WO2004069479A1 - Wire tool used for wire saw cutting device, method of manufacturing wire tool, and method of cutting by wire saw - Google Patents
Wire tool used for wire saw cutting device, method of manufacturing wire tool, and method of cutting by wire saw Download PDFInfo
- Publication number
- WO2004069479A1 WO2004069479A1 PCT/JP2003/001103 JP0301103W WO2004069479A1 WO 2004069479 A1 WO2004069479 A1 WO 2004069479A1 JP 0301103 W JP0301103 W JP 0301103W WO 2004069479 A1 WO2004069479 A1 WO 2004069479A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wire
- wire saw
- tool
- cutting device
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
Abstract
A wire tool used for a wire saw cutting device for slicing a work such as a semiconductor single crystal ingot, a method of manufacturing a wire tool, and a method of cutting by a wire saw, the wire tool (1) used for the wire saw cutting device for slicing the work such as the semiconductor single crystal ingot wherein abrasive grain containing-fiber member (3) having abrasive grains (Q) uniformly adhered thereto is spirally wound on the peripheral surface of a wire core (2), the abrasive grain containing-fiber member (3) is fixed to the wire core (2) in thermoplastic state by a fiber fixing member (4) of thermosetting resin allowed to harden in thermosetting state, and the abrasive grains (Q) used are diamond, silicon carbide, silicon nitride, aluminum, silica, ceramic, or CBN.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/001103 WO2004069479A1 (en) | 2003-02-04 | 2003-02-04 | Wire tool used for wire saw cutting device, method of manufacturing wire tool, and method of cutting by wire saw |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/001103 WO2004069479A1 (en) | 2003-02-04 | 2003-02-04 | Wire tool used for wire saw cutting device, method of manufacturing wire tool, and method of cutting by wire saw |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004069479A1 true WO2004069479A1 (en) | 2004-08-19 |
Family
ID=32843955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/001103 WO2004069479A1 (en) | 2003-02-04 | 2003-02-04 | Wire tool used for wire saw cutting device, method of manufacturing wire tool, and method of cutting by wire saw |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2004069479A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104084443A (en) * | 2014-01-19 | 2014-10-08 | 凡登(常州)新型金属材料技术有限公司 | Heterogeneous metal wire for multi-line cutting, manufacturing device and preparation method thereof |
US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000271872A (en) * | 1999-03-23 | 2000-10-03 | Osaka Diamond Ind Co Ltd | Super abrasive grain resin bond wire saw |
JP2000288902A (en) * | 1999-04-07 | 2000-10-17 | Tokyo Seimitsu Co Ltd | Wire with fixed abrasive grains and fixed abrasive grain wire saw |
JP2002166348A (en) * | 2000-11-30 | 2002-06-11 | Mitsubishi Materials Corp | Working device using grinding rope, and working method |
JP2002200506A (en) * | 2000-12-27 | 2002-07-16 | Kyocera Corp | Wire for bore machining, manufacturing method therefor and machining method for ceramics using the same wire |
JP2002273663A (en) * | 2001-03-14 | 2002-09-25 | Noritake Super Abrasive:Kk | Resin bond wire saw |
JP2003080466A (en) * | 2001-09-10 | 2003-03-18 | Akimichi Koide | Wire tool used for wire saw cutting device, manufacturing method for wire tool and cutting method by wire saw |
-
2003
- 2003-02-04 WO PCT/JP2003/001103 patent/WO2004069479A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000271872A (en) * | 1999-03-23 | 2000-10-03 | Osaka Diamond Ind Co Ltd | Super abrasive grain resin bond wire saw |
JP2000288902A (en) * | 1999-04-07 | 2000-10-17 | Tokyo Seimitsu Co Ltd | Wire with fixed abrasive grains and fixed abrasive grain wire saw |
JP2002166348A (en) * | 2000-11-30 | 2002-06-11 | Mitsubishi Materials Corp | Working device using grinding rope, and working method |
JP2002200506A (en) * | 2000-12-27 | 2002-07-16 | Kyocera Corp | Wire for bore machining, manufacturing method therefor and machining method for ceramics using the same wire |
JP2002273663A (en) * | 2001-03-14 | 2002-09-25 | Noritake Super Abrasive:Kk | Resin bond wire saw |
JP2003080466A (en) * | 2001-09-10 | 2003-03-18 | Akimichi Koide | Wire tool used for wire saw cutting device, manufacturing method for wire tool and cutting method by wire saw |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9862041B2 (en) | 2009-08-14 | 2018-01-09 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9248583B2 (en) | 2010-12-30 | 2016-02-02 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
US10596681B2 (en) | 2012-06-29 | 2020-03-24 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9687962B2 (en) | 2012-06-29 | 2017-06-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
WO2015106609A1 (en) * | 2014-01-19 | 2015-07-23 | 凡登(常州)新型金属材料技术有限公司 | Heterogeneous metal wire for use in multi-wire cutting, manufacturing method for same, and preparation method therefor |
CN104084443A (en) * | 2014-01-19 | 2014-10-08 | 凡登(常州)新型金属材料技术有限公司 | Heterogeneous metal wire for multi-line cutting, manufacturing device and preparation method thereof |
US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US10137514B2 (en) | 2015-06-29 | 2018-11-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US10583506B2 (en) | 2015-06-29 | 2020-03-10 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
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