • the value of the binder content varies depending on the dust content of the chips, which occurs increasingly in the production of micro chips.
  • micro chip cake happens in analogy to chipboard production. Again, no special devices are needed and it can be used on spreaders of the prior art.
  • one-floor presses multi-daylight presses
  • continuous presses such as conti-roll systems or calendering machines can be used.
  • Another advantage of the method according to the invention compared to the MDF technology is that a grinding of the micro-chipboard is possible immediately after pressing. After hot pressing, MDF boards are stored for 2 to 5 days in the maturing warehouse before they can be sanded and subsequently processed. This circumstance is detrimental to the production logistics as well as to the manufacturing costs due to the need for corresponding storage capacities and the longer capital tie-up in the maturing warehouse.
  • the mechanical technological properties of the micro-chipboard according to the invention correspond to the requirements for MDF boards by the dry process, as shown in Table 4 of EN 622, Part 5 above.
  • sheets from 1.0 mm (eg calender press) to more than 40 mm (platen press or Conti-Roll press) thickness can be produced.
  • the homogenous density distribution over the slab thickness comparable with an MDF slab, offers advantages in edge processing.
  • Particle boards with a marked density minimum in the center of the board and the coarse chip structure of the middle layer chips on the other hand do not provide adequate conditions, for example, for direct paintability of the board edges.
  • Machining surfaces can be directly painted without any complex surface treatment, thanks to the closed nature of the material, comparable to MDF. Such machining is not possible with chipboard due to the porous center layer without complex pore-filling machining.
  • Another area of use is the use of such plates, in particular with low strength (2.5 to 3.5 mm) as door decks. The advantage here is the good paintability of the surface with yet comparatively low plate costs. Also, use as a support plate for laminate floor is possible.
  • FIGS. 1 and 2 is a graphical comparison of the values from Tables 1, 3 and 6, FIG. 2 illustrates a section of the ⁇ diameter portion shown in Fig. 1.
  • Chips from the production of thin chipboard by the calender process are mikrozerspant after drying the same by means of a fiber mill.
  • the mill is characterized by special V-slot bar fittings that leave a narrow gap between stator and rotor of the mill. This can affect the Mikrospangeometrie.
  • the microsphering mixture thus obtained shows the sieve fractionation shown in Table 6.
  • the microsphering mix is mixed with 12% (solids to dry weight micro-chips) of a conventional urea-formaldehyde binder. Furthermore, 0.8 percent by weight of hardener based on solid binder based on ammonium sulfate and about 1.2% paraffin emulsion (solid wax based on dry weight micro-chips) are added in the form of a 60% emulsion.
  • the mixture of the individual components with the micro-chips is carried out in a conventional continuous mixer, as it is used for the production of chipboard.
  • micro-chip mat is formed using a spreader with wind and throw separation.
  • the microspheric cake thus obtained is then pressed in a calender press under the action of pressure and temperature to form a stable plate having the mechanical technological properties shown in Table 7.
  • Figs. 1 and 2 the diameters are shown in cumulative distributions.
  • the curves for the micro-chips and the MDF fibers are very close to each other.
  • a chipboard of the invention can be easily distinguished from a conventional chipboard by analyzing the size distribution of the chips.
  • the micro-chips and the fiber can nevertheless be very well distinguished from each other. Because the fibers have, in contrast to the micro-chips on a much longer form, while the micro-chips have a more cubic or almost cubic shape. Cubic shape means that the dimensions of the micro-chips in length, width and thickness are substantially similar. Incidentally, in contrast to the fiber, the cubic shape makes it possible for the micro-chips to be a free-flowing and pourable material.
  • the following test can be performed.
  • Material of the plate to be examined is treated in an acid bath in order to dissolve the aminoplast resin acting as a binder. Thereafter, the detached material is dried and mechanically sieved. If the material can be sieved, ie if it is sieve-capable, it results from the fact that the plate consists at least partially of micro-chips. If, on the other hand, a coherent, possibly tangling mass forms, then this can be assumed that it was a fiberboard.
  • An essential criterion for the good paintability of the chipboard according to the invention is the limited absorbency of the surface. This is essentially determined by the small size of the chips, by the binder content and the calendar process additionally by the location of the heating drum. The lower the absorbency, the better the paintability.
  • the absorbency can be quantified by means of the toluene test specified in EN 382-1: 1990 10 01 (Fibreboard, Determination of surface absorption, toluene test). It is applied a defined amount of toluene on the arranged at a certain angle to the horizontal specimens and the distance which the resulting droplets travels until it is completely absorbed by the substrate, then determined as a measure of the absorbency.
  • the chipboard according to the invention therefore has a significantly lower absorbency than a conventional chipboard.
  • the chipboard according to the invention can therefore be painted better than a conventional chipboard.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dry Shavers And Clippers (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Laminated Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

