EP2078599B1 - Plaque de serrage - Google Patents

Plaque de serrage Download PDF

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Publication number
EP2078599B1
EP2078599B1 EP09158439A EP09158439A EP2078599B1 EP 2078599 B1 EP2078599 B1 EP 2078599B1 EP 09158439 A EP09158439 A EP 09158439A EP 09158439 A EP09158439 A EP 09158439A EP 2078599 B1 EP2078599 B1 EP 2078599B1
Authority
EP
European Patent Office
Prior art keywords
chips
micro
chipboard
board
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP09158439A
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German (de)
English (en)
Other versions
EP2078599A1 (fr
Inventor
Manfred Riepertinger
Martin Berger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fritz Egger GmbH and Co OG
Original Assignee
Fritz Egger GmbH and Co OG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fritz Egger GmbH and Co OG filed Critical Fritz Egger GmbH and Co OG
Priority to PL09158439T priority Critical patent/PL2078599T3/pl
Publication of EP2078599A1 publication Critical patent/EP2078599A1/fr
Application granted granted Critical
Publication of EP2078599B1 publication Critical patent/EP2078599B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles

Definitions

  • the present invention relates to a plate made of a cellulosic material, with a content of cellulose-containing chips and with a proportion of binders, wherein at least within a plate layer micro-chip material is provided.
  • Such a plate is for example from the DE 199 56 765 A1 known.
  • Table 1 shows the diameters of the chips, the values of the table being understood to mean that, for example, for covering layer material, 95.8 mass% of the material to be screened passes through a sieve with a mesh size of 2.0 mm or 8.4 mass% through the screen mesh area from 1.4 to 2.0 mm.
  • diameter is to be understood in the indication of a sieve fraction that the diameter in each case indicates the smallest diameter in a cross section in any direction of the particle or chip. Because in a screening, the particles to be sieved are moved so that too elongated particles are erected and come along the longitudinal extent through the sieve.
  • the shavings are mixed separately into cover layers and middle layer in mixers with binder, hardener, wax emulsion and optionally additives and fed to the spreading machine, which forms a multi-layered chip cake mirroring the center of the board.
  • the chip cake consisting of lower cover layer, a middle layer and an upper cover layer (three-layer or multilayer boards). But a multi-layered structure can also be completely missing, then one speaks of single-layer plates.
  • a stable chipboard is pressed under the action of pressure and temperature, by curing the binder, which can meet the requirements of the European standard EN 312-3, shown in Table 2.
  • the production of fiberboards by the dry process is known.
  • the wood particles so-called wood chips, are softened by the action of pressure and temperature in a saturated steam atmosphere and then separated in a refiner into fine particles, the fibers. This process is also called defibration.
  • MDF fibers are prone to clumping or felting, screening with screening machines such as chips is not possible to determine the size of the fibers. Therefore, the diameters of MDF fibers were determined by means of a laser particle counter.
  • the sample material was homogeneously mixed with water to form an approximately 2% dispersion and fed to the PQM 1000 measuring device.
  • the measured quantities were the number of fibers, with a certain length and a certain diameter, from which the mass fractions could then be calculated as a function of the fiber diameter. The results are shown in Table 3.
  • the fibers leave the refiner together with water and steam via a pressure pipeline, the so-called blowpipe - also called blow-line.
  • blowpipe - also called blow-line.
  • this tube there are several leads for supplying binder, hardener, emulsion and other additives.
  • the fiber-binder mixture thus obtained is transferred to the dryer - usually a tubular electric dryer in which the fibers are dried by the action of convective heat to a final moisture content of 8 to 15%.
  • the result is binder-provided wood fibers from which a fiber cake is subsequently formed.
  • a stable plate medium-density fiberboard MDF or high-density fiberboard HDF
  • the panels comply with the requirements of European standard EN 622, Part 5, which defines the properties of MDF and whose values are shown in Table 4.
  • a fiberboard in contrast to a chipboard, is distinguished by a very homogeneous density distribution over the plate thickness and over a very homogeneous surface. If the direct coating of chipboard makes high demands on the preparation of particle board surface quality, such as. can be achieved by trowelling, so an MDF board can be painted with conventional painting techniques without pretreatment as a chipboard. The reason for this is on the one hand the high isotropy of the MDF surface, which is ensured by the fineness and / or fiberiness of the wood, and on the other hand by the homogeneous suction behavior of the surface.
  • fiberboard Another disadvantage in the production of fiberboard is that the fibers are not pourable Good and thus are expensive to handle.
  • the conventional mixers used for particle board production can not be used for gluing the fibers.
  • the fibers are very flexible due to their elongated rod-like shape with small thickness and have the so-called Curl bin. As a result, juxtaposed fibers entangle and matt easily, which makes pouring or sieving impossible for fractionation.
  • a disadvantage of the fiberboard is that because of the high process temperatures, the color of the fibers and thus of the finished fiberboard is dark.
  • the dark color makes a color coating difficult, for example by painting, when a light color, for example white, is to be achieved as the surface color.
  • a molded wood material element comprising wood particles and a binder is known.
  • the WO 92/06832 discloses a wood flour mixture suitable for the production of wood products.
  • the US 2003/0001305 A1 shows a wood-like material plate, which is made of a mixture comprising binder 1 and lignocellulose particles.
  • the US 5,277,024 discloses a low density material having a vegetable filling material.
  • the EP 1 190 825 A2 a three-dimensionally shaped semi-finished or finished part, wherein the semi-finished or finished part of a mixture of wood and / or Wood fiber material and / or plant fiber particles and a liquid, heat-reactive binder.
  • a plate made of a cellulosic material with a content of cellulose-containing chips and a proportion of binders known, at least within a plate layer microspan material is provided.
  • the present invention is therefore based on the technical problem of specifying a chipboard, wherein the chipboard has properties of an MDF board without using the expensive MDF manufacturing process.
  • the plate according to the invention consists of a cellulosic material with a proportion of cellulosic chips and a proportion of binders.
  • Microplated material is provided within at least one plate layer, the chips having a proportion of micro-chips with a diameter of less than 1.0 mm, which is at least 75%, in particular at least 80% and preferably at least 90% of the chips.
  • a further preferred embodiment of the invention even includes a proportion of greater than 95% chips with a diameter of less than 1.0 mm. It is also possible to produce a plate containing over 98% of micro-chips smaller than 1 mm in diameter.
  • the plate according to the invention thus differs from the prior art, which is larger in the at least one layer, the proportion of micro-chips than conventional chipboard. It generally applies that the properties of the chipboard are better, the greater the proportion of chips under a diameter of less than 1 mm.
  • the chips have a proportion of micro-chips with a diameter of less than 0.6 mm, which is at least 50%, in particular at least 65% and preferably at least 80% or even at least 85% of the chips.
  • the proportion of small chips, so the micro-chips compared to the prior art is so high that the properties of such micro-chipboard are similar to the properties of MDF boards.
  • the properties of the micro-chipboard are the better, the greater the proportion of smaller micro-chips.
  • the plate may preferably be made entirely of the microspot mat material so as to give a homogeneous distribution of the micropipes within the plate.
  • the plate has a middle layer, which consists of a conventional chip material, while the two outer layers consist of the micro-chip material. This ensures that the cheaper material of the chipboard is used in the middle, while the more expensive material of the micro-chips is used at the bottom and the top, in particular to be able to exploit the improved surface properties can.
  • the inventive method is then designed accordingly, wherein only a part of the plate is made from the micro-chip cake.
  • micro-chip material wood parts are machined analogously to chipboard production and dried to a residual moisture content of 2-5%, in particular 4-4.5%. Subsequently, the dry fiber is carried out in a fiber mill, which is for example by means of special V-groove strips and baskets in a position to produce fibers from the chips.
  • the particles produced in the dry fiber are called micro-chips, which can also be derived from the properties of the micro-chips described below.
  • a first distinguishing feature compared to fibers is that the micro-chips represent a pourable and pourable good. In contrast to the fibers for a production of a fiberboard so the micro-chips can be fractionated by a sieving.
  • microspheric mixture obtained in this way has the following exemplary microspan size distribution which has been obtained by sieve analysis with sieves of corresponding mesh size.
  • Table 5 shows the measurement results for the diameter of the micro-chips over several samples. The result is a diameter distribution which is close to the diameter distribution for fibers shown in Table 3. Further measurement results are explained in more detail in the examples discussed below.
  • micro-chips are subsequently glued, and due to the nature of the micro-chips, conventional mixers used in the chipboard industry can be used.
  • conventional mixers used in the chipboard industry can be used.
  • fiber plate technology low-line gluing
  • no damage to the binder occurs, which is reflected in a lower binder requirement.
  • a proportion of binder based on the dry weight of the microprecipitants, of at least 12%, preferably 15-25%, is emphasized.
  • the value of the binder content varies depending on the dust content of the chips, which occurs increasingly in the production of micro chips.
  • micro chip cake is done in analogy to chipboard production. Again, no special devices are needed and it can be used on spreaders of the prior art.
  • one-floor presses, multi-daylight presses, continuous presses such as conti-roll systems or calendering machines can be used.