La présente invention concerne un procédé pour produire une plaque à partir de particules contenant de la cellulose. La première étape de ce procédé consiste à couper mécaniquement des copeaux de la matière contenant de la cellulose, à sécher les copeaux, puis à les couper au moins partiellement mécaniquement en micro-copeaux qui sont ensuite encollés, et enfin à fabriquer une galette de micro-copeaux à partir de la matière en micro-copeaux, la plaque étant alors produite au moins partiellement à partir de la matière en micro-copeaux par application de pression et de chaleur. La présente invention concerne également une plaque constituée de la matière susmentionnée. Cette invention permet de produire une plaque de serrage présentant des caractéristiques d'une plaque en MDF, mais sans mettre en oeuvre le coûteux procédé de fabrication de MDF.
PCT/EP2004/003730 2003-04-07 2004-04-07 Plaque de serrage et procede pour produire une plaque de serrage WO2004089585A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE502004009691T DE502004009691D1 (de) 2003-04-07 2004-04-07 Verfahren zur herstellung einer spanplatte
AT04739079T ATE435104T1 (de) 2003-04-07 2004-04-07 Verfahren zur herstellung einer spanplatte
EP04739079A EP1610933B1 (fr) 2003-04-07 2004-04-07 Procede pour produire une plaque de serrage
PL04739079T PL1610933T3 (pl) 2003-04-07 2004-04-07 Sposób wytwarzania płyty wiórowej

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10315997.5 2003-04-07
DE10315997A DE10315997A1 (de) 2003-04-07 2003-04-07 Spanplatte sowie Verfahren zur Herstellung einer Spanplatte

Publications (2)

Publication Number Publication Date
WO2004089585A2 true WO2004089585A2 (fr) 2004-10-21
WO2004089585A3 WO2004089585A3 (fr) 2004-11-25

Family

ID=33154116

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/003730 WO2004089585A2 (fr) 2003-04-07 2004-04-07 Plaque de serrage et procede pour produire une plaque de serrage

Country Status (6)

Country Link
EP (2) EP2078599B1 (fr)
AT (2) ATE460263T1 (fr)
DE (3) DE10315997A1 (fr)
ES (2) ES2339832T3 (fr)
PL (2) PL1610933T3 (fr)
WO (1) WO2004089585A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10118311B2 (en) 2007-10-19 2018-11-06 Flooring Industries Limited, Sarl Board, methods for manufacturing boards, and panel which comprises such board material
CN113601631A (zh) * 2021-08-17 2021-11-05 山东鹤洋木业有限公司 一种可镂铣用刨花板及其制备方法
EP4005757A1 (fr) * 2020-11-09 2022-06-01 Siempelkamp Maschinen- und Anlagenbau GmbH Procédé et installation de fabrication de panneaux de matière