  • Another advantage of the method according to the invention compared to the MDF technology is that a grinding of the micro-chipboard is possible immediately after pressing. After hot pressing, MDF boards are stored for 2 to 5 days in the maturing warehouse before they can be sanded and subsequently processed. This circumstance is detrimental to the production logistics as well as to the manufacturing costs due to the necessity corresponding storage capacities and through the longer capital tie-up in the maturing warehouse.
  • the mechanical technological properties of the micro-chipboard according to the invention correspond to the requirements for MDF boards by the dry process, as shown in Table 4 of EN 622, Part 5 above.
  • sheets from 1.0 mm (for example calender presses) to more than 40 mm thick (platen press or conti-roll press) can be produced.
  • the homogenous density distribution over the slab thickness, comparable with an MDF slab offers advantages in edge processing.
  • Particle boards with a marked density minimum in the center of the board and the coarse chip structure of the middle layer chips on the other hand do not provide adequate conditions, for example, for direct paintability of the board edges.
  • Chips from the production of thin chipboard by the calender process are mikrozerspant after drying the same by means of a fiber mill.
  • the mill is characterized by special V-slot bar fittings that leave a narrow gap between stator and rotor of the mill. This can affect the Mikrospangeometrie.
  • the microsphering mixture thus obtained shows the sieve fractionation shown in Table 6.
  • the microsphering mix is mixed with 12% (solids to dry weight micro-chips) of a conventional urea-formaldehyde binder. Furthermore, 0.8 percent by weight of hardener based on solid binder based on ammonium sulfate and about 1.2% paraffin emulsion (solid wax based on dry weight micro-chips) are added in the form of a 60% emulsion.
  • the mixture of the individual components with the micro-chips is carried out in a conventional continuous mixer, as it is used for the production of chipboard.
  • micro-chip mat is formed using a spreader with wind and throw separation.
  • the microspheric cake thus obtained is then pressed in a calender press under the action of pressure and temperature to form a stable plate having the mechanical technological properties shown in Table 7.
  • the diameters are shown in cumulative distributions.
  • the shavings of the conventional chipboard that are shifted to larger diameters, the values for the middle layer and the outer layer are shown.
  • the curves for the micro-chips and the MDF fibers are very close to each other.
  • a chipboard of the invention can be easily distinguished from a conventional chipboard by analyzing the size distribution of the chips.
  • the micro-chips and the fiber can nevertheless be very well distinguished from each other. Because the fibers have, in contrast to the micro-chips on a much longer form, while the micro-chips have a more cubic or almost cubic shape. Cubic shape means that the dimensions of the micro-chips in length, width and thickness are substantially similar. Incidentally, in contrast to the fiber, the cubic shape makes it possible for the micro-chips to be a free-flowing and pourable material.
  • the following test can be performed become.
  • Material of the plate to be examined is treated in an acid bath in order to dissolve the aminoplast resin acting as a binder. Thereafter, the detached material is dried and mechanically sieved. If the material can be sieved, ie if it is sieve-capable, it results from the fact that the plate consists at least partially of micro-chips. If, on the other hand, a coherent, possibly tangling, mass is formed, then it can be assumed that it was a fiberboard.
  • An essential criterion for the good paintability of the chipboard according to the invention is the limited absorbency of the surface. This is essentially determined by the small size of the chips, by the binder content and the calendar process additionally by the location of the heating drum. The lower the absorbency, the better the paintability.
  • the absorbency can be quantified by means of the toluene test specified in EN 382-1: 1990 10 01 (Fibreboard, Determination of surface absorption, toluene test). It is applied a defined amount of toluene on the arranged at a certain angle to the horizontal specimens and the distance which the resulting droplets travels until it is completely absorbed by the substrate, then determined as a measure of the absorbency.
  • the chipboard according to the invention therefore has a significantly lower absorbency than a conventional chipboard.
  • the chipboard according to the invention can therefore be painted better than a conventional chipboard.
  • Table 1 Diameter distribution of the chips for a conventional chipboard, D - mesh width % Figures in weight percent: topcoat middle class D in mm % total % total 10.0 0.0 0.6 100.0 8.0 1.0 100.0 17.0 99.4 4.0 3.2 99.0 40.5 82.4 2.0 8.4 95.8 7.7 41.9 1.4 22.7 87.4 14.1 34.2 1.0 47.9 64.7 16.1 20.1 0.4 9.6 16.8 2.7 4.0 0.2 7.2 7.2 1.3 1.3 0.0 0.0 0.0 0.0 0.0 Table 2: Mechanical material properties of a conventional chipboard Requirement Thickness range (mm, nominal size) properties test methods unit 3 to 4 > 4 to 6 > 6 to 13 > 13 to 20 > 20 to 25 > 25 to 32 > 32 to 40 > 45 flexural strength EN 310 N / mm 2 13 15 14 13 11.5 10 8.5 7 Flexural modulus EN 310 N / mm 2 1800 1950 1800 1600 1500 1350 1200 1050 transverse tensile strength EN 319 N /