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB961736A (en) * 1961-03-30 1964-06-24 August Moralt Improvements in or relating to moulded wood material elements containing sanding or grinding dust
GB1125797A (en) * 1965-05-28 1968-08-28 Panneaux Landais Sopaland Soc Improvements in and relating to a composite panel and improved manufacturing methodtherefor
WO1992006832A1 (fr) * 1990-10-19 1992-04-30 Casco Nobel Industrial Products Ab Composition de farine de bois
US5227024A (en) * 1987-12-14 1993-07-13 Daniel Gomez Low density material containing a vegetable filler
US5695875A (en) * 1992-06-29 1997-12-09 Perstorp Flooring Ab Particle board and use thereof
DE19956765A1 (de) * 1998-11-26 2000-05-31 Ernst Nickel Dünnwandiges, dreidimensional geformtes Halbzeug oder Fertigteil
EP1190825A2 (fr) * 2000-07-29 2002-03-27 Ernst Nickel Produit fini ou semi-fini moulé, tridimensionnel, à paroi mince
US20030001305A1 (en) * 2001-06-25 2003-01-02 Maschinenfabrik J. Dieffenbacher Gmbh & Co. Process for the manufacture of boards of ligneous material

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4409512A1 (de) * 1994-03-19 1995-09-21 Basf Ag Verfahren zur Herstellung von hochreaktiven wässerigen Bindemitteln für Holzwerkstoffe aus zerteiltem gewachsenen Holz
DE19647240B4 (de) * 1996-11-15 2005-06-09 Fritz Homann Gmbh & Co. Kg Holzfaserplatte und Verfahren zu ihrer Herstellung
DE19718772B4 (de) * 1997-05-03 2015-08-20 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und Anlage zur Herstellung von Holzwerkstoffplatten

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB961736A (en) * 1961-03-30 1964-06-24 August Moralt Improvements in or relating to moulded wood material elements containing sanding or grinding dust
GB1125797A (en) * 1965-05-28 1968-08-28 Panneaux Landais Sopaland Soc Improvements in and relating to a composite panel and improved manufacturing methodtherefor
US5227024A (en) * 1987-12-14 1993-07-13 Daniel Gomez Low density material containing a vegetable filler
WO1992006832A1 (fr) * 1990-10-19 1992-04-30 Casco Nobel Industrial Products Ab Composition de farine de bois
US5695875A (en) * 1992-06-29 1997-12-09 Perstorp Flooring Ab Particle board and use thereof
DE19956765A1 (de) * 1998-11-26 2000-05-31 Ernst Nickel Dünnwandiges, dreidimensional geformtes Halbzeug oder Fertigteil
EP1190825A2 (fr) * 2000-07-29 2002-03-27 Ernst Nickel Produit fini ou semi-fini moulé, tridimensionnel, à paroi mince
US20030001305A1 (en) * 2001-06-25 2003-01-02 Maschinenfabrik J. Dieffenbacher Gmbh & Co. Process for the manufacture of boards of ligneous material

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10118311B2 (en) 2007-10-19 2018-11-06 Flooring Industries Limited, Sarl Board, methods for manufacturing boards, and panel which comprises such board material
US11292151B2 (en) 2007-10-19 2022-04-05 Flooring Industries Limited, Sarl Methods for manufacturing boards, and profiled element for manufacturing boards
EP4005757A1 (fr) * 2020-11-09 2022-06-01 Siempelkamp Maschinen- und Anlagenbau GmbH Procédé et installation de fabrication de panneaux de matière
CN113601631A (zh) * 2021-08-17 2021-11-05 山东鹤洋木业有限公司 一种可镂铣用刨花板及其制备方法

Also Published As

Publication number Publication date
EP1610933B1 (fr) 2009-07-01
ES2328572T3 (es) 2009-11-16
EP1610933A2 (fr) 2006-01-04
WO2004089585A3 (fr) 2004-11-25
DE10315997A1 (de) 2004-12-02
ES2339832T3 (es) 2010-05-25
ATE435104T1 (de) 2009-07-15
EP2078599A1 (fr) 2009-07-15
EP2078599B1 (fr) 2010-03-10
ATE460263T1 (de) 2010-03-15
DE502004009691D1 (de) 2009-08-13
PL1610933T3 (pl) 2009-12-31
DE502004010891D1 (de) 2010-04-22
PL2078599T3 (pl) 2010-08-31

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