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dry Shavers And Clippers (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Laminated Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Claims (8)

  1. Plaque en matériaux contenant de la cellulose
    - avec une part de copeaux contenant de la cellulose et
    - avec une part de liants,
    un matériau aux microcopeaux étant prévu au moins à l'intérieur d'une couche de plaque,
    caractérisée en ce que les copeaux présentent une teneur en microcopeaux collés d'un diamètre inférieur à 1,0 mm qui est au moins de 75 pour cent en poids et une teneur en microcopeaux collés avec un diamètre inférieur à 0,4 mm qui est d'au moins 35 pour cent en poids.
  2. Plaque selon la revendication 1, caractérisée en ce que la plaque est fabriquée complètement à partir du matériau aux microcopeaux.
  3. Plaque selon la revendication 1 ou 2, caractérisée en ce qu'une couche médiane est fabriquée en matériau de panneau de particules et les deux couches externes sont fabriquées en matériau aux microcopeaux.
  4. Plaque selon l'une des revendications précédentes, caractérisée en ce que le collage des microcopeaux s'effectue avec une teneur en liant par rapport au poids sec des microcopeaux d'au moins 12 pour cent en poids.
  5. Plaque selon la revendication 4, caractérisée en ce que le collage des microcopeaux s'effectue avec une teneur en liant par rapport au poids sec des microcopeaux d'au moins 15 à 25 pour cent en poids.
  6. Plaque selon l'une des revendications précédentes, caractérisée en ce que les copeaux présentent dans la couche de plaque une teneur en microcopeaux d'un diamètre inférieur à 1,0 mm qui s'élève à au moins 80 pour cent en poids, de préférence au moins 90 pour cent en poids, des copeaux.
  7. Plaque selon l'une des revendications précédentes, caractérisée en ce que les copeaux présentent une teneur de microcopeaux d'un diamètre inférieur à 0,6 mm qui comporte au moins 50 pour cent en poids, en particulier au moins 65 pour cent en poids, de préférence au moins 80 pour cent en poids, des copeaux.
  8. Plaque selon l'une des revendications précédentes, caractérisée en ce que les copeaux présentent une teneur de microcopeaux d'un diamètre inférieur à 0,4 mm qui comporte au moins 50 pour cent en poids, de préférence au moins 60 pour cent en poids, des copeaux.
EP09158439A 2003-04-07 2004-04-07 Plaque de serrage Expired - Lifetime EP2078599B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL09158439T PL2078599T3 (pl) 2003-04-07 2004-04-07 Płyta wiórowa

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10315997A DE10315997A1 (de) 2003-04-07 2003-04-07 Spanplatte sowie Verfahren zur Herstellung einer Spanplatte
EP04739079A EP1610933B1 (fr) 2003-04-07 2004-04-07 Procede pour produire une plaque de serrage

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP04739079A Division EP1610933B1 (fr) 2003-04-07 2004-04-07 Procede pour produire une plaque de serrage
EP04739079.4 Division 2004-04-07

Publications (2)

Publication Number Publication Date
EP2078599A1 EP2078599A1 (fr) 2009-07-15
EP2078599B1 true EP2078599B1 (fr) 2010-03-10

Family

ID=33154116

Family Applications (2)

Application Number Title Priority Date Filing Date
EP09158439A Expired - Lifetime EP2078599B1 (fr) 2003-04-07 2004-04-07 Plaque de serrage
EP04739079A Expired - Lifetime EP1610933B1 (fr) 2003-04-07 2004-04-07 Procede pour produire une plaque de serrage

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP04739079A Expired - Lifetime EP1610933B1 (fr) 2003-04-07 2004-04-07 Procede pour produire une plaque de serrage

Country Status (6)

Country Link
EP (2) EP2078599B1 (fr)
AT (2) ATE460263T1 (fr)
DE (3) DE10315997A1 (fr)
ES (2) ES2339832T3 (fr)
PL (2) PL1610933T3 (fr)
WO (1) WO2004089585A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1017821A5 (nl) 2007-10-19 2009-08-04 Flooring Ind Ltd Sarl Plaat, werkwijzen voor het vervaardigen van platen en paneel dat dergelijk plaatmateriaal bevat.
DE102020006861A1 (de) * 2020-11-09 2022-05-12 Siempelkamp Maschinen- Und Anlagenbau Gmbh Verfahren und Anlage zur Herstellung von Werkstoffplatten
CN113601631A (zh) * 2021-08-17 2021-11-05 山东鹤洋木业有限公司 一种可镂铣用刨花板及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1453397A1 (de) * 1961-03-30 1969-03-13 August Moralt Holzindustrie Holzwerkstofformkoerper
FR1444912A (fr) * 1965-05-28 1966-07-08 Panneau composite et procédé perfectionné pour sa fabrication
US5227024A (en) * 1987-12-14 1993-07-13 Daniel Gomez Low density material containing a vegetable filler
SE468419B (sv) * 1990-10-19 1993-01-18 Casco Nobel Ab Pulvertraekomposition foer framstaellning av pressade traeprodukter, foerfarande foer framstaellning av en saadan komposition samt anvaendning av en saadan komposition
SE9201982D0 (sv) * 1992-06-29 1992-06-29 Perstorp Flooring Ab Spaanskiva, foerfarande foer framstaellning daerav samt anvaendning daerav
DE4409512A1 (de) * 1994-03-19 1995-09-21 Basf Ag Verfahren zur Herstellung von hochreaktiven wässerigen Bindemitteln für Holzwerkstoffe aus zerteiltem gewachsenen Holz
DE19647240B4 (de) * 1996-11-15 2005-06-09 Fritz Homann Gmbh & Co. Kg Holzfaserplatte und Verfahren zu ihrer Herstellung
DE19718772B4 (de) * 1997-05-03 2015-08-20 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und Anlage zur Herstellung von Holzwerkstoffplatten
DE19956765A1 (de) * 1998-11-26 2000-05-31 Ernst Nickel Dünnwandiges, dreidimensional geformtes Halbzeug oder Fertigteil
EP1190825A3 (fr) * 2000-07-29 2004-01-21 Ernst Nickel Produit fini ou semi-fini moulé, tridimensionnel, à paroi mince
DE10130526A1 (de) * 2001-06-25 2003-01-09 Dieffenbacher Gmbh Maschf Verfahren zur Herstellung von Holzwerkstoffplatten

Also Published As

Publication number Publication date
EP1610933B1 (fr) 2009-07-01
ES2328572T3 (es) 2009-11-16
WO2004089585A2 (fr) 2004-10-21
EP1610933A2 (fr) 2006-01-04
WO2004089585A3 (fr) 2004-11-25
DE10315997A1 (de) 2004-12-02
ES2339832T3 (es) 2010-05-25
ATE435104T1 (de) 2009-07-15
EP2078599A1 (fr) 2009-07-15
ATE460263T1 (de) 2010-03-15
DE502004009691D1 (de) 2009-08-13
PL1610933T3 (pl) 2009-12-31
DE502004010891D1 (de) 2010-04-22
PL2078599T3 (pl) 2010-08-31

